CN109244703B - Holding assembly - Google Patents
Holding assembly Download PDFInfo
- Publication number
- CN109244703B CN109244703B CN201811055940.5A CN201811055940A CN109244703B CN 109244703 B CN109244703 B CN 109244703B CN 201811055940 A CN201811055940 A CN 201811055940A CN 109244703 B CN109244703 B CN 109244703B
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- Prior art keywords
- accommodating space
- edge
- insulator
- holding assembly
- conductor
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R12/00—Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCB], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
- H01R12/70—Coupling devices
- H01R12/71—Coupling devices for rigid printing circuits or like structures
- H01R12/712—Coupling devices for rigid printing circuits or like structures co-operating with the surface of the printed circuit or with a coupling device exclusively provided on the surface of the printed circuit
- H01R12/716—Coupling device provided on the PCB
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
- H01R13/02—Contact members
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
- H01R13/40—Securing contact members in or to a base or case; Insulating of contact members
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
- H01R13/46—Bases; Cases
- H01R13/502—Bases; Cases composed of different pieces
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
- H01R13/646—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00 specially adapted for high-frequency, e.g. structures providing an impedance match or phase match
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0213—Electrical arrangements not otherwise provided for
- H05K1/0237—High frequency adaptations
- H05K1/024—Dielectric details, e.g. changing the dielectric material around a transmission line
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Coupling Device And Connection With Printed Circuit (AREA)
Abstract
The invention discloses a holding assembly, which is characterized by comprising: an insulator; the insulator is provided with an accommodating space, and at least one lug is arranged in the accommodating space; at least one electric conductor is accommodated in the accommodating space, the electric conductor is provided with at least one edge, and the convex block is abutted to the edge. According to the holding assembly, the electric conductor is held in the insulator only through a few parts, so that most of the electric conductor is exposed in the accommodating space and is in contact with air in the accommodating space, and therefore signal transmission of the electric conductor can be achieved through air, and compared with a traditional electronic element which transmits signals through plastic, the holding assembly can achieve the effect of ultralow signal attenuation.
Description
Technical Field
The present invention relates to a holding module, and more particularly, to a holding module using air as a medium for transmitting signals.
Background
With the development of electronic technology, in the transmission process of electronic signals, the transmission attenuation of high-frequency signals is mainly affected by a medium, the fundamental reason is that the high-frequency signals are related to the dielectric constant of the medium, and the transmission of the high-frequency signals is better when the dielectric constant of the medium is lower.
However, the dielectric loss of the above materials is still relatively large, resulting in a relatively large signal attenuation in signal transmission of electronic components made of the above materials. In addition, both teflon and liquid crystal high molecular polymer belong to special materials, and have higher material cost.
Therefore, there is a need for an improved retention assembly that overcomes the above-mentioned problems.
Disclosure of Invention
The invention aims to provide a holding component with better high-frequency signal transmission.
In order to achieve the purpose, the invention adopts the following technical means:
a retention assembly, comprising:
an insulator; the insulator is provided with an accommodating space, and at least one lug and a butting part are arranged in the accommodating space;
the at least one electric conductor is accommodated in the accommodating space and is provided with a base part, the base part is in a flat plate shape, at least one fixing part is concavely arranged at the plate edge of the base part, the fixing part is provided with an edge extending in the vertical direction, the convex block is abutted against the edge, and the abutting part abuts against the plate surface of the base part in the horizontal direction;
the contact part of the conductor and the insulator is only the fixed part and the part where the plate surface of the base part abuts against the abutting part, and the rest part is exposed in the accommodating space.
Furthermore, the fixing portion has an upper stop surface and a lower stop surface, and the upper stop surface and the lower stop surface are matched with the projection to fixedly hold the conductor in the accommodating space.
Furthermore, the edge is located at the fixed part and between the upper stop surface and the lower stop surface.
Furthermore, the lug is provided with an interference plane, the edge is positioned on the fixed part and forms line contact with the interference plane, and the edge is the intersection line of the two planes on the electric conductor.
Furthermore, the lug is provided with an interference edge, the interference edge is formed by connecting two inclined planes, and the edge is positioned on the fixed part and forms point contact with the interference edge.
