CN109266247A - A kind of damping glue for vibration reducing plate and preparation method thereof - Google Patents

A kind of damping glue for vibration reducing plate and preparation method thereof Download PDF

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Publication number
CN109266247A
CN109266247A CN201811131489.0A CN201811131489A CN109266247A CN 109266247 A CN109266247 A CN 109266247A CN 201811131489 A CN201811131489 A CN 201811131489A CN 109266247 A CN109266247 A CN 109266247A
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CN
China
Prior art keywords
parts
vibration reducing
reducing plate
damping glue
damping
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Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN201811131489.0A
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Chinese (zh)
Inventor
李俊
毛旺龙
张文强
李斌商
赵旭
袁良鹏
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Anhui Wei Wei Environmental Protection Technology Co Ltd
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Anhui Wei Wei Environmental Protection Technology Co Ltd
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Priority to CN201811131489.0A priority Critical patent/CN109266247A/en
Publication of CN109266247A publication Critical patent/CN109266247A/en
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    • CCHEMISTRY; METALLURGY
    • C09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09JADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J109/00Adhesives based on homopolymers or copolymers of conjugated diene hydrocarbons
    • C09J109/02Copolymers with acrylonitrile
    • CCHEMISTRY; METALLURGY
    • C09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09JADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J11/00Features of adhesives not provided for in group C09J9/00, e.g. additives
    • C09J11/02Non-macromolecular additives
    • C09J11/04Non-macromolecular additives inorganic
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08KUse of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K2201/00Specific properties of additives
    • C08K2201/001Conductive additives
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08LCOMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L2205/00Polymer mixtures characterised by other features
    • C08L2205/03Polymer mixtures characterised by other features containing three or more polymers in a blend
    • C08L2205/035Polymer mixtures characterised by other features containing three or more polymers in a blend containing four or more polymers in a blend

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  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Inorganic Chemistry (AREA)
  • Compositions Of Macromolecular Compounds (AREA)

Abstract

The invention discloses a kind of damping glue for vibration reducing plate and preparation method thereof, belong to damping field.The damping glue for vibration reducing plate includes the raw material of following parts by weight: 6-8 parts of butadiene rubber, 23-27 parts of nitrile rubber, 5-7 parts of epoxy resin, 20-24 parts of acetylene carbon black, 3-7 parts of chloro unsaturated polyester resin, 4-8 parts of Abietyl modified tertiary butyl phenol resin, 0.5-0.7 parts of gelling agent, 1-3 parts of reinforcing filler, 2-4 parts of curing agent, 50-66 parts of solvent.Damping glue for vibration reducing plate of the present invention and preparation method thereof improves the welding performance and damping capacity of damping glue.

