CN109257922B - Electronic component mounting apparatus and electronic component mounting method - Google Patents

Abstract

The invention provides an electronic component mounting device and an electronic component mounting method capable of inhibiting poor mounting. The electronic component mounting apparatus mounts an electronic component having a body and a projection projecting from the body on a substrate having an opening provided on a surface thereof. The electronic component mounting device comprises: a suction nozzle that holds the body; a detection device for detecting a relative position between the main body and the front end of the projection in a predetermined plane parallel to the surface of the substrate; and a control unit that determines whether or not to mount the electronic component on the substrate based on an error between the target relative position and a detected relative position indicating the relative position detected by the detection device.

Description

Electronic component mounting apparatus and electronic component mounting method

Technical Field

The invention relates to an electronic component mounting apparatus and an electronic component mounting method.

Background

The electronic component mounting device has a suction nozzle for holding an electronic component, and the electronic component held by the suction nozzle is mounted on a substrate. As an electronic component, there is a so-called insertion type electronic component (lead type electronic component) as disclosed in, for example, patent document 1. The insertion type electronic component has a body and a lead protruding from the body. The insertion-type electronic component is mounted on the substrate by inserting the lead into an opening provided on the surface of the substrate.

Patent document 1: japanese laid-open patent publication No. 62-143497

When the base end portion of the lead of the electronic component is bent, even if the relative position between the tip portion of the lead and the opening of the substrate is detected, the lead may be inserted into the opening of the substrate while adjusting the relative position, and a mounting failure may occur. That is, when the base end portion of the lead is bent, the lead may be forcibly inserted into the opening of the substrate by adjusting only the relative position between the tip end portion of the lead and the opening of the substrate, and the lead may receive a load. As a result, the lead may be deformed, and a mounting failure may occur.

Disclosure of Invention

An object of an embodiment of the present invention is to provide an electronic component mounting apparatus and an electronic component mounting method that can suppress the occurrence of mounting failure.

According to the 1 st aspect of the present invention, there is provided an electronic component mounting apparatus for mounting an electronic component having a body and a projection projecting from the body on a substrate having an opening provided on a surface thereof, the electronic component mounting apparatus comprising: a suction nozzle that holds the body; a detecting device that detects a relative position between the main body and a tip end portion of the projection within a predetermined plane parallel to a surface of the substrate; and a control unit that determines whether or not to mount the electronic component on the substrate based on an error between a target relative position and a detected relative position indicating the relative position detected by the detection device.

According to the 2 nd aspect of the present invention, there is provided an electronic component mounting method for mounting an electronic component having a body and a projection projecting from the body on a substrate having an opening provided on a surface thereof, the electronic component mounting method comprising the steps of: detecting a relative position between the body and a tip end of the projection within a predetermined plane parallel to a surface of the substrate; determining whether or not to mount the electronic component on the substrate based on an error between a target relative position and a detected relative position indicating the detected relative position; and determining a movement path of the suction nozzle holding the main body based on the detected relative position and the size of the bump when it is determined that the electronic component is mounted on the board, moving the suction nozzle based on the movement path, and inserting the bump into the opening.

ADVANTAGEOUS EFFECTS OF INVENTION

According to an aspect of the present invention, an electronic component mounting apparatus and an electronic component mounting method are provided that can suppress the occurrence of mounting defects.

Drawings

Fig. 1 is a perspective view showing an example of an electronic component mounting apparatus according to the present embodiment.

Fig. 2 is a view schematically showing an example of the mounting head according to the present embodiment.

Fig. 3 is a side view schematically showing an example of an electronic component according to the present embodiment.

Fig. 4 is a plan view schematically showing an example of an electronic component according to the present embodiment.

Fig. 5 is a perspective view schematically showing an example of the imaging apparatus according to the present embodiment.

Fig. 6 is a functional block diagram showing an example of the computer system according to the present embodiment.

Fig. 7 is a diagram schematically showing an example of an imaging operation of the imaging device according to the present embodiment.

Fig. 8 is a schematic diagram for explaining a method of calculating contrast according to the present embodiment.

Fig. 9 is a schematic diagram for explaining the smoothing of the contrast according to the present embodiment.

Fig. 10 is a diagram schematically showing a relationship between a distance between an electronic component and an imaging device according to the present embodiment and a contrast of a pixel of interest.

Fig. 11 is a diagram for explaining a method of calculating a focus position according to the present embodiment.

Fig. 12 is a diagram showing an example of an all-focus image of the electronic component according to the present embodiment.

Fig. 13 is a side view schematically showing an example of an electronic component according to the present embodiment.

Fig. 14 is a diagram showing an example of an all-focus image of the electronic component according to the present embodiment.

Fig. 15 is a side view schematically showing an example of an electronic component according to the present embodiment.

Fig. 16 is a diagram showing an example of an all-focus image of the electronic component according to the present embodiment.

Fig. 17 is a diagram for explaining a movement path of the suction nozzle according to the present embodiment.

Fig. 18 is a diagram schematically showing a state in which a lead of an electronic component according to the present embodiment is inserted into an opening of a substrate.

Fig. 19 is a diagram schematically showing a state in which a lead of an electronic component according to the present embodiment is inserted into an opening of a substrate.

Fig. 20 is a flowchart showing an example of the electronic component mounting method according to the present embodiment.

Description of the reference numerals

A 4 … control section, a 5 … image processing section, a 10 … suction nozzle, a 20 … lighting device, a 21 … casing, a 22 … light emitting element, a 23 … light emitting element, a 24 … opening, a 25 … opening, a 30 … imaging device, a 31 … optical system, a 32 … image sensor, a 41 … arithmetic processing device, a 42 … storage device, a 43 … input-output interface, a 100 … electronic component mounting device, a 101 … base frame, a 102 … feeder housing, a 103 … substrate transport device, a 104 … substrate clamping mechanism, a 105 … base plate, a 106 … mounting head, a 107 … mounting head moving device, a 108 … X axis guide rail, a 109 … Y axis guide rail, a 110 … X driving device, a 111 … Y driving device, a 112 … suction nozzle moving device, a 113 … Z driving device, a 114 … θ Z driving device, a 200 …, a … mounting control section, a … lighting control section, a 685412 lighting control section 413, a … imaging distance setting section 414, 421 387387-4 plan data storage section, 422 … program storage section, 423 … component data storage section, 424 … allowable value storage section, 300 … detection device, 511 … image data acquisition section, 512 … contrast calculation section, 513 … distance measurement processing section, 514 … all-focus image generation section, 515 … relative position calculation section, 415 … determination section, 416 … movement path determination section, … opposite-focus position storage section, 522 … all-focus image storage section, … optical axis, B … base end section, C … electronic component, Cb … body, Cl … lead wire (bump), Cl … 1 st lead wire (1 st bump), Cl … nd lead wire (2 nd bump), FP 4 focus, H … distance, HF … focus position, L … length, M …, P … substrate, PK … aperture, … component supply position, … mounting position, T … front end section.

Detailed Description

Embodiments according to the present invention will be described below with reference to the drawings, but the present invention is not limited thereto. The constituent elements of the embodiments described below can be combined as appropriate. In addition, some of the components may not be used.

In the following description, an XYZ rectangular coordinate system is set, and the positional relationship of each portion is described with reference to the XYZ rectangular coordinate system. A direction parallel to the X axis in a predetermined plane is referred to as an X axis direction, a direction parallel to the Y axis orthogonal to the X axis in a predetermined plane is referred to as a Y axis direction, and a direction parallel to a Z axis orthogonal to each of the X axis and the Y axis is referred to as a Z axis direction. The rotation direction or the tilt direction about the X axis is defined as the θ X direction, the rotation direction or the tilt direction about the Y axis is defined as the θ Y direction, and the rotation direction or the tilt direction about the Z axis is defined as the θ Z direction. The prescribed plane is an XY plane. The Z axis is orthogonal to the predetermined plane. In the present embodiment, the predetermined plane is parallel to the horizontal plane. The Z-axis direction is a vertical direction. The predetermined surface may be inclined with respect to the horizontal plane.

[ electronic component mounting apparatus ]

Fig. 1 is a perspective view showing an example of an electronic component mounting apparatus 100 according to the present embodiment. The electronic component mounting apparatus 100 mounts the electronic component C on the substrate P. As shown in fig. 1, the electronic component mounting apparatus 100 includes: a base frame 101; a feeder container 102 in which a feeder 200 for supplying the electronic component C is installed; a substrate transfer device 103 that transfers the substrate P; a substrate clamping mechanism 104 provided in a transport path of the substrate transport device 103 and holding the substrate P; a mounting head 106 that supports the suction nozzle 10 capable of holding the electronic component C; a mounting head moving device 107 capable of moving the mounting head 106 in the XY plane; a nozzle transfer device 112 provided in the mounting head 106 and capable of transferring the nozzles 10 in the Z-axis direction and the θ Z direction with respect to the mounting head 106; an illumination device 20 that illuminates the electronic component C held by the suction nozzle 10; an imaging device 30 that images the electronic component C held by the suction nozzle 10; and a computer system 40.

