CN109246268B

CN109246268B - Electronic device

Info

Publication number: CN109246268B
Application number: CN201811428393.0A
Authority: CN
Inventors: 杨鑫
Original assignee: Guangdong Oppo Mobile Telecommunications Corp Ltd
Current assignee: Guangdong Oppo Mobile Telecommunications Corp Ltd
Priority date: 2018-11-27
Filing date: 2018-11-27
Publication date: 2024-05-07
Anticipated expiration: 2038-11-27
Also published as: CN109246268A

Abstract

The application provides an electronic device. The electronic device comprises a main board, a first imaging module, a receiver and a receiver circuit board. The first imaging module is connected with the main board, is a rear camera of the electronic device and is a periscope camera, and the length direction of the first imaging module extends along the longitudinal direction of the electronic device; the receiver is connected with the main board and is positioned at one side of the first imaging module; the receiver circuit board is connected with the receiver, the receiver circuit board is connected with the main board through a contact, and the contact is positioned on the top side of the first imaging module in the length direction. In the electronic device provided by the embodiment of the application, the receiver circuit board is connected with the main board through the contact positioned at the top side of the length direction of the first imaging module, so that the space can be more reasonably utilized, and the structure of the electronic device is more compact.

Description

Electronic device

Technical Field

The present disclosure relates to electronic devices, and particularly to an electronic device.

Background

In the related art, in order to support various functions of an electronic device, various devices such as a front camera, a rear camera, a receiver, a flash lamp, and the like are added into the electronic device, and each of the devices occupies a certain independent space, so that the structure of the electronic device is not compact.

Disclosure of Invention

In view of the above, the present application provides an electronic device.

An electronic device according to an embodiment of the present application includes:

A main board;

The first imaging module is connected with the main board, is a rear camera of the electronic device and is a periscope camera, and the length direction of the first imaging module extends along the longitudinal direction of the electronic device;

The receiver is connected with the main board and is positioned at one side of the first imaging module;

and the receiver circuit board is connected with the main board through a contact, and the contact is positioned on the top side of the first imaging module in the length direction.

In the electronic device provided by the embodiment of the application, the receiver circuit board is connected with the main board through the contact positioned at the top side of the length direction of the first imaging module, so that the space can be more reasonably utilized, and the structure of the electronic device is more compact.

Additional aspects and advantages of the application will be set forth in part in the description which follows, and in part will be obvious from the description, or may be learned by practice of the application.

Drawings

The foregoing and/or additional aspects and advantages of the present application will become apparent and readily appreciated from the following description of the embodiments, taken in conjunction with the accompanying drawings, in which:

FIG. 1 is a schematic plan view of an electronic device according to an embodiment of the present application;

FIG. 2 is a schematic view of a portion of an electronic device according to an embodiment of the present application;

FIG. 3 is a schematic view of another portion of a camera assembly according to an embodiment of the present application;

FIG. 4 is a schematic perspective view of a first imaging module according to an embodiment of the application;

FIG. 5 is an exploded view of a first imaging module according to an embodiment of the present application;

FIG. 6 is a schematic cross-sectional view of a first imaging module according to an embodiment of the application;

FIG. 7 is a schematic partial cross-sectional view of a first imaging module according to an embodiment of the application;

FIG. 8 is a schematic cross-sectional view of a first imaging module according to another embodiment of the application;

Fig. 9 is a schematic perspective view of a retroreflective element according to an embodiment of the present application.

FIG. 10 is a schematic diagram of a light reflection imaging of an imaging module in the related art;

FIG. 11 is a schematic diagram of a light reflection imaging of a first imaging module according to an embodiment of the application;

FIG. 12 is a schematic diagram of an imaging module in the related art;

fig. 13 is a schematic structural diagram of a first imaging module according to an embodiment of the application.

Description of main reference numerals:

The electronic device 1000, the main board 110, the first mounting hole 112, the second mounting hole 114, the first imaging module 20, the module circuit board 205, the receiver 120, the receiver circuit board 122, the front camera 130, the flash 140, the connector 150, and the contact 160;

The camera module 100, the first imaging module 20, the housing 21, the light inlet 211, the groove 212, the top wall 213, the side wall 214, the avoidance hole 215, the reflective element 22, the light inlet surface 222, the backlight surface 224, the light inlet surface 226, the light outlet surface 228, the mounting base 23, the arc surface 231, the first lens module 24, the lens 241, the moving element 25, the clip 222, the first image sensor 26, the driving mechanism 27, the driving device 28, the arc guide 281, the central axis 282, the chip circuit board 201, the mounting portion 2011, the connection portion 2022, the driving chip 202, the sensor circuit board 203, the second imaging module 30, and the bracket 50.

Detailed Description

Embodiments of the present application are described in detail below, examples of which are illustrated in the accompanying drawings, wherein the same or similar reference numerals refer to the same or similar elements or elements having the same or similar functions throughout. The embodiments described below by referring to the drawings are exemplary only for explaining the present application and are not to be construed as limiting the present application.

In the description of the present application, it should be understood that the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "clockwise", "counterclockwise", etc. indicate orientations or positional relationships based on the orientations or positional relationships shown in the drawings are merely for convenience in describing the present application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, be configured and operated in a specific orientation, and thus should not be construed as limiting the present application. Furthermore, the terms "first," "second," and the like, are used for descriptive purposes only and are not to be construed as indicating or implying a relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defining "a first" or "a second" may explicitly or implicitly include one or more of the described features. In the description of the present application, the meaning of "a plurality" is two or more, unless explicitly defined otherwise.