Further, a contact portion is formed upward from the base portion and exposed to the insulator, and a welding portion is formed downward from the base portion and exposed to the insulator.
Furthermore, the convex blocks are symmetrically formed by protruding from two sides of the accommodating space.
Furthermore, the insulator can be formed by splicing a plurality of first insulator bodies and a plurality of second insulator bodies in a staggered manner, and the accommodating space is formed by enclosing the first insulator bodies and the second insulator bodies.
Further, the boundary of the bump is located at the joint of the first insulating body and the second insulating body.
A retention assembly, comprising:
the insulators are horizontally arranged side by side, an accommodating space is arranged between every two adjacent insulators, and at least one lug is arranged in the accommodating space;
at least one electric conductor is accommodated in the accommodating space, the electric conductor is provided with at least one edge, and the lug is provided with a fixing part for fixing the edge;
the conductor is in contact with the insulator only through the holding part, and the rest part of the conductor is in contact with the air in the accommodating space.
Furthermore, a shielding layer is respectively arranged on the upper surface and the lower surface of the insulator, and an insulating layer is arranged on the upper surface and the lower surface of the shielding layer.
Furthermore, the electric conductors are flat and are held between two adjacent insulators.
Further, the insulator is provided with a plurality of the convex blocks, each convex block is provided with a notch, and each notch is provided with an upper inclined plane and a lower inclined plane which are used for being abutted to the edges of the electric conductors to form line contact.
Further, the insulator is provided with a plurality of the convex blocks, each convex block is provided with a notch, each notch is provided with an upper inclined edge and a lower inclined edge, and the inclined edges are connected through two inclined planes to form point contact for abutting against the edges of the electric conductors.
Furthermore, two ends of the conductor are electrically connected with a first electronic element and a second electronic element respectively.
Compared with the prior art, the invention has the following beneficial effects:
according to the holding assembly, the electric conductor is held in the insulator only through a few parts, so that most of the electric conductor is exposed in the accommodating space and is in contact with air in the accommodating space, and therefore signal transmission of the electric conductor can be achieved through air, and compared with a traditional electronic element which transmits signals through plastic, the holding assembly can achieve the effect of ultralow signal attenuation.
[ description of the drawings ]
FIG. 1 is an exploded perspective view of a first embodiment of a retaining assembly of the present invention;
FIG. 2 is a perspective view of the electrical conductor of FIG. 1;
FIG. 3 is a perspective cross-sectional view of FIG. 1;
FIG. 4 is an enlarged view of a portion of FIG. 3;
FIG. 5 is a front cross-sectional view of FIG. 1;
FIG. 6 is an exploded perspective view of a second embodiment of the retaining assembly of the present invention;
FIG. 7 is a perspective cross-sectional view of FIG. 6;
FIG. 8 is an enlarged view of a portion of FIG. 7;
FIG. 9 is a perspective cross-sectional view of a third embodiment of a retaining assembly of the present invention;
FIG. 10 is an enlarged view of a portion of FIG. 9;
FIG. 11 is a perspective cross-sectional view of a fourth embodiment of a retaining assembly of the present invention;
FIG. 12 is an enlarged view of a portion of FIG. 11;
fig. 13 is a perspective cross-sectional view of a fifth embodiment of a holding assembly of the present invention.
Detailed description of the embodiments reference is made to the accompanying drawings in which:
[ detailed description ] embodiments
For a better understanding of the objects, structure, features, and functions of the invention, reference should be made to the drawings and detailed description that follow.
As shown in fig. 1 to 8, the holding assembly of the present invention has a first and a second embodiments, each of which is an electrical connector 100, wherein the electrical connector 100 includes an insulator 1 and a plurality of electrical conductors 2 received in the insulator 1.
As shown in fig. 1 to 5, in a first embodiment of the present invention, the insulator 1 is formed by splicing a plurality of first insulator bodies 11 and a plurality of second insulator bodies 12 in a staggered manner, the first insulator bodies 11 and the second insulator bodies 12 can be combined together by glue or other methods to form the insulator 1, the first insulator bodies 11 and the second insulator bodies 12 are identical in structure, the insulator 1 can also be integrally injection-molded (not shown), the insulator 1 is provided with a plurality of receiving spaces 13 vertically penetrating through the insulator 1, the receiving spaces 13 are arranged in a matrix, the receiving spaces 13 are formed by surrounding the first insulator bodies 11 and the second insulator bodies 12 together, and the receiving spaces 13 are substantially in a cross shape when viewed from top to bottom.
