CN109244044A - Semiconductor packaging structure for motor driving and motor - Google Patents
Semiconductor packaging structure for motor driving and motor Download PDFInfo
- Publication number
- CN109244044A CN109244044A CN201711001842.9A CN201711001842A CN109244044A CN 109244044 A CN109244044 A CN 109244044A CN 201711001842 A CN201711001842 A CN 201711001842A CN 109244044 A CN109244044 A CN 109244044A
- Authority
- CN
- China
- Prior art keywords
- motor
- semiconductor package
- motor driving
- coil
- coil block
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000004065 semiconductor Substances 0.000 title claims abstract description 133
- 238000004806 packaging method and process Methods 0.000 title claims abstract description 7
- 238000000034 method Methods 0.000 claims abstract description 27
- 238000004519 manufacturing process Methods 0.000 claims abstract description 11
- 239000000463 material Substances 0.000 claims description 25
- 238000005516 engineering process Methods 0.000 claims description 24
- 239000002184 metal Substances 0.000 claims description 11
- 229910052751 metal Inorganic materials 0.000 claims description 11
- 230000015572 biosynthetic process Effects 0.000 claims description 6
- 239000000758 substrate Substances 0.000 claims description 6
- 238000005323 electroforming Methods 0.000 claims description 5
- 229910000679 solder Inorganic materials 0.000 claims description 4
- 239000007787 solid Substances 0.000 claims description 2
- 239000005022 packaging material Substances 0.000 abstract 2
- 238000010586 diagram Methods 0.000 description 4
- 238000003466 welding Methods 0.000 description 3
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 2
- 239000004020 conductor Substances 0.000 description 2
- 238000005538 encapsulation Methods 0.000 description 2
- 238000005530 etching Methods 0.000 description 2
- 238000004804 winding Methods 0.000 description 2
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 1
- 239000004568 cement Substances 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 229910052742 iron Inorganic materials 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 238000000465 moulding Methods 0.000 description 1
- 230000002093 peripheral effect Effects 0.000 description 1
- 238000001259 photo etching Methods 0.000 description 1
- 238000002360 preparation method Methods 0.000 description 1
- 238000005476 soldering Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
- H01L23/31—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/58—Structural electrical arrangements for semiconductor devices not otherwise provided for, e.g. in combination with batteries
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/58—Structural electrical arrangements for semiconductor devices not otherwise provided for, e.g. in combination with batteries
- H01L23/64—Impedance arrangements
Abstract
The invention relates to a semiconductor packaging structure for motor driving and a motor. The semiconductor package structure includes: a coil assembly, a motor driving unit, a packaging material and a hole. The coil assembly is manufactured by a semiconductor process. The motor driving unit is manufactured by a semiconductor process and is electrically connected with the coil assembly. The packaging material is used for packaging the coil assembly and the motor driving unit into a semiconductor packaging structure. The hole is formed at a set position of the semiconductor packaging structure. By using the hole, the semiconductor package structure can be easily combined with other elements of the motor, thereby greatly simplifying and accelerating the process of manufacturing the motor and miniaturizing the motor.
Description
Technical field
The present invention is about a kind of semiconductor package and motor for motor driving.
Background technique
Each element of known motor driving usually makes in a different process, then assembling each element is a driving assembly, is made
It is difficult to further decrease at the driving assembly size of known motor, and because making each element in a different process, so that known horse
The driving assembly complex process and cost reached improves.In addition, when assembling known motor, it is known that the spare part of motor is quite a lot of,
So that the technique of production motor is considerably complicated, process is tedious, and the size of known motor is difficult to decrease.
Summary of the invention
The present invention is provided to the semiconductor packages of motor driving.In one embodiment, the semiconductor package
It include: a coil block, a motor drive unit, encapsulating material and a hole.The coil block is made with semiconductor technology.It should
Motor drive unit is made with semiconductor technology, which is set in the coil block, and is electrically connected the coil
Component.Encapsulating material is semiconductor package to encapsulate the coil block.The hole formation is in the semiconductor package
A setting position.
The present invention provides motor.In one embodiment, which includes: semiconductor encapsulating structure and a rotor.It should be partly
Conductor package structure includes: a coil block, a motor drive unit, encapsulating material and a hole.The coil block is partly to lead
Body technology production.The motor drive unit is made with semiconductor technology, which is set in the coil block, and
It is electrically connected the coil block.Encapsulating material is the semiconductor package to encapsulate the coil block.The hole formation is in this
One setting position of semiconductor package.The rotor have a wheel hub and a permanent magnet, the rotor be rotatably arranged to
The hole, which is incorporated into the wheel hub, and the permanent magnet is corresponding with the coil block.