The base frame 101 supports the feeder container 102, the substrate transport device 103, the mounting head 106, the mounting head moving device 107, and the imaging device 30.

The feeder receptacle 102 supports the feeder 200. The feeder 200 is an electronic component feeding device that feeds the electronic components C. The feeder 200 feeds the electronic component C to the component feeding position PJa. The component supply position PJa is a position where a component supply process for supplying the electronic component C from the supplier 200 to the nozzle 10 is performed. The component feeding position PJa includes a position opposing the electronic component C fed from the feeder 200.

The substrate transport apparatus 103 includes: a base plate 105; and a conveyor belt which is provided above the base plate 105 and can convey the substrate P. The substrate P is conveyed in the X-axis direction by a conveyor belt of the substrate conveyor 103. The substrate chucking mechanism 104 holds the substrate P in the conveyance path of the substrate conveyance device 103. The substrate clamping mechanism 104 clamps both ends of the substrate P in the Y-axis direction.

The substrate chucking mechanism 104 holds the substrate P at a mounting position PJb where the mounting process is performed. The substrate clamping mechanism 104 holds the substrate P such that the surface of the substrate P is parallel to the XY plane. The mounting position PJb is a position at which a mounting process for mounting the electronic component C on the substrate P is performed. The mounting position PJb includes a position facing the substrate P on which the electronic component C is mounted.

The mounting head 106 has the nozzles 10 holding the electronic components C, and mounts the electronic components C held by the nozzles 10 on the board P held by the board clamping mechanism 104. The mounting head 106 holds the electronic component C supplied from the feeder 200 by the suction nozzle 10 and mounts the electronic component C on the surface of the substrate P. The mounting head 106 is movable in an XY plane including a component supply position PJa where component supply processing is performed and a mounting position PJb where mounting processing is performed.

The mounting head moving device 107 moves the mounting head 106 above the substrate P and above the feeder 200. The mounting head moving device 107 can move the mounting head 106 within an XY plane including a component supply position PJa facing the electronic component C supplied from the supplier 200 and a mounting position PJb facing the substrate P on which the electronic component C is mounted. The movable range of the mounting head 106, which is realized by the mounting head moving device 107, includes the working area of the mounting head 106. The mounting head 106 can move in the XY plane by the operation of the mounting head moving device 107.

The mounting head moving device 107 has: an X-axis guide rail 108 that guides the mounting head 106 in the X-axis direction; a Y-axis guide 109 that guides the X-axis guide 108 in the Y-axis direction; an X drive device 110 that generates power for moving the mounting head 106 in the X-axis direction; and a Y drive device 111 that generates power for moving the mounting head 106 in the Y axis direction.

The mounting head 106 is supported by an X-axis guide rail 108. The X drive device 110 includes an actuator such as a motor, and generates power for moving the mounting head 106 supported by the X-axis guide 108 in the X-axis direction. By the operation of the X drive device 110, the mounting head 106 moves in the X axis direction while being guided by the X axis guide 108.

The X-axis rail 108 is supported by the Y-axis rail 109. The Y drive device 111 includes an actuator such as a motor, and generates power for moving the X-axis rail 108 supported by the Y-axis rail 109 in the Y-axis direction. By the operation of the Y drive device 111, the X-axis guide rail 108 moves in the Y-axis direction while being guided by the Y-axis guide rail 109. If the X-axis guide 108 moves in the Y-axis direction, the mounting head 106 supported by the X-axis guide 108 moves in the Y-axis direction together with the X-axis guide 108. In the present embodiment, the Y drive device 111 moves the mounting head 106 in the Y axis direction via the X axis guide 108.

[ mounting head ]

Fig. 2 is a diagram schematically showing an example of the mounting head 106 according to the present embodiment. The mounting head 106 has the suction nozzle 10 which detachably holds the electronic component C. The suction nozzle 10 is a suction nozzle that suctions and holds the electronic component C. A suction port connected to a vacuum source is provided at the tip of the suction nozzle 10. The electronic component C is sucked and held by the suction nozzle 10 by performing suction by a vacuum source in a state where the tip of the suction nozzle 10 is in contact with the electronic component C. By releasing the suction by the vacuum source, the electronic component C is released from the suction nozzle 10. The suction nozzle 10 may be a holding suction nozzle that holds the electronic component C by sandwiching it.

The mounting head 106 is movable within the XY plane so that the suction nozzles 10 are arranged at each of the component supply position PJa and the mounting position PJb. The mounting head 106 holds the electronic component C supplied from the feeder 200 by the suction nozzle 10 and mounts the electronic component C on the substrate P.

The suction nozzle 10 holds the electronic component C supplied from the feeder 200 at the component supply position PJa. After holding the electronic component C at the component supply position PJa, the suction nozzle 10 is transported to the mounting position PJb and mounted on the board P. After the electronic component C is mounted on the substrate P at the mounting position PJb, the nozzle 10 releases the electronic component C. Thereby, the electronic component C is mounted on the substrate P.

The mounting head 106 supports the suction nozzle 10 movably in the Z-axis direction and the θ Z direction. The mounting head 106 has a nozzle transfer device 112 capable of transferring the nozzles 10 in the Z-axis direction and the θ Z direction. The nozzle moving device 112 includes: a Z driving device 113 that moves the suction nozzle 10 in the Z-axis direction; and a θ Z driving device 114 that moves (rotates) the suction nozzle 10 in the θ Z direction. The Z drive unit 113 includes an actuator such as a motor, and generates power for moving the suction nozzle 10 in the Z-axis direction. The oz driving device 114 includes an actuator such as a motor, and generates power for moving the suction nozzle 10 in the oz direction.

The nozzles 10 are movable in 4 directions of the X axis, the Y axis, the Z axis, and θ Z by the mounting head moving device 107 and the nozzle moving device 112 provided in the mounting head 106. The nozzle 10 may be movable in 6 directions of X, Y, Z, θ X, θ Y, and θ Z.

[ electronic component ]

Fig. 3 is a side view schematically showing an example of an electronic component C according to the present embodiment. Fig. 4 is a plan view schematically showing an example of the electronic component C according to the present embodiment, and is a view of the electronic component C as viewed from below.

The electronic component C is an insertion type electronic component. As shown in fig. 3 and 4, the electronic component C includes: an ontology Cb; and a lead Cl that is a projection from the body Cb.

The main body Cb includes a cover member made of synthetic resin. In the internal space of the body Cb, for example, a coil is disposed. The lead Cl is a metal bump. The lead wire Cl is connected to a coil disposed in the internal space of the body Cb. The lead wire Cl protrudes downward from the lower surface of the body Cb.

In the present embodiment, the lead Cl includes: a 1 st lead Cl1 as a 1 st bump and a 2 nd lead Cl2 as a 2 nd bump. That is, 2 leads Cl are provided in the body Cb.

The suction nozzle 10 holds the body Cb. The electronic component mounting apparatus 100 inserts the leads Cl of the electronic component C into the opening provided on the surface of the substrate P in a state where the body Cb is held by the suction nozzle 10. The electronic component C is mounted on the substrate P by inserting the lead Cl into the opening of the substrate P.

[ image pickup apparatus ]

Fig. 5 is a perspective view schematically showing an example of the imaging device 30 according to the present embodiment. The imaging device 30 images the electronic component C held by the suction nozzle 10 and illuminated by the illumination device 20. The photographing device 30 is supported by the base frame 101. The imaging device 30 images the electronic component C held by the nozzle 10 from below.

The imaging device 30 includes: an optical system 31; and an image sensor 32 that receives light passing through the optical system 31. The position of the focal point of the optical system 31 is fixed. That is, the optical system 31 is a fixed focus lens, and the imaging device 30 is a fixed focus camera. The optical axis AX of the optical system 31 is parallel to the Z-axis.

The image sensor 32 includes a ccd (charge device) image sensor or a cmos (complementary Metal Oxide semiconductor) image sensor. The imaging device 30 images the electronic component C to acquire image data of the electronic component C.

The illumination device 20 illuminates the electronic component C held by the suction nozzle 10 with illumination light. The illumination device 20 is disposed above the imaging device 30. The lighting device 20 includes: a housing 21; a light emitting element 22 provided on the upper part of the case 21; and a light emitting element 23 provided at a lower portion of the housing 21.

The outer shape of the housing 21 in the XY plane is a square shape. An opening 24 is provided in an upper portion of the housing 21. An opening 25 is provided in the lower portion of the housing 21. A plurality of light emitting elements 22 are disposed on the upper portion of the housing 21 so as to surround the opening 24. A plurality of light emitting elements 23 are disposed at the lower portion of the housing 21 so as to surround the opening 25.

