CN109269155B - Aluminum profile evaporative heat dissipation refrigeration plate - Google Patents
Aluminum profile evaporative heat dissipation refrigeration plate Download PDFInfo
- Publication number
- CN109269155B CN109269155B CN201811314675.8A CN201811314675A CN109269155B CN 109269155 B CN109269155 B CN 109269155B CN 201811314675 A CN201811314675 A CN 201811314675A CN 109269155 B CN109269155 B CN 109269155B
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- aluminum profile
- substrate
- profile substrate
- substrates
- heat exchange
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Classifications
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F25—REFRIGERATION OR COOLING; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS; MANUFACTURE OR STORAGE OF ICE; LIQUEFACTION SOLIDIFICATION OF GASES
- F25B—REFRIGERATION MACHINES, PLANTS OR SYSTEMS; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS
- F25B39/00—Evaporators; Condensers
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F25—REFRIGERATION OR COOLING; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS; MANUFACTURE OR STORAGE OF ICE; LIQUEFACTION SOLIDIFICATION OF GASES
- F25B—REFRIGERATION MACHINES, PLANTS OR SYSTEMS; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS
- F25B39/00—Evaporators; Condensers
- F25B39/02—Evaporators
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F25—REFRIGERATION OR COOLING; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS; MANUFACTURE OR STORAGE OF ICE; LIQUEFACTION SOLIDIFICATION OF GASES
- F25B—REFRIGERATION MACHINES, PLANTS OR SYSTEMS; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS
- F25B39/00—Evaporators; Condensers
- F25B39/04—Condensers
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- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Mechanical Engineering (AREA)
- Thermal Sciences (AREA)
- General Engineering & Computer Science (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
- Heat-Exchange Devices With Radiators And Conduit Assemblies (AREA)
Abstract
The invention discloses an aluminum profile evaporative heat-dissipation refrigeration plate, which at least comprises a left aluminum profile substrate and a right aluminum profile substrate, wherein the left aluminum profile substrate and the right aluminum profile substrate are connected through a detachable clamping structure, the bottoms of the left end and the right end of the left aluminum profile substrate and the right aluminum profile substrate are respectively provided with a left foot and a right foot, the tops of the left aluminum profile substrate and the right aluminum profile substrate are planes, the bottoms of the left aluminum profile substrate and the right aluminum profile substrate are concave-convex surfaces, pipe holes which penetrate through the corresponding aluminum profile substrates from front to back are formed in the convex parts, and two pipe holes on the front end surface and the rear end surface of the left aluminum profile substrate are communicated through corresponding semicircular bent pipes to form two heat exchange pipelines which are connected in series inside the left aluminum profile substrate and the right aluminum profile substrate; pipeline baffles are inserted into left and right upper slots opposite to the upper parts of the left and right footings, and heat insulation baffles are inserted into left and right lower slots opposite to the lower parts of the left and right footings. The invention is an integrally formed external heat exchange component, can meet the installation requirement on the plane and space, and has large conduction coefficient, wide conduction area and good refrigerating and heat radiating effects.
Description
Technical Field
The invention relates to a refrigerating and radiating system element, in particular to an aluminum profile evaporative radiating and refrigerating plate.
Background
The core element of the refrigeration and heat dissipation system is mainly a finned tube radiator or a plate radiator.
The finned tube radiator is the most widely used heat exchange equipment in gas and liquid heat exchangers, and achieves the aim of enhancing heat transfer by adding fins on a common base tube. The base pipe can be steel pipe, stainless steel pipe, copper pipe, etc., and the fin can also be steel belt, stainless steel belt, copper belt, aluminum belt, etc.
The plate radiator is made of 5 materials such as steel, cast iron, aluminum, copper, plastic and the like, and has the shapes such as column type, plate type, wing type, column wing type, plate wing type, fin tube type, convection type, composite type, combined type and the like.
In the plate radiator:
1. the cast iron radiator has complex production process, poor production conditions, large smoke dust and poor environmental protection.
2. The plastic radiator can not be degraded after being abandoned, is difficult to recycle and can pollute the environment.
3. The cast iron radiator with sand stuck in the inner cavity can pollute the water quality of the heating medium and damage the temperature control valve and the heat meter.