The present invention is provided to the semiconductor packages of motor driving.In one embodiment, the semiconductor package
It include: a coil block, a motor drive unit, encapsulating material and a hole.The coil block is made with semiconductor technology.It should
Motor drive unit is made with semiconductor technology, which is electrically connected the coil block.Encapsulating material is to encapsulate
The coil block and the motor drive unit are semiconductor package.The hole formation is set in the one of the semiconductor package
Positioning is set.
The present invention provides motor.In one embodiment, which includes: semiconductor encapsulating structure and a rotor.It should be partly
Conductor package structure includes: a coil block, a motor drive unit, encapsulating material and a hole.The coil block is partly to lead
Body technology production.The motor drive unit is made with semiconductor technology, which is electrically connected the coil block.Encapsulation
Material is to encapsulate the coil block and the motor drive unit as the semiconductor package.The hole formation is in the semiconductor
One setting position of encapsulating structure.The rotor has a wheel hub and a permanent magnet, which is rotatably arranged to the hole,
The permanent magnet is incorporated into the wheel hub, and the permanent magnet is corresponding with the coil block.
Semiconductor package using the present invention for motor driving, the coil block and the motor drive unit are with half
Semiconductor process makes together, is not required to be fabricated separately using other different techniques, can simplify technique and relevant cost.Also, benefit
With the hole, which can be easily in conjunction with the other elements of motor, significantly to simplify and speed up production
The technique of motor, and motor microminiaturization can be made.
Detailed description of the invention
In order to more clearly explain the embodiment of the invention or the technical proposal in the existing technology, to embodiment or will show below
There is attached drawing needed in technical description to be briefly described, it should be apparent that, the accompanying drawings in the following description is only
Some embodiments of the present invention, for those of ordinary skill in the art, without any creative labor, also
Other drawings may be obtained according to these drawings without any creative labor.
Diagrammatic cross-section of Fig. 1 display present invention for an embodiment of the semiconductor package of motor driving；
Stereoscopic schematic diagram of Fig. 2 display present invention for an embodiment of the semiconductor package of motor driving；
Upper schematic diagram of Fig. 3 display present invention for an embodiment of the semiconductor package of motor driving；
Fig. 4 display present invention is used for an embodiment of the semiconductor package of motor driving in conjunction with central siphon and plate body
Diagrammatic cross-section；
Fig. 5 shows the diagrammatic cross-section of an embodiment of motor of the present invention；
Diagrammatic cross-section of Fig. 6 display present invention for an embodiment of the semiconductor package of motor driving；
Fig. 7 shows the diagrammatic cross-section of an embodiment of motor of the present invention；And
Diagrammatic cross-section of Fig. 8 display present invention for an embodiment of the semiconductor package of motor driving.
Drawing reference numeral:
10 semiconductor packages
11 coil blocks
12 motor drive units
13 encapsulating materials
14 holes
15 are electrically connected port
16 central siphons
17 plate bodys
18 metal fixation kits
19 support plates
20 rotors
21 wheel hubs
22 permanent magnets
23 central axises
30 motors
40 semiconductor packages
41 bearings
42 support plates
50 rotors
51 wheel hubs
52 permanent magnets
53 central axises
60 motors
70 semiconductor packages
71 coil blocks
72 motor drive units
73 encapsulating materials
111 bottom line ring layers
112 coil layers
113 top line ring layers
114,115 medium unit
161 axle sleeves
181 metallic pins
711 bottom line ring layers
712 coil layers
713 top line ring layers
1111,1112 coil
1131,1132,1133 coil
1136 center endpoints
1137 the outer end points
1141 insulating layers
1142 conductive columns
The setting height of H1 first
The setting height of H2 second
Specific embodiment
Following will be combined with the drawings in the embodiments of the present invention, and technical solution in the embodiment of the present invention carries out clear, complete
Site preparation description, it is clear that described embodiments are only a part of the embodiments of the present invention, instead of all the embodiments.Based on this
Embodiment in invention, relevant technical staff in the field's every other reality obtained without making creative work
Example is applied, the range of protection of the invention is belonged to.
