CN109218567A - Camera module and its photosensory assembly - Google Patents
Camera module and its photosensory assembly Download PDFInfo
- Publication number
- CN109218567A CN109218567A CN201710524903.3A CN201710524903A CN109218567A CN 109218567 A CN109218567 A CN 109218567A CN 201710524903 A CN201710524903 A CN 201710524903A CN 109218567 A CN109218567 A CN 109218567A
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- China
- Prior art keywords
- light hole
- packaging body
- photosensory assembly
- side wall
- photosensitive element
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- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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- 238000004806 packaging method and process Methods 0.000 claims abstract description 82
- 239000000758 substrate Substances 0.000 claims abstract description 30
- 230000003287 optical effect Effects 0.000 claims description 15
- 238000000465 moulding Methods 0.000 abstract description 8
- 239000000463 material Substances 0.000 description 6
- 238000005538 encapsulation Methods 0.000 description 5
- 238000000034 method Methods 0.000 description 4
- 230000007704 transition Effects 0.000 description 4
- 229920000106 Liquid crystal polymer Polymers 0.000 description 3
- 239000004977 Liquid-crystal polymers (LCPs) Substances 0.000 description 3
- 239000004743 Polypropylene Substances 0.000 description 3
- -1 Polypropylene Polymers 0.000 description 2
- 230000004313 glare Effects 0.000 description 2
- 238000012536 packaging technology Methods 0.000 description 2
- 229920001155 polypropylene Polymers 0.000 description 2
- 230000001681 protective effect Effects 0.000 description 2
- 238000007788 roughening Methods 0.000 description 2
- 230000003319 supportive effect Effects 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 241000218202 Coptis Species 0.000 description 1
- 235000002991 Coptis groenlandica Nutrition 0.000 description 1
- 239000004677 Nylon Substances 0.000 description 1
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 1
- 229910000831 Steel Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- 239000000919 ceramic Substances 0.000 description 1
- 238000010276 construction Methods 0.000 description 1
- 238000001746 injection moulding Methods 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
- 238000003754 machining Methods 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 229920001778 nylon Polymers 0.000 description 1
- 229920000642 polymer Polymers 0.000 description 1
- 238000009738 saturating Methods 0.000 description 1
- 238000007493 shaping process Methods 0.000 description 1
- 125000006850 spacer group Chemical group 0.000 description 1
- 239000010959 steel Substances 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
- H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
- H04N23/50—Constructional details
- H04N23/54—Mounting of pick-up tubes, electronic image sensors, deviation or focusing coils
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
- H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
- H04N23/50—Constructional details
- H04N23/55—Optical parts specially adapted for electronic image sensors; Mounting thereof
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
- H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
- H04N23/57—Mechanical or electrical details of cameras or camera modules specially adapted for being embedded in other devices
Landscapes
- Engineering & Computer Science (AREA)
- Multimedia (AREA)
- Signal Processing (AREA)
- Studio Devices (AREA)
Abstract
The present invention relates to a kind of camera module and its photosensory assembly, photosensory assembly includes: substrate；Photosensitive element is set on substrate and is electrically connected with substrate, and photosensitive element includes the photosurface for being provided with photosensitive area；Packaging body, including the lower surface and upper surface being oppositely arranged, packaging body is equipped with light hole；Light hole includes the first light hole and the second light hole, patch photosurface is supported in the bottom end of first light hole, the side wall of first light hole is to be recessed the concave surface to be formed towards the lateral wall of packaging body, the side wall of second light hole extends to the upper surface of the packaging body from the inclination of the first light hole apical margin, and the internal diameter of the second light hole is gradually increased in this direction.Above-mentioned photosensory assembly, sidewall slope extension and diameter due to the second light hole of packaging body are gradually increased on the direction far from photosensitive element, and the light quantity being radiated on photosensitive element increases.Moreover, the side wall of the second light hole is oblique, can be convenient for being used to form the molding mold release of packaging body.
Description
Technical field
The present invention relates to camera module fields, more particularly to a kind of camera module and its photosensory assembly.