In the description of the present application, it should be noted that, unless explicitly specified and limited otherwise, the terms "mounted," "connected," and "connected" are to be construed broadly, and may be either fixedly connected, detachably connected, or integrally connected, for example; can be mechanically connected, electrically connected or can be communicated with each other; can be directly connected or indirectly connected through an intermediate medium, and can be communicated with the inside of two elements or the interaction relationship of the two elements. The specific meaning of the above terms in the present application can be understood by those of ordinary skill in the art according to the specific circumstances.

The following disclosure provides many different embodiments, or examples, for implementing different features of the application. In order to simplify the present disclosure, components and arrangements of specific examples are described below. They are, of course, merely examples and are not intended to limit the application. Furthermore, the present application may repeat reference numerals and/or letters in the various examples, which are for the purpose of brevity and clarity, and which do not themselves indicate the relationship between the various embodiments and/or arrangements discussed. In addition, the present application provides examples of various specific processes and materials, but one of ordinary skill in the art will recognize the application of other processes and/or the use of other materials.

Under the conditions that the periscope type camera falls, the reflecting element in the periscope type camera is easy to generate position deviation, the reflecting element cannot accurately turn light to the image sensor, and the image sensor cannot accurately sense an object image outside the periscope type camera and cannot be used normally.

Referring to fig. 1,2 and 3, an electronic device 1000 according to an embodiment of the application includes a main board 110, a first imaging module 20, a receiver 120, a receiver circuit board 122, a front camera 130, a flash 140 and a second imaging module 30.

The first imaging module 20 is a rear camera of the electronic device 1000 and is a periscope camera, and the length direction of the first imaging module 20 extends along the longitudinal direction of the electronic device 1000; the receiver 120 is connected with the main board 110, and the receiver 120 is positioned at one side of the first imaging module 20; the receiver circuit board 122 is connected to the receiver 120, and the receiver circuit board 122 is connected to the main board through the contact 160, and the contact 160 is located on the top side of the first imaging module 20 in the length direction.

In the electronic device 1000 according to the embodiment of the application, the receiver circuit board 122 is connected to the main board 110 through the contact 160 located at the top side of the first imaging module 20 in the longitudinal direction, so that the space can be more reasonably utilized, and the structure of the electronic device 1000 can be more compact.

Note that the "top side" herein refers to a side of the first imaging module 20 that is close to the receiver 120 in the length direction. The motherboard 110 is a main circuit board of the electronic device 1000, and is a control component of the electronic device 1000.

By way of example, the electronic apparatus 1000 may be any of various types of computer system devices that are mobile or portable and that perform wireless communications (only one form of which is shown by way of example in FIG. 1). In particular, the electronic apparatus 1000 may be a mobile phone or a smart phone (e.g., an iPhone-based (TM) -based phone), a Portable game device (e.g., nintendo DS (TM), playStation Portable (TM), gameboy ADVANCE TM, iPhone (TM)), a laptop, a PDA, a Portable internet device, a music player, and a data storage device, other handheld devices, and devices such as watches, in-ear headphones, pendants, headsets, etc., and the electronic apparatus 100 may also be other wearable devices (e.g., head-mounted devices (HMDs) such as e-glasses, electronic clothing, electronic bracelets, electronic necklaces, electronic tattoos, electronic devices, or smart watches).

The electronic apparatus 1000 may also be any of a number of electronic devices including, but not limited to, cellular telephones, smart phones, other wireless communication devices, personal digital assistants, audio players, other media players, music recorders, video recorders, cameras, other media recorders, radios, medical devices, vehicle transportation equipment, calculators, programmable remote controls, pagers, laptop computers, desktop computers, printers, netbooks, personal Digital Assistants (PDAs), portable Multimedia Players (PMPs), moving picture experts group (MPEG-1 or MPEG-2) audio layer 3 (MP 3) players, portable medical devices, and digital cameras, and combinations thereof.

In some cases, the electronic device 1000 may perform a variety of functions (e.g., playing music, displaying video, storing pictures, and receiving and sending phone calls). If desired, the electronic apparatus 1000 may be a portable device such as a cellular telephone, media player, other handheld device, wristwatch device, pendant device, earpiece device, or other compact portable device.

Specifically, referring to fig. 1, 2 and 3, the length direction of the receiver 120 extends along the longitudinal direction of the electronic device 1000. Therefore, the space can be utilized to the maximum extent, and the structure is more compact.

The receiver circuit board 122 may be a flexible circuit board having high wiring density, light weight, thin thickness, and good flexibility, and may reduce the overall weight of the electronic device 1000 and save the internal space of the electronic device 1000. Of course, the receiver circuit board 122 may be a printed circuit board or other circuit boards such as a rigid-flex circuit board, and the specific form of the receiver circuit board 122 is not limited herein.

The contact comprises a spring plate. Specifically, during installation, the elastic sheet may be welded on the main board 110 by using a surface mount technology (Surface Mount Technology, SMT), so that the elastic force of the elastic sheet after bending is used to control the on-off of the electrical connection between the receiver circuit board 122 and the main board 110. The number of the elastic pieces may be one or a plurality, and the specific number of the elastic pieces is not limited. When the number of the elastic sheets is multiple, the elastic sheets can be firstly arranged on the fixing element, then the fixing element is sucked by the sucker, so that the elastic sheets can be moved to the main board 110, and then the elastic sheets are welded. This can improve the mounting efficiency.