4. The steel radiator which is not used normally is easy to oxidize and corrode, also can pollute the water quality of the heating medium, and can damage the temperature control valve and the heat meter.
5. The aluminum and copper radiators do not pollute the water quality, the waste materials can be recycled, the environment friendliness is good, but the defects of complex structure, high manufacturing and processing difficulty, difficult installation and positioning and the like exist.
Disclosure of Invention
In order to solve the defects in the prior art, the invention provides an aluminum profile evaporative heat dissipation refrigeration plate.
The technical scheme includes that the aluminum profile evaporative heat-dissipating and refrigerating plate comprises a left aluminum profile substrate and a right aluminum profile substrate, wherein the left aluminum profile substrate and the right aluminum profile substrate are connected through a detachable clamping structure, left and right footings are respectively formed at the bottoms of the left end and the right end of the left aluminum profile substrate and the right aluminum profile substrate, the tops of the left aluminum profile substrate and the right aluminum profile substrate are planes, the bottoms of the left aluminum profile substrate and the right aluminum profile substrate are concave-convex surfaces, pipe holes which are communicated with the corresponding aluminum profile substrate in front and rear directions are formed at the protruding parts, two pipe holes on the front end surface and the rear end surface of the left aluminum profile substrate and the right aluminum profile substrate are communicated through corresponding U-shaped bent pipes or semicircular bent pipes, two heat exchange pipelines which are connected in series are formed inside the left aluminum profile substrate and the right aluminum profile substrate are respectively arranged at the front end surfaces or the rear end surfaces of the left aluminum profile substrate and the right aluminum profile substrate, and the heat exchange pipelines are respectively arranged at the front end surfaces and the rear end surfaces of the left aluminum profile substrate and the right aluminum profile substrate; pipeline baffles are inserted into left and right upper slots opposite to the upper parts of the left and right footings, and heat insulation baffles are inserted into left and right lower slots opposite to the lower parts of the left and right footings.
The further application is expanded in that grooves which are connected with corresponding support foot frames in a clamping way are formed in the bottoms of the left foot frame and the right foot frame; grooves which are connected in a clamping way and correspond to the plane expansion frames (for expanding the heat exchange area) are formed on the left side surface and the right side surface of the left aluminum profile substrate and the right aluminum profile substrate.
In the multi-layer frame structure with expanded application, left and right footings of left and right aluminum profile substrates at the lower layer are arranged on corresponding supporting foot frames, and left and right aluminum profile substrates at the upper layer are connected with left and right aluminum profile substrates at the lower layer through front and rear plate frames; the heat exchange pipelines of the upper left and right aluminum profile substrates are connected in series or in parallel with the heat exchange pipelines of the lower left and right aluminum profile substrates.
In order to increase the heat exchange area, more than one middle aluminum profile substrate is arranged between the left aluminum profile substrate and the right aluminum profile substrate, and the left aluminum profile substrate and the right aluminum profile substrate are connected through a detachable clamping structure.
A detachable clamping and embedding structure comprises a trapezoid groove and a trapezoid strip which are inserted in the front-back direction.
The invention has the beneficial effects that:
1. the aluminum profile evaporative heat-dissipation refrigeration plate is an external heat-exchange component manufactured by integral molding, and can meet the use and installation requirements on a plane and space.
2. According to the invention, one or more than two middle aluminum profile substrates can be arranged between the left aluminum profile substrate and the right aluminum profile substrate, so that the heat dissipation and refrigeration area is expanded in width.
3. The left or right aluminum profile substrate can expand the heat dissipation and refrigeration area through the plane expansion frame.
4. The two internal heat exchange pipelines can be flexibly converted according to the installation and use requirements.
5. The support foot rest of the invention adopts an inserting connection mode, and can reduce the support foot rest on the upper layer when being used as a layer frame structure.
6. The invention has large conduction coefficient, wide conduction area and good refrigerating and heat-radiating effects.
Drawings
Fig. 1 is a schematic structural diagram of an embodiment of the present invention.
Fig. 2 is a sectional view a-a in fig. 1.
