CN109215520A - LED display and preparation method thereof - Google Patents
LED display and preparation method thereof Download PDFInfo
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- CN109215520A CN109215520A CN201811182910.0A CN201811182910A CN109215520A CN 109215520 A CN109215520 A CN 109215520A CN 201811182910 A CN201811182910 A CN 201811182910A CN 109215520 A CN109215520 A CN 109215520A
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- led display
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- glass substrate
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- optical cement
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- G—PHYSICS
- G09—EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
- G09F—DISPLAYING; ADVERTISING; SIGNS; LABELS OR NAME-PLATES; SEALS
- G09F9/00—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements
- G09F9/30—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements in which the desired character or characters are formed by combining individual elements
- G09F9/33—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements in which the desired character or characters are formed by combining individual elements being semiconductor devices, e.g. diodes
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Abstract
The application provides a kind of LED display and preparation method thereof, and LED display includes glass substrate, optical cement and LED display module, and LED display module is arranged side by side on the glass substrate；Optical cement is arranged between LED display module and glass substrate, for encapsulating the LED chip of LED display module and for LED display module is fixed on the glass substrate；LED display module includes pcb board and LED chip of the pcb board towards glass substrate side is arranged in, and optical cement coats LED chip completely.The application is fixed on the glass substrate by multiple LED display modules by optical cement, improves the stability of LED display, avoids in transportation and handling procedure, the splicing gap between LED display module becomes larger.
Description
Technical field
This application involves a kind of display technology, in particular to a kind of LED display and preparation method thereof.
Background technique
LED display is widely applied on oversized display screens outdoors at present, and the common scheme of LED display is
The chip package of red-green-blue in single LED device, then again LED component piece on PCB, one is formed solely
Vertical display panel module.Multiple independent display panel modules are formed a large-sized display screen by mechanical package.
Spacing (point spacing) minimum between the pixel of existing LED display can only accomplish 1 millimeter or so, closely see
There is apparent granular sensation when seeing, and LED screen needs to splice multiple independent display modules, due to the error of mechanical splice
In the presence of, cause display with the presence of splicing seams, splicing seams between 0.5~1 millimeter, in addition, LED display transport or load and unload
During, splicing seams can become larger.
Therefore, it is desirable to provide a kind of splicing gap is small and the LED display and preparation method thereof without obvious granular sensation when watching,
To solve the above technical problems.
Summary of the invention
The embodiment of the present application provides a kind of LED display and production method；To solve existing LED display closely
Granular sensation obviously and between display module splices the biggish technical problem in gap when viewing.
The embodiment of the present application provides a kind of LED display comprising:
Glass substrate；
Multiple LED display modules are disposed side by side on the glass substrate；And
Optical cement is arranged between the multiple LED display module and glass substrate, aobvious for encapsulating the multiple LED
Show the LED chip of module and for the multiple LED display module to be fixed on the glass substrate；
The LED display module includes pcb board, LED chip of the pcb board towards the glass substrate side is arranged in
With driving part of the pcb board backwards to the glass substrate side for driving the LED chip luminous is set, it is described
Optical cement coats the LED chip completely.
In the LED display of the application, the frontal projected area of the LED chip is less than or equal to 0.04 square millimeter and big
In equal to 1 square micron.
In the LED display of the application, the thickness of the optical cement is greater than the height of the LED chip.
In the LED display of the application, there are splicing gap, the splicings between the adjacent LED display module
The width in gap is less than or equal to 0.1 millimeter.
In the LED display of the application, reflecting material, the reflection of the reflecting material are filled in the splicing gap
Facing towards the glass substrate.
In the LED display of the application, the optical cement is high molecular transparent material.
In the LED display of the application, the optical cement is silica gel.
In the LED display of the application, the optical cement includes between the LED chip and the glass substrate
Compartment, the thickness of the compartment is less than or equal to 90 microns.