The flash 140 and the receiver 120 are respectively disposed on two opposite sides of the receiver circuit board 122. Further, the flash 140 and the receiver 120 are stacked in the thickness direction of the receiver circuit board 122.

In this way, the arrangement of the flash 140, the receiver circuit board 122, and the receiver 120 is realized. It will be appreciated that such a flashlight 140 and receiver 120 may share receiver circuit board 122, thereby saving space. In addition, the flash 140 and the receiver 120 are stacked in the thickness direction of the receiver circuit board 122, so that the space in the thickness direction of the receiver circuit board 122 can be fully utilized, and the lateral space of the electronic device 1000 is saved, so that the front camera 130, the receiver 120 and the first imaging module 20 are more compactly arranged along the lateral direction of the electronic device 1000.

Specifically, in the example of fig. 2, the number of flash lamps 140 is two. It is understood that in other embodiments, the number of flash lamps 140 may be 1,3, or 4. The number of the flash 140 is not limited herein.

The first imaging module 20 includes a module circuit Board 205, and the module circuit Board 205 may be provided with a connector 150, where the connector 150 is, for example, a Board-to-Board connector (Board-to-Board Connectors). The module circuit board 205 may be connected to the motherboard 110 through the connector 150. The connector 150 has a strong transmission capability, and can ensure the connection reliability of the first imaging module 20 and the motherboard 110.

It should be noted that the circuit board of the front camera 130 is separately connected to the motherboard 110.

The main board 110 is formed with a first mounting hole 112 and a second mounting hole 114, the first imaging module 20 is located in the first mounting hole 112, and the receiver 120 is located in the second mounting hole 114. In this way, the thickness of the electronic device 1000 may be reduced, making the structure of the electronic device 1000 more compact. In addition, the first mounting hole 112 and the second mounting hole 114 also have a limiting function, so that the mounting efficiency can be improved when the first imaging module 20 and the receiver 120 are mounted on the main board.

In addition, the electronic device 1000 further includes a second imaging module 30, the second imaging module 30 is a rear camera of the electronic device 1000 and is a periscope camera, the length direction of the second imaging module 30 extends along the longitudinal direction of the electronic device 1000, and the second imaging module 30 and the receiver 120 are respectively located at two opposite sides of the first imaging module 20. In this way, the second imaging module 30 is disposed, so that the structure of the electronic device 1000 is more compact.

As shown in fig. 2 and 3, the second imaging module 30, the first imaging module 20, the receiver 120, and the front camera 130 are sequentially arranged along a lateral direction of the electronic device 1000. The first imaging module 20 and the second imaging module 30 can be abutted against each other, so that the structure between the first imaging module 20 and the second imaging module 30 is more compact.

Referring to fig. 4-6, in the present embodiment, the first imaging module 20 includes a housing 21, a reflective element 22, a mounting base 23, a first lens assembly 24, a moving element 25, a first image sensor 26, and a driving mechanism 27.

The reflective element 22, mount 23, first lens assembly 24, and moving element 25 are all disposed within the housing 21. The reflective element 22 is arranged on the mount 23 and the first lens assembly 24 is fixed to the moving element 25. The moving element 25 is provided on the first image sensor 26 side. Further, the moving element 25 is located between the reflective element 22 and the first image sensor 26.

The driving mechanism 27 connects the moving element 25 with the housing 21. After entering the housing 21, the incident light is diverted through the reflective element 22 and then transmitted through the first lens assembly 24 to the first image sensor 26, such that the first image sensor 26 obtains an ambient image. The drive mechanism 27 is used to drive the movement element 25 along the optical axis of the first lens assembly 24.

The housing 21 is substantially square, and the housing 21 has an optical inlet 211, and incident light enters the first imaging module 20 from the optical inlet 211. That is, the reflective element 22 is configured to redirect the incident light entering from the light inlet 211 and transmit the incident light to the first image sensor 26 through the first lens assembly 24, so that the first image sensor 26 senses the incident light outside the first imaging module 20.

It can be appreciated that the first imaging module 20 is a periscope type lens module, and the periscope type lens module has a smaller height than the vertical type lens module, so that the overall thickness of the electronic device 1000 can be reduced. The vertical lens module refers to that the optical axis of the lens module is a straight line, or that the incident light is conducted to the photosensitive device of the lens module along the direction of the optical axis of the straight line.

It can be appreciated that the light inlet 211 is exposed through the through hole 11, so that the external light enters the first imaging module 20 from the light inlet 211 after passing through the through hole 11.

Specifically, referring to fig. 5, the housing 21 includes a top wall 213 and side walls 214. Side walls 214 are formed extending from side edges 2131 of top wall 213. The top wall 213 includes two opposite sides 2131 and two side walls 214, each side wall 214 extending from a corresponding one of the sides 2131, or the side walls 214 respectively connect the opposite sides of the top wall 213. The light inlet 211 is formed in the top wall 213.

The light reflecting element 22 is a prism or a plane mirror. In one example, when the reflective element 22 is a prism, the prism may be a triangular prism, and the cross-section of the prism is a right triangle, where light is incident from one of the right triangle sides, reflected by the hypotenuse, and exits from the other right triangle side. It will be appreciated that of course, incident light may exit after refraction by the prism without reflection. The prism can be made of materials with good light transmittance such as glass, plastic and the like. In one embodiment, a reflective material such as silver may be coated on one of the surfaces of the prism to reflect incident light.