Diagrammatic cross-section of Fig. 1 display present invention for an embodiment of the semiconductor package of motor driving.With reference to
Fig. 1, semiconductor package 10 of the invention are applied to motor, controllable and drive motor.In one embodiment, the semiconductor
Encapsulating structure 10 includes a coil block 11 and a motor drive unit 12 and encapsulating material 13.The coil block 11 and the motor
Driving unit 12 is made with semiconductor technology.Semiconductor technology include: film growth, photolithographic exposure, etching molding, encapsulation etc. its
Middle some processes can also extend to microelectromechanical processes based on semiconductor technology, can again include anisotropy etching, electroforming, micro-
The part technique such as photoetching electroforming modeling.But semiconductor technology of the invention is not limited to above-mentioned technique.
The coil block 11 has multilayer wire ring layer, shows three-winding layer in the embodiment in figure 1, but the present invention is not limited to
Three-winding layer.The folded setting of the lattice coil layer heap.In one embodiment, which includes a bottom line ring layer 111, one
Coil layer 112 and a top line ring layer 113.The bottom line ring layer 111 is set to the bottom position of the multilayer wire ring layer, the top
Coil layer 113 is set to the top position of the multilayer wire ring layer.In the embodiment in figure 1, which is set to this
On bottom line ring layer 111.Each coil layer includes multiple coils.Illustrate by taking bottom line ring layer 111 as an example, the bottom line ring layer
111 include multiple coils 1111,1112, and the lattice coil 1111,1112 is set to same plane height.Cooperation refers to Fig. 1
And Fig. 3, which includes multiple coils 1131,1132,1133, and the lattice coil 1131,1132,1133 is set
It is placed in same plane height.
In one embodiment, there is a medium unit, multilayer wire ring layer electrical connection between adjacent coil layers.Fig. 1's
In embodiment, there is a medium unit 114, the adjacent coil between adjacent the bottom line ring layer 111 and the coil layer 112
There is a medium unit 115 between layer 112 and the top line ring layer 113.The coil block 11 have two medium units 114,
115.In one embodiment, which can have three layers or more coil layers, such as: four layers, five layers or more, with view
The required adjustment coil number of plies of practical application.
In one embodiment, which includes an insulating layer 1141 and an at least conductive column 1142, this at least one
Conductive column 1142 is electrically connected adjacent bottom line ring layer 111 and the coil layer 112.In one embodiment, an at least conductive column
1142 are made with electroforming process.An at least conductive column 1142 is electrically connected one of the bottom line ring layer 111 coil and extremely should
One of coil layer 112 coil.In one embodiment, which can be a substrate.
The coil block 11 is set between one first setting height H1 and one second setting height H2, and first setting is high
The extreme lower position height that H1 is the coil block 11 is spent, second setting height H2 is an extreme higher position of the coil block 11
Highly, second setting height H2 is greater than first setting height H1.First setting height H1 is the bottom line ring layer 111
Minimum set height.Second setting height H2 is that height is arranged in the highest of the top line ring layer 113.
The motor drive unit 12 is set between the first setting height H1 and second setting height H2, and is electrically connected
The coil block 11.The motor drive unit 12 can drive chip (die) for a motor, also as un-encapsulated chip
(die)；Or the motor drive unit 12 can be a motor driving chip packaging body, also be the chip (chip) encapsulated.It should
Motor drive unit 12 may include sensing element, driving circuit and control circuit etc..
In one embodiment, which is set to the medium unit 114, and is set to the medium unit
114 insulating layer 1141.The motor drive unit 12 is electrically connected with the coil layer 112.
Encapsulating material 13 is to encapsulate the coil block 11.In the embodiment in figure 1, which is set to
The medium unit 114, that is, the motor drive unit 12 is set in the coil block 11, therefore encapsulating material 13 encapsulates the coil
Component 11.
In one embodiment, which may be disposed on the coil block, and encapsulating material is made to encapsulate the coil
Component and the motor drive unit.
In one embodiment, semiconductor package 10 of the invention separately includes multiple electrically connected ports 15, and electrical connection should
Coil block 11 or the motor drive unit 12.The multilayer electrically connected port 15 can be tin ball or pin.The multilayer electric connecting terminal
Mouth 15 may include I/O port (I/O port) or power end, ground terminal.
The hole 14 is formed in a setting position of the semiconductor package 10.In one embodiment, 14 shape of hole
At in a central location of the semiconductor package 10.In one embodiment, which is perforation.The semiconductor packages knot
Structure 10 includes separately a support plate 19, and the coil block 11 and the motor drive unit 12 are set to the support plate 19.The support plate 19 can be
Substrate.The support plate 19 has perforation, is connected to the hole 14, makes 14 perforation of hole.With reference to Fig. 2, show that the present invention is used for
The stereoscopic schematic diagram of one embodiment of the semiconductor package of motor driving.The semiconductor package 10 is in hollow ring,
Its central location is the hole 14.In one embodiment, which can be circular ring shape, triangular ring or polygonal
The shapes such as annular.