A kind of production method that the application further relates to LED display comprising step:
101: a glass substrate is provided；
102: one layer of optical cement is coated on the glass substrate, the thickness of the optical cement is less than the height of LED chip；
103: LED display module being fixed in fixed fixture, and the LED display module is placed on the optical cement
On, the LED chip of the LED display module is partially immersed in the optical cement, and the LED display module includes
Pcb board and the LED chip being arranged on the pcb board；
104: as a reference plane with the surface of the glass substrate, being shown multiple LED by the fixed fixture
Show that module is fixed on same plane；
105: re-inject the optical cement in the surrounding of the glass substrate so that the optical cement be totally submerged it is described
LED chip；
106: shortening the splicing gap between the adjacent LED display module by adjusting the fixed fixture；
107: a pressing plate is set above the LED display module, to reduce the LED display module and the glass base
The thickness of the optical cement between plate；
108: the optical cement is solidified, after remove the pressing plate and the fixed fixture.
In the production method of the LED display of the application, the step 106 includes:
Using the surface of the glass substrate as reference planes, the fixed fixture is adjusted along X-direction or/and Y-direction side
To movement, until the adjacent fixed fixture contacts with each other.
In the production method of the LED display of the application, the production method of the LED display further include:
109: spraying reflecting material in the gap between the LED display module.
In the production method of the LED display of the application, the reflecting material is white ink.
The splicing gap in the production method of the LED display of the application, between the adjacent LED display module
Width be less than or equal to 0.1 millimeter.
In the production method of the LED display of the application, it is flat that the frontal projected area of the LED chip is less than or equal to 0.04
Square millimeter and be more than or equal to 1 square micron.
In the production method of the LED display of the application, the optical cement is high molecular transparent material.
In the production method of the LED display of the application, the optical cement is silica gel.
LED display compared to the prior art and preparation method thereof, LED display of the application and preparation method thereof are logical
It crosses optical cement multiple LED display modules are fixed on the glass substrate, improves the stability of LED display, avoid and transporting
In defeated and cargo handling process, the splicing gap between LED display module becomes larger；
In addition, the frontal projected area of the LED chip of LED display module is less than or equal to 0.04 square millimeter and is more than or equal to 1
The setting of square micron improves PPI index, enhances display effect, when solving existing LED display short distance viewing
Granular sensation obviously and between display module splices the biggish technical problem in gap.
Detailed description of the invention
In order to illustrate the technical solutions in the embodiments of the present application or in the prior art more clearly, below to required in embodiment
Attached drawing to be used is briefly described.The accompanying drawings in the following description is only the section Example of the application, general for this field
For logical technical staff, without creative efforts, other attached drawings can also be obtained according to these attached drawings.
Fig. 1 is the structural schematic diagram of the preferred embodiment of the LED display of the application；
Fig. 2 is the flow chart of the preferred embodiment of the production method of the LED display of the application.
Specific embodiment
The schema in attached drawing is please referred to, wherein identical component symbol represents identical component.The following description is to be based on
Illustrated by the application specific embodiment, be not construed as limitation the application other specific embodiments not detailed herein.
Fig. 1 is please referred to, Fig. 1 is the structural schematic diagram of the preferred embodiment of the LED display of the application.The LED of the application
The embodiment of display screen 100 comprising glass substrate 11, multiple LED display modules 12 and optical cement 13.
Multiple LED display modules 12 are disposed side by side on glass substrate 11.Optical cement 13 is arranged in multiple LED display modules
Between 12 and glass substrate 11, for encapsulating the LED chip 122 of multiple LED display modules 12 and for multiple LED to be shown mould
Block 12 is fixed on glass substrate 11.
LED display module 12 includes pcb board 121, LED chip of the pcb board 121 towards 11 side of glass substrate is arranged in
122 and driving part 123 of the pcb board 121 backwards to glass substrate 11 side for driving LED chip 122 luminous is set.Light
Learn the cladding LED chip 121 completely of glue 13.
The present embodiment passes through the setting of optical cement 13, by 11 company of being fixed of multiple LED display modules 12 and glass substrate
It connects, improves the spliced stability of multiple LED display modules 12, avoid LED display 100 in the process transported and loaded and unloaded
The splicing gap occurred between LED display module 12 causes LED display module 12 to loosen because colliding or shaking, and then increases spelling
The case where seam gap, occurs.