As shown in fig. 1, 3 and 4, four bumps 131 are disposed in the receiving space 13, the bumps 131 are mainly disposed on the first insulating body 11 and have an interference plane 1311, the bumps 131 are disposed at the corners of two sides of the receiving space 13 and are symmetrically disposed, one bump 131 is disposed at each corner of the upper and lower sides, and in other embodiments, the number of the bumps 131 can be freely increased or decreased according to actual conditions, and is not limited to four. Wherein a vertical plane of a boundary of the bump 131 coincides with a vertical plane of an intersection of the first insulating body 11 and the second insulating body 12.
As shown in fig. 1, a supporting portion 132 is disposed on the second insulating body 12, the supporting portion 132 is located in the accommodating space 13, and the supporting portion 132 is opposite to a plane surrounded by the four bumps 131.
As shown in fig. 1, 2 and 3, a plurality of the electrical conductors 2 are accommodated in the accommodating space 13 in a one-to-one correspondence manner, the electrical conductor 2 has a base portion 21, the base portion 21 is substantially in a flat plate shape, a contact portion 22 formed by bending and extending upwards from the base portion 21 is exposed to the insulator 1 for guiding a butt-joint element (not shown), two upper and lower fixing portions 23 are respectively formed at plate edges at two sides of the base portion 21, the fixing portions 23 have an upper stop surface 231 and a lower stop surface 232 for cooperating with the protruding block 131 to limit the electrical conductor 2 in the up-down direction, the fixing portions 23 have edges 233 in the up-down direction, and the edges 233 are located at the fixing portions 23 and between the upper stop surface and the lower stop surface 232 231. The interference plane 1311 and the edge 233 are in interference fit in the horizontal direction, and the interference mode of the fixing portion 23 and the interference plane 1311 is as follows: the edge 233 of the fixing portion 23 and the interference surface 1311 abut against each other, that is, a line contact is formed, the line contact means that the contact area of the two is a line, and it should be noted that the edge 233 refers to a line where two planes of an object intersect. In other embodiments, the number of the fixing portions 23 can be freely increased or decreased according to actual situations, and is not limited to four, the abutting portion 132 abuts against the plate surface of the base portion 21 in the horizontal direction, a soldering portion 24 is formed downward from the base portion 21 and is exposed to the insulator 1, the soldering portion 24 has a tin containing hole 241, and the tin containing hole 241 is used for adsorbing solder (not shown), so that the soldering portion 24 can be prevented from rising upwards to cause a void soldering phenomenon in the process of soldering to a circuit board (not shown).
When the electrical conductor 2 is accommodated in the accommodating space 13, the electrical conductor 2 is mainly fixed in the accommodating space 13 by the one-to-one interference fit of the four bumps 131 and the four fixing portions 23 and the abutting portions 132 abutting against the plate surface of the base portion 21, that is, the contact portion between the electrical conductor 2 and the insulator 1 only includes the fixing portions 23 and the abutting portions between the plate surface of the base portion 21 and the abutting portions 132, and the rest portions are exposed in the accommodating space 13, so that the electrical conductor 2 is in contact with the air in the accommodating space 13 to a great extent (see fig. 5 for details).
During the transmission of electronic signals, the transmission attenuation of high-frequency signals is mainly influenced by a medium. The fundamental reason for this is that the high frequency signal is related to the dielectric constant of the medium, and the lower the dielectric constant of the medium, the better the high frequency signal transmission. The dielectric constant of the conventional insulator, which is Liquid Crystal Polymer (LCP) or Teflon, is usually higher than that of air, but a lower relative dielectric constant, such as pure glue, may be used as a substrate layer for covering the signal line, but the dielectric constant of air is still lower than that of the conventional dielectric, so that the more the conductor 2 is exposed to the air without being covered by the dielectric, the better the transmission quality of the high-frequency signal of the conductor 2 is.