Description

A kind of damping glue for vibration reducing plate and preparation method thereof
Technical field
The present invention relates to damping fields, and in particular to a kind of damping glue for vibration reducing plate and preparation method thereof.
Background technique
Damping block is the new material that recent domestic rapidly develops, and high resistant possessed by high molecular material is utilized in it Damping characteristics have significant vibration and noise reducing effect, are the ideal products of vibration noise occasion substitution pure metal plate.Last century 90 Since age, a large amount of work has been done in the research of vibration damping steel plate and application aspect by the developed countries such as the U.S., Japan, Europe, and The industries such as aerospace, automobile, machinery are widely used to, good economic benefit is had received.China is also at last century 90 years Carrying out the research work of vibration damping steel plate for mid-term, China has the production of vibration damping steel plate product, but of less types on the whole, Application field is narrow.With the improvement of people ' s living standards and the enhancing of environmental consciousness subtracts living environment strong request improvement Application of the vibration noise reduction in fields such as household electric appliances, building traffic, electromechanical industries gradually increases.Resistance used in these industries Buddhist nun's glue requires damping temp field width, and using temperature range range damping factor height, also some industries welding demand is high, but current resistance Buddhist nun's glue all has insulation performance, can not directly be welded.
Summary of the invention
The purpose of the present invention is to provide a kind of damping glue for vibration reducing plate and preparation method thereof, improve the welding of damping glue Performance and damping capacity.
To achieve the above object, the invention provides the following technical scheme:
A kind of damping glue for vibration reducing plate, the raw material including following parts by weight: 6-8 parts of butadiene rubber, nitrile rubber 23-27 Part, 5-7 parts of epoxy resin, 20-24 parts of acetylene carbon black, 3-7 parts of chloro unsaturated polyester resin, Abietyl modified tertiary butyl phenol resin 4- 8 parts, 0.5-0.7 parts of gelling agent, 1-3 parts of reinforcing filler, 2-4 parts of curing agent, 50-66 parts of solvent.
Preferably, the damping glue for vibration reducing plate, the raw material including following parts by weight: 7 parts of butadiene rubber, nitrile rubber 25 Part, 6 parts of epoxy resin, 22 parts of acetylene carbon black, 5 parts of chloro unsaturated polyester resin, 6 parts of Abietyl modified tertiary butyl phenol resin, gel 0.6 part of agent, 2 parts of reinforcing filler, 3 parts of curing agent, 58 parts of solvent.
Preferably, the partial size of the acetylene black is 30-34nm, specific surface area 55-63m2/g。
Preferably, the reinforcing filler is one or more of diatomite, talcum powder, flake asbestos.
Preferably, the curing agent includes tetraethylenepentamine and dicyandiamide, the quality of the tetraethylenepentamine and dicyandiamide Than for 3:1.
Preferably, the solvent is the mixture of butyl acetate, ethyl acetate, butanone, the butyl acetate, acetic acid second Ester, butanone mass ratio be 3:2:5.
Preferably, a kind of preparation method of damping glue for vibration reducing plate, comprising the following steps:
(1) Abietyl modified tertiary butyl phenol resin is placed at 160-180 DEG C and is softened, be then always held at temperature 160-180 DEG C, gelling agent is added, stirs evenly, obtains mixture;
(2) butadiene rubber and nitrile rubber are plasticated 25-35min on twin-roll machine, acetylene carbon black is then added and is kneaded, until Wei Shi plasticity obtains mixture between 0.34-0.41, and then mixture is added in solvent and stirs 30-40min;Again plus Enter epoxy resin, chloro unsaturated polyester resin, reinforcing filler, curing agent, mixture to stir to 35-50min, obtain uniformly Thick liquid is to get the damping glue for vibration reducing plate.
Preferably, in the step (2), mixing speed is 350-400r/min.
Compared with prior art, the beneficial effects of the present invention are:
(1) acetylene black resistivity is extremely low, has excellent electric conductivity, by adding acetylene black, improves the welding of damping glue Performance keeps damping glue electrically conductive, improves speed of welding.
(2) mixture that Abietyl modified tertiary butyl phenol resin and gelling agent are mixed to get has excellent viscoplasticity, Ke Yizeng Add the elasticity and damping capacity of damping glue.
(3) proportion optimal by each raw material makes to have obtained a kind of damping temp field width, damped within the scope of using temperature range because The high damping glue for vibration reducing plate of son.
Specific embodiment