Fig. 3 is a schematic diagram of a connection structure of the left, middle and right aluminum profile substrates in fig. 2.
Fig. 4 is a schematic view of the layer frame structure of the embodiment of fig. 1.
Drawing number identification: 1. a left aluminum profile substrate; 2. a right aluminum profile substrate; 3. a left footing; 4. a right footing; 5. pipe holes; 6. semicircular bent pipe; 7. a pipeline baffle; 8. an upper slot; 9. a lower slot; 10. a thermal shield; 11. a middle aluminum profile substrate; 12. a plate frame; 13. a support foot rest; 14. a plane expansion frame; 15. a clamping and embedding structure; 16. an inlet; 17. and an outlet.
Detailed Description
The technical scheme of the invention is further described below with reference to the embodiment shown in the drawings.
The invention relates to an aluminum profile evaporation type heat dissipation and refrigeration plate, which comprises a left aluminum profile substrate 1, a middle aluminum profile substrate 11 and a right aluminum profile substrate 2 which can be assembled into a whole on a plane, wherein the left aluminum profile substrate 1 and the middle aluminum profile substrate 11 and the right aluminum profile substrate 2 are respectively connected through respective detachable clamping structures 15, the clamping structures 15 between the left aluminum profile substrate 1 and the middle aluminum profile substrate 11 comprise trapezoid grooves (front and rear directions) formed on the right end surface of the left aluminum profile substrate 1 and trapezoid strips (front and rear directions) formed on the left end surface of the middle aluminum profile substrate 11, the clamping structures 15 between the middle aluminum profile substrate 11 and the right aluminum profile substrate 2 comprise trapezoid grooves (front and rear directions) formed on the right end surface of the middle aluminum profile substrate 11 and trapezoid strips (front and rear directions) formed on the left end surface of the right aluminum profile substrate 2, and the corresponding trapezoid grooves and trapezoid strips are inserted and connected in the front and rear directions so as to assemble the left aluminum profile substrate 1, the middle aluminum profile substrate 11 and the right aluminum profile substrate 2 into a whole, as shown in fig. 1, fig. 3, fig. 4.
A left footing 3 is formed at the bottom of the left end of the left aluminum profile substrate 1 to the left and the lower part of the right end of the right aluminum profile substrate 2 to the right and the lower part of the right footing 4 symmetrical to the left footing 3, a pipeline baffle 7 is inserted into a left upper slot 8 and a right upper slot 8 which are opposite to the upper parts of the left footing 3 and the right footing 4, the pipeline baffle 7 is positioned at the bottoms of the left aluminum profile substrate 1, a middle aluminum profile substrate 11 and the right aluminum profile substrate 2, and a heat insulation baffle 10 positioned below the pipeline baffle 7 is inserted into a left lower slot 9 and a right lower slot 9 which are opposite to the lower parts of the left footing 3 and the right footing 4; trapezoidal grooves which are connected with the corresponding supporting foot frames 13 in a clamping way are formed in the bottoms of the left and right footings 3 and 4, and O-shaped grooves which are connected with the corresponding plane expansion frames 14 in a clamping way are formed in the left and right side faces of the left and right aluminum profile base plates 1 and 2, as shown in figure 3.
In the overall structure of the left aluminum profile substrate 1, the middle aluminum profile substrate 11 and the right aluminum profile substrate 2, the top of the overall substrate is a plane, the bottom of the overall substrate is a concave-convex surface, pipe holes 5 which penetrate through the corresponding aluminum profile substrate front and back are formed in 14 convex parts, the first pipe hole 5 on the left side of the front end of the overall substrate is set as an outlet 17, the first pipe hole 5 on the right side of the front end of the overall substrate is set as an inlet 16, every two of 12 pipe holes 5 between the inlet 16 and the outlet 17 are correspondingly communicated through 6 semicircular bent pipes 6, every two of 14 pipe holes 5 at the rear end of the overall substrate are correspondingly communicated through 7 semicircular bent pipes 6, and accordingly a serial heat exchange pipeline is formed inside the overall substrate, as shown in fig. 1.