As shown in fig. 6 to 8, a second embodiment of the present invention is different from the first embodiment in that the interference manner between the fixing portion 23 and the bump 131 is: the edge 233 of the fixing portion 23 and the interference edge 1312 of the protrusion 131 abut against each other, so that a point contact is formed, i.e., the contact area of the two is a point, and the rest of the structure can be seen in the first embodiment.
As shown in fig. 9 to 13, there are third, fourth and fifth embodiments of the present invention, which are different from the first and second embodiments, and each of the third, fourth and fifth embodiments is a circuit board 200.
As shown in fig. 9 and 10, in a third embodiment of the present invention, the circuit board 200 is a flexible circuit board 200, the circuit board 200 is a substantially five-layer board structure circuit board 200, and a plurality of insulators 1 are horizontally arranged side by side, the insulators 1 extend in a substantially rectangular shape along a longitudinal direction, and the insulators 1 may have other feasible shapes in other embodiments, such as: is in a square shape. An accommodating space 13 is arranged between two adjacent insulators 1, the accommodating space 13 is filled with air, wherein a plurality of bumps 131 are horizontally arranged in the insulator 1 towards the accommodating space 13 in a protruding manner, a slot 1313 is arranged on each bump 131, and each slot 1313 is provided with an upper inclined plane 1314.
As shown in fig. 9, the upper and lower surfaces of the insulator 1 are covered with a shielding layer 3, the shielding layer 3 is connected to the receiving space 13, the upper and lower surfaces of the shielding layer 3 are covered with an insulating layer 4, and the plane of the upper and lower surfaces of the insulator 1 is parallel to the plane enclosed by the extending direction of the receiving space 13 and the arrangement direction of the receiving space 13.
As shown in fig. 10, a plurality of conductors 2 are accommodated in the accommodating space 13, and two ends of the conductors 2 are used for abutting against a first electronic component 300 and a second electronic component 400, the conductors 2 are substantially flat plate-shaped, two sides of the conductors 2 are held in the notches 1313 of two adjacent insulators 1, the edges 233 of the conductors 2 abut against the inclined planes 1314 of the notches 1313 to form line contact, a middle portion of the conductors 2 is exposed in the accommodating space 13, and thus, only the holding portion of the conductors 2 is in contact with the insulator 1, and the rest portions are in contact with the air in the accommodating space 13.
As shown in fig. 11 to 12, a fourth embodiment of the present invention is different from the third embodiment in that the notch 1313 has upper and lower inclined edges 1315 for making point contact with the edge 233 of the conductor 2, the inclined edges 1315 are formed by two inclined surfaces being connected, and the rest of the structure can be seen from the third embodiment.
As shown in fig. 13, a fifth embodiment of the present invention is different from the third embodiment in that the insulator 1 is a separable structure, the two can be combined together by glue or other means, the slot 1313 has upper and lower inclined edges 1315 for making point contact with the edge 233 of the conductor 2, and the rest of the structure can be seen from the third embodiment.
In the flexible circuit board 200 provided by the present invention, the conductor 2 except the holding portion is exposed in the receiving space 13 and contacts with air, and the dielectric constant of the air in the receiving space 13 is lower than that of the conventional teflon, liquid crystal high molecular polymer, pure glue or other insulating materials, so that the air is used as a dielectric layer to cover the periphery of the signal line instead of the conventional teflon, liquid crystal high molecular polymer, pure glue or other insulating materials, so that the signal of the flexible circuit board 200 is almost lossless as if the signal is transmitted in the air, thereby achieving ultra-low signal attenuation signal transmission.
In summary, the holding assembly of the present invention has the following advantages:
(1) the periphery of the conductor of the conventional electrical connector is generally covered with a medium, generally made of plastic, therefore, the signal transmission of the conductor is mainly affected by the plastic, and the lower the dielectric constant of the plastic, the better the signal transmission effect, since the dielectric constant of these conventional plastics is greater than that of air, the electrical connector 100 of the present invention, the conductor 2 is accommodated in the accommodating space 13, and the conductor 2 is held only by interference fit between the four fixing portions 23 and the four bumps 131 and by the abutting action between the plate surface of the base portion 21 and the abutting portion 132, so that the conductor 2 is held without the above-mentioned portions, most of the structure of the conductor is in contact with the air in the accommodating space 13, so that the conductor 2 can transmit signals through the air, and the signal transmission effect with ultralow signal attenuation is achieved.