Wherein, glass substrate 11 plays the role of protecting LED chip 122, and in the processing procedure of the present embodiment, glass base
Plate 11 plays the role of reference planes, in order to which same plane between LED display module 12 is arranged, improves planarization.
Optical cement 13 play the role of packaging LED chips 122 be fixedly connected with glass substrate 11 with LED display module 12, and optics
Glue 13 is transparent material, facilitates through the light of the sending of LED chip 121.Therefore optical cement 13 is not only high molecular transparent material
Material, and have the function of completely cutting off steam and adherency.Optionally, optical cement 13 is silica gel.
In the embodiment of this LED display 100, the thickness of optical cement 13 is greater than the height of LED chip 122.By optics
The thickness setting of glue 13 is greater than the height of LED chip 122, on the one hand plays the purpose of protection chip leg, on the other hand plays
Support fixed function.Since optical cement 13 is between glass substrate 11 and LED display module 12, optical cement 13 plays branch
The effect for supportting LED display module 12 to avoid LED display module 12 by pressure in processing procedure, and promotes LED chip 122 to oppress
Glass substrate 11, to damage LED chip 122.
In addition, the thickness of the optical cement 13 between glass substrate 11 and LED chip 122, can according to the actual situation into
Row adjustment, when 13 thickness of optical cement of the part is smaller, the translucency of LED display 100 is better, supports LED display module 12
Performance it is weaker.And it is LED chip 122 and pcb board 121 that optical cement 13, which is supported in 12 live part of LED display module, therefore
As long as optical cement 13 avoids LED chip 122 from oppressing glass substrate 11 support performance of pcb board 121 enough, can be as far as possible
Reduce the thickness of the optical cement 13 between glass substrate 11 and LED chip 122.
In the present embodiment, the thickness of the optical cement 13 between glass substrate 11 and LED chip 122 is micro- less than 100
Rice.Optionally, the thickness can be 90 microns, 70 microns, 50 microns, 30 microns, 20 microns, 10 microns, 5 microns, 2 microns and
1 micron, even 0 micron.
In the embodiment of this LED display 100, the frontal projected area of LED chip 122 is less than or equal to 0.04 square millimeter
And it is more than or equal to 1 square micron.
The area size of LED chip 122 is set smaller than equal to 0.04 square millimeter and is more than or equal to 1 square micron.
LED chip in compared to the prior art reduces the size of LED chip 122, reaches and promotes PPI index, enhances display effect,
It avoids when short distance watches LED display 100, the phenomenon that obvious granular sensation occurs.It is wherein optional, LED display module
12 can be mini-LED or micro-LED display module.
In the embodiment of this LED display 100, there are splicing gaps between adjacent LED display module 12.Splicing seams
The width of gap is less than or equal to 0.1 millimeter.Splicing gap becomes smaller, and improves the viewing effect of LED display 100.In addition, splicing seams
Reflecting material 14 is filled in gap.The reflecting surface of reflecting material 14 is towards glass substrate 11.Reflecting material 14 can be white oil
Ink, allow reflecting material 14 121 surface of color and pcb board solid colour, with cover splicing gap so that the spelling that is invisible to the naked eye
Seam gap, and then improve viewing effect.
Referring to figure 2., a kind of production method that the application further relates to LED display comprising step:
101: a glass substrate is provided.
102: one layer of optical cement is coated on the glass substrate, the thickness of the optical cement is less than the height of LED chip.
103: LED display module being fixed in fixed fixture, and the LED display module is placed on the optical cement
On.The LED chip of the LED display module is partially immersed in the optical cement.The LED display module includes
Pcb board and the LED chip being arranged on the pcb board.
104: as a reference plane with the surface of the glass substrate, being shown multiple LED by the fixed fixture
Show that module is fixed on same plane.
105: re-inject the optical cement in the surrounding of the glass substrate so that the optical cement be totally submerged it is described
LED chip.
106: shortening the splicing gap between the adjacent LED display module by adjusting the fixed fixture.
107: a pressing plate is set above the LED display module, to reduce the LED display module and the glass base
The thickness of the optical cement between plate.