Upper schematic diagram of Fig. 3 display present invention for an embodiment of the semiconductor package of motor driving.With reference to
Fig. 3, in one embodiment, each coil are spirally extended outwardly by a center endpoint to a outer end point.The coil is in this
Heart endpoint or the outer end point are electrically connected with other coils.The helical form can be round spiral, triangle helical form, square spiral
The helical form of shape or other shapes.In one embodiment, which includes a center endpoint 1136 and a outer end point 1137,
The coil 1131 is spirally extended outwardly by the center endpoint 1136 to the outer end point 1137.The coil 1131 is with the outer end point
1137 are electrically connected with the coil 1133.In one embodiment, which connects with the coil 1133, and is single-phase coil
Connection.In other embodiments, it is connected if the coil of three-phase, the lattice coil of same coil layer can not be electrically connected.
Semiconductor package using the present invention for motor driving, the coil block and the motor drive unit are with half
Semiconductor process makes together, is not required to be fabricated separately using other different techniques, can simplify technique and relevant cost.
Fig. 4 display present invention is used for an embodiment of the semiconductor package of motor driving in conjunction with central siphon and plate body
Diagrammatic cross-section.With reference to Fig. 4, in one embodiment, which includes separately a central siphon 16, is set to the hole
In 14.The central siphon 16 is tight in the hole 14.The central siphon 16 can be metal central siphon or plastic cement central siphon.In one embodiment, should
Semiconductor package 10 separately includes a plate body 17, which is fixedly arranged at the plate body 17.The plate body 17 can be circuit
Plate, printed circuit board, bottom plate, motherboard (mother board), metal plate, plastic plate or substrate.The plate body 17 can be a framework.
In one embodiment, which includes separately a metal fixation kit 18, is set to the central siphon 16
Periphery wall, 18 solder bond of metal fixation kit to the plate body 17.In one embodiment, which includes
Multiple metallic pins 181, using the multiple layer metal pin 181 with spot welding, laser welding, soldering or surface mount technology (SMT)
Equal welding manners, solder bond to the plate body 17.
Fig. 5 shows the diagrammatic cross-section of an embodiment of motor of the present invention.With reference to Fig. 5, which includes: semiconductor
Encapsulating structure 10 and a rotor 20.The semiconductor package 10 please refers to the above-mentioned narration of Fig. 4 semiconductor package 10,
It is not described herein.However, the semiconductor package 10 of the semiconductor package 10 of Fig. 5 without Fig. 4 is somebody's turn to do
Metal fixation kit 18.In the semiconductor package 10 of Fig. 5, the central siphon 16 and the plate body 17 are integrally formed production.
The central siphon 16 and the plate body 17 form a blind hole.The semiconductor package 10 includes separately an axle sleeve 161, is set to the central siphon 16
It is interior.The axle sleeve 161 can be bearing.
The rotor 20 has a wheel hub 21 and a permanent magnet 22.The rotor 20 is rotatably arranged to the hole 14.?
In one embodiment, which separately includes a central axis 23, which is rotationally arranged at the central siphon 16.The permanent magnetic
Iron 22 is incorporated into the wheel hub 21.In one embodiment, which is an annular solid, and the permanent magnet 22 is incorporated into this
The inside peripheral wall of wheel hub 21.The permanent magnet 22 is corresponding with the coil block 10.
Using the hole 14, the semiconductor package 10 can easily in conjunction with the other elements of motor, such as: central siphon
16 and rotor 20, after being set to the rotor 20 in the hole 14, motor 30 can be completed, can significantly simplify and speed up production
The technique of motor, and motor microminiaturization can be made.
Diagrammatic cross-section of Fig. 6 display present invention for an embodiment of the semiconductor package of motor driving.With reference to
Fig. 6, the semiconductor package 40 include a coil block 11 and a motor drive unit 12 and encapsulating material 13.Compared to figure
1 embodiment, identical element then gives similar elements number in the embodiment in fig 6.In one embodiment, the semiconductor package
Assembling structure 40 includes separately a bearing 41, is formed in the relative position of the hole 14.The bearing 41 is formed in the inner circumferential of the hole 14
Wall.The bearing 41 is made with semiconductor technology.
In one embodiment, which separately includes a support plate 42, and the coil block 11 and the motor drive
Moving cell 12 is set to the support plate 42.The support plate 42 can be substrate.The hole 14 is blind hole, that is, the support plate 42 is not perforated.