It will be appreciated that when the reflective element 22 is a flat mirror, the flat mirror reflects incident light to effect the turning of the incident light.

Further, referring to fig. 6 and 9, the reflective element 22 has a light incident surface 222, a backlight surface 224, a reflective surface 226 and a light emergent surface 228. The light incident surface 222 is close to and faces the light inlet 211. The backlight surface 224 is far away from the light inlet 211 and is opposite to the light inlet surface 222. The reflective surface 226 is connected to the light incident surface 222 and the backlight surface 224. The light-emitting surface 228 is connected to the light-entering surface 222 and the backlight surface 224. The light-emitting surface 228 faces the first image sensor 26. The reflective surface 226 is disposed obliquely with respect to the light incident surface 222. The light-emitting surface 228 is disposed opposite to the light-reflecting surface 226.

Specifically, in the light conversion process, the light passes through the light inlet 211 and enters the reflective element 22 from the light inlet 222, then is reflected by the reflective surface 226, and finally is reflected from the light outlet 228 to the reflective element 22, so as to complete the light conversion process, and the backlight surface 224 is fixedly arranged with the mounting seat 23, so that the reflective element 22 is kept stable.

As shown in fig. 10, in the related art, due to the need to reflect the incident light, the reflective surface 226a of the reflective element 22a is inclined with respect to the horizontal direction, and the reflective element 22a is of an asymmetric structure in the reflective direction of the light, so the actual optical area below the reflective element 22a is smaller than above the reflective element 22a, and it can be understood that the portion of the reflective surface 226a away from the light inlet is less or unable to reflect the light.

Therefore, referring to fig. 11, the reflecting element 22 according to the embodiment of the present application has the edges and corners away from the light inlet cut away from the reflecting element 22a in the related art, so that the effect of reflecting light rays by the reflecting element 22 is not affected, and the overall thickness of the reflecting element 22 is reduced.

Referring to fig. 6, in some embodiments, the reflective surface 226 is inclined at 45 degrees with respect to the incident surface 222.

Therefore, the incident light rays are reflected and converted better, and the light ray conversion effect is better.

The reflecting element 22 can be made of glass, plastic or other materials with good light transmission. In one embodiment, one of the surfaces of the reflective element 22 may be coated with a reflective material such as silver to reflect incident light.

In some embodiments, the light incident surface 222 is disposed parallel to the backlight surface 224.

Thus, when the backlight surface 224 and the mounting seat 23 are fixedly arranged, the light reflecting element 22 can be kept stable, the light incident surface 222 is also in a plane, and the incident light forms a regular light path in the conversion process of the light reflecting element 22, so that the conversion efficiency of the light is better. Specifically, the cross section of the reflecting element 22 is substantially trapezoidal along the light incident direction of the light inlet 211, or the reflecting element 22 is substantially trapezoidal.

In some embodiments, the light-in surface 222 and the backlight surface 224 are both perpendicular to the light-out surface 228.

Thus, the regular reflecting element 22 can be formed, so that the light path of the incident light is straight, and the conversion efficiency of the light is improved.

In some embodiments, the distance between the light incident surface 222 and the backlight surface 224 is in the range of 4.8-5.0mm.

Specifically, the distance between the light incident surface 222 and the backlight surface 224 may be 4.85mm, 4.9mm, 4.95mm, etc. Alternatively, the distance between the light incident surface 222 and the backlight surface 224 can be understood as the height of the reflective element 22 is 4.8-5.0mm. The reflective element 22 formed by the light incident surface 222 and the backlight surface 224 within the above distance range has a moderate volume, and can be better combined into the first imaging module 20, so as to form a more compact and miniaturized first imaging module 20, the camera assembly 100 and the electronic device 1000, thereby meeting more demands of consumers.

In some embodiments, the light incident surface 222, the backlight surface 224, the light reflecting surface 226 and the light emergent surface 228 are all hardened to form a hardened layer.

When the light reflecting element 22 is made of glass, the light reflecting element 22 is brittle, so that the light incident surface 222, the backlight surface 224, the light reflecting surface 226 and the light emergent surface 228 of the light reflecting element 22 can be hardened for improving the strength of the light reflecting element 22. The hardening treatment such as lithium ion penetration, lamination of the above surfaces without affecting the light conversion of the light reflecting element 22, and the like.

In one example, the reflective element 22 diverts incident light incident from the light inlet 211 by an angle of 90 degrees. For example, the incident angle of the incident light on the emitting surface of the reflecting element 22 is 45 degrees, and the reflection angle is also 45 degrees. Of course, the angle at which the reflective element 22 deflects the incident light may be other angles, such as 80 degrees, 100 degrees, etc., as long as the incident light is deflected and reaches the first image sensor 26.

In the present embodiment, the number of reflective elements 22 is one, and at this time, the incident light is diverted once and then transmitted to the first image sensor 26. In other embodiments, the number of reflective elements 22 is multiple, at which time the incident light is diverted at least twice and passed to the first image sensor 26.