Background technique
With the fast development of various smart machines, the smart machine for being integrated with camera module is improving the same of image quality
When, also increasingly as lightening direction is developed.And improve image quality mean the specification of electronic component constantly increase, quantity
It is increasing, largely influences also constantly increasing for the area of the photosensitive element of image quality, therefore cause camera module
Assembling difficulty constantly increase, overall dimensions also constantly increase, cause the lightening of camera module to receive very big limitation, into
And limit the volume of the smart machine equipped with the camera module.
The camera module packaging technology generallyd use now is COB (Chip On Board) packaging technology, that is, camera shooting mould
Wiring board, photosensitive element, the bracket etc. of group are made into respectively, then successively by passive electronic component, photosensitive element and bracket
Encapsulation is in the circuit board.
However use above-mentioned molded method, it usually needs light hole is formed by supporting structure, is on wiring board
Sensitive chip provide passage of light.But currently, since light is the camera module that decision is equipped with the photosensory assembly into image quality
An important factor for amount, and current bracket shape limits the size of light passing amount, and is unfavorable for demoulding, and affects camera module
Image quality.
Summary of the invention
Based on this, it is necessary to lead to because of fault of construction that light passing amount is smaller, not easy mold release for the light hole of photosensory assembly
The problem of, the camera module and its photosensory assembly of a kind of larger, the easy demoulding of light passing amount are provided.
A kind of photosensory assembly, comprising:
Substrate；
Photosensitive element is set on the substrate and is electrically connected with the substrate, and the photosensitive element includes photosurface, institute
Stating photosurface includes photosensitive area；And
Packaging body is packaged on the substrate and the photosensitive element, and the packaging body includes far from the photosensitive element
Upper surface, the packaging body, which is equipped with, runs through light hole, and the light hole is through the packaging body and photosensitive area described in face；
Wherein, the light hole includes the first light hole and the second light hole of connection, the bottom end of first light hole
To pasting the photosurface, the side wall of first light hole is to be recessed the concave surface to be formed towards the lateral wall of packaging body, described the
The side wall of two light holes extends to the upper surface of the packaging body, and second light passing from the first light hole apical margin inclination
The internal diameter in hole is gradually increased in this direction.
Above-mentioned photosensory assembly, the sidewall slope extension and internal diameter due to the second light hole of packaging body are far from photosensitive element
Direction on be gradually increased, therefore be radiated at the light quantity on photosensitive element increase, to improve the light passing amount of photosensory assembly.And
And second the lateral wall of side wall towards packaging body of light hole be recessed to form concave surface, convenient for being used to form the shaping mould of packaging body
Tool demoulding, avoids causing to damage to packaging body, finally improves the image quality of the camera module equipped with the photosensory assembly.
Further, since the concave side wall of the first light hole forms concave surface, thus make the first light hole and the second light hole it
Between formed smooth transition, avoid demoulding when packaging body is caused to damage.
The side wall of second light hole is equipped with serration in one of the embodiments,.Second light hole
Sidewall surfaces roughening, forms multiple reflectings surface with reflection light, makes the light being radiated on the side wall of the second light hole can quilt
Reflective surface without reaching photosensitive element, thus reduce reflection veiling glare to be equipped with the photosensitive element camera module at
The influence of image quality amount.
The concave surface is arc in one of the embodiments,.
The concave surface is arc surface, radius 0.02-0.40mm in one of the embodiments,.
The radius of the arc surface is 0.07-0.13mm in one of the embodiments,.Above-mentioned radius setting can make first
While the smooth transition formed between light hole and the second light hole more optimizes, it is also ensured that the structural strength of the packaging body
To play support and protective effect, and reduces material utilization amount and reduce material cost.
The width of the upper surface of the packaging body is 0.3-3mm, length 2.7-8.7mm in one of the embodiments,.
The above-mentioned size design of upper surface not only can satisfy the demand of stable optical component, but also combine the miniaturization of camera module
Design.
The height of the packaging body is 0.2-2.5mm in one of the embodiments,.Above-mentioned height design can expire simultaneously
Foot encapsulation requires and Miniaturization Design.