Fig. 7 shows the diagrammatic cross-section of an embodiment of motor of the present invention.With reference to Fig. 7, which includes: semiconductor
Encapsulating structure 40 and a rotor 50.The above-mentioned of the semiconductor package 40 that the semiconductor package 40 please refers to Fig. 6 is chatted
It states, is not described herein.The rotor 50 has a wheel hub 51 and a permanent magnet 52.The rotor 50 is rotatably arranged to this
Hole 14.In one embodiment, which separately includes a central axis 53, which is rotationally arranged at the bearing
41。
Using the hole, central siphon or bearing can be directly arranged in the hole.Also, on production motor, it is only necessary to make
The semiconductor package, then rotor is set in the hole, motor can be completed, therefore can significantly simplify and speed up production
The technique of motor, and motor microminiaturization can be made.
Diagrammatic cross-section of Fig. 8 display present invention for an embodiment of the semiconductor package of motor driving.With reference to
Fig. 8, in one embodiment, the semiconductor package 70 include a coil block 71 and a motor drive unit 72, package material
Material 73 and hole 74.The coil block 71 has multilayer wire ring layer.The folded setting of the lattice coil layer heap.In one embodiment, should
Multilayer wire ring layer includes a bottom line ring layer 711, a coil layer 712 and a top line ring layer 713.The motor drive unit 72 is set
It is placed in the top line ring layer 713.Encapsulating material 73 encapsulates the coil block 71 and the motor drive unit 72.
The coil block 71 is set between one first setting height H1 and one second setting height H2, and first setting is high
The extreme lower position height that H1 is the coil block 71 is spent, second setting height H2 is an extreme higher position of the coil block 71
Highly, second setting height H2 is greater than first setting height H1.First setting height H1 is the bottom line ring layer 711
Minimum set height.Second setting height H2 is that height is arranged in a highest of the encapsulating material 73.The motor drive unit 72
It is set between the first setting height H1 and second setting height H2.
The hole 74 is formed in a setting position of the semiconductor package 70.In one embodiment, 74 shape of hole
At in a central location of the semiconductor package 70.Using the hole 74, the semiconductor package 70 can easily with
The other elements of motor combine, such as: central siphon 16, axle sleeve 161 and the rotor 20 of Fig. 5 makes the rotor 20 be set to the hole 74
After interior, motor can be completed, the technique that can significantly simplify and speed up production motor, and motor microminiaturization can be made.
Above-described embodiment is only to illustrate the principle of the present invention and its effect, is not intended to limit the present invention.Those skilled in the art
The modification and variation made to above-described embodiment are still without prejudice to spirit of the invention.Interest field of the invention should be such as claim
It is listed.
Claims (58)
1. a kind of semiconductor package for motor driving characterized by comprising
One coil block, is made with semiconductor technology；
One motor drive unit, is made with semiconductor technology, is set in the coil block, and is electrically connected the coil block；
Encapsulating material, encapsulating the coil block is semiconductor package；And
One hole is formed in a setting position of the semiconductor package.
2. a kind of semiconductor package for motor driving characterized by comprising
One coil block, is made with semiconductor technology；
One motor drive unit, is made with semiconductor technology, is electrically connected the coil block；
Encapsulating material, encapsulates the coil block and the motor drive unit is semiconductor package；And
One hole is formed in a setting position of the semiconductor package.
3. the semiconductor package for motor driving as claimed in claim 1 or 2, which is characterized in that separately include an axis
It holds, is formed in the relative position of the hole.
4. the semiconductor package for motor driving as claimed in claim 3, which is characterized in that the bearing is with semiconductor
Technique production.
5. the semiconductor package for motor driving as claimed in claim 1 or 2, which is characterized in that separately include an axis
Pipe, is set in the hole.
6. the semiconductor package for motor driving as claimed in claim 5, which is characterized in that it separately include a plate body,
The central siphon is fixedly arranged at the plate body.
7. the semiconductor package for motor driving as claimed in claim 6, which is characterized in that separately include that a metal is solid
Determine component, is set to the periphery wall of the central siphon, the metal fixation kit solder bond to the plate body.
8. the semiconductor package for motor driving as claimed in claim 5, which is characterized in that the central siphon is tight at this
In hole.
9. the semiconductor package for motor driving as claimed in claim 6, which is characterized in that the plate body is a frame
Body.
