CN109219272A - A kind of conduction method of flexible electric circuit board - Google Patents
A kind of conduction method of flexible electric circuit board Download PDFInfo
- Publication number
- CN109219272A CN109219272A CN201811229664.XA CN201811229664A CN109219272A CN 109219272 A CN109219272 A CN 109219272A CN 201811229664 A CN201811229664 A CN 201811229664A CN 109219272 A CN109219272 A CN 109219272A
- Authority
- CN
- China
- Prior art keywords
- hole
- circuit board
- electric circuit
- flexible electric
- copper
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
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Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
- H05K3/42—Plated through-holes or plated via connections
- H05K3/425—Plated through-holes or plated via connections characterised by the sequence of steps for plating the through-holes or via connections in relation to the conductive pattern
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09209—Shape and layout details of conductors
- H05K2201/095—Conductive through-holes or vias
- H05K2201/09563—Metal filled via
Abstract
The invention discloses a kind of conduction methods of flexible electric circuit board, and processing carries out black holes processing to the through-hole to obtain through-hole at the pad of flexible electric circuit board, make to adhere to one layer of carbon dust layer on the hole wall of through-hole；Electroplating liquid medicine using TP value greater than 180 carries out electro-coppering to black holes treated through-hole, makes to form conductting layer in the through-hole.Through-hole is processed at pad, is avoided the pre-treatment process of production blind hole and blind hole, can be effectively improved the planarization of flexible electric circuit board plate face, pass bad phenomena such as being recessed with blind hole filling perforation caused by having evaded because of production blind hole；The upper copper rate that copper rate is greater than face copper in through hole wall can be made, so that turn-on effect is good, to guarantee the electric property of flex circuit application convenient for forming conductting layer in through-hole using the electroplating liquid medicine of high TP value.
Description
Technical field
The present invention relates to circuit board technology field more particularly to a kind of conduction methods of flexible electric circuit board.
Background technique
When pad will carry out paster technique at the via-hole of circuit board of double-faced flexible, the conducting between pad generallys use blind
Technique is filled and led up to realize in hole, but since flexible electric circuit board is very thin, easily generates pleat when carrying out processing and holeization processing to blind hole
Wrinkle, blind hole pass is unqualified, hole when hole bottom black line and blind hole filling perforation be recessed phenomena such as excessive, produced after will lead to patch
The failure of product electrical property.
Summary of the invention
The technical problems to be solved by the present invention are: a kind of conduction method of flexible electric circuit board is provided, manufacturing process letter
It is single, and the electric property of product can be effectively ensured.
In order to solve the above-mentioned technical problem, the technical solution adopted by the present invention are as follows:
A kind of conduction method of flexible electric circuit board, processing is at the pad of flexible electric circuit board to obtain through-hole, to described logical
Hole carries out black holes processing, makes to adhere to one layer of carbon dust layer on the hole wall of through-hole；Using TP value greater than 180 electroplating liquid medicine to black holes at
Through-hole after reason carries out electro-coppering, makes to form conductting layer in the through-hole.
The beneficial effects of the present invention are: through-hole is processed at pad, avoids the pre-treatment stream of production blind hole and blind hole
Journey can be effectively improved the planarization of flexible electric circuit board plate face, and pass is bad caused by having evaded because of production blind hole and blind hole is filled out
Phenomena such as hole is recessed；Copper rate in through hole wall can be made to be convenient for greater than the upper copper rate of face copper using the electroplating liquid medicine of high TP value
Conductting layer is formed in through-hole, so that turn-on effect is good, guarantees the electric property of flex circuit application.
Detailed description of the invention
Fig. 1 is cross-sectional view of the flexible electric circuit board of the embodiment of the present invention one in turn on process；
Fig. 2 is another cross-sectional view of the flexible electric circuit board of the embodiment of the present invention one in turn on process；
Fig. 3 is another cross-sectional view of the flexible electric circuit board of the embodiment of the present invention one in turn on process；
Fig. 4 is the cross-sectional view of the flexible electric circuit board of the embodiment of the present invention one after switch.
Label declaration:
1, the first layers of copper；2, PI layers；3, the second layers of copper；4, through-hole；5, carbon dust layer；6, conductting layer；61, it is recessed.
Specific embodiment
To explain the technical content, the achieved purpose and the effect of the present invention in detail, below in conjunction with embodiment and cooperate attached
Figure is explained.
The most critical design of the present invention is: processing through-hole at the pad of flexible electric circuit board, then it is greater than using TP value
180 electroplating liquid medicine carries out electro-coppering to black holes treated through-hole, avoids the pre-treatment process of production blind hole and blind hole, can
To be effectively improved the planarization of flexible electric circuit board plate face.