In one of the embodiments, the side wall of first light hole between the packaging body lateral wall at a distance from be
0.5-5.5mm。
In one of the embodiments, the side wall of first light hole between the packaging body lateral wall at a distance from be
0.93-2.14mm.The design of above-mentioned distance has taken into account structural strength and Miniaturization Design.
The packaging body lateral wall tilts towards the upper surface from the following table and extends in one of the embodiments,
And the outer diameter of the packaging body is gradually reduced from bottom to top.The inclined design of lateral wall is conducive to the molding mold release of packaging body
And avoid damage to packaging body.
The side wall of second light hole and the angle of optical axis are 3 ° -85 ° in one of the embodiments,.
The side wall of second light hole and the angle of optical axis are 20 ° -40 ° in one of the embodiments,.In this way,
Reach the light that extension is tilted to the optical axis direction of photosensitive element can along the second light hole
On photosensitive element, increase the light passing amount of the light hole, so improve the camera module equipped with the photosensory assembly at image quality
Amount.
It in one of the embodiments, further include conducting wire, the photosurface further includes the non-photo-sensing around the photosensitive area
Area, one end of the conducting wire are located at the non-photo-sensing area, and the other end is located at substrate, and the packaging body packed part non-photo-sensing area is simultaneously
Coat the conducting wire.In this way, encapsulation body portion takes shape on photosensitive element the overall volume for reducing the photosensory assembly, and can keep away
Exempt from conducting wire to be exposed to outside packaging body and be damaged.
A kind of camera module, including lens module and above-mentioned photosensory assembly, the lens module is located at the packaging body
Upper surface.
Detailed description of the invention
Fig. 1 is the cross-sectional view of the photosensory assembly of one embodiment of the invention.
Specific embodiment
To facilitate the understanding of the present invention, a more comprehensive description of the invention is given in the following sections with reference to the relevant attached drawings.In attached drawing
Give preferred embodiment of the invention.But the invention can be realized in many different forms, however it is not limited to herein
Described embodiment.On the contrary, purpose of providing these embodiments is keeps the understanding to the disclosure more saturating
It is thorough comprehensive.
It should be noted that it can directly on the other element when element is referred to as " being fixed on " another element
Or there may also be elements placed in the middle.When an element is considered as " connection " another element, it, which can be, is directly connected to
To another element or it may be simultaneously present centering elements.Term as used herein " vertical ", " horizontal ", " left side ",
" right side " and similar statement are for illustrative purposes only.
Unless otherwise defined, all technical and scientific terms used herein and belong to technical field of the invention
The normally understood meaning of technical staff is identical.Term as used herein in the specification of the present invention is intended merely to description tool
The purpose of the embodiment of body, it is not intended that in the limitation present invention.Term " and or " used herein includes one or more phases
Any and all combinations of the listed item of pass.
As shown in Figure 1, a kind of photosensory assembly 100 of an embodiment of the present invention, including substrate 120, photosensitive element 140 and
Packaging body 160.
Wherein, photosensitive element 140 is set on substrate 120 and is electrically connected with substrate 120, and the photosensitive element 140 includes
Photosurface 142, the photosurface 142 include photosensitive area 1421.Packaging body 160 is packaged on substrate 120 and photosensitive element 140,
Including the lower surface 164 of close photosensitive element 140 being oppositely arranged and far from the upper surface 162 of photosensitive element 140, packaging body
160 are equipped with the light hole 168 through upper surface 162 and lower surface 164.Lateral wall of the packaging body 160 far from photosensitive element 140
161 extend vertically from lower surface 164 to upper surface 162.Specifically, light hole 168 include connection the first light hole 1682 with
Second light hole 1684, the bottom end of the first light hole 1682, which is supported, pastes the photosurface 142, the side wall 1681 of the first light hole 1682
For the concave surface formed towards the recess of lateral wall 161, the side wall 1683 of the second light hole 1684 inclines from 1682 apical margin of the first light hole
The upper surface 168 of the packaging body 160 is tiltedly extended to, and the internal diameter of the second light hole 1684 is gradually increased in this direction.
