CN109266219A - A kind of high heat-conductivity conducting coating material and preparation method thereof - Google Patents
A kind of high heat-conductivity conducting coating material and preparation method thereof Download PDFInfo
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- CN109266219A CN109266219A CN201810849892.0A CN201810849892A CN109266219A CN 109266219 A CN109266219 A CN 109266219A CN 201810849892 A CN201810849892 A CN 201810849892A CN 109266219 A CN109266219 A CN 109266219A
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- coating material
- formula
- high heat
- conducting coating
- conductivity conducting
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
- C09D185/00—Coating compositions based on macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing atoms other than silicon, sulfur, nitrogen, oxygen, and carbon; Coating compositions based on derivatives of such polymers
- C09D185/02—Coating compositions based on macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing atoms other than silicon, sulfur, nitrogen, oxygen, and carbon; Coating compositions based on derivatives of such polymers containing phosphorus
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
- C09D5/00—Coating compositions, e.g. paints, varnishes or lacquers, characterised by their physical nature or the effects produced; Filling pastes
- C09D5/24—Electrically-conducting paints
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/02—Elements
- C08K3/08—Metals
- C08K2003/085—Copper
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K2201/00—Specific properties of additives
- C08K2201/011—Nanostructured additives
Abstract
A kind of high heat-conductivity conducting coating material provided by the invention, the high heat-conductivity conducting coating material are the compound of polymer shown in formula (I), graphene and Nanometer Copper.The present invention also provides the preparation methods of above-mentioned coating material.High heat-conductivity conducting coating material provided by the invention, preparation method is simple, compound using macromolecule and nano aluminium oxide, and thermal conductivity ability is strong.
Description
Technical field
The present invention relates to coating material Material Field, in particular to a kind of high heat-conductivity conducting coating material further relates to its system
Preparation Method.
Background technique
With the development of science and technology, all trades and professions such as petroleum, chemical industry, medical treatment increasingly tend to mechanization and electronics
Change, these factors all make harm of the electrostatic in society increasingly domination.Electrostatic is easy in metal and nonmetallic materials table
Area is poly-, gently then causes the instrument and equipment interruption of service, heavy then will puncture electronic component, causes to shock by electricity, the things such as fire or explosion
Therefore.Therefore, electronic component and the antistatic of equipment require higher and higher.
The technical method of antistatic is more at present, and static conductive coating has preparation process compared to plating, vacuum sputtering
Simply, the advantages that easy for construction, low in cost, is particularly suitable for various surfaces of complex shape.Compared to static conductive stick, static conductive
Applied widely, the long service life of coating.
Static conductive coating is broadly divided into Intrinsical and addition type, wherein the research about addition type is more.Addition type is led quiet
Electrocoating paint mainly passes through filling conductive carbon series, metal, metal oxide and macroion etc., at present existing for these fillers
Greatest problem is dispersibility and poor compatibility, directly affects the adhesive force of coating.
Summary of the invention
Goal of the invention: in order to overcome the above-mentioned deficiencies of the prior art, the purpose of the present invention is to provide a kind of high thermal conductivities to lead
Coating material.
The second object of the present invention is to provide the preparation method of above-mentioned high heat-conductivity conducting coating material.
Technical solution: a kind of high heat-conductivity conducting coating material provided by the invention, the high heat-conductivity conducting coating material are formula
(I) compound of polymer, graphene shown in and Nanometer Copper；
Wherein, the structural formula of polymer shown in formula (I) are as follows:
In formula, n is the integer between 500~2000.
The present invention provides the preparation methods of above-mentioned high heat-conductivity conducting coating material, comprising the following steps:
(1) at the protection of inert gas, 350~400 DEG C, by 2,5- thiophene dicarboxylic acid and 4,4 '-diamino-phenyl hydroxyls
Base phosphine oxide reacts 8-12h under the action of catalyst, is cooled to 300 DEG C to get polymer shown in formula (I)；
(2) 250 DEG C are cooled to the speed of 10 DEG C/h, while graphene and Nanometer Copper is added, continue cool to room temperature, very
The dry compound to get polymer and graphene and Nanometer Copper shown in formula (I) of sky.
In step (1), catalyst is selected from one or more of triphenyl phosphate, triethylamine, ethylenediamine.