10. the semiconductor package for motor driving as claimed in claim 1 or 2, which is characterized in that another to be carried including one
Plate, the coil block and the motor drive unit are set to the support plate.
11. the semiconductor package for motor driving as claimed in claim 1 or 2, which is characterized in that the hole is to pass through
Hole.
12. the semiconductor package for motor driving as claimed in claim 1 or 2, which is characterized in that the hole is blind
Hole.
13. the semiconductor package for motor driving as claimed in claim 1 or 2, which is characterized in that the semiconductor package
Assembling structure is in a ring.
14. the semiconductor package for motor driving as claimed in claim 1 or 2, which is characterized in that motor driving
Unit is that a motor drives chip.
15. the semiconductor package for motor driving as claimed in claim 1 or 2, which is characterized in that motor driving
Unit is a motor driving chip packaging body.
16. the semiconductor package for motor driving as claimed in claim 1 or 2, which is characterized in that separately include multiple
Electrically connected port is electrically connected the coil block or the motor drive unit.
17. the semiconductor package for motor driving as claimed in claim 1 or 2, which is characterized in that the coil block
With multilayer wire ring layer, the folded setting of the lattice coil layer heap, each coil layer includes multiple coils, is had between adjacent coil layers
One medium unit, multilayer wire ring layer electrical connection.
18. as claimed in claim 17 for semiconductor package of motor driving, which is characterized in that motor driving
Unit is set at least one medium unit.
19. the semiconductor package for motor driving as claimed in claim 17, which is characterized in that each coil layer
The lattice coil is set to same plane height.
20. the semiconductor package for motor driving as claimed in claim 17, which is characterized in that the medium unit packet
An insulating layer and at least a conductive column are included, which is electrically connected adjacent coil layers.
21. the semiconductor package for motor driving as claimed in claim 20, which is characterized in that at least one conduction
Column is made with electroforming process.
22. the semiconductor package for motor driving as claimed in claim 20, which is characterized in that motor driving is single
Member is set to the insulating layer.
23. the semiconductor package for motor driving as claimed in claim 17, which is characterized in that the medium unit is
One substrate.
24. as claimed in claim 17 for motor driving semiconductor package, which is characterized in that the coil block and
The motor drive unit is set between one first setting height and one second setting height, which is the coil
One extreme lower position height of component, the second setting height are an extreme higher position height of the coil block, and second setting is high
Degree is greater than the first setting height.
25. the semiconductor package for motor driving as claimed in claim 24, which is characterized in that the multilayer wire ring layer
Including a bottom line ring layer and a top line ring layer, which is set to a bottom position of the multilayer wire ring layer, should
Top line ring layer is set to a top position of the multilayer wire ring layer.
26. the semiconductor package for motor driving as claimed in claim 25, which is characterized in that first setting is high
Degree is a minimum set height of the bottom line ring layer, which is arranged high for a highest of the top line ring layer
Degree.
27. the semiconductor package for motor driving as claimed in claim 25, which is characterized in that motor driving is single
Member is set to the top line ring layer.
28. the semiconductor package for motor driving as claimed in claim 27, which is characterized in that first setting is high
Degree is a minimum set height of the bottom line ring layer, which is that height is arranged in a highest of the encapsulating material.
29. the semiconductor package for motor driving as claimed in claim 1 or 2, which is characterized in that the hole formation
In a central location of the semiconductor package.
30. a kind of motor characterized by comprising
Semiconductor encapsulating structure, comprising:
One coil block, is made with semiconductor technology；
One motor drive unit, is made with semiconductor technology, is set in the coil block, and is electrically connected the coil block；
Encapsulating material, encapsulating the coil block is semiconductor package；And
One hole is formed in a setting position of the semiconductor package；And
One rotor has a wheel hub and a permanent magnet, which is rotatably arranged to the hole, which is incorporated into
The wheel hub, and the permanent magnet is corresponding with the coil block.
31. a kind of motor characterized by comprising
Semiconductor encapsulating structure, comprising:
One coil block, is made with semiconductor technology；
One motor drive unit, is made with semiconductor technology, is electrically connected the coil block；
Encapsulating material, encapsulates the coil block and the motor drive unit is semiconductor package；And
One hole is formed in a setting position of the semiconductor package；And
One rotor has a wheel hub and a permanent magnet, which is rotatably arranged to the hole, which is incorporated into
The wheel hub, and the permanent magnet is corresponding with the coil block.
32. the motor as described in claim 30 or 31, which is characterized in that include separately a bearing, be formed in the opposite of the hole
Position.
33. motor as claimed in claim 32, which is characterized in that the bearing is made with semiconductor technology.