The mounting base 23 is used for mounting the reflecting element 22, or the mounting base 23 is a carrier of the reflecting element 22, and the reflecting element 22 is fixed on the mounting base 23. This allows the position of the retroreflective elements 22 to be determined, which is advantageous for the retroreflective elements 22 to reflect or refract incident light. The reflective element 22 may be fixed to the mounting base 23 by adhesive bonding to achieve a fixed connection with the mounting base 23.

Specifically, in the present embodiment, the mounting base 23 is provided with a limiting structure 232, and the limiting structure 232 is connected to the reflective element 22 to limit the position of the reflective element 22 on the mounting base 23.

In this way, the limiting structure 232 limits the position of the reflective element 22 on the mounting seat 23, so that the reflective element 22 will not shift under the condition of being impacted, which is beneficial to the normal use of the first imaging module 20.

It will be appreciated that in one example, the reflective element 22 is fixed to the mounting base 23 by adhesion, if the limiting structure 232 is omitted, the reflective element 22 is easily detached from the mounting base 23 if the adhesion between the reflective element 2222 and the mounting base 23 is insufficient when the first imaging module 20 is impacted.

In the present embodiment, the mounting seat 23 is formed with a mounting groove 233, the reflective element 22 is disposed in the mounting groove 233, and the limiting structure 232 is disposed at an edge of the mounting groove 233 and abuts against the reflective element 22.

In this manner, the mounting groove 233 can allow the reflective element 22 to be easily mounted on the mounting seat 23. The limiting structure 232 is disposed at an edge of the mounting groove 233 and abuts against an edge of the reflective element 22, so that not only the position of the reflective element 22 can be limited, but also the reflective element 22 is not prevented from emitting incident light to the first image sensor 26.

Further, the limiting structure 232 includes a protrusion 234 protruding from an edge of the mounting groove 233, and the protrusion 234 abuts against an edge of the light-emitting surface 228. Since the reflective element 22 is mounted on the mounting base 23 through the reflective surface 226, the light emitting surface 228 is disposed opposite to the reflective surface 226. Therefore, the reflective element 22 is more likely to be located toward one side of the light emitting surface 228 when being impacted. In this embodiment, the limit structure 232 abuts against the edge of the light-emitting surface 228, so that not only the reflective element 22 is prevented from being displaced toward the light-emitting surface 228, but also the light is ensured to be emitted normally from the light-emitting surface 228.

Of course, in other embodiments, the spacing structure 232 may include other structures so long as the position of the reflective element 22 can be limited. For example, the limiting structure 232 is formed with a clamping groove, and the reflecting element 22 is formed with a limiting post, and the limiting post is clamped in the clamping groove so as to limit the position of the reflecting element 22.

In some embodiments, the protrusions 234 are stripe-shaped and extend along an edge of the light-emitting surface 228. In this way, the contact area between the protrusion 234 and the edge of the light-emitting surface 228 is large, so that the reflective element 22 can be more firmly located on the mounting seat 23.

Of course, in other embodiments, the protrusion 234 may have other structures such as a block shape.

Referring to fig. 5 again, in one example, the mounting base 23 is movably disposed in the housing 21, and the mounting base 23 can rotate relative to the housing 21 to adjust the direction in which the reflective element 22 deflects the incident light.

The mounting base 23 can drive the reflective element 22 to rotate along with the reflective element toward the opposite direction of the shake of the first imaging module 20, so as to compensate the incident deviation of the incident light of the light inlet 211, and achieve the optical anti-shake effect.

The first lens assembly 24 is housed within the motion element 25, and further, the first lens assembly 24 is disposed between the reflective element 22 and the first image sensor 26. The first lens assembly 24 is used to image incident light onto the first image sensor 26. This allows the first image sensor 26 to obtain a better quality image.

The first lens assembly 24, when moved entirely along its optical axis, can be imaged onto the first image sensor 26 to effect focusing of the first imaging module 20. The first lens assembly 24 includes a plurality of lenses 241, and when at least one lens 241 moves, the overall focal length of the first lens assembly 24 changes, thereby achieving the zooming function of the first imaging module 20, and further, the driving mechanism 27 drives the moving element 25 to move in the housing 21 for zooming purposes.

In the example of fig. 6, in certain embodiments, the motion element 25 is cylindrical and the plurality of lenses 241 in the first lens assembly 24 are secured within the motion element 25 at axial intervals along the motion element 25. As in the example of fig. 8, the movement element 25 comprises two jaws 252, the two jaws 252 sandwiching the lens 241 between the two jaws 252.

It can be appreciated that, since the moving element 25 is used for fixedly disposing a plurality of lenses 241, the length of the moving element 25 is larger, the moving element 25 can be cylindrical, square, etc. with a shape having a certain cavity, so that the moving element 25 is cylindrical and can better dispose a plurality of lenses 241, and can better protect the lenses 241 in the cavity, so that the lenses 241 are not easy to shake.

In addition, in the example of fig. 8, the moving element 25 clamps the plurality of lenses 241 between the two clamping pieces 252, which not only has a certain stability, but also can reduce the weight of the moving element 25, and can reduce the power required by the driving mechanism 27 to drive the moving element 25, and the difficulty in designing the moving element 25 is also low, and the lenses 241 are also easier to be arranged on the moving element 25.

Of course, the moving element 25 is not limited to the cylindrical shape and two clips 252, and in other embodiments, the moving element 25 may comprise three, four, etc. more clips 252 to form a more stable structure, or a simpler structure such as a single clip 252; or a rectangular body, a round body, etc. having a cavity to accommodate various regular or irregular shapes of the lens 241. The specific selection is performed on the premise of ensuring the normal imaging and operation of the imaging module 10.