The technical scheme in the embodiments of the invention will be clearly and completely described below, it is clear that described implementation Example is only a part of the embodiments of the present invention, instead of all the embodiments.Based on the embodiments of the present invention, this field is general Logical technical staff every other embodiment obtained without making creative work belongs to what the present invention protected Range.
Embodiment 1
Damping glue for vibration reducing plate described in the present embodiment, the raw material including following parts by weight: 6 parts of butadiene rubber, butyronitrile 23 parts of rubber, 5 parts of epoxy resin, 20 parts of acetylene carbon black, 3 parts of chloro unsaturated polyester resin, Abietyl modified tertiary butyl phenol resin 4 Part, 0.5 part of gelling agent, 1 part of reinforcing filler, 2 parts of curing agent, 50 parts of solvent;The partial size of the acetylene black is 30nm, specific surface Product 55m2/g;The reinforcing filler is diatomite;The curing agent includes tetraethylenepentamine and dicyandiamide, four ethylene five The mass ratio of amine and dicyandiamide is 3:1;The solvent is the mixture of butyl acetate, ethyl acetate, butanone, the acetic acid fourth Ester, ethyl acetate, butanone mass ratio be 3:2:5.
A kind of preparation method of damping glue for vibration reducing plate, which comprises the following steps:
(1) Abietyl modified tertiary butyl phenol resin is placed at 160 DEG C and is softened, temperature is then made to be always held at 160 DEG C, Gelling agent is added, stirs evenly, obtains mixture;
(2) butadiene rubber and nitrile rubber are plasticated 25min on twin-roll machine, acetylene carbon black is then added and is kneaded, until prestige Family name's plasticity obtains mixture between 0.34, and then mixture is added in solvent and stirs 30min;Add epoxy resin, Chloro unsaturated polyester resin, reinforcing filler, curing agent, mixture are stirred to 35min, obtain uniform thick liquid to get The damping glue for vibration reducing plate, wherein mixing speed is 350r/min.
Embodiment 2
Damping glue for vibration reducing plate described in the present embodiment, the raw material including following parts by weight: 7 parts of butadiene rubber, butyronitrile 25 parts of rubber, 6 parts of epoxy resin, 22 parts of acetylene carbon black, 5 parts of chloro unsaturated polyester resin, Abietyl modified tertiary butyl phenol resin 6 Part, 0.6 part of gelling agent, 2 parts of reinforcing filler, 3 parts of curing agent, 58 parts of solvent;The partial size of the acetylene black is 32nm, specific surface Product 59m2/g;The reinforcing filler is talcum powder;The curing agent includes tetraethylenepentamine and dicyandiamide, four ethylene five The mass ratio of amine and dicyandiamide is 3:1;The solvent is the mixture of butyl acetate, ethyl acetate, butanone, the acetic acid fourth Ester, ethyl acetate, butanone mass ratio be 3:2:5.
A kind of preparation method of damping glue for vibration reducing plate, which comprises the following steps:
(1) Abietyl modified tertiary butyl phenol resin is placed at 170 DEG C and is softened, temperature is then made to be always held at 170 DEG C, Gelling agent is added, stirs evenly, obtains mixture;
(2) butadiene rubber and nitrile rubber are plasticated 30min on twin-roll machine, acetylene carbon black is then added and is kneaded, until prestige Family name's plasticity obtains mixture between 0.37, and then mixture is added in solvent and stirs 35min;Add epoxy resin, Chloro unsaturated polyester resin, reinforcing filler, curing agent, mixture are stirred to 43min, obtain uniform thick liquid to get The damping glue for vibration reducing plate, wherein mixing speed is 375r/min.
Embodiment 3
Damping glue for vibration reducing plate described in the present embodiment, the raw material including following parts by weight: 8 parts of butadiene rubber, butyronitrile 27 parts of rubber, 7 parts of epoxy resin, 24 parts of acetylene carbon black, 7 parts of chloro unsaturated polyester resin, Abietyl modified tertiary butyl phenol resin 8 Part, 0.7 part of gelling agent, 3 parts of reinforcing filler, 4 parts of curing agent, 66 parts of solvent;The partial size of the acetylene black is 34nm, specific surface Product 63m2/g;The reinforcing filler is flake asbestos;The curing agent includes tetraethylenepentamine and dicyandiamide, four ethylene five The mass ratio of amine and dicyandiamide is 3:1;The solvent is the mixture of butyl acetate, ethyl acetate, butanone, the acetic acid fourth Ester, ethyl acetate, butanone mass ratio be 3:2:5.
A kind of preparation method of damping glue for vibration reducing plate, which comprises the following steps:
(1) Abietyl modified tertiary butyl phenol resin is placed at 180 DEG C and is softened, temperature is then made to be always held at 180 DEG C, Gelling agent is added, stirs evenly, obtains mixture;
(2) butadiene rubber and nitrile rubber are plasticated 35min on twin-roll machine, acetylene carbon black is then added and is kneaded, until prestige Family name's plasticity obtains mixture between 0.41, and then mixture is added in solvent and stirs 40min;Add epoxy resin, Chloro unsaturated polyester resin, reinforcing filler, curing agent, mixture are stirred to 50min, obtain uniform thick liquid to get The damping glue for vibration reducing plate, wherein mixing speed is 400r/min.