In step (1), the molar ratio of 2,5- thiophene dicarboxylic acids and 4,4 '-diamino-phenyl hydroxyl phosphine oxides is (1~1.2)
∶1。
In step (2), the molar ratio of polymer shown in graphene, Nanometer Copper and formula (I) is (0.04~0.06):
(0.04~0.06): 1, wherein polymer shown in formula (I) uses meter with 4,4 '-diamino-phenyl hydroxyl phosphine oxides.
The utility model has the advantages that high heat-conductivity conducting coating material provided by the invention, preparation method is simple, using macromolecule and nanometer
Alumina composite, thermal conductivity ability are strong.
Specific embodiment
According to following embodiments, the present invention may be better understood.However, as it will be easily appreciated by one skilled in the art that real
It applies content described in example and is merely to illustrate the present invention, without sheet described in detail in claims should will not be limited
Invention.
Embodiment 1
The preparation method of high heat-conductivity conducting coating material, comprising the following steps:
(1) at the protection of inert gas, 375 DEG C, 2,5- thiophene dicarboxylic acid and 4,4 '-diamino-phenyl hydroxyls are aoxidized
Phosphine reacts 10h under triphenyl phosphate effect, is cooled to 300 DEG C to get polymer shown in formula (I)；2,5- thiophene dicarboxylic acid
Molar ratio with 4,4 '-diamino-phenyl hydroxyl phosphine oxides is 1.1: 1；
Sampling, cools down to room temperature, is dried in vacuo, washing, drying and crushing, and the detection degree of polymerization is 1910, and 1% heat is lost
Weight decomposition rate is 311.2 DEG C；
(2) 250 DEG C are cooled to the speed of 10 DEG C/h, while graphene and Nanometer Copper is added, continue cool to room temperature, very
The dry compound to get polymer and graphene and Nanometer Copper shown in formula (I) of sky；Shown in graphene, Nanometer Copper and formula (I)
Polymer molar ratio be 0.05: 0.05: 1, wherein polymer shown in formula (I) is aoxidized with 4,4 '-diamino-phenyl hydroxyls
Phosphine uses meter.
Embodiment 2
The preparation method of high heat-conductivity conducting coating material, comprising the following steps:
(1) at the protection of inert gas, 350 DEG C, 2,5- thiophene dicarboxylic acid and 4,4 '-diamino-phenyl hydroxyls are aoxidized
Phosphine reacts 12h under triethylamine effect, is cooled to 300 DEG C to get polymer shown in formula (I)；2,5- thiophene dicarboxylic acid and 4,
The molar ratio of 4 '-diamino-phenyl hydroxyl phosphine oxides is 1: 1；
Sampling, cools down to room temperature, is dried in vacuo, washing, drying and crushing, and the detection degree of polymerization is 1700, and 1% heat is lost
Weight decomposition rate is 286.3 DEG C；
(2) 250 DEG C are cooled to the speed of 10 DEG C/h, while graphene and Nanometer Copper is added, continue cool to room temperature, very
The dry compound to get polymer and graphene and Nanometer Copper shown in formula (I) of sky；Shown in graphene, Nanometer Copper and formula (I)
Polymer molar ratio be 0.04: 0.06: 1, wherein polymer shown in formula (I) is aoxidized with 4,4 '-diamino-phenyl hydroxyls
Phosphine uses meter.
Embodiment 3
The preparation method of high heat-conductivity conducting coating material, comprising the following steps:
(1) at the protection of inert gas, 400 DEG C, 2,5- thiophene dicarboxylic acid and 4,4 '-diamino-phenyl hydroxyls are aoxidized
Phosphine reacts 8h under ethylenediamine effect, is cooled to 300 DEG C to get polymer shown in formula (I)；2,5- thiophene dicarboxylic acid and 4,
The molar ratio of 4 '-diamino-phenyl hydroxyl phosphine oxides is 1.2: 1；
Sampling, cools down to room temperature, is dried in vacuo, washing, drying and crushing, and the detection degree of polymerization is 1650, and 1% heat is lost
Weight decomposition rate is 271.1 DEG C；
(2) 250 DEG C are cooled to the speed of 10 DEG C/h, while graphene and Nanometer Copper is added, continue cool to room temperature, very
The dry compound to get polymer and graphene and Nanometer Copper shown in formula (I) of sky；Shown in graphene, Nanometer Copper and formula (I)
Polymer molar ratio be 0.06: 0.04: 1, wherein polymer shown in formula (I) is aoxidized with 4,4 '-diamino-phenyl hydroxyls
Phosphine uses meter.