The first image sensor 26 may employ a complementary metal oxide semiconductor (CMOS, complementary Metal Oxide Semiconductor) photosensitive element or a Charge-coupled Device (CCD) photosensitive element.

In certain embodiments, the drive mechanism 27 is an electromagnetic drive mechanism, a piezoelectric drive mechanism, or a memory alloy drive mechanism.

Specifically, the electromagnetic driving mechanism comprises a magnetic field and a conductor, if the magnetic field moves relative to the conductor, induced current is generated in the conductor, the induced current enables the conductor to be acted by ampere force, the ampere force enables the conductor to move, and the conductor is a part of the electromagnetic driving mechanism which drives the moving element 25 to move; the piezoelectric driving mechanism is based on the inverse piezoelectric effect of the piezoelectric ceramic material: if voltage is applied to the piezoelectric material, mechanical stress is generated, namely, electric energy and mechanical energy are converted, and rotation or linear motion is generated by controlling mechanical deformation of the piezoelectric material, so that the piezoelectric material has the advantages of simple structure and low speed.

The actuation of the memory alloy actuation mechanism is based on the characteristics of the shape memory alloy: the shape memory alloy is a special alloy, once it is made to memorize any shape, even if it is deformed, it can be restored to its original shape when heated to a proper temp. so as to attain the goal of driving.

Referring to fig. 6 again, further, the first imaging module 20 further includes a driving device 28, and the driving device 28 is used for driving the mounting base 23 with the reflective element 22 to rotate around the rotation axis 29. The driving device 28 is used for driving the mounting seat 23 to axially move along the rotation axis 29. The rotation axis 29 is perpendicular to the optical axis of the light inlet 211 and the photosensitive direction of the first image sensor 26, so that the first imaging module 20 realizes optical anti-shake on the optical axis of the light inlet 211 and the axial direction of the rotation axis 29.

In this way, since the volume of the reflective element 22 is smaller than that of the lens barrel, the driving device 28 drives the mounting seat 23 to move in two directions, so that not only the optical anti-shake effect of the first imaging module 20 in two directions can be achieved, but also the volume of the first imaging module 20 can be made smaller.

Referring to fig. 5 to 6, for convenience of description, the width direction of the first imaging module 20 is defined as the X direction, the height direction is defined as the Y direction, and the length direction is defined as the Z direction. Thus, the optical axis of the light inlet 211 is in the Y direction, the light receiving direction of the first image sensor 26 is in the Z direction, and the axial direction of the rotation axis 29 is in the X direction.

The driving device 28 drives the mounting seat 23 to rotate, so that the reflecting element 22 rotates around the X direction, and the first imaging module 20 realizes the Y-direction optical anti-shake effect. In addition, the driving device 28 drives the mounting base 23 to move along the axial direction of the rotation axis 29, so that the first imaging module 20 achieves the effect of X-direction optical anti-shake. Additionally, the first lens assembly 24 may be along the Z-direction to achieve focusing of the first lens assembly 24 on the first image sensor 26.

Specifically, when the reflective element 22 rotates around the X-direction, the light reflected by the reflective element 22 moves in the Y-direction, so that the first image sensor 26 forms a different image in the Y-direction to achieve the anti-shake effect in the Y-direction. When the reflective element 22 moves along the X-direction, the light reflected by the reflective element 22 moves in the X-direction, so that the first image sensor 26 forms different images in the X-direction to achieve the anti-shake effect in the X-direction.

In some embodiments, the driving device 28 is formed with an arc-shaped guide rail 281, and the driving device 28 is used for driving the mounting seat 23 to rotate along the arc-shaped guide rail 281 around a central axis 282 of the arc-shaped guide rail 281 and axially move along the central axis 282, and the central axis 2282 coincides with the rotation axis 29.

It will be appreciated that the driving device 28 is used to drive the mounting base 23 to rotate along the curved guide 281 about the central axis 282 of the curved guide 281 and to move axially along the central axis 282.

In this way, the driving device 28 drives the mounting seat 23 with the reflective element 22 to rotate together by adopting the arc-shaped guide rail 281, so that the friction between the driving device 28 and the mounting seat 23 is small, which is beneficial to the stable rotation of the mounting seat 23 and improves the optical anti-shake effect of the first imaging module 20.

Specifically, referring to fig. 12, in the related art, a mounting base (not shown) is rotatably connected to the rotating shaft 23a, and the mounting base rotates around the rotating shaft 23a to drive the reflective element 22a to rotate together. Assuming that the friction force is F1, the radius of the rotating shaft 23a is R1, the thrust force is F1, and the rotation radius is R1. The friction torque to thrust torque ratio K1 is k1=f1r1/F1 A1. Since the reflecting element 22a only needs to be slightly rotated, F1 cannot be excessively large; the imaging module itself needs to be thin and small, so that the size of the reflective element 22a cannot be too large, and the enlarged space of a is limited, so that the influence of friction force cannot be further eliminated.