(2) The traditional circuit board also adopts Teflon and liquid crystal high molecular polymer as dielectric layers, the cost is higher, a plurality of insulators 1 of the circuit board 200 are horizontally arranged side by side, and an accommodating space 13 is arranged between two adjacent insulators 1, so that the material consumption of the insulators 1 can be reduced, and the signal transmission is better, therefore, the accommodating space 13 can also reduce the production cost, and the circuit board 200 is a flexible circuit board 200, and because the accommodating space 13 is a discontinuous layer on the layer surface where the insulators 1 are positioned, the structural strength of the layer is lower, and the flexibility of the circuit board 200 is improved.
(3) The conductive layer of the conventional circuit board structure is generally disposed above the dielectric layer, and the conductor 2 of the circuit board 200 of the present invention is disposed in the receiving space 13 between the insulators 1, so that the thickness of the circuit board 200 is reduced, the space is saved, the circuit board 200 has the possibility of disposing more other structures, and the flexibility of the circuit board 200 is improved.
The above detailed description is only for the purpose of illustrating the preferred embodiments of the present invention, and not for the purpose of limiting the scope of the present invention, therefore, all technical changes that can be made by applying the present specification and drawings are included in the scope of the present invention.
Claims (13)
1. A retention assembly, comprising:
an insulator; the insulator is provided with an accommodating space, and a butting part and at least one lug are arranged in the accommodating space;
the at least one electric conductor is accommodated in the accommodating space and is provided with a base part, the base part is in a flat plate shape, at least one fixing part is concavely arranged at the plate edge of the base part, the fixing part is provided with an edge extending in the vertical direction, the convex block is abutted against the edge, and the abutting part abuts against the plate surface of the base part in the horizontal direction;
the contact part of the conductor and the insulator is only the part where the fixing part abuts against the lug and the part where the plate surface of the base abuts against the abutting part, and the rest parts are exposed in the accommodating space.
2. The holding assembly of claim 1, wherein: the fixing part is provided with an upper stop surface and a lower stop surface which are matched with the lug to fixedly hold the conductor in the accommodating space.
3. The holding assembly of claim 2, wherein: the edge is located the fixed part and between last backstop face and lower backstop face.
4. The holding assembly of claim 2, wherein: the lug is provided with an interference plane, the edge is positioned on the fixed part and forms line contact with the interference plane, and the edge is the intersection line of the two planes on the electric conductor.
5. The holding assembly of claim 2, wherein: the lug is provided with an interference edge, the interference edge is formed by connecting two inclined planes, and the edge is positioned on the fixed part and forms point contact with the interference edge.
6. The holding assembly of claim 2, wherein: a contact portion is formed upward from the base portion and exposed to the insulator, and a welding portion is formed downward from the base portion and exposed to the insulator.
7. The holding assembly of claim 1, wherein: the convex blocks are symmetrically formed by protruding from two sides of the accommodating space.
8. The holding assembly of claim 1, wherein: the insulator can be formed by splicing a plurality of first insulator bodies and a plurality of second insulator bodies in a staggered manner, and the accommodating space is formed by surrounding the first insulator bodies and the second insulator bodies.
9. The holding assembly of claim 8, wherein: the boundary of the bump is positioned at the joint of the first insulating body and the second insulating body.
10. A retention assembly, comprising:
the insulators are horizontally arranged side by side, an accommodating space is arranged between every two adjacent insulators, and a plurality of convex blocks are arranged in the accommodating space;
at least one electric conductor is accommodated in the accommodating space, the electric conductor is provided with a plurality of edges, the protruding block is provided with a notch, the notch is provided with an upper inclined plane and a lower inclined plane which are used for being abutted against the edges of the electric conductor to form line contact or the notch is provided with an upper inclined edge and a lower inclined edge, and the inclined edges are connected by two inclined planes to form point contact which is used for being abutted against the edges of the electric conductor;
the conductor is only contacted with the inclined plane or the inclined edge of the notch groove through the edge, and the rest part of the conductor is contacted with the air in the accommodating space.
11. The holding assembly of claim 10, wherein: and the upper surface and the lower surface of the insulator are respectively provided with a shielding layer, and the upper surface and the lower surface of the shielding layer are provided with an insulating layer.