The whole structure of the two sets of left aluminum profile base plates 1, the middle aluminum profile base plates 11 and the right aluminum profile base plates 2 can form an upper layer frame structure and a lower layer frame structure for series heat exchange: in the lower-layer integral substrate structure, a left supporting foot rest 13 is supported at the bottom of a left foot 3 of a left aluminum profile substrate 1 and is connected with a trapezoid groove in an inserting way through an aligned trapezoid bar, a right supporting foot rest 13 is supported at the bottom of a right foot 4 of a right aluminum profile substrate 2 and is connected with the trapezoid groove in an inserting way through the aligned trapezoid bar, a corresponding plane expansion frame 14 is arranged on the left side surface of the left aluminum profile substrate 1, the left foot rest 13 is connected with the O groove in an inserting way through an aligned O-shaped bar, a corresponding plane expansion frame 14 is arranged on the right side surface of the right aluminum profile substrate 1, the right foot rest 14 is connected with the O groove in an inserting way through the aligned O-shaped bar, and the integral structures of the upper-layer left aluminum profile substrate 1, the middle aluminum profile substrate 11 and the right aluminum profile substrate 2 are arranged on the lower-layer integral substrate through a front plate frame 12 and a rear plate frame 12; the heat exchange pipelines of the upper left aluminum profile substrate 1, the middle aluminum profile substrate 11 and the right aluminum profile substrate 2 and the heat exchange pipelines of the lower left aluminum profile substrate 1, the middle aluminum profile substrate 11 and the right aluminum profile substrate 2 can be connected in series or in parallel, as shown in fig. 2 and 4.
The invention can be flexibly applied to a heat dissipation refrigeration system, and can be used as a condenser and an evaporator according to the heat dissipation or refrigeration requirement.
Claims (5)
1. Aluminum profile evaporative heat dissipation refrigeration board, its characterized in that: the heat exchange device comprises left and right aluminum profile substrates (1, 2), wherein the left and right aluminum profile substrates (1, 2) are connected through a detachable clamping structure (15), left and right end bottoms of the left and right aluminum profile substrates (1, 2) are respectively provided with left and right footings (3, 4), the tops of the left and right aluminum profile substrates (1, 2) are plane surfaces, the bottoms of the left and right aluminum profile substrates are concave-convex surfaces, pipe holes (5) penetrating through the corresponding aluminum profile substrates are formed at the protruding parts, two pipe holes (5) on the front and rear end surfaces of the left and right aluminum profile substrates (1, 2) are communicated through corresponding U-shaped bent pipes or semicircular bent pipes (6), two heat exchange pipelines which are connected in series are formed inside the left and right aluminum profile substrates (1, 2), in one heat exchange pipeline, an inlet and an outlet (16, 17) are positioned on the front end surfaces or the rear end surfaces of the left and right aluminum profile substrates (1, 2), and in the other heat exchange pipeline, the inlet and the outlet (16, 17) are positioned on the front end surfaces and the rear end surfaces of the left and right aluminum profile substrates (1, 2); a pipeline baffle (7) is inserted into a left upper slot (8) and a right upper slot (8) which are opposite to the upper parts of the left footing (3) and the right footing (4), and a heat insulation baffle (10) is inserted into a left lower slot (9) and a right lower slot which are opposite to the lower parts of the left footing (3) and the right footing (4).
2. The aluminum profile evaporative heat sink and cooler as recited in claim 1, wherein: grooves which are in clamping connection with the corresponding supporting foot frames (13) are respectively arranged at the bottoms of the left foot frames (3) and the right foot frames (4); grooves which are connected in a clamping way and correspond to the plane expansion frames (14) are respectively arranged on the left side surface and the right side surface of the left aluminum profile substrate (1) and the right aluminum profile substrate (2).
3. The aluminum profile evaporative heat sink and cooler as recited in claim 2, wherein: in the layer frame structure, left and right footings (3, 4) of lower left and right aluminum profile substrates (1, 2) are arranged on corresponding supporting foot frames (13), and upper left and right aluminum profile substrates (1, 2) are connected with lower left and right aluminum profile substrates (1, 2) through front and rear plate frames (12); the heat exchange pipelines of the upper left and right aluminum profile substrates (1, 2) are connected in series or in parallel with the heat exchange pipelines of the lower left and right aluminum profile substrates (1, 2).