The performance of the coating material of testing example 1 to 3
| Embodiment 1 | Embodiment 2 | Embodiment 3 | Graphene | |
| Resistivity Ω cm | 8×10-6 | 5×10-6 | 5×10-6 | 10-6 |
| Thermal conductivity | 1800W/mk | 1500W/mk | 1500W/mk | 1400W/mk |
Claims (5)
1. a kind of high heat-conductivity conducting coating material, it is characterised in that: the high heat-conductivity conducting coating material is to polymerize shown in formula (I)
The compound of object, graphene and Nanometer Copper；
Wherein, the structural formula of polymer shown in formula (I) are as follows:
In formula, n is the integer between 500~2000.
2. a kind of preparation method of high heat-conductivity conducting coating material described in claim 1, it is characterised in that: including following step
It is rapid:
(1) at the protection of inert gas, 350~400 DEG C, by 2,5- thiophene dicarboxylic acid and 4,4 '-diamino-phenyl hydroxyl oxygens
Change phosphine and react 8-12h under the action of catalyst, is cooled to 300 DEG C to get polymer shown in formula (I)；
(2) 250 DEG C are cooled to the speed of 10 DEG C/h, while graphene and Nanometer Copper is added, continue cool to room temperature, vacuum is dry
The dry compound to get polymer and graphene and Nanometer Copper shown in formula (I).
3. a kind of preparation method of high heat-conductivity conducting coating material according to claim 2, it is characterised in that: step (1)
In, catalyst is selected from one or more of triphenyl phosphate, triethylamine, ethylenediamine.
4. a kind of preparation method of high heat-conductivity conducting coating material according to claim 2, it is characterised in that: step (1)
In, the molar ratio of 2,5- thiophene dicarboxylic acids and 4,4 '-diamino-phenyl hydroxyl phosphine oxides is (1~1.2): 1.
5. a kind of preparation method of high heat-conductivity conducting coating material according to claim 2, it is characterised in that: step (2)
In, the molar ratio of polymer shown in graphene, Nanometer Copper and formula (I) is (0.04~0.06): (0.04~0.06): 1,
In, polymer shown in formula (I) uses meter with 4,4 '-diamino-phenyl hydroxyl phosphine oxides.
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810849892.0A CN109266219A (en) | 2018-07-28 | 2018-07-28 | A kind of high heat-conductivity conducting coating material and preparation method thereof |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810849892.0A CN109266219A (en) | 2018-07-28 | 2018-07-28 | A kind of high heat-conductivity conducting coating material and preparation method thereof |
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| CN109266219A true CN109266219A (en) | 2019-01-25 |
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| CN201810849892.0A Withdrawn CN109266219A (en) | 2018-07-28 | 2018-07-28 | A kind of high heat-conductivity conducting coating material and preparation method thereof |
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Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102220597A (en) * | 2011-05-20 | 2011-10-19 | 湖南大学 | Preparation method of conducting polymer-graphene composition |
| KR20160012438A (en) * | 2014-07-24 | 2016-02-03 | 한국전기연구원 | Highly conductive ink manufacturing method using two-demensional nanostructured materials |
| CN107216850A (en) * | 2017-06-20 | 2017-09-29 | 东莞市联洲知识产权运营管理有限公司 | A kind of highly conductive organic silicon adhesive of high heat conduction and preparation method thereof |
-
2018
- 2018-07-28 CN CN201810849892.0A patent/CN109266219A/en not_active Withdrawn
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102220597A (en) * | 2011-05-20 | 2011-10-19 | 湖南大学 | Preparation method of conducting polymer-graphene composition |
| KR20160012438A (en) * | 2014-07-24 | 2016-02-03 | 한국전기연구원 | Highly conductive ink manufacturing method using two-demensional nanostructured materials |
| CN107216850A (en) * | 2017-06-20 | 2017-09-29 | 东莞市联洲知识产权运营管理有限公司 | A kind of highly conductive organic silicon adhesive of high heat conduction and preparation method thereof |
Non-Patent Citations (1)
| Title |
|---|
| 赵伟: "聚合型磷基阻燃剂合成及对环氧树脂的阻燃机理研究", 《中国博士学位论文全文数据库 工程科技Ⅰ辑》 * |
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