12. The holding assembly of claim 10, wherein: the electric conductors are flat and tabular and are fixedly held between two adjacent insulators.
13. The holding assembly of claim 10, wherein: two ends of the conductor are respectively electrically connected with a first electronic element and a second electronic element.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201811055940.5A CN109244703B (en) | 2018-09-11 | 2018-09-11 | Holding assembly |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201811055940.5A CN109244703B (en) | 2018-09-11 | 2018-09-11 | Holding assembly |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN109244703A CN109244703A (en) | 2019-01-18 |
| CN109244703B true CN109244703B (en) | 2020-12-22 |
Family
ID=65067743
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201811055940.5A Active CN109244703B (en) | 2018-09-11 | 2018-09-11 | Holding assembly |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN109244703B (en) |
Citations (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| GB2276781A (en) * | 1993-03-31 | 1994-10-05 | Clamason Ind Ltd | Improvements relating to electrical plugs |
| GB2291280A (en) * | 1994-07-07 | 1996-01-17 | Jo Jo A S | A plug |
| CN2395401Y (en) * | 1998-12-22 | 2000-09-06 | 富士康(昆山)电脑接插件有限公司 | SIM card connector |
| CN2622881Y (en) * | 2003-05-08 | 2004-06-30 | 富港电子（东莞）有限公司 | Board-to-board connector |
| CN2682693Y (en) * | 2003-11-26 | 2005-03-02 | 富士康(昆山)电脑接插件有限公司 | Electric connector |
| CN2840366Y (en) * | 2005-07-15 | 2006-11-22 | 美国莫列斯股份有限公司 | Electric connector and terminal thereof |
| CN202231193U (en) * | 2010-12-20 | 2012-05-23 | 番禺得意精密电子工业有限公司 | Electric connector |
| CN203434325U (en) * | 2013-08-14 | 2014-02-12 | 番禺得意精密电子工业有限公司 | Electric connector |
| CN203660225U (en) * | 2014-01-27 | 2014-06-18 | 绵阳高新区经纬达科技有限公司 | Stitch seat as well as electronic element utilizing same and network transformer |
| CN104882691A (en) * | 2014-02-27 | 2015-09-02 | 美国莫列斯股份有限公司 | Electrical connector |
Family Cites Families (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN205863544U (en) * | 2016-05-27 | 2017-01-04 | 番禺得意精密电子工业有限公司 | Electric connector |
| CN206225628U (en) * | 2016-11-07 | 2017-06-06 | 番禺得意精密电子工业有限公司 | Electric connector |
-
2018
- 2018-09-11 CN CN201811055940.5A patent/CN109244703B/en active Active
Patent Citations (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| GB2276781A (en) * | 1993-03-31 | 1994-10-05 | Clamason Ind Ltd | Improvements relating to electrical plugs |
| GB2291280A (en) * | 1994-07-07 | 1996-01-17 | Jo Jo A S | A plug |
| CN2395401Y (en) * | 1998-12-22 | 2000-09-06 | 富士康(昆山)电脑接插件有限公司 | SIM card connector |
| CN2622881Y (en) * | 2003-05-08 | 2004-06-30 | 富港电子（东莞）有限公司 | Board-to-board connector |
| CN2682693Y (en) * | 2003-11-26 | 2005-03-02 | 富士康(昆山)电脑接插件有限公司 | Electric connector |
| CN2840366Y (en) * | 2005-07-15 | 2006-11-22 | 美国莫列斯股份有限公司 | Electric connector and terminal thereof |
| CN202231193U (en) * | 2010-12-20 | 2012-05-23 | 番禺得意精密电子工业有限公司 | Electric connector |
| CN203434325U (en) * | 2013-08-14 | 2014-02-12 | 番禺得意精密电子工业有限公司 | Electric connector |
| CN203660225U (en) * | 2014-01-27 | 2014-06-18 | 绵阳高新区经纬达科技有限公司 | Stitch seat as well as electronic element utilizing same and network transformer |
| CN104882691A (en) * | 2014-02-27 | 2015-09-02 | 美国莫列斯股份有限公司 | Electrical connector |
Also Published As
| Publication number | Publication date |
|---|---|
| CN109244703A (en) | 2019-01-18 |
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