34. the motor as described in claim 30 or 31, which is characterized in that include separately a central siphon, be set in the hole.
35. motor as claimed in claim 34, which is characterized in that separately include a plate body, which is fixedly arranged at the plate
Body.
36. motor as claimed in claim 35, which is characterized in that include separately a metal fixation kit, be set to the central siphon
Periphery wall, the metal fixation kit solder bond to the plate body.
37. motor as claimed in claim 34, which is characterized in that the central siphon is tight in the hole.
38. motor as claimed in claim 35, which is characterized in that the plate body is a framework.
39. the motor as described in claim 30 or 31, which is characterized in that separately include a support plate, the coil block and the motor
Driving unit is set to the support plate.
40. the motor as described in claim 30 or 31, which is characterized in that the hole is perforation.
41. the motor as described in claim 30 or 31, which is characterized in that the hole is blind hole.
42. the motor as described in claim 30 or 31, which is characterized in that the semiconductor package is in a ring.
43. the motor as described in claim 30 or 31, which is characterized in that the motor drive unit is that a motor drives chip.
44. the motor as described in claim 30 or 31, which is characterized in that the motor drive unit is motor driving chip envelope
Fill body.
45. the motor as described in claim 30 or 31, which is characterized in that include separately multiple electrically connected ports, be electrically connected the line
Coil assembly or the motor drive unit.
46. the motor as described in claim 30 or 31, which is characterized in that the coil block has multilayer wire ring layer, the multilayer
Coil layer stacks setting, and each coil layer includes multiple coils, has a medium unit, the lattice coil between adjacent coil layers
Layer electrical connection.
47. motor as claimed in claim 46, which is characterized in that the motor drive unit is set at least one intermediary list
Member.
48. motor as claimed in claim 46, which is characterized in that the lattice coil of each coil layer is set to same plane
Highly.
49. motor as claimed in claim 46, which is characterized in that the medium unit includes that an insulating layer and at least one are conductive
Column, an at least conductive column are electrically connected adjacent coil layers.
50. motor as claimed in claim 49, which is characterized in that at least a conductive column is made with electroforming process for this.
51. motor as claimed in claim 49, which is characterized in that the motor drive unit is set to the insulating layer.
52. motor as claimed in claim 46, which is characterized in that the medium unit is a substrate.
53. motor as claimed in claim 46, which is characterized in that the coil block and the motor drive unit are set to one
Between one setting height and one second setting height, which is an extreme lower position height of the coil block, should
Second setting height is an extreme higher position height of the coil block, which is greater than the first setting height.
54. motor as claimed in claim 53, which is characterized in that the multilayer wire ring layer includes a bottom line ring layer and a top
Coil layer, the bottom line ring layer are set to a bottom position of the multilayer wire ring layer, which is set to the multilayer wire
One top position of ring layer.
55. motor as claimed in claim 54, which is characterized in that the first setting height is the one minimum of the bottom line ring layer
Setting height, the second setting height are that height is arranged in a highest of the top line ring layer.
56. motor as claimed in claim 54, which is characterized in that the motor drive unit is set to the top line ring layer.
57. motor as claimed in claim 56, which is characterized in that the first setting height is the one minimum of the bottom line ring layer
Setting height, the second setting height are that height is arranged in a highest of the encapsulating material.