The nozzle 10 can hold the electronic component C so that the electronic component C faces the optical system 31 of the imaging device 30. The Z drive device 113 can move the nozzle 10 in the Z axis direction in a state where the electronic component C held by the nozzle 10 and the optical system 31 of the imaging device 30 face each other.

The Z drive device 113 moves the nozzle 10 holding the electronic component C in the Z axis direction, and adjusts the distance H between the electronic component C and the imaging device 30 in the Z axis direction parallel to the optical axis AX of the optical system 31. The Z drive device 113 functions as a drive device for adjusting the distance H between the electronic component C and the imaging device 30. The distance H between the electronic component C and the imaging device 30 adjusted by the Z drive device 113 is a distance in the Z axis direction parallel to the optical axis AX of the optical system 31.

The distance H between the electronic component C and the imaging device 30 in the Z-axis direction includes the distance between the region of interest of the electronic component C and the imaging device 30. The distance H between the electronic component C and the imaging device 30 may be a distance between the part of interest of the electronic component C and a surface of a lens closest to the focal point FP of the optical system 31 among the plurality of lenses of the optical system 31 of the imaging device 30, a distance between the part of interest of the electronic component C and the incident surface of the image sensor 32 of the imaging device 30, or a distance between the part of interest of the electronic component C and the focal point FP of the optical system 31 of the imaging device 30.

As described above, the optical system 31 is a fixed focus lens. In the present embodiment, the distance H between the electronic component C and the imaging device 30 in the Z-axis direction is set to be the distance between the focused part of the electronic component C and the focal point FP of the optical system 31 of the imaging device 30.

When the electronic component C is photographed by the photographing device 30, the computer system 40 controls the Z driving device 113 to move the electronic component C held by the nozzle 10 to the internal space of the housing 21 through the opening 24. The computer system 40 controls the illumination device 20 to emit illumination light from each of the light-emitting elements 22 and 23. Thereby, the electronic component C disposed in the internal space of the housing 21 is illuminated by the illumination light. The imaging device 30 images the electronic component C held by the suction nozzle 10 and illuminated by the illumination device 20 from below through the opening 25.

[ computer System ]

Fig. 6 is a functional block diagram showing an example of the computer system 40 according to the present embodiment. The computer system 40 includes, for example, a personal computer. The computer system 40 has: an arithmetic Processing unit 41 including a processor such as a cpu (central Processing unit); a storage device 42 including a volatile memory such as a ram (random Access memory) and a nonvolatile memory such as a rom (read Only memory); and an input-output interface 43.

The illumination device 20, the imaging device 30, the X drive device 110, the Y drive device 111, the Z drive device 113, and the θ Z drive device 114 are each connected to the input/output interface 43 of the computer system 40. Further, the photographing device 30 and the computer system 40 are connected by a LAN cable. The illumination device 20, the imaging device 30, the X drive device 110, the Y drive device 111, the Z drive device 113, and the θ Z drive device 114 are each controlled by the computer system 40.

The arithmetic processing device 41 includes: a control unit 4 that controls the electronic component mounting apparatus 100; and an image processing unit 5 that performs image processing on the image data of the electronic component C acquired by the imaging device 30.

The control unit 4 includes: a mounting control unit 411 that outputs a control signal for performing mounting processing; an illumination control unit 412 that outputs a control signal for controlling the illumination device 20; an imaging control unit 413 that outputs a control signal for controlling the imaging device 30; a distance setting unit 414 that sets a distance between the electronic component C and the imaging device 30 when the electronic component C is imaged by the imaging device 30; a determination unit 415 that determines whether or not to mount the electronic component C on the substrate P based on the relative position between the main body Cb and the tip T of the lead Cl in the XY plane; and a movement path determining part 416 for determining the movement path of the nozzle 10 when the lead wire Cl is inserted into the opening of the substrate P.

The storage device 42 has: a schedule data storage unit 421 that stores schedule data for the mounting process; a program storage unit 422 that stores a computer program for controlling the installation process; a component data storage unit 423 that stores component data indicating the external shape of the electronic component C mounted on the substrate P; and an allowable value storage unit 424 that stores an allowable value used for determining whether or not the electronic component C is mounted on the board P.

The plan data includes at least one of a list of electronic components C to be mounted on the substrate P, a mounting order of the electronic components C, and a mounting position of the electronic components C on the substrate P.

The component data includes the external dimensions of the main body Cb of the electronic component C in each of the X-axis direction, the Y-axis direction, and the Z-axis direction. In addition, the component data includes the size (length L) of the lead Cl in the Z-axis direction protruding from the lower surface of the body Cb. In addition, the component data includes a target relative position between the body Cb and the tip end portion T of the lead line Cl in the XY plane. The target relative position between the body Cb and the tip portions T of the leads Cl is an ideal relative position between the body Cb and the tip portions T of the leads Cl, and is a relative position between the body Cb and the tip portions T of the leads Cl in the design data of the electronic component C. In addition, the part data includes the target relative position between the leading end T of the 1 st lead Cl1 and the leading end T of the 2 nd lead Cl2 in the XY plane. The target relative position between the leading end portion T of the 1 st lead Cl1 and the leading end portion T of the 2 nd lead Cl2 is an ideal relative position between the leading end portion T of the 1 st lead Cl1 and the leading end portion T of the 2 nd lead Cl2, and is a relative position between the leading end portion T of the 1 st lead Cl1 and the leading end portion T of the 2 nd lead Cl2 in the design data of the electronic component C.

The installation control unit 411 reads the schedule data from the schedule data storage unit 421, and reads the computer program from the program storage unit 422. In the mounting process of the electronic component C, the mounting control unit 411 outputs a control signal to at least one of the X drive device 110 and the Y drive device 111, moves the mounting head 106 to the component supply position PJa of the feeder 200, outputs a control signal to the Z drive device 113 to lower the suction nozzle 10, and holds the electronic component C placed at the component supply position PJa by the suction nozzle 10, in accordance with the schedule data and the computer program. After the electronic component C is held by the suction nozzle 10, the mounting control unit 411 outputs a control signal to at least one of the X drive device 110 and the Y drive device 111 according to plan data and a computer program, moves the mounting head 106 to the mounting position PJb, outputs a control signal to the Z drive device 113 to lower the suction nozzle 10, and mounts the electronic component C held by the suction nozzle 10 on the board P. The mounting control unit 411 performs mounting processing for all the electronic components C specified in the plan data.

The illumination control unit 412 outputs a control signal for controlling the light emitting operation of the light emitting elements 22 and 23 of the illumination device 20. The illumination device 20 illuminates the electronic component C disposed in the internal space of the housing 21 at a predetermined timing based on a control signal output from the illumination control unit 412.

The imaging control unit 413 outputs a control signal for controlling the imaging operation of the imaging device 30. The imaging device 30 images the electronic component C disposed in the internal space of the housing 21 at a predetermined timing based on the control signal output from the imaging control unit 413.

The distance setting unit 414 sets the distance H between the electronic component C and the imaging device 30 when the electronic component C is imaged by the imaging device 30. In the present embodiment, when the electronic component C and the imaging device 30 are separated by a plurality of different distances H, the electronic component C is imaged by the imaging device 30. The distance setting unit 414 sets a plurality of distances H between the electronic component C and the imaging device 30 when the electronic component C is imaged by the imaging device 30.

Before the electronic component C held by the nozzle 10 is mounted on the board P, the electronic component C held by the nozzle 10 is imaged by the imaging device 30. The control unit 4 controls the Z driving device 113 so that the electronic components C are arranged at different positions in the Z axis direction. The imaging device 30 images the electronic components C arranged at different positions in the Z-axis direction from below.

Fig. 7 is a diagram schematically showing an example of an imaging operation of the imaging device 30 according to the present embodiment. As shown in fig. 7, when the region of interest of the electronic component C and the imaging device 30 are separated by a plurality of different distances H, the imaging operation of the electronic component C by the imaging device 30 is performed.

The distance setting unit 414 sets a plurality of distances H between the focus point FP of the optical system 31 of the imaging device 30 and the focus point of the electronic component C such that the focus point FP of the optical system 31 of the imaging device 30 is located on the front side (-Z side) and the rear side (+ Z side), respectively.

The imaging device 30 images the electronic component C and acquires image data of the electronic component C when the electronic component C and the focal point FP of the optical system 31 of the imaging device 30 are separated by a plurality of different distances H. In other words, the imaging device 30 operates the Z driving device 113 to capture a plurality of image data of the electronic component C while changing the distance H between the electronic component C and the focal point FP of the optical system 31 of the imaging device 30.