Above-mentioned photosensory assembly 100, the inclination of side wall 1683 extension and internal diameter due to the second light hole 1684 of packaging body 160
The light quantity for being gradually increased, therefore being radiated on photosensitive element 140 on the direction far from photosensitive element 140 increases, to improve
The light passing amount of photosensory assembly 100.Moreover, the lateral wall 161 of the side wall 1683 of the second light hole 1684 towards packaging body 160 is recessed
It falls into and forms concave surface, convenient for being used to form the molding mold release of packaging body 160, and avoid that packaging body 160 is caused to damage, finally
Improve the image quality of the camera module equipped with the photosensory assembly 100.
In the present embodiment, the side wall 1683 of the second light hole 1684 and optical axis included angle α are 3 ° -85 °, further preferably
It is 20 ° -40 °, and section of second light hole 1682 on the plane perpendicular to photosensitive element 140 is at isosceles trapezoid.In this way,
Make the light for tilting extension to the optical axis direction of photosensitive element 140 can be along the second light hole while conducive to molding mold release
1684 reach on photosensitive element 140, increase the light passing amount of the light hole 168, and then improve equipped with the photosensory assembly 100
The image quality of camera module.
Further, since the side wall 1681 of the first light hole 1682 is recessed concave surface, thus make the first light hole 1682 with
Smooth transition is formed between second light hole 1684, avoids that packaging body 160 is caused to damage when demoulding.
In one embodiment, the concave surface that the side wall 1681 is recessed is arc.
In one embodiment, the concave surface that the side wall 1681 is recessed is arc surface, and radius R is 0.02-0.40mm, into one
Step is preferably 0.07-0.13mm.What the setting of above-mentioned radius can make to be formed between the first light hole 1682 and the second light hole 1684
Smooth transition more optimize while, it is also ensured that the structural strength of the packaging body 160 to play support and protective effect, and
It reduces material utilization amount and reduces material cost.
In one embodiment, the side wall 1683 of the second light hole 1684 is equipped with serration 1684a.In this way, second is logical
1683 surface roughening of side wall of unthreaded hole 1684, forms multiple reflectings surface with reflection light, makes to be radiated at the second light hole 1684
Side wall 1683 on light can be by reflective surface without reaching photosensitive element 140, to reduce reflection veiling glare to setting
There is the influence of the image quality of the camera module of the photosensitive element 140.
In one embodiment, the width W of the upper surface 162 of packaging body 160 is 0.3-3, and length is (perpendicular to drawing in Fig. 1
Dimension) it is 2.7-8.7mm.The upper surface 162 can be used for carrying optical module, although the area increase of upper surface 162 can
Increase the contact surface for carrying optical module, thus the installation stable degree of improving optical component, but area is crossed senior general and increased and takes the photograph
As the overall volume of mould group, Miniaturization Design cannot achieve.The size design of above-mentioned upper surface 162 both can satisfy stable optical
The demand of component, and combined the Miniaturization Design of camera module.
In one embodiment, the height H of packaging body 160 is 0.2-2.5mm.The height H of the packaging body 160 should consider can
To form encapsulation to other electronic components on photosensitive element 140 or substrate 120, consider to take the photograph in short transverse increase again
As the volume of mould group.Above-mentioned height H design can meet encapsulation requirement and Miniaturization Design simultaneously.
In one embodiment, the side wall 1681 of the first light hole 1682 distance T between 160 lateral wall 161 of packaging body
For 0.5-5.5mm, further preferably 0.93-2.14mm.Outside the side wall 1681 of first light hole 1682 and the packaging body 160
The distance T size of side wall 161 influences the structural strength of packaging body 160 and the volume of camera module, if distance T is excessive, though structure
Intensity meets the requirements, but volume is excessive, is not able to satisfy Miniaturization Design；If distance T is too small, set although can satisfy miniaturization
Meter, but structural strength is inadequate.The design of above-mentioned distance T has taken into account structural strength and Miniaturization Design.