108: the optical cement is solidified, after remove the pressing plate and the fixed fixture.
109: spraying reflecting material in the gap between the LED display module.
In the present embodiment, the structure of LED display is consistent with the structure of LED display 100 of above-described embodiment, below
It is to be elaborated to above-mentioned production method.
Step 101: a glass substrate is provided.Wherein glass substrate is horizontal positioned.
Step 102: coating one layer of optical cement on the glass substrate, the thickness of optical cement is less than the height of LED chip.Its
In, the thickness of first layer optical cement is set smaller than to the height of LED chip, to be in order to avoid optical cement be more than, and LED shows mould
The pcb board of block, and convenient for adjusting the position of LED display module in subsequent step.Optical cement is high molecular transparent material.It is optional
, optical cement is silica gel.
Step 103: LED display module is fixed in fixed fixture, and LED display module is placed on optical cement,
The LED chip of LED display module is partially immersed in optical cement, and LED display module includes pcb board and is arranged on pcb board
LED chip.
In addition, the frontal projected area of LED chip is less than or equal to 0.04 square millimeter and is more than or equal to 1 square micron.It reduces
The size of LED chip reaches and promotes PPI index, enhances display effect, avoids when short distance watches LED display, occurs
The phenomenon that obvious granular sensation.Wherein optional, LED display module can be mini-LED or micro-LED display module.
Step 104: as a reference plane with the surface of glass substrate, by fixed fixture by multiple LED display modules, Gu
It is scheduled on same plane.Wherein, using glass baseplate surface as the reference planes of horizontal arrangement, LED is shown by fixed fixture
Module carries out preliminary positioning and arrangement, improves the flatness between LED display module.
Step 105: optical cement is re-injected in the surrounding of glass substrate, so that optical cement is totally submerged the LED chip.
Wherein, it fixes and positions since LED display module is fixed jig, optical cement is re-injected, so that optics is totally submerged
LED chip plays the purpose of packaging protection LED chip.
Step 106: by adjusting the splicing gap between fixed fixture shortening adjacent LED display module.Specifically, step
106 include:
Using the surface of glass substrate as reference planes, adjusts fixed fixture and moved along X-direction or/and Y-direction direction, directly
It contacts with each other to adjacent fixed fixture.
So that the splicing gap between LED display module is minimum.The width in the splicing gap between adjacent LED display module
Degree is less than or equal to 0.1 millimeter.
Step 107: a pressing plate is set above LED display module, to reduce institute between LED display module and glass substrate
State the thickness of optical cement.Wherein, the effect of pressing plate is to apply pressure to LED display module, so that LED display module declines.
Additionally, due to the supportive of optical cement, so that LED display module needs biggish pressure that could decline, therefore when application pressing plate
When, LED display module will not decline rapidly, and LED chip is made to oppress glass substrate.
So the thickness of the optical cement between glass substrate and LED chip, can by increase and decrease the weight of pressing plate into
Row is adjusted.
Step 108: optical cement is solidified, after remove pressing plate and the fixed fixture.The solidification of optical cement, improves
Multiple spliced stability of LED display module avoid LED display in the process transported and loaded and unloaded and LED display mould occur
Splicing gap between block causes LED display module to loosen because colliding or shaking, and then increases the case where splicing gap generation.
Step 109: spraying reflecting material in the gap between LED display module.Wherein, splice in gap filled with anti-
Penetrate substance, the reflecting surface of reflecting material is towards glass substrate.Reflecting material can be white ink, allow reflecting material color and
The solid colour on pcb board surface splices gap so that being invisible to the naked eye, and then improve viewing effect to cover splicing gap.
LED display compared to the prior art and preparation method thereof, LED display of the application and preparation method thereof are logical
It crosses optical cement multiple LED display modules are fixed on the glass substrate, improves the stability of LED display, avoid and transporting
In defeated and cargo handling process, the splicing gap between LED display module becomes larger；
In addition, the frontal projected area of the LED chip of LED display module is less than or equal to 0.04 square millimeter and is more than or equal to 1
The setting of square micron improves PPI index, enhances display effect, when solving existing LED display short distance viewing
Granular sensation obviously and between display module splices the biggish technical problem in gap.