In the present embodiment, the region of interest of the electronic component C includes at least the body Cb of the electronic component C and the tip T of the lead Cl of the electronic component C. The distance setting unit 414 sets the distance H between the part of interest of the electronic component C and the focal point FP of the optical system 31 so that the part of interest of the electronic component C is positioned on the front side (-Z side) of the focal point FP of the optical system 31 in one of the plurality of imaging operations, and sets the distance H between the part of interest of the electronic component C and the focal point FP of the optical system 31 so that the part of interest of the electronic component C is positioned on the rear side (+ Z side) of the focal point FP of the optical system 31 in the other imaging operation.

The position of the focal point FP of the optical system 31 in the Z-axis direction is, for example, known data derived from specification data of the optical system 31. In addition, the position of the tip of the suction nozzle 10 in the Z-axis direction is detected based on the driving amount of the Z-drive device 113. Further, a position sensor for detecting the position of the tip of the suction nozzle 10 in the Z-axis direction may be provided, and the position of the tip of the suction nozzle 10 in the Z-axis direction may be detected by the position sensor. The outer dimensions of the main body Cb and the length L of the lead Cl of the electronic component C are derived from the component data stored in the component data storage unit 423. Therefore, the distance setting unit 414 can calculate the position of the region of interest of the electronic component C in the Z-axis direction based on the position of the tip of the nozzle 10 in the Z-axis direction and the component data of the electronic component C held by the nozzle 10. The distance setting unit 414 can set the plurality of distances H such that the part of interest of the electronic component C is arranged in the vicinity of the focal point FP in one of the plurality of imaging operations and the part of interest of the electronic component C is arranged on the front side and the rear side of the focal point FP in the other imaging operation, based on the position of the focal point FP of the optical system 31 and the part data of the electronic component C.

In fig. 6, the image processing unit 5 performs image processing on the image data of the electronic component C acquired by the imaging device 30. The plurality of image data of the electronic component C captured by the imaging device 30 while changing the distance H is output to the computer system 40.

The image processing unit 5 generates a full focus image of the electronic component C based on a plurality of image data of the electronic component C captured by the imaging device 30 while changing the distance H. Further, the image processing unit 5 calculates the relative position between the main body Cb and the tip end portion T of the lead Cl in the XY plane parallel to the surface of the substrate P based on the all-focus image of the electronic component C. Further, the image processing unit 5 calculates the relative position between the tip T of the 1 st lead Cl1 and the tip T of the 2 nd lead Cl2 in the XY plane parallel to the surface of the substrate P based on the all-focus image of the electronic component C.

In the present embodiment, the detection device 300 is configured by the imaging device 30 and the image processing unit 5, the imaging device 30 includes the optical system 31, the image processing unit 5 generates an all-focus image of the electronic component C based on the plurality of image data of the electronic component C while changing the distance H between the electronic component C and the focal point FP of the optical system 31, the image processing unit 5 calculates the relative position between the body Cb and the tip portion T of the lead Cl, and the detection device 300 detects the relative position between the body Cb and the tip portion T of the lead Cl within the XY plane parallel to the surface of the substrate P. In the following description, the imaging device 30 and the image processing unit 5 are combined and appropriately referred to as a detection device 300.

The control unit 4 determines whether or not to mount the electronic component C on the board P based on the relative position between the main body Cb and the tip end portion T of the lead Cl in the XY plane detected by the detection device 300. When it is determined that electronic component C is mounted on board P, controller 4 adjusts the position of electronic component C in the XY plane orthogonal to optical axis AX of optical system 31 based on the all-focus image of electronic component C generated by image processor 5, and mounts electronic component C on board P. The control unit 4 calculates the position of the tip of the lead Cl of the electronic component C in the XY plane based on the all-focus image of the electronic component C, controls the head moving device 107, and adjusts the position of the electronic component C held by the suction nozzle 10 in the XY plane so that the lead Cl is inserted into the opening of the substrate P.

The image processing unit 5 includes: an image data acquisition unit 511 that acquires image data of the electronic component C captured by the imaging device 30; a contrast calculation unit 512 that calculates a contrast in each pixel of the image data; a distance measurement processing unit 513 that calculates a focus position HF of the region of interest of the electronic component C based on the calculated contrast; an all-focus image generating unit 514 that generates an all-focus image of the electronic component C based on the calculated focus position HF; and a relative position calculating unit 515 that calculates a relative position between the main body Cb of the electronic component C and the tip end portion T of the lead line Cl in the XY plane based on the generated all-focus image of the electronic component C.

The storage device 42 has: an in-focus position storage unit 521 for storing the in-focus position HF calculated by the distance measurement processing unit 513; and an all-focus image storage unit 522 that stores the all-focus image generated by the all-focus image generation unit 514.

The image data acquiring unit 511 acquires a plurality of image data of the electronic component C captured by the imaging device 30 when the electronic component C and the imaging device 30 are separated by a plurality of different distances H.

The plurality of image data of the electronic component C acquired by the image data acquiring unit 511 are generated by converting an analog image signal output from the imaging device 30 into a digital image signal. The image data includes a plurality of pixels. The image data acquired by the image data acquisition unit 511 indicates the detected luminance values for each of the plurality of pixels.

The contrast calculation unit 512 calculates the contrast of each of the same target pixels including the target region of the electronic component C in the plurality of image data.

Fig. 8 is a schematic diagram for explaining a method of calculating contrast according to the present embodiment. The coordinate value in the XY plane of a pixel of interest which is a calculation target of contrast is set as (I, j), the luminance value of the pixel of interest (I, j) is set as I (I, j), the luminance value of a pixel separated by a distance dx in the + X direction from the pixel of interest (I, j) is set as I (I + dx, j), the luminance value of a pixel separated by a distance dx in the-X direction from the pixel of interest (I, j) is set as I (I-dx, j), the luminance value of a pixel separated by a distance dy in the + Y direction from the pixel of interest (I, j) is set as I (I, j + dy), the luminance value of a pixel separated by a distance dx in the-Y direction from the pixel of interest (I, j) is set as I (I, j-dy), the luminance value of a pixel separated by a distance dx in the + X direction from the pixel of interest (I, j) and a distance dy in the + Y direction from the pixel of interest (I, j) is set as I (I + dy), j + dy), where I (I + dx, j-dy) represents the luminance value of a pixel separated by a distance dx in the + X direction from the target pixel (I, j) and by a distance dy in the-Y direction, I (I-dx, j-dy) represents the luminance value of a pixel separated by a distance dx in the-X direction from the target pixel (I, j) and by a distance dy in the-Y direction, and I (I-dx, j-dy) represents the luminance value of a pixel separated by a distance dx in the-X direction from the target pixel (I, j) and by a distance dy in the + Y direction, the contrast Lm (I, j) of the target pixel (I, j) is calculated based on expression (1).

[ formula 1 ]

That is, as shown in expression (1), the contrast calculation unit 512 calculates the total sum of the differences between the luminance values of the 8 pixels around the target pixel (i, j) and the luminance value of the target pixel as the contrast Lm (i, j) in the target pixel (i, j).

The distance dx and the distance dy are predetermined integers, and may be 1 pixel or 10 pixels, for example.

Note that the method of calculating the contrast Lm (i, j) in the pixel of interest (i, j) may not be based on the expression (1).

After calculating the contrast Lm (i, j) in the pixel of interest (i, j), the contrast calculation unit 512 performs smoothing in accordance with expression (2) on the basis of the contrast Lm (i, j) for all pixels in the image data.

[ formula 2 ]

Fig. 9 is a schematic diagram for explaining the smoothing of the contrast according to the present embodiment. As shown in fig. 9, when the contrast is smoothed for the target pixel, the contrast calculation unit 512 smoothes the contrast by averaging the contrast values of all pixels in the addition region centered on the target pixel. In the example shown in fig. 9, the addition area is a square area with 2N +1 sides. N is a predetermined integer, and is appropriately selected according to the resolution, for example.

The contrast calculation unit 512 calculates and smoothes the contrast L for each of all pixels of the plurality of image data. In the present embodiment, the processing for calculating the contrast Lm based on expression (1) corresponds to the filtering processing of 1 st order, and the processing for smoothing the contrast Lm based on expression (2) corresponds to the filtering processing of 2 nd order.

As described above, the contrast value (2-step filter value) obtained by smoothing is calculated for each of all pixels of the plurality of image data.

Fig. 10 is a diagram schematically showing a relationship between a distance between the electronic component C and the imaging device 30 according to the present embodiment and a contrast of a pixel of interest. A plurality of image data of the electronic component C captured by the imaging device 30 when the electronic component C and the imaging device 30 are separated by a plurality of different distances H are acquired.

The distance measurement processing unit 513 calculates the focus position HF in the pixel of interest based on the smoothed contrast of the pixel of interest. The distance measurement processing unit 513 calculates a focus position HF of at least a region of interest of the electronic component C in the pixel of interest. The target portion of the electronic component C is included in the target pixel. The focus position HF in the pixel of interest including the region of interest of the electronic component C is calculated.