Referring to fig. 13, in the present application, the mounting seat 23 rotates along the arc-shaped guide 281, and the radius of the arc-shaped guide 281 is R2. At this time, the ratio K2 of the friction torque to the rotation torque is k2=f2r2/f2a, and when F2, R2, and F2 are not changed significantly, the corresponding thrust torque becomes R2 due to the rotation in the orbital swing manner, and R2 may not be limited by the size of the reflective element 22, and may even be several times or more than R1. Therefore, in this case, the influence of the friction force on the rotation of the reflective element 22 can be greatly reduced (the size of K2 is reduced), so as to improve the rotation accuracy of the reflective element 22, and make the optical anti-shake effect of the first imaging module 20 better.

Referring to fig. 6, in some embodiments, the mounting block 23 includes an arcuate surface 231, the arcuate surface 231 being disposed concentric with the arcuate rail 281 and cooperating with the arcuate rail 281. Alternatively, the center of the arcuate surface 231 coincides with the center of the arcuate guide rail 281. This results in a more compact mating of the mounting block 23 with the drive 28.

In some embodiments, the central axis 282 is located outside the first imaging module 20. In this way, the radius R2 of the arc-shaped guide rail 281 is larger, so that the adverse effect of friction force on the rotation of the mounting seat 23 can be reduced.

In some embodiments, the drive 28 is located at the bottom of the housing 21. Alternatively, the drive means 28 is integrally formed with the housing 21. In this way, the structure of the first imaging module 20 is more compact.

In some embodiments, the drive 28 drives the mount 23 in rotation electromagnetically. In one example, the driving device 28 is provided with a coil, the mounting seat 23 is fixed with an electromagnetic sheet, and after the coil is electrified, the coil can generate a magnetic field to drive the electromagnetic sheet to move, so as to drive the mounting seat 23 and the reflecting element to rotate together.

Of course, in other embodiments, the driving device 28 may drive the mount 23 to move by piezoelectric driving or memory alloy driving. The piezoelectric driving method and the memory alloy driving method are referred to the above description, and will not be repeated here.

Referring to fig. 4-7 again, the first imaging module 20 further includes a chip circuit board 201 and a driving chip 202, the chip circuit board 201 is fixed on a side of the driving mechanism 27, the driving chip 202 is fixed on a surface of the chip circuit board 201 opposite to the driving mechanism 27, and the driving chip 202 is electrically connected with the driving mechanism 27 through the chip circuit board 201.

In this way, the driving chip 202 is fixed on the side of the driving mechanism 27 through the chip circuit board 201, and is electrically connected with the driving mechanism 27 through the chip circuit board 201, so that the structure between the driving chip 202 and the driving mechanism 27 is more compact, which is beneficial to reducing the volume of the first imaging module 20.

Specifically, the driving chip 202 is used for controlling the driving mechanism 27 to drive the motion element 25 to move along the optical axis of the first lens assembly 24, so that the first lens assembly 24 focuses and images on the first image sensor 26. The driving chip 202 is used for controlling the driving device 28 to drive the mounting seat 23 with the reflecting element 22 to rotate around the rotation axis 29 according to feedback data of the gyroscope. The driving chip 202 is further used for driving the mounting seat 23 to move axially along the rotation axis 29 according to the feedback data of the gyroscope 28.

The driving chip 202 is further used for driving the mounting seat 23 to rotate along the arc-shaped guide rail 281 around the central axis 282 of the arc-shaped guide rail 281 and axially move along the central axis 282 according to the feedback data of the gyroscope.

In some embodiments, the first imaging module 20 includes a sensor circuit board 203, the first image sensor 26 is fixed on the sensor circuit board 203, the chip circuit board 201 includes a mounting portion 2011 and a connecting portion 2022, the mounting portion 2011 is fixed on a side surface of the driving mechanism 27, the driving chip 202 is fixed on the mounting portion 2011, and the connecting portion 2022 connects the mounting portion 2011 and the sensor circuit board 203.

In this way, the driving chip 202 may be electrically connected to the first image sensor 26 through the sensor circuit board 203. Specifically, the connection portion 2022 may be fixedly connected to the sensor circuit board 203 by means of soldering.

In one example, when the first imaging module 20 is assembled, the driving chip 202 may be fixed on the chip circuit board 201, then the chip circuit board 201 with the driving chip 202 and the sensor circuit board 203 are connected by soldering, and finally the chip circuit board 201 with the driving chip 202 is fixed on the side of the driving mechanism 27.

The chip circuit board 201 may be fixedly connected to the driving mechanism 27 by soldering, bonding, or the like.

It should be noted that, the fixing of the chip circuit board 201 to the side of the driving mechanism 27 may refer to the fixing of the chip circuit board 201 to the side of the driving mechanism 27, or may refer to the fixing of the chip circuit board 201 to the side of the driving mechanism 27 through other components.

In the present embodiment, the mounting portion 2011 is a rigid circuit board, the connecting portion 2022 is a flexible circuit board, and the mounting portion 2011 is attached to a side surface of the driving mechanism 27.

In this way, the mounting portion 2011 is a rigid circuit board, so that the mounting portion 2011 has better rigidity, is not easy to deform, and is beneficial to the side fixed connection of the mounting portion 2011 and the driving mechanism 27. The mounting portion 2011 may be bonded to a side surface of the driving mechanism 27 by adhesion. In addition, the connection portion 2022 is a flexible circuit board so that the chip circuit board 201 is easily deformed, so that the chip circuit board 201 is easily mounted on the side of the driving mechanism 27.

Of course, in other embodiments, the mounting portion 2011 may be a flexible circuit board.