4. An aluminum profile evaporative heat sink and cooler as claimed in any one of claims 1 to 3, wherein: more than one middle aluminum profile substrate (11) is arranged between the left aluminum profile substrate (1) and the right aluminum profile substrate (2), and the left aluminum profile substrate (1) and the right aluminum profile substrate (2) are connected with the middle aluminum profile substrate (11) through a detachable clamping structure (15).
5. The aluminum profile evaporative heat sink and cooler as recited in claim 4, wherein: the detachable clamping and embedding structure (15) comprises a trapezoid groove and a trapezoid strip which are inserted in the front and rear directions.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201811314675.8A CN109269155B (en) | 2018-11-06 | 2018-11-06 | Aluminum profile evaporative heat dissipation refrigeration plate |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201811314675.8A CN109269155B (en) | 2018-11-06 | 2018-11-06 | Aluminum profile evaporative heat dissipation refrigeration plate |
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| Publication Number | Publication Date |
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| CN109269155A CN109269155A (en) | 2019-01-25 |
| CN109269155B true CN109269155B (en) | 2023-10-13 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN201811314675.8A Active CN109269155B (en) | 2018-11-06 | 2018-11-06 | Aluminum profile evaporative heat dissipation refrigeration plate |
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Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE102010040340A1 (en) * | 2010-09-07 | 2012-03-08 | BSH Bosch und Siemens Hausgeräte GmbH | Refrigeration unit with skin condenser |
| CN203148298U (en) * | 2013-02-20 | 2013-08-21 | 安徽天祥空调科技有限公司 | Overall braze welded all-aluminum module radiator |
| CN106016846A (en) * | 2016-06-13 | 2016-10-12 | 江苏亚光金属制品有限公司 | Energy-saving and environment protective type internal freezing evaporator assembly |
| CN107401859A (en) * | 2017-08-16 | 2017-11-28 | 河南科隆集团有限公司 | A kind of manufacture method of card slot type plate pipe evaporator |
| CN207763128U (en) * | 2017-12-25 | 2018-08-24 | 广东美的暖通设备有限公司 | Radiator and air-conditioning |
| CN209085118U (en) * | 2018-11-06 | 2019-07-09 | 广西钦州市奇福保温冷冻设备有限公司 | Aluminum profile vaporation-type heat dissipation cold plate |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE10311214A1 (en) * | 2003-03-14 | 2004-09-23 | Jolly, Jürgen | Room cooling system |
-
2018
- 2018-11-06 CN CN201811314675.8A patent/CN109269155B/en active Active
Patent Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE102010040340A1 (en) * | 2010-09-07 | 2012-03-08 | BSH Bosch und Siemens Hausgeräte GmbH | Refrigeration unit with skin condenser |
| CN203148298U (en) * | 2013-02-20 | 2013-08-21 | 安徽天祥空调科技有限公司 | Overall braze welded all-aluminum module radiator |
| CN106016846A (en) * | 2016-06-13 | 2016-10-12 | 江苏亚光金属制品有限公司 | Energy-saving and environment protective type internal freezing evaporator assembly |
| CN107401859A (en) * | 2017-08-16 | 2017-11-28 | 河南科隆集团有限公司 | A kind of manufacture method of card slot type plate pipe evaporator |
| CN207763128U (en) * | 2017-12-25 | 2018-08-24 | 广东美的暖通设备有限公司 | Radiator and air-conditioning |
| CN209085118U (en) * | 2018-11-06 | 2019-07-09 | 广西钦州市奇福保温冷冻设备有限公司 | Aluminum profile vaporation-type heat dissipation cold plate |
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| CN109269155A (en) | 2019-01-25 |
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Effective date of registration: 20230912 Address after: No. 3, South 1st Lane, Wuma Road, Qinnan District, Qinzhou, Guangxi 535000 Applicant after: Deng Jianqin Address before: Building 1-6 #, Standard Plant, Plot D3, Electronic Industrial Park, Hedong Industrial Park, Qinzhou City, Guangxi, 535000 Applicant before: Guangxi Qinzhou Qifu Insulation Refrigeration Equipment Co.,Ltd. |
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