Further, packaging body 160 is formed in substrate 120 by molded mode.For example, being led to using injection molding machine
Cross insert molding technique by substrate 120 carry out molding form packaging body 160.Packaging body 160 after molding and the secured phase of substrate 120
Even, compared with conventional stent is bonded by glue-line, the bonding force between packaging body 160 and substrate 120 is much greater.Specifically,
Using Shooting Technique to form the material of packaging body 160 can be nylon, LCP (Liquid Crystal Polymer, liquid crystal polymer
Polymer) or PP (Polypropylene, polypropylene) etc..It can choose it will be apparent to a skilled person that aforementioned
Manufacture and the material that can choose are illustrative only the mode that can be implemented of the invention, are not the present invention
Limitation.
In above-described embodiment, lateral wall 161 of the packaging body 160 far from photosensitive element 140 is from lower surface 164 to upper surface
162 extend vertically.In addition in some embodiments, lateral wall 161 of the packaging body 160 far from photosensitive element 140 can be from following table
Face 164 is tilted to upper surface 162 to be extended, and the outer diameter edge of packaging body 160 gradually subtracts from lower surface 164 to 162 direction of upper surface
It is small, that is, the outer diameter of packaging body 160 is gradually reduced from bottom to top.The lateral wall 161 of packaging body 160 is oblique, is also convenient for being used for
The molding mold release of packaging body 160 is formed, and avoids that packaging body 160 is caused to damage, is finally improved equipped with this photosensitive group
The image quality of the camera module of part 100.
In the present embodiment, substrate 120 is wiring board, may be, for example, hard circuit board, ceramic substrate (without soft board),
It may be Rigid Flex, soft board.When substrate 120 is soft board, can be set in substrate 120 far from the side of photosensitive element 140
Stiffening plate (not shown) is set, to improve the intensity of substrate 120, to improve the overall structural strength of the photosensory assembly 100.
Including photosurface 142 and back on the non-photo-sensing face of the setting of photosurface 142, photosurface 142 includes photosensitive element 140
Photosensitive area 1421 and non-photo-sensing area 1422, and photosensitive area 1421 is located at 142 middle part of photosurface, non-photo-sensing area 1422 surrounds photosensitive area
Setting.
In one embodiment, as shown in Figure 1,1422 part of non-photo-sensing area is embedded in packaging body 160 and by conducting wire 180
It is electrically connected to substrate 120, and conducting wire 180 is contained in completely in packaging body 160.In this way, 160 part of packaging body takes shape in photosensitive member
Reduce the overall volume of the photosensory assembly 100 on part 140, and coats the conducting wire 180 completely and be exposed to avoid conducting wire 180
Packaging body 160 is outer and is damaged.Wherein, conducting wire 180 can be gold thread, copper wire, aluminum steel or silver wire etc..
In another embodiment, the sidewall spacers that non-photo-sensing area can also form light hole 168 with packaging body 160 are arranged, and
It is electrically connected to substrate 120 by conducting wire 180, and conducting wire 180 is completely exposed packaging body 160.In this way, can be higher with flatness
Photosensitive element 140 is attached on substrate 120 by the upper surface 162 of packaging body 160 as machining benchmark, to improve photosensitive element
140 with the optical axis Aligning degree of camera lens.
One embodiment of the invention also provides a kind of camera module (not shown), including above-mentioned photosensory assembly 100, further includes
Lens module, the lens module are located at the upper surface 162 of the packaging body 160.
Specifically, the lens module includes camera lens when that need to use tight shot, the camera lens is located at the packaging body
160 upper surface 162；When that need to use zoom lens, the lens module includes camera lens and the voice coil horse for being arranged the camera lens
It reaches, the voice coil motor is located at the upper surface 162 of the packaging body 160.Light is incident from camera lens and reaches photosensitive element 140
Photosurface 142, the photosensitive element 140 convert optical signals into electric signal.
Above-mentioned camera module, since its photosensory assembly for including has biggish light passing while with lesser volume
Amount, therefore the camera module has preferable image quality and lesser volume, is conducive to the intelligence for being equipped with the camera module
Equipment develops while guaranteeing image quality to lightening direction.
Each technical characteristic of embodiment described above can be combined arbitrarily, for simplicity of description, not to above-mentioned reality
It applies all possible combination of each technical characteristic in example to be all described, as long as however, the combination of these technical characteristics is not deposited
In contradiction, all should be considered as described in this specification.