In some embodiments, housing 21 is formed with relief holes 215, and driver chip 202 is at least partially positioned in relief holes 215 so as to be exposed to housing 21. In this way, the driving chip 202 penetrates the housing 21, so that an overlapping portion exists between the driving chip 202 and the housing 21, so that the structure between the driving chip 202 and the housing 21 is more compact, and the volume of the first imaging module 20 can be further reduced.

It will be appreciated that when there is a gap between the side of the drive mechanism 27 and the housing 21, the drive chip 202 is partially located in the relief hole 215.

Preferably, the shape and size of the relief hole 215 are matched with the shape and size of the driving chip 202, respectively. For example, the size of the escape hole 215 is slightly larger than the size of the driving chip 202, and the shape of the escape hole 215 is the same as the shape of the driving chip 202.

In the present embodiment, the escape hole 215 is formed in the side wall 214 of the housing 21. It will be appreciated that the relief holes 215 extend through the inner and outer sides of the side wall 214. Of course, in other embodiments, the relief holes 215 may also be formed in the top wall 213 of the housing 21.

In this embodiment, the features of the second imaging module 30 may be the same as the features of the first imaging module 20, so the features of the second imaging module 30 are described with reference to the features of the first imaging module 20, and will not be described herein.

In the description of the present specification, reference to the terms "one embodiment," "certain embodiments," "illustrative embodiments," "examples," "specific examples," or "some examples," etc., means that a particular feature, structure, material, or characteristic described in connection with the embodiment or example is included in at least one embodiment or example of the application. In this specification, schematic representations of the above terms do not necessarily refer to the same embodiments or examples. Furthermore, the particular features, structures, materials, or characteristics described may be combined in any suitable manner in any one or more embodiments or examples.

While embodiments of the present application have been shown and described, it will be understood by those of ordinary skill in the art that: many changes, modifications, substitutions and variations may be made to the embodiments without departing from the spirit and principles of the application, the scope of which is defined by the claims and their equivalents.

Claims

1. An electronic device, comprising:

A main board;

the first imaging module is connected with the main board, is a rear camera of the electronic device and is a periscope camera, the length direction of the first imaging module extends along the longitudinal direction of the electronic device, and the longitudinal direction of the electronic device is the length direction of the electronic device;

And the receiver circuit board is connected with the main board through a contact, the contact is positioned on the top side of the first imaging module in the length direction, and the top side is one side of the first imaging module, which is close to the receiver in the length direction.

2. The electronic device of claim 1, wherein the motherboard is formed with a first mounting hole, and the first imaging module is located in the first mounting hole.

3. The electronic device of claim 1, wherein the main board is formed with a second mounting hole, and the receiver is located in the second mounting hole.

4. The electronic device of claim 1, wherein a length direction of the receiver extends along a longitudinal direction of the electronic device.

5. The electronic device of claim 1, wherein the contact comprises a spring.

6. The electronic device of claim 1, wherein the electronic device comprises a flash disposed on opposite sides of the receiver circuit board from the receiver, respectively.

7. The electronic device of claim 1, wherein the first imaging module comprises:

a housing having a light inlet; and

The light reflecting element is used for turning incident light entering from the light inlet and transmitting the incident light to the image sensor so that the image sensor senses the incident light outside the first imaging module.

8. The electronic device of claim 7, wherein the light reflecting element is disposed on the mount, the mount being provided with a limiting structure that connects the light reflecting element to limit the position of the light reflecting element on the mount;

the mounting seat is provided with a mounting groove, the light reflecting element is arranged in the mounting groove, and the limiting structure is arranged at the edge of the mounting groove and abuts against the edge of the light reflecting element.

9. The electronic device of claim 7, wherein the first imaging module comprises a driving device disposed in the housing, the driving device being configured to drive the mount with the reflective element to rotate about an axis of rotation to achieve optical anti-shake in an optical axis direction of the light inlet, the axis of rotation being perpendicular to an optical axis of the light inlet.

10. The electronic device of claim 9, wherein the driving means is formed with an arc-shaped guide rail, and the driving means is configured to drive the mount to rotate along the arc-shaped guide rail about a central axis of the arc-shaped guide rail, the central axis coinciding with the rotation axis.

11. The electronic device of claim 7, wherein the first imaging module comprises a lens assembly, a moving element, and a driving mechanism, all disposed within the housing, the moving element being positioned between the reflective element and the image sensor, the lens assembly being secured to the moving element, the driving mechanism being configured to drive the moving element along an optical axis of the lens assembly to focus the lens assembly on the image sensor.

12. The electronic device of claim 11, wherein the first imaging module further comprises a chip circuit board and a driving chip, the chip circuit board is fixed on a side of the driving mechanism, the driving chip is fixed on a surface of the chip circuit board opposite to the driving mechanism, and the driving chip is electrically connected with the driving mechanism through the chip circuit board.

13. The electronic device of claim 12, wherein the first imaging module comprises a sensor circuit board, the image sensor is fixed on the sensor circuit board, the chip circuit board comprises a mounting portion and a connecting portion, the mounting portion is fixed on a side surface of the driving mechanism, the driving chip is fixed on the mounting portion, and the connecting portion connects the mounting portion and the sensor circuit board.

14. The electronic device of claim 1, further comprising a second imaging module, the second imaging module being a rear camera of the electronic device and being a periscope camera, a length direction of the second imaging module extending longitudinally of the electronic device, the second imaging module and the receiver being located on opposite sides of the first imaging module, respectively.