Fig. 1 to Fig. 4 is please referred to, a kind of conduction method of flexible electric circuit board, processing is at the pad of flexible electric circuit board to obtain
Through-hole 4 is obtained, black holes processing is carried out to the through-hole 4, makes to adhere to one layer of carbon dust layer 5 on the hole wall of through-hole 4；It is greater than using TP value
180 electroplating liquid medicine carries out electro-coppering to black holes treated through-hole 4, makes to form conductting layer 6 in the through-hole 4.
As can be seen from the above description, the beneficial effects of the present invention are: at pad process through-hole, avoid production blind hole and
The pre-treatment process of blind hole, can be effectively improved the planarization of flexible electric circuit board plate face, hole caused by having evaded because of production blind hole
Phenomena such as type is bad and blind hole filling perforation is recessed；Copper rate in through hole wall can be made to be greater than face copper using the electroplating liquid medicine of high TP value
Upper copper rate, convenient for forming conductting layer in through-hole.
Further, the through-hole 4 is obtained using the method for laser drill.
Seen from the above description, the through-hole precision that laser drill obtains is high, and obtained through-hole aperture is small.
Further, the aperture of the through-hole 4 is 0.025~0.035mm.
Further, recess 61 is formed on the conductting layer 6, the depth value of the recess 61 is less than or equal to 12 μm.
Further, the flexible electric circuit board includes the first layers of copper 1 being cascading, PI layer 2 and the second layers of copper 3.
Further, the thickness value of the PI layer 2 is 24~26 μm.
Further, the thickness value of first layers of copper 1 and the second layers of copper 3 is 5~7 μm.
Seen from the above description, the smaller through-hole easy to process of the thickness value of the first layers of copper and the second layers of copper.
Please refer to Fig. 1 to Fig. 4, the embodiment of the present invention one are as follows:
A kind of conduction method of flexible electric circuit board, includes the following steps:
Bottom copper thickness is selected to make flex circuit application, such as Fig. 1 for 1/3OZ, PI layer 2 with a thickness of 24~26 μm of substrate first
It is shown, the thickness of bottom copper is reduced to by 5~7 μm, the i.e. thickness of the first layers of copper 1 and the second layers of copper 3 using the roll-to-roll method for subtracting copper wire
Degree is 5~7 μm.Sawing sheet is carried out to substrate, cuts into the size of needs as requested.
As shown in Fig. 2, processing is at the pad of flexible electric circuit board to obtain through-hole 4, specifically, using the side of laser drill
Method obtains the through-hole 4, and the aperture of the through-hole 4 is 0.025~0.035mm, it is preferred that the aperture of the through-hole 4 is
0.03mm。
As shown in figure 3, carrying out black holes processing to the through-hole 4, make to adhere to one layer of carbon dust layer 5 on the hole wall of through-hole 4.Black
The carbon dust layer 5 in the first layers of copper 1 and the second layers of copper 3 is removed in the treatment process of hole.
As shown in figure 4, the electroplating liquid medicine using TP value greater than 180 carries out electro-coppering to black holes treated through-hole 4, make institute
It states and forms conductting layer 6 in through-hole 4.In the present embodiment, recess 61, the depth value of the recess 61 are formed on the conductting layer 6
Less than or equal to 12 μm.In electro-coppering due to the electroplating liquid medicine using high TP value, so that copper plating copper thickness in face is less than or equal to
12μm.Cut sections for microscopic examination finally are carried out to conductting layer 6 according to the reception standard of blind hole filling perforation, the normal system of dual platen is carried out after qualified
Make process.
The embodiment of the present invention two are as follows:
A kind of conduction method of flex circuit application, with embodiment one the difference is that:
PI layers with a thickness of 25 μ, the first layers of copper and the second layers of copper with a thickness of 6 μm；The aperture of through-hole is 0.03mm.
The embodiment of the present invention three are as follows:
A kind of conduction method of flex circuit application, with embodiment one the difference is that:
PI layers with a thickness of 24 μ, the first layers of copper and the second layers of copper with a thickness of 5 μm；The aperture of through-hole is 0.025mm.
The embodiment of the present invention four are as follows:
A kind of conduction method of flex circuit application, with embodiment one the difference is that:
PI layers with a thickness of 26 μ, the first layers of copper and the second layers of copper with a thickness of 7 μm；The aperture of through-hole is 0.035mm.
In conclusion a kind of conduction method of flex circuit application provided by the invention, production blind hole and blind hole are avoided
Pre-treatment process can be effectively improved the planarization of flexible electric circuit board plate face, and pass is bad caused by having evaded because of production blind hole
Phenomena such as with blind hole filling perforation recess；Turn-on effect is good, can effectively ensure that the electric property of flex circuit application.