The closer the region of interest of the electronic component C in the pixel of interest is to the focus position HF, the higher the contrast value. The focus position HF is a position where a focus point of the electronic component C coincides with the focal point FP of the optical system 31.

Fig. 11 is a diagram for explaining a method of calculating the focal point position HF according to the present embodiment. Fig. 11 is a graph showing a relationship between the distance H between the electronic component C and the photographing device 30 and the contrast of the pixel of interest. Fig. 11 corresponds to a diagram extracted as a part of fig. 10. In the graph shown in fig. 11, the horizontal axis shows the distance H between the electronic component C and the imaging device 30, and the vertical axis shows the contrast in the pixel of interest including the region of interest of the electronic component C.

In the present embodiment, the focus position HF of the region of interest of the electronic component C in the pixel of interest is calculated based on a plurality of contrasts for the same pixel of interest.

In the example shown in fig. 11, image data of the electronic component C is acquired in a state where the distance H between the electronic component C and the imaging device 30 is changed in a plurality of stages, and the contrast of each pixel of interest in the same image data is calculated. The closer the object is disposed to the focal point FP of the optical system 31, that is, the closer to the focus position HP, the higher the contrast value is. The contrast curve is obtained by smoothing a plurality of contrasts. The focus position HF of the region of interest of the electronic component C in the pixel of interest is calculated based on the distance between the electronic component C and the imaging device 30, which shows the maximum value of the contrast in the contrast curve.

In the present embodiment, the region of interest of electronic component C includes at least the outer shape of main body Cb of electronic component C and tip T of lead Cl of electronic component C. The distance measurement processing unit 513 calculates a focus position HF of the outer shape of the body Cb in the pixel of interest. The distance measurement processing unit 513 calculates the focus position HF of the tip portion T of the lead line Cl in the pixel of interest. The calculated in-focus position HF of the outer shape of the main body Cb and the in-focus position HF of the tip portion T of the lead Cl are stored in the in-focus position storage unit 521.

In the present embodiment, the out-of-focus position HF of the outer shape of the main body Cb in the pixel of interest and the in-focus position HF of the tip portion T of the lead line Cl are calculated, and the in-focus position HF in a plurality of pixels including each of a plurality of portions of the electronic component C is calculated. The in-focus positions of a plurality of portions of the electronic component C in each of the plurality of pixels are stored in the in-focus position storage unit 521.

The all-focus image generating unit 514 generates an all-focus image of the electronic component C based on the focus positions HF in a plurality of pixels including each of the plurality of portions of the electronic component C. The all-focus image generating unit 514 generates an all-focus image based on the focus position HF in each of the plurality of pixels stored in the focus position storage unit 521. Thereby, an all-focus image in focus is generated for each of the plurality of pixels. The generated all-focus image is stored in the all-focus image storage unit 522.

The relative position calculating unit 515 calculates the relative position between the main body Cb and the tip T of the lead Cl in the XY plane based on the all-focus image of the electronic component C generated by the all-focus image generating unit 514. In the present embodiment, the relative position calculating unit 515 calculates the outer shape of the main body Cb held by the nozzle 10 and the relative positions in the XY plane of the tip T of the 1 st lead Cl1 and the tip T of the 2 nd lead Cl2 based on the all-focus image of the electronic component C.

The determination unit 415 determines whether or not to mount the electronic component C on the substrate P based on the relative position between the body Cb and the tip end portion T of the lead Cl in the XY plane calculated by the relative position calculation unit 515.

The determination section 415 determines whether or not to mount the electronic component C on the substrate P based on the error Δ a between the detected relative position Las indicating the relative position between the body Cb and the tip end portion T of the lead line Cl in the XY plane calculated by the relative position calculation section 515 and the target device position Lar indicating the relative position between the body Cb and the tip end portion T of the lead line Cl in the XY plane stored in the component data storage section 423.

The determination unit 415 determines whether or not to mount the electronic component C on the substrate P based on an error Δ b between a detected relative position Lbs indicating a relative position between the tip end portion T of the 1 st lead Cl1 and the tip end portion T of the 2 nd lead Cl2 in the XY plane calculated by the relative position calculation unit 515 and a target device position Lbr indicating a relative position between the tip end portion T of the 1 st lead Cl1 and the tip end portion T of the 2 nd lead Cl2 in the XY plane stored in the component data storage unit 423.

In the present embodiment, the position of the body Cb in the XY plane detected by the detection device 300 is the position of the center point As of the lower surface of the body Cb in the XY plane detected by the detection device 300. The position of the body Cb in the XY plane stored in the component data storage unit 423 is assumed to be the position of the center point Ar of the lower surface of the body Cb in the XY plane stored in the component data storage unit 423.

The position of the lead Cl in the XY plane detected by the detector 300 is a position of an intermediate point Bs between the tip T of the 1 st lead Cl1 and the tip T of the 2 nd lead Cl2 in the XY plane detected by the detector 300. The position of the lead line Cl in the XY plane stored in the component data storage unit 423 is set to be a position of an intermediate point Br between the tip end T of the 1 st lead line Cl1 and the tip end T of the 2 nd lead line Cl2 in the XY plane stored in the component data storage unit 423.

The detection relative position Las between the body Cb and the tip end portion T of the lead wire Cl is set As the distance between the center point As and the intermediate point Bs in the all-focus image. The target relative position Lar between the body Cb and the tip end T of the lead Cl is a distance between the center point Ar and the intermediate point Br in the design data. The error Δ a is a difference between the distance Las and the distance Lar.

The detected relative position Lbs between the leading end portion T of the 1 st lead Cl1 and the leading end portion T of the 2 nd lead Cl2 is a distance between the leading end portion T of the 1 st lead Cl1 and the leading end portion T of the 2 nd lead Cl2 in the all-focus image. The target relative position Lbr between the leading end portion T of the 1 st lead Cl1 and the leading end portion T of the 2 nd lead Cl2 is a distance between the leading end portion T of the 1 st lead Cl1 and the leading end portion T of the 2 nd lead Cl2 in the design data. Let the error Δ b be the difference between the distance Lbs and the distance Lbr.

Fig. 12 is a diagram showing an example of an all-focus image of the electronic component C shown in fig. 3. Fig. 12 corresponds to an all-focus image when the electronic component C is viewed from below.

In the electronic component C shown in fig. 3, the base end portion B of the lead Cl is not bent, but projects straight downward from the lower surface of the body Cb, and the 1 st lead Cl1 and the 2 nd lead Cl2 are parallel to each other. The shape of the electronic component C shown in fig. 3 is an ideal shape, and is similar to the shape of the electronic component C in the design data stored in the component data storage portion 423. The detected relative position Las indicating the relative position between the body Cb detected by the detection device 300 and the tip end portion T of the lead wire Cl is approximated to the target relative position Lar indicating the relative position between the body Cb of the electronic component C and the tip end portion T of the lead wire Cl in the design data stored in the component data storage portion 423. In addition, the detected relative position Lbs indicating the relative position between the leading end portion T of the 1 st lead Cl1 and the leading end portion T of the 2 nd lead Cl2 detected by the detection device 300 and the target device position Lbr indicating the relative position between the leading end portion T of the 1 st lead Cl1 and the leading end portion T of the 2 nd lead Cl2 in the design data stored in the component data storage portion 423 are approximated.

Note that the center point Ar and the intermediate point Br in the design data coincide with each other, and the target relative position Lar is not shown in fig. 12.

As shown in fig. 12, the error Δ a between the detected relative position Las between the body Cb and the leading end portion T of the lead line Cl in the all-focus image detected by the detection device 300 and the target relative position Lar between the body Cb and the leading end portion T of the lead line Cl stored in the component data storage portion 423 is small. In addition, the error Δ b between the detected relative position Lbs between the leading end portion T of the 1 st lead Cl1 and the leading end portion T of the 2 nd lead Cl2 in the all-focus image detected by the detection device 300 and the target relative position Lbr between the leading end portion T of the 1 st lead Cl1 and the leading end portion T of the 2 nd lead Cl2 stored in the component data storage portion 423 is small.

Fig. 13 is a side view schematically showing an example of an electronic component C according to the present embodiment. Fig. 14 is a diagram showing an example of an all-focus image of the electronic component C shown in fig. 13. Fig. 14 corresponds to an all-focus image when the electronic component C is viewed from below.