Comparative example 1
It is in place of this comparative example and the difference of embodiment 2, does not include butadiene rubber, and removed therewith in preparation method Related step.This comparative example includes the raw material of following parts by weight: 35 parts of nitrile rubber, 7 parts of epoxy resin, acetylene carbon black 24 Part, 7 parts of chloro unsaturated polyester resin, 8 parts of Abietyl modified tertiary butyl phenol resin, 0.7 part of gelling agent, 3 parts of reinforcing filler, solidification 4 parts of agent, 66 parts of solvent.
Comparative example 2
It is in place of this comparative example and the difference of embodiment 2, does not include nitrile rubber, and removed therewith in preparation method Related step.This comparative example includes the raw material of following parts by weight: 35 parts of butadiene rubber, 7 parts of epoxy resin, acetylene carbon black 24 Part, 7 parts of chloro unsaturated polyester resin, 8 parts of Abietyl modified tertiary butyl phenol resin, 0.7 part of gelling agent, 3 parts of reinforcing filler, solidification 4 parts of agent, 66 parts of solvent.
Comparative example 3
It is in place of this comparative example and the difference of embodiment 2, does not include Abietyl modified tertiary butyl phenol resin, and in preparation method It is middle to remove associated step.This comparative example includes the raw material of following parts by weight: 35 parts of nitrile rubber, 7 parts of epoxy resin, second 24 parts of alkynes carbon black, 7 parts of chloro unsaturated polyester resin, 0.7 part of gelling agent, 3 parts of reinforcing filler, 4 parts of curing agent, solvent 66 Part.
Comparative example 4
It is in place of this comparative example and the difference of embodiment 2, does not include gelling agent, and remove phase therewith in preparation method The step of pass.This comparative example includes the raw material of following parts by weight: 35 parts of nitrile rubber, 7 parts of epoxy resin, 24 parts of acetylene carbon black, 7 parts of chloro unsaturated polyester resin, 8 parts of Abietyl modified tertiary butyl phenol resin, 3 parts of reinforcing filler, 4 parts of curing agent, 66 parts of solvent.
Comparative example 5
It is in place of the difference of this comparative example and embodiment 2, does not include gelling agent and Abietyl modified tertiary butyl phenol resin, and Associated step is removed in preparation method.This comparative example includes the raw material of following parts by weight: 35 parts of nitrile rubber, asphalt mixtures modified by epoxy resin 7 parts of rouge, 24 parts of acetylene carbon black, 7 parts of chloro unsaturated polyester resin, 3 parts of reinforcing filler, 4 parts of curing agent, 66 parts of solvent.
Product made from embodiment 1-3 and comparative example 1-5 is subjected to performance detection, testing result is as follows:
The performance indicator of product is made in table 1 embodiment 1-3 and comparative example 1-5
Solid content % Viscosity Pas (25 DEG C) Tensile shear strength MPa Welding performance μ Ω Damping temperature domain DEG C
Embodiment 1 32 11.2 12.3 234 -7.2-69.1
Embodiment 2 35 15.7 15.4 252 -15-70
Embodiment 3 39 14.3 14.8 241 -8.5-54.8
Comparative example 1 33 9.8 11.5 250 -5.3-61.4
Comparative example 2 34 8.6 8.3 245 -19-43.2
Comparative example 3 28 7.4 9.2 256 -6.5-56.9
Comparative example 4 31 6.3 8.0 253 -2.3-60.5
Comparative example 5 26 4.5 7.1 260 -0.4-57.8
The fissipation factor of product is made in table 2 embodiment 1-3 and comparative example 1-5
Fissipation factor (10Hz, 0 DEG C) Fissipation factor (10Hz, 20 DEG C) Fissipation factor (10Hz, 30 DEG C)
Embodiment 1 0.53 0.68 0.92
Embodiment 2 0.46 1.22 0.85
Embodiment 3 1.31 0.95 0.54
Comparative example 1 0.33 1.10 0.65
Comparative example 2 0.35 0.96 0.72
Comparative example 3 0.41 0.80 0.63
Comparative example 4 0.37 0.82 0.59
Comparative example 5 0.31 0.77 0.61
Damping temperature domain in table 1 is the temperature range of fissipation factor >=0.3, and according to Tables 1 and 2, the present invention is made Standby damping glue has excellent viscosity, tensile shear strength, welding performance, and damping temp field width, using within the scope of temperature range Damping factor is high;Secondly, the combination of butadiene rubber and nitrile rubber, substantially improves the performance of damping glue;Abietyl modified tertiary fourth The addition of phenol resin and gelling agent also significantly improves the viscosity and tensile shear strength of damping glue.
Above content is only to structure of the invention example and explanation, affiliated those skilled in the art couple Described specific embodiment does various modifications or additions or is substituted in a similar manner, without departing from the present invention Structure or beyond the scope defined by this claim, be within the scope of protection of the invention.