The above description is only an embodiment of the present invention, is not intended to limit the scope of the invention, all to utilize this hair
Equivalents made by bright specification and accompanying drawing content are applied directly or indirectly in relevant technical field, similarly include
In scope of patent protection of the invention.
Claims (7)
1. a kind of conduction method of flexible electric circuit board, which is characterized in that it is processed at the pad of flexible electric circuit board to obtain through-hole,
Black holes processing is carried out to the through-hole, makes to adhere to one layer of carbon dust layer on the hole wall of through-hole；It is greater than 180 electroplating liquid medicine using TP value
Electro-coppering is carried out to black holes treated through-hole, makes to form conductting layer in the through-hole.
2. the conduction method of flexible electric circuit board according to claim 1, which is characterized in that obtained using the method for laser drill
To the through-hole.
3. the conduction method of flexible electric circuit board according to claim 1, which is characterized in that the aperture of the through-hole is
0.025~0.035mm.
4. the conduction method of flexible electric circuit board according to claim 1, which is characterized in that be formed on the conductting layer recessed
It falls into, the depth value of the recess is less than or equal to 12 μm.
5. the conduction method of flexible electric circuit board according to claim 1, which is characterized in that the flexible electric circuit board include according to
Secondary the first layers of copper being stacked, PI layers and the second layers of copper.
6. the conduction method of flexible electric circuit board according to claim 5, which is characterized in that PI layers of the thickness value is 24
~26 μm.
7. the conduction method of flexible electric circuit board according to claim 5, which is characterized in that first layers of copper and the second bronze medal
The thickness value of layer is 5~7 μm.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201811229664.XA CN109219272A (en) | 2018-10-22 | 2018-10-22 | A kind of conduction method of flexible electric circuit board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201811229664.XA CN109219272A (en) | 2018-10-22 | 2018-10-22 | A kind of conduction method of flexible electric circuit board |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN109219272A true CN109219272A (en) | 2019-01-15 |
Family
ID=64981145
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201811229664.XA Pending CN109219272A (en) | 2018-10-22 | 2018-10-22 | A kind of conduction method of flexible electric circuit board |
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| Country | Link |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109825863A (en) * | 2019-03-28 | 2019-05-31 | 烟台恒诺新材料有限公司 | A kind of carbon nanotube conducting starches the application in black holesization is directly electroplated |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101119614A (en) * | 2006-07-31 | 2008-02-06 | 比亚迪股份有限公司 | Pattern electroplating method for two-sided and multi-layer flexible printed circuit board |
| CN101572992A (en) * | 2008-04-28 | 2009-11-04 | 王定锋 | Continuous double-sided flexible printed circuit board and LED strip |
| CN105887144A (en) * | 2016-06-21 | 2016-08-24 | 广东光华科技股份有限公司 | Electric copper plating liquid and electric copper plating process thereof |
| CN107217282A (en) * | 2017-07-24 | 2017-09-29 | 苏州天承化工有限公司 | A kind of high TP values soft board electroplate liquid and electro-plating method |
| CN108560029A (en) * | 2018-01-10 | 2018-09-21 | 深圳市星扬高新科技有限公司 | A kind of FPC flexible boards copper plating additive and preparation method thereof |
-
2018
- 2018-10-22 CN CN201811229664.XA patent/CN109219272A/en active Pending
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101119614A (en) * | 2006-07-31 | 2008-02-06 | 比亚迪股份有限公司 | Pattern electroplating method for two-sided and multi-layer flexible printed circuit board |
| CN101572992A (en) * | 2008-04-28 | 2009-11-04 | 王定锋 | Continuous double-sided flexible printed circuit board and LED strip |
| CN105887144A (en) * | 2016-06-21 | 2016-08-24 | 广东光华科技股份有限公司 | Electric copper plating liquid and electric copper plating process thereof |
| CN107217282A (en) * | 2017-07-24 | 2017-09-29 | 苏州天承化工有限公司 | A kind of high TP values soft board electroplate liquid and electro-plating method |
| CN108560029A (en) * | 2018-01-10 | 2018-09-21 | 深圳市星扬高新科技有限公司 | A kind of FPC flexible boards copper plating additive and preparation method thereof |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109825863A (en) * | 2019-03-28 | 2019-05-31 | 烟台恒诺新材料有限公司 | A kind of carbon nanotube conducting starches the application in black holesization is directly electroplated |
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| RJ01 | Rejection of invention patent application after publication |
Application publication date: 20190115 |
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