The embodiments described above only express several embodiments of the present invention, and the description thereof is more specific and detailed, but simultaneously
It cannot therefore be construed as limiting the scope of the patent.It should be pointed out that coming for those of ordinary skill in the art
It says, without departing from the inventive concept of the premise, various modifications and improvements can be made, these belong to protection of the invention
Range.Therefore, the scope of protection of the patent of the invention shall be subject to the appended claims.
Claims (14)
1. a kind of photosensory assembly characterized by comprising
Substrate；
Photosensitive element is set on the substrate and is electrically connected with the substrate, and the photosensitive element includes photosurface, the sense
Smooth surface includes photosensitive area；And
Packaging body is packaged on the substrate and the photosensitive element, and the packaging body includes upper far from the photosensitive element
Surface, the packaging body, which is equipped with, runs through light hole, and the light hole is through photosensitive area described in the packaging body and face；
Wherein, the light hole includes the first light hole and the second light hole of connection, and patch is supported in the bottom end of first light hole
The photosurface, the side wall of first light hole are to be recessed the concave surface to be formed towards the lateral wall of packaging body, and described second is logical
The side wall of unthreaded hole extends to the upper surface of the packaging body from the first light hole apical margin inclination, and second light hole
Internal diameter is gradually increased in this direction.
2. photosensory assembly according to claim 1, which is characterized in that the side wall of second light hole is equipped with zigzag
Protrusion.
3. photosensory assembly according to claim 1, which is characterized in that the concave surface is arc.
4. photosensory assembly according to claim 1, which is characterized in that the concave surface is arc surface, radius 0.02-
0.40mm。
5. photosensory assembly according to claim 4, which is characterized in that the radius of the arc surface is 0.07-0.13mm.
6. photosensory assembly according to claim 1, which is characterized in that the width of the upper surface of the packaging body is 0.3-
3mm, length 2.7-8.7mm.
7. photosensory assembly according to claim 1, which is characterized in that the height of the packaging body is 0.2-2.5mm.
8. photosensory assembly according to claim 1, which is characterized in that the side wall and the packaging body of first light hole
Distance between lateral wall is 0.5-5.5mm.
9. photosensory assembly according to claim 8, which is characterized in that the side wall and the packaging body of first light hole
Distance between lateral wall is 0.93-2.14mm.
10. photosensory assembly according to claim 1, which is characterized in that the packaging body lateral wall from the following table towards
The upper surface inclination extends, and the outer diameter of the packaging body is gradually reduced from bottom to top.
11. photosensory assembly according to claim 1, which is characterized in that the side wall of second light hole and the folder of optical axis
Angle is 3 ° -85 °.
12. photosensory assembly according to claim 11, which is characterized in that the side wall of second light hole and the folder of optical axis
Angle is 20 ° -40 °.
13. photosensory assembly described in any one according to claim 1~12, which is characterized in that including conducting wire, the photosurface
It further include around the non-photo-sensing area of the photosensitive area, one end of the conducting wire is located at the non-photo-sensing area, and the other end is located at substrate,
The packaging body packed part non-photo-sensing area simultaneously coats the conducting wire.
14. a kind of camera module, which is characterized in that the sense including lens module and as described in claim 1~13 any one
Optical assembly, the lens module are located at the upper surface of the packaging body.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710524903.3A CN109218567A (en) | 2017-06-30 | 2017-06-30 | Camera module and its photosensory assembly |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710524903.3A CN109218567A (en) | 2017-06-30 | 2017-06-30 | Camera module and its photosensory assembly |
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|---|---|
| CN109218567A true CN109218567A (en) | 2019-01-15 |
Family
ID=64961160
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| Application Number | Title | Priority Date | Filing Date |
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| CN201710524903.3A Pending CN109218567A (en) | 2017-06-30 | 2017-06-30 | Camera module and its photosensory assembly |
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| CN105744130A (en) * | 2016-03-12 | 2016-07-06 | 宁波舜宇光电信息有限公司 | Camera shooting module, photosensitive assembly of the camera shooting module and production method of the photosensitive assembly of the camera shooting module |
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