In the electronic component C shown in fig. 13, although the 1 st lead Cl1 and the 2 nd lead Cl2 are parallel to each other, the base end portion B of the lead Cl is bent and protrudes in an oblique direction from the lower surface of the main body Cb. The shape of the electronic component C shown in fig. 13 is different from the shape of the electronic component C in the design data stored in the component data storage portion 423. The detected relative position Las indicating the relative position between the body Cb detected by the detection device 300 and the tip end portion T of the lead wire Cl is different from the target relative position Lar indicating the relative position between the body Cb of the electronic component C and the tip end portion T of the lead wire Cl in the design data stored in the component data storage portion 423. On the other hand, since the 1 st lead Cl1 and the 2 nd lead Cl2 are parallel to each other, the detected relative position Lbs indicating the relative position between the tip end portion T of the 1 st lead Cl1 and the tip end portion T of the 2 nd lead Cl2 detected by the detection device 300 is approximate to the target device position Lbr indicating the relative position between the tip end portion T of the 1 st lead Cl1 and the tip end portion T of the 2 nd lead Cl2 in the design data stored in the component data storage portion 423.

As shown in fig. 14, an error Δ a between the detected relative position Las between the body Cb and the leading end portion T of the lead line Cl in the all-focus image detected by the detection device 300 and the target relative position Lar between the body Cb and the leading end portion T of the lead line Cl stored in the component data storage portion 423 is large. On the other hand, the 1 st lead Cl1 and the 2 nd lead Cl2 are parallel, and therefore the error Δ b between the detected relative position Lbs between the leading end portion T of the 1 st lead Cl1 and the leading end portion T of the 2 nd lead Cl2 in the all-focus image detected by the detection apparatus 300 and the target relative position Lbr between the leading end portion T of the 1 st lead Cl1 and the leading end portion T of the 2 nd lead Cl2 stored in the component data storage portion 423 is small.

Fig. 15 is a side view schematically showing an example of an electronic component C according to the present embodiment. Fig. 16 is a diagram showing an example of an all-focus image of the electronic component C shown in fig. 15. Fig. 16 corresponds to an all-focus image when the electronic component C is viewed from below.

In the electronic component C shown in fig. 15, the base end portion B of the lead Cl is bent and protrudes in a direction inclined from the lower surface of the main body Cb. In addition, the 1 st lead Cl1 and the 2 nd lead Cl2 are not parallel to each other and protrude in different directions. The shape of the electronic component C shown in fig. 16 is different from the shape of the electronic component C in the design data stored in the component data storage portion 423. The detected relative position Las indicating the relative position between the body Cb detected by the detection device 300 and the tip end portion T of the lead wire Cl is different from the target relative position Lar indicating the relative position between the body Cb of the electronic component C and the tip end portion T of the lead wire Cl in the design data stored in the component data storage portion 423. In addition, the detected relative position Lbs indicating the relative position between the leading end portion T of the 1 st lead Cl1 and the leading end portion T of the 2 nd lead Cl2 detected by the detection device 300 is different from the target device position Lbr indicating the relative position between the leading end portion T of the 1 st lead Cl1 and the leading end portion T of the 2 nd lead Cl2 in the design data stored in the component data storage portion 423.

As shown in fig. 16, the error Δ a between the detected relative position Las between the front end portions T of the body Cb and the lead wires Cl in the all-focus image detected by the detection device 300 and the target relative position Lar between the front end portions T of the body Cb and the lead wires Cl stored in the component data storage portion 423 is small. In addition, the error Δ b between the detected relative position Lbs between the leading end portion T of the 1 st lead Cl1 and the leading end portion T of the 2 nd lead Cl2 in the all-focus image detected by the detection device 300 and the target relative position Δ Lbr between the leading end portion T of the 1 st lead Cl1 and the leading end portion T of the 2 nd lead Cl2 stored in the component data storage portion 423 is large.

In the present embodiment, the determination unit 415 determines that the electronic component C is not mounted on the substrate P when determining that the error Δ b of the detected relative position Lbs between the leading end portion T of the 1 st lead Cl1 and the leading end portion T of the 2 nd lead Cl2 is larger than the 1 st allowable value stored in the allowable value storage unit 424. That is, when the electronic component C is in the state described with reference to fig. 15 and 16, the determination unit 415 determines not to mount the electronic component C on the substrate P.

When the determination unit 415 determines that the error Δ b of the detected relative position Lbs between the tip end portion T of the 1 st lead Cl1 and the tip end portion T of the 2 nd lead Cl2 is less than or equal to the 1 st allowable value stored in the allowable value storage unit 424 and the error Δ a of the detected relative position Las between the body Cb and the tip end portion T of the lead Cl is greater than the 2 nd allowable value, it determines that the electronic component C is not mounted on the substrate P. That is, in the state where the electronic component C is described with reference to fig. 13 and 14, although the 1 st lead Cl1 and the 2 nd lead Cl2 are parallel to each other, the determination section 415 determines that the electronic component C is not mounted on the substrate P when the 1 st lead Cl1 and the 2 nd lead Cl2 are excessively inclined.

When the determination unit 415 determines that the error Δ b of the detected relative position Lbs between the tip end portion T of the 1 st lead Cl1 and the tip end portion T of the 2 nd lead Cl2 is equal to or less than the 1 st allowable value and the error Δ a of the detected relative position Las between the body Cb and the tip end portion T of the lead Cl is equal to or less than the 2 nd allowable value, it determines that the electronic component C is mounted on the substrate P. That is, when the electronic component C is in the state described with reference to fig. 3 and 12 or when the electronic component C is in the state described with reference to fig. 13 and 14, and the inclination of the 1 st lead Cl1 and the 2 nd lead Cl2 is small, the determination unit 415 determines that the electronic component C is mounted on the substrate P.

The movement path determination unit 416 determines the movement path of the nozzle 10 when the lead wire Cl is inserted into the opening of the substrate P.

When determining that the error Δ a of the detected relative position Las between the main body Cb and the leading end portion T of the lead wire Cl is equal to or smaller than the 2 nd allowable value, the movement path determining unit 416 determines the movement path of the nozzle 10 when inserting the lead wire Cl into the opening of the substrate P, based on the detected relative position Las between the main body Cb and the leading end portion T of the lead wire Cl and the length L of the lead wire Cl stored in the component data storage unit 423. That is, when the 1 st lead Cl1 and the 2 nd lead Cl2 of the electronic component C are inclined as described above with reference to fig. 13 and 14, the movement path of the nozzle 10 is optimized in accordance with the inclination of the 1 st lead Cl1 and the 2 nd lead Cl2 so that the 1 st lead Cl1 and the 2 nd lead Cl2 are inserted into the opening of the substrate P.

When it is determined that the error Δ a of the detected relative position Las between the main body Cb and the tip end portion T of the lead Cl is equal to or smaller than the 2 nd allowable value, the movement path determination unit 416 determines the movement path of the nozzle 10 holding the main body Cb so that the base end portion B of the lead Cl changes from the 1 st state in which the tip end portion T of the lead Cl is positioned in the opening of the substrate P to the 3 rd state in which the base end portion B of the lead Cl is positioned in the opening of the substrate P through the 2 nd state in which the middle portion M of the lead Cl is positioned in the opening of the substrate P, based on the detected relative position Las and the length L of the lead Cl.

Fig. 17 is an explanatory diagram for explaining a movement path of the suction nozzle 10 according to the present embodiment. As shown in fig. 17, the position of the base end portion B of the lead Cl and the length L of the lead Cl on the lower surface of the main body Cb are known data stored in the component data storage portion 423. Therefore, the movement path determining unit 416 can calculate the distance W between the base end portion B and the tip end portion T of the lead wire Cl in the XY plane based on the detected relative position Las between the main body Cb and the tip end portion T of the lead wire Cl detected by the detecting device 300. The focusing position HF of the distal end portion T is calculated by the distance measurement processing unit 513. Therefore, the movement path determination unit 416 can calculate the distance H between the base end portion B and the tip end portion T in the Z-axis direction. The movement path determination unit 416 can calculate the angle θ indicating the inclination of the lead line Cl based on the length L, the distance W, and the distance H of the lead line Cl. The movement path determining unit 416 determines the movement path of the nozzle 10 when the lead Cl is inserted into the opening PK of the substrate P based on the angle θ so that the base end portion B of the lead Cl is in the 3 rd state of the opening PK of the substrate P through the 2 nd state where the middle portion M of the lead Cl is located in the opening PK of the substrate P from the 1 st state where the tip end portion T of the lead Cl is located in the opening PK of the substrate P.

After the movement path is determined, as shown in fig. 17, the mounting controller 411 moves the nozzle 10 holding the main body Cb in the XY plane so that the tip T of the lead Cl is positioned at the center of the opening PK.

With the main body Cb held by the nozzle 10, the lead Cl is imaged by the imaging device 30, and the position of the tip T of the lead Cl in the XY plane is determined. The position of the substrate P in the XY plane is detected by a substrate position detection device (not shown). The substrate position detection device detects a reference mark provided on the surface of the substrate P, for example. The positional relationship between the reference mark and the opening PK is known data that can be obtained from design data of the substrate P, for example. This determines the position of the opening PK in the XY plane. Thereby, the positional relationship between the tip end portion T of the lead Cl and the opening PK of the substrate P in the XY plane is calculated. Therefore, the mounting controller 411 can position the tip end portion T of the lead Cl at the center of the opening PK of the substrate P.