The above for those of ordinary skill in the art can according to the technique and scheme of the present invention and technology
Other various corresponding changes and modifications are made in design, and all these change and modification all should belong to the appended right of the present invention
It is required that protection scope.
Claims (10)
1. a kind of LED display characterized by comprising
Glass substrate；
Multiple LED display modules are disposed side by side on the glass substrate；And
Optical cement is arranged between the multiple LED display module and glass substrate, shows mould for encapsulating the multiple LED
The LED chip of block and for the multiple LED display module to be fixed on the glass substrate；
The LED display module includes pcb board and LED chip of the pcb board towards the glass substrate side, institute is arranged in
It states optical cement and coats the LED chip completely.
2. LED display according to claim 1, which is characterized in that the frontal projected area of the LED chip is less than or equal to
0.04 square millimeter and be more than or equal to 1 square micron.
3. LED display according to claim 1, which is characterized in that the thickness of the optical cement is greater than the LED chip
Height.
4. LED display according to claim 1, which is characterized in that there are spellings between the adjacent LED display module
The width of seam gap, the splicing gap is less than or equal to 0.1 millimeter.
5. LED display according to claim 4, which is characterized in that be filled with reflecting material, institute in the splicing gap
The reflecting surface of reflecting material is stated towards the glass substrate.
6. a kind of production method of LED display, feature exist, comprising steps of
101: a glass substrate is provided；
102: one layer of optical cement is coated on the glass substrate, the thickness of the optical cement is less than the height of LED chip；
103: LED display module is fixed in fixed fixture, and the LED display module is placed on the optical cement,
The LED chip of the LED display module is partially immersed in the optical cement, and the LED display module includes pcb board
With the LED chip being arranged on the pcb board；
104: as a reference plane with the surface of the glass substrate, multiple LED being shown by mould by the fixed fixture
Block is fixed on same plane；
105: the optical cement is re-injected in the surrounding of the glass substrate, so that the optical cement is totally submerged the LED
Chip；
106: shortening the splicing gap between the adjacent LED display module by adjusting the fixed fixture；
107: a pressing plate is set above the LED display module, with reduce the LED display module and the glass substrate it
Between the optical cement thickness；
108: the optical cement is solidified, after remove the pressing plate and the fixed fixture.
7. the production method of LED display according to claim 6, which is characterized in that the step 106 includes:
Using the surface of the glass substrate as reference planes, adjusts the fixed fixture and moved along X-direction or/and Y-direction direction
It is dynamic, until the adjacent fixed fixture contacts with each other.
8. the production method of LED display according to claim 6, which is characterized in that the production side of the LED display
Method further include:
109: spraying reflecting material in the gap between the LED display module.
9. the production method of LED display according to claim 8, which is characterized in that the reflecting material is white oil
Ink.
10. the production method of LED display according to claim 6, which is characterized in that the adjacent LED display module
Between the splicing gap width be less than or equal to 0.1 millimeter.
Priority Applications (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201811182910.0A CN109215520B (en) | 2018-10-11 | 2018-10-11 | L ED display screen and manufacturing method thereof |
| PCT/CN2018/124882 WO2020073525A1 (en) | 2018-10-11 | 2018-12-28 | Led display screen and manufacturing method therefor |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201811182910.0A CN109215520B (en) | 2018-10-11 | 2018-10-11 | L ED display screen and manufacturing method thereof |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN109215520A true CN109215520A (en) | 2019-01-15 |
| CN109215520B CN109215520B (en) | 2020-07-10 |
Family
ID=64979684
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201811182910.0A Active CN109215520B (en) | 2018-10-11 | 2018-10-11 | L ED display screen and manufacturing method thereof |
Country Status (2)
| Country | Link |
|---|---|
| CN (1) | CN109215520B (en) |
| WO (1) | WO2020073525A1 (en) |
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| CN110568660A (en) * | 2019-08-09 | 2019-12-13 | 惠州市华星光电技术有限公司 | Display device and method for manufacturing the same |
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| WO2020207102A1 (