Claims (8)

1. a kind of damping glue for vibration reducing plate, which is characterized in that the raw material including following parts by weight: 6-8 parts of butadiene rubber, butyronitrile rubber 23-27 parts of glue, 5-7 parts of epoxy resin, 20-24 parts of acetylene carbon black, 3-7 parts of chloro unsaturated polyester resin, Abietyl modified tertiary fourth 4-8 parts of phenol resin, 0.5-0.7 parts of gelling agent, 1-3 parts of reinforcing filler, 2-4 parts of curing agent, 50-66 parts of solvent.
2. a kind of damping glue for vibration reducing plate according to claim 1, which is characterized in that the raw material including following parts by weight: 7 parts of butadiene rubber, 25 parts of nitrile rubber, 6 parts of epoxy resin, 22 parts of acetylene carbon black, 5 parts of chloro unsaturated polyester resin, rosin Modified 6 parts of tertiary butyl phenol resin, 0.6 part of gelling agent, 2 parts of reinforcing filler, 3 parts of curing agent, 58 parts of solvent.
3. a kind of damping glue for vibration reducing plate according to claim 1, it is characterised in that: the partial size of the acetylene black is 30- 34nm, specific surface area 55-63m2/g。
4. a kind of damping glue for vibration reducing plate according to claim 1, it is characterised in that: the reinforcing filler is diatom One or more of soil, talcum powder, flake asbestos.
5. a kind of damping glue for vibration reducing plate according to claim 1, it is characterised in that: the curing agent includes four ethylene five The mass ratio of amine and dicyandiamide, the tetraethylenepentamine and dicyandiamide is 3:1.
6. a kind of damping glue for vibration reducing plate according to claim 1, it is characterised in that: the solvent is butyl acetate, vinegar The mixture of acetoacetic ester, butanone, the butyl acetate, ethyl acetate, butanone mass ratio be 3:2:5.
7. a kind of preparation method of damping glue for vibration reducing plate according to claim 1-6, which is characterized in that including Following steps:
(1) Abietyl modified tertiary butyl phenol resin is placed at 160-180 DEG C and is softened, then temperature is made to be always held at 160- 180 DEG C, gelling agent is added, stirs evenly, obtains mixture;
(2) butadiene rubber and nitrile rubber are plasticated 25-35min on twin-roll machine, acetylene carbon black is then added and is kneaded, until Wei Shi Plasticity obtains mixture between 0.34-0.41, and then mixture is added in solvent and stirs 30-40min;Add ring Oxygen resin, chloro unsaturated polyester resin, reinforcing filler, curing agent, mixture are stirred to 35-50min, are obtained uniformly sticky Liquid is to get the damping glue for vibration reducing plate.
8. a kind of preparation method of damping glue for vibration reducing plate according to claim 7, it is characterised in that: the step (2) In, mixing speed is 350-400r/min.
CN201811131489.0A 2018-09-27 2018-09-27 A kind of damping glue for vibration reducing plate and preparation method thereof Pending CN109266247A (en)

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CN201811131489.0A CN109266247A (en) 2018-09-27 2018-09-27 A kind of damping glue for vibration reducing plate and preparation method thereof

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Application Number Priority Date Filing Date Title
CN201811131489.0A CN109266247A (en) 2018-09-27 2018-09-27 A kind of damping glue for vibration reducing plate and preparation method thereof

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Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN101914230A (en) * 2010-08-23 2010-12-15 上海市合成树脂研究所 Preparation method of weldable damping adhesive for vehicle vibration-damping plate
CN102115647A (en) * 2009-12-30 2011-07-06 上海市合成树脂研究所 Damping glue for vibration reducing plate and preparation method thereof
CN106867060A (en) * 2015-12-14 2017-06-20 株洲时代新材料科技股份有限公司 A kind of aseismatic bearing rubber composition and preparation method thereof

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102115647A (en) * 2009-12-30 2011-07-06 上海市合成树脂研究所 Damping glue for vibration reducing plate and preparation method thereof
CN101914230A (en) * 2010-08-23 2010-12-15 上海市合成树脂研究所 Preparation method of weldable damping adhesive for vehicle vibration-damping plate
CN106867060A (en) * 2015-12-14 2017-06-20 株洲时代新材料科技股份有限公司 A kind of aseismatic bearing rubber composition and preparation method thereof

Non-Patent Citations (1)

* Cited by examiner, † Cited by third party
Title
耿耀宗主编: "《现代水性涂料 工艺•配方•应用》", 31 March 2003, 中国石化出版社 *

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Application publication date: 20190125