Next, the mounting controller 411 moves the nozzle 10 in the-Z direction while moving in the XY plane so that the middle portion M of the lead C is positioned in the opening PK from the 1 st state where the tip portion T of the lead Cl is positioned in the opening PK to the 2 nd state.

Fig. 18 is a diagram schematically showing a state in which the lead Cl of the electronic component C according to the present embodiment is inserted into the opening PK of the substrate P. The nozzle 10 holding the main body Cb moves in the-Z direction while moving in the XY plane, and thereby changes from the 1 st state in which the tip end portion T of the lead Cl is positioned at the opening PK of the substrate P as shown in fig. 17 to the 2 nd state in which the middle portion M of the lead Cl is positioned at the opening PK of the substrate P as shown in fig. 18.

The mounting control unit 411 releases the holding of the electronic component C by the nozzle 10 when the intermediate portion M of the lead Cl is positioned at the opening PK of the substrate P in the moving path of the nozzle 10. In the present embodiment, when the intermediate portion M of the lead Cl is positioned at the opening PK of the substrate P, the suction by the vacuum source connected to the suction port of the suction nozzle 10 is released. Thereby, the electronic component C is released from the suction nozzle 10.

Fig. 19 is a diagram schematically showing a state in which the lead Cl of the electronic component C according to the present embodiment is inserted into the opening PK of the substrate P. When the intermediate portion M of the lead Cl is positioned at the opening PK, the holding of the electronic component C by the nozzle 10 is released, and thereby the state changes from the 2 nd state in which the intermediate portion M of the lead Cl is positioned at the opening PK of the substrate P as shown in fig. 18 to the 3 rd state in which the base end portion B of the lead Cl is positioned at the opening PK of the substrate P as shown in fig. 19. In the present embodiment, when the intermediate portion M of the lead Cl is positioned at the opening PK, the electronic component C is moved in the-Z direction by gravity (self-weight) by releasing the holding of the electronic component C by the nozzle 10. The lead wire Cl is guided by the opening PK, and the electronic component C moves in the-Z direction while moving in the XY plane.

[ mounting method of electronic Components ]

Fig. 20 is a flowchart showing an example of the electronic component mounting method according to the present embodiment. The mounting control section 411 moves the suction nozzle 10 to the component supply position PJa, and holds the electronic component C supplied from the feeder 200 by the suction nozzle 10. The mounting control unit 411 moves the nozzle 10 holding the electronic component C to the imaging device 30.

The imaging control unit 413 controls the imaging device 30 to capture a plurality of image data of the electronic component C while changing the distance H between the electronic component C held by the nozzle 10 and the focal point FP of the optical system 31. The plurality of image data are output to the image processing unit 5. The image processing unit 5 generates an all-focus image of the electronic component C based on the plurality of image data of the electronic component C, and detects the relative position between the main body Cb and the tip T of the lead Cl in the XY plane. Further, the image processing unit 5 detects the relative position between the tip portion T of the 1 st lead Cl1 and the tip portion T of the 2 nd lead Cl2 in the XY plane based on the all-focus image of the electronic component C (step S10).

The determination section 415 determines whether or not the error Δ b between the detected relative position Lbs and the target relative position Lbr between the leading end portion T of the 1 st lead Cl1 and the leading end portion T of the 2 nd lead Cl2 is less than or equal to the 1 st allowable value (step S20).

In step S20, when determining that the error Δ b is less than or equal to the 1 st allowable value (step S20: Yes), the determination section 415 determines whether or not the error Δ a between the detected relative position Las and the target relative position Lar between the body Cb and the leading end portion T of the lead wire Cl is less than or equal to the 2 nd allowable value (step S30).

When it is determined in step S30 that error Δ a is equal to or smaller than the 2 nd allowable value (step S30: Yes), determination unit 415 determines that electronic component C is mounted on board P.

The movement path determination unit 416 determines the movement path of the nozzle 10 holding the main body Cb, based on the detected relative position Las and the length L of the lead line Cl (step S40).

The mounting control section 411 moves the suction nozzle 10 holding the electronic component C to the mounting position PJb. The mounting control section 411 moves the suction nozzle 10 based on the movement path determined by the movement path determining section 416, and inserts the lead Cl of the electronic component C into the opening PK of the substrate P. Thus, as described with reference to fig. 17 to 19, from the 1 st state in which the tip end portion T of the lead Cl is positioned at the opening PK of the substrate P, the 2 nd state in which the intermediate portion M of the lead Cl is positioned at the opening of the substrate P is changed to the 3 rd state in which the base end portion B of the lead Cl is positioned at the opening PK of the substrate P. The base end portion B of the lead Cl is positioned at the opening PK of the substrate P, whereby the electronic component C is mounted on the substrate P (step S50).

When determining in step S20 that error Δ b is greater than the 1 st allowable value (No in step S20), determination unit 415 determines not to mount electronic component C on board P (step S60). The electronic component C held by the suction nozzle 10 is discarded, for example.

When determining in step S30 that the error Δ a is larger than the 2 nd allowable value (No in step S30), the determination unit 415 determines not to mount the electronic component C on the board P (step S60). The electronic component C held by the suction nozzle 10 is discarded, for example.

[ Effect ]

As described above, according to the present embodiment, in the insertion-type electronic component, the relative position between the body Cb and the tip portion T of the lead Cl is detected by the detection device 300. By detecting the relative position between the main body Cb and the distal end portion T of the lead Cl, it is possible to detect that the base end portion B of the lead Cl of the electronic component C is bent, as described with reference to fig. 13, for example. For example, in the case of detecting only the tip portion T of the lead Cl, as described with reference to fig. 13, if the 1 st lead Cl1 and the 2 nd lead Cl2 are parallel, the electronic component C may be erroneously recognized as being normal based on the relative position between the tip portion T of the 1 st lead Cl1 and the tip portion T of the 2 nd lead Cl2 even though the base end portion B is bent. Even if the base end portion B of the lead Cl is bent, when the relative position between the tip end portion T of the 1 st lead Cl1 and the tip end portion T of the 2 nd lead Cl2 is normal, the tip end portion T of the 1 st lead Cl1 and the tip end portion T of the 2 nd lead Cl2 can be inserted into the opening PK of the substrate P, and therefore, the mounting operation of the electronic component C in which the base end portion B of the lead Cl is bent is performed. When the base end portion B of the lead Cl is bent, if the nozzle 10 holding the electronic component C is moved straight in the-Z direction after the tip end portion T of the lead Cl is inserted into the opening PK of the substrate P, the lead Cl is forcibly inserted into the opening PK of the substrate P, and the lead Cl may receive a load. As a result, the lead Cl may be deformed, and a mounting failure may occur.

According to the present embodiment, the relative position between the body Cb and the tip end portion T of the lead Cl is detected by the detection device 300, and based on the detection result, it is determined whether or not the base end portion B of the lead Cl is bent. When it is determined that the base end portion B of the lead Cl is bent largely, the electronic component C is not mounted on the substrate P, thereby suppressing the occurrence of a mounting failure. This suppresses the production of defective devices and the reduction in productivity.

In addition, according to the present embodiment, the detection device 300 includes: an imaging device 30 having an optical system 31, which captures a plurality of image data of the electronic component C while changing a distance H between the electronic component C and a focal point FP of the optical system 31; and an image processing unit 5 that generates a full focus image of the electronic component C based on the plurality of image data of the electronic component C and calculates a detected relative position. This allows the relative position between the main body Cb and the tip portion T of the lead wire Cl to be detected with high accuracy based on the all-focus image of the electronic component C.

In addition, according to the present embodiment, the detection device 300 detects the relative positions in the XY plane of the body Cb held by the nozzle 10, the tip T of the 1 st lead Cl1, and the tip T of the 2 nd lead Cl 2. When the control unit 4 determines that the error Δ b of the detected relative position Lbs between the leading end portion T of the 1 st lead Cl1 and the leading end portion T of the 2 nd lead Cl2 is greater than the 1 st allowable value, it determines that the electronic component C is not mounted on the substrate P. When the error Δ b is large, the 1 st lead Cl1 and the 2 nd lead Cl2 cannot be inserted into the 2 openings PK of the substrate P, respectively. According to the present embodiment, the relative positions of the body Cb held by the suction nozzle 10, the tip T of the 1 st lead Cl1, and the tip T of the 2 nd lead Cl2 in the XY plane are detected. Therefore, it is appropriately determined whether or not the electronic component C can be mounted on the board P.