58. the motor as described in claim 30 or 31, which is characterized in that the hole formation in the semiconductor package one
Central location.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| TW106123007A TWI651918B (en) | 2017-07-10 | 2017-07-10 | Semiconductor package structure and motor for motor drive |
| TW106123007 | 2017-07-10 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN109244044A true CN109244044A (en) | 2019-01-18 |
Family
ID=65083992
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201711001842.9A Pending CN109244044A (en) | 2017-07-10 | 2017-10-24 | Semiconductor packaging structure for motor driving and motor |
Country Status (2)
| Country | Link |
|---|---|
| CN (1) | CN109244044A (en) |
| TW (1) | TWI651918B (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113497536A (en) * | 2020-04-01 | 2021-10-12 | 中芯集成电路（宁波）有限公司 | Actuator, forming method thereof, driving method thereof, electronic device and imaging module |
Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS61206U (en) * | 1984-06-06 | 1986-01-06 | 旭化成株式会社 | printed coil unit |
| JPH10257704A (en) * | 1997-03-10 | 1998-09-25 | S M C:Kk | Motor and manufacturing for multi-pole flat coil |
| US6005324A (en) * | 1997-06-25 | 1999-12-21 | Daewoo Electronics Co., Ltd. | Brushless motor and method of manufacturing a stator of the brushless motor |
| TW201103234A (en) * | 2009-07-09 | 2011-01-16 | Sunonwealth Electr Mach Ind Co | A stator of a motor with a coil unit |
| CN105576872A (en) * | 2014-10-31 | 2016-05-11 | 建准电机工业股份有限公司 | Motor and winding set thereof |
| CN105990931A (en) * | 2015-01-27 | 2016-10-05 | 建准电机工业股份有限公司 | Motor winding |
Family Cites Families (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5678342A (en) * | 1979-11-26 | 1981-06-27 | Kangiyou Denki Kiki Kk | Printed circuit |
| JP4496010B2 (en) * | 2004-05-20 | 2010-07-07 | 株式会社東芝 | motor |
| TW200835120A (en) * | 2007-02-02 | 2008-08-16 | Yen Sun Technology Corp | Waterproof motor stator and method of making the same |
-
2017
- 2017-07-10 TW TW106123007A patent/TWI651918B/en active
- 2017-10-24 CN CN201711001842.9A patent/CN109244044A/en active Pending
Patent Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS61206U (en) * | 1984-06-06 | 1986-01-06 | 旭化成株式会社 | printed coil unit |
| JPH10257704A (en) * | 1997-03-10 | 1998-09-25 | S M C:Kk | Motor and manufacturing for multi-pole flat coil |
| US6005324A (en) * | 1997-06-25 | 1999-12-21 | Daewoo Electronics Co., Ltd. | Brushless motor and method of manufacturing a stator of the brushless motor |
| TW201103234A (en) * | 2009-07-09 | 2011-01-16 | Sunonwealth Electr Mach Ind Co | A stator of a motor with a coil unit |
| CN105576872A (en) * | 2014-10-31 | 2016-05-11 | 建准电机工业股份有限公司 | Motor and winding set thereof |
| CN105990931A (en) * | 2015-01-27 | 2016-10-05 | 建准电机工业股份有限公司 | Motor winding |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113497536A (en) * | 2020-04-01 | 2021-10-12 | 中芯集成电路（宁波）有限公司 | Actuator, forming method thereof, driving method thereof, electronic device and imaging module |
Also Published As
| Publication number | Publication date |
|---|---|
| TW201909518A (en) | 2019-03-01 |
| TWI651918B (en) | 2019-02-21 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| US20190334393A1 (en) | Stack-type stator using multi-layer substrate, slim motor using same, and blower for air purification system | |
| CN103532313B (en) | Motor | |
| CN105871089B (en) | A kind of printed circuit board stator | |
| US20150097462A1 (en) | Laminated core and method for manufacturing the same | |
| CN109072929A (en) | Laminated type stator using multilayer board and the single-phase motor and cooling fan using it | |
| CN103683682A (en) | Rotating electric machine drive system | |
| TW201209991A (en) | Stackable molded microelectronic packages with area array unit connectors | |
| CN109075622A (en) | Thin stator, single-phase motor and cooling fan using it | |
| CN109075621A (en) | Thin stator and using its without sensor single-phase motor and cooling fan | |
| CN103090890A (en) | Magnetic sensor device | |
| CN101459127A (en) | Sensor module and method for manufacturing a sensor module | |
| CN103023170A (en) | Connection module for a bar wound stator assembly and method of manufacturing a bar wound stator assembly | |
| CN105277217A (en) | Magnetic sensor device with ring-shaped magnet | |
| CN107424970A (en) | Semiconductor device packages and its manufacture method | |
| CN1028582C (en) | Energization coil device, method of making such device and electromagnetic micromotor fitted therewith | |
| CN107295747A (en) | Component carrier and the method for manufacturing component carrier | |
| CN107112121A (en) | Embedded coil block and its manufacture method | |
| CN203180679U (en) | A motor | |
| CN109300882A (en) | Stack embedded packaging structure and preparation method thereof | |
| CN109244044A (en) | Semiconductor packaging structure for motor driving and motor | |
| CN208655635U (en) | Stack embedded packaging structure | |
| JP4465647B2 (en) | Multilayer coil and brushless motor using the same | |
| CN109392315A (en) | Rotor and whirler | |
| CN106449550A (en) | Chip packaging module | |
| TWI651919B (en) | Drive assembly for motor and semiconductor package structure for motor excitation |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| WD01 | Invention patent application deemed withdrawn after publication | ||
| WD01 | Invention patent application deemed withdrawn after publication |
Application publication date: 20190118 |