Further, according to the present embodiment, when determining that the error Δ b of the detected relative position Lbs is equal to or less than the 1 st allowable value and the error Δ a of the detected relative position Las between the main body Cb and the tip end portion T of the lead wire Cl is greater than the 2 nd allowable value, the control portion 4 determines not to mount the electronic component C on the substrate P. If the lead line Cl is greatly inclined even if the error Δ b is less than or equal to the 1 st allowable value and the error Δ a is greater than the 2 nd allowable value, if the electronic component C is attempted to be mounted on the substrate P, there is a high possibility that a mounting failure occurs. According to the present embodiment, when the error Δ b is less than or equal to the 1 st allowable value and the error Δ a is greater than the 2 nd allowable value, the mounting operation of the electronic component C on the substrate P is not performed. Therefore, the occurrence of mounting failure is suppressed, and the production of defective devices is suppressed.

Further, according to the present embodiment, the control portion 4 determines that the electronic component C is mounted on the substrate P when determining that the error Δ b between the detected relative position Lbs and the target relative position Lbr between the leading end portion T of the 1 st lead Cl1 and the leading end portion T of the 2 nd lead Cl2 is less than or equal to the 1 st allowable value and the error Δ a between the detected relative position Las and the target relative position Lar between the body Cb and the leading end portion T of the lead Cl is less than or equal to the 2 nd allowable value. When both the error Δ b and the error Δ a are small, it can be determined that the lead Cl of the electronic component C is normal.

Further, according to the present embodiment, when it is determined that the error Δ a between the detected relative position Las and the target relative position Lar between the body Cb and the tip end portion T of the lead wire Cl is less than or equal to the 2 nd allowable value, the movement path of the nozzle 10 is determined so that the nozzle 10 moves in the tilt direction based on the detected relative position Las and the length L of the lead wire Cl. Thus, when the base end portion B of the lead Cl is not bent largely, the movement path of the nozzle 10 is determined in accordance with the angle θ of the lead Cl, and the electronic component C can be mounted on the substrate P. Therefore, the number of electronic components C to be discarded can be suppressed.

Further, according to the present embodiment, when the intermediate portion M of the lead Cl is positioned at the opening PK of the substrate P in the movement path of the nozzle 10 in the oblique direction, the control unit 4 releases the holding of the electronic component C by the nozzle 10. Thus, the lead wire Cl is guided by the opening PK and is smoothly inserted into the opening PK by the action of gravity (dead weight) of the electronic component C.

In the above-described embodiment, when the base end portion B of the lead Cl is bent largely and the error Δ B is larger than the 1 st allowable value or the error Δ a is larger than the 2 nd allowable value, the bending of the lead Cl may be corrected by using a lead corrector based on the error Δ B or the error Δ a without discarding the electronic component C.

In the above-described embodiment, the main body Cb is provided with 2 lead lines Cl. The number of the leads Cl may be 3 or more, or may be only 1. When the number of the leads Cl provided in the main body Cb is 1, the control unit 4 can determine that the electronic component C is not mounted on the substrate P when determining that the error in the detected relative position between the main body Cb and the tip end portions T of the leads Cl is greater than the 2 nd allowable value, and can determine that the electronic component C is mounted on the substrate P when determining that the error in the detected relative position between the main body Cb and the tip end portions T of the leads Cl is less than or equal to the 2 nd allowable value.

In the above-described embodiment, it is assumed that an all-focus image of the electronic component C is generated, and the relative position between the main body Cb and the tip portion T of the lead Cl is detected based on the all-focus image of the electronic component C. The method of using the all-focus image is not limited as long as the relative position between the body Cb and the tip end portion of the lead Cl can be detected, and any method may be used. For example, the relative position between the body Cb of the electronic component C and the tip T of the lead Cl can be detected based on the result of light reception of the laser light when the body Cb and the lead Cl are irradiated with the laser light, respectively. The position of the tip T of the lead line Cl may be detected based on the all-focus image, and the position of the main body Cb may be detected based on the result of receiving the laser light when the laser light is irradiated.

Further, in the above-described embodiment, the protrusion protruding from the body Cb may not be the lead line Cl. For example, in the case where a boss as a projection for positioning the electronic component C and the substrate P is provided on the body of the electronic component C, the relative position between the body and the tip of the boss may be detected, and based on the relative position, it may be determined whether or not the electronic component C is mounted on the substrate P.

In the above-described embodiment, the distance between the electronic component C and the imaging device 30 is adjusted by moving the nozzle 10 holding the electronic component C in the Z-axis direction by the operation of the Z driving device 113. An imaging device moving device capable of moving the imaging device 30 in the Z-axis direction may be provided, and the distance between the electronic component C and the imaging device 30 may be adjusted by the operation of the imaging device moving device. Further, the distance between the electronic component C and the imaging device 30 may be adjusted by moving both the electronic component C and the imaging device 30 in the Z-axis direction.

Claims (8)

1. An electronic component mounting apparatus for mounting an electronic component having a body and a projection projecting from the body on a substrate having an opening provided on a surface thereof,

the electronic component mounting apparatus includes:

a suction nozzle that holds the body;

a detecting device that detects a relative position between the main body and a tip end portion of the projection within a predetermined plane parallel to a surface of the substrate; and

a control section that determines whether or not to mount the electronic component on the substrate based on an error between a target relative position and a detected relative position indicating the relative position detected by the detection device,

the detection device has: an imaging device having an optical system, and configured to image a plurality of image data of the electronic component while changing a distance between the electronic component and a focal point of the optical system; and an image processing unit that generates an all-focus image of the electronic component based on a plurality of image data of the electronic component and calculates the detected relative position.

2. The electronic component mounting apparatus according to claim 1,

the protrusions include a 1 st protrusion and a 2 nd protrusion,

the detection device detects relative positions of the main body held by the suction nozzle, the tip of the 1 st projection, and the tip of the 2 nd projection within the predetermined plane,

the control unit determines not to mount the electronic component on the substrate when determining that the error in the detected relative position between the 1 st bump tip portion and the 2 nd bump tip portion is larger than a 1 st allowable value.

3. The electronic component mounting apparatus according to claim 2,

the control unit determines not to mount the electronic component on the substrate when determining that an error in the detected relative position between the tip end portion of the 1 st bump and the tip end portion of the 2 nd bump is less than or equal to a 1 st allowable value and an error in the detected relative position between the body and the tip end portion of the bump is greater than a 2 nd allowable value.

4. The electronic component mounting apparatus according to claim 2,

the control unit determines that the electronic component is mounted on the substrate when it is determined that an error in the detected relative position between the tip end portion of the 1 st bump and the tip end portion of the 2 nd bump is equal to or smaller than a 1 st allowable value and an error in the detected relative position between the body and the tip end portion of the bump is equal to or smaller than a 2 nd allowable value.

5. The electronic component mounting apparatus according to claim 1,

the control unit determines not to mount the electronic component on the substrate when determining that the error in the detected relative position between the main body and the tip portion of the bump is larger than a 2 nd allowable value, and determines to mount the electronic component on the substrate when determining that the error in the detected relative position between the main body and the tip portion of the bump is smaller than or equal to the 2 nd allowable value.

6. The electronic component mounting apparatus according to claim 4 or 5,

the control unit determines a movement path of the nozzle holding the main body so that the movement path changes from a 1 st state in which the tip portion of the protrusion is positioned in the opening to a 3 rd state in which the base end portion of the protrusion is positioned in the opening through a 2 nd state in which the middle portion of the protrusion is positioned in the opening, based on the detected relative position and the size of the protrusion, when it is determined that an error in the detected relative position between the main body and the tip portion of the protrusion is less than or equal to a 2 nd allowable value, the control unit outputs a control signal for moving the nozzle based on the movement path,

the movement path includes a path along which the suction nozzle moves in a direction perpendicular to the surface of the substrate and in a direction parallel to the surface of the substrate.

7. The electronic component mounting apparatus according to claim 6,

the control portion releases the holding of the electronic component by the suction nozzle when the intermediate portion of the projection is positioned at the opening in the moving path.

8. An electronic component mounting method for mounting an electronic component having a body and a projection projecting from the body on a substrate having an opening provided on a surface thereof,

the electronic component mounting method includes the steps of:

detecting a relative position between the main body and a tip end of the projection within a predetermined plane parallel to a surface of the substrate;

determining whether or not to mount the electronic component on the substrate based on an error between a target relative position and a detected relative position indicating the detected relative position; and

determining a movement path of a suction nozzle holding the main body based on the detected relative position and the size of the bump when it is determined that the electronic component is mounted on the board, moving the suction nozzle based on the movement path, and inserting the bump into the opening,

the step of detecting includes the steps of:

a step of having an optical system and shooting a plurality of image data of the electronic component while changing a distance between the electronic component and a focal point of the optical system; and

and generating an all-focus image of the electronic component based on a plurality of image data of the electronic component, and calculating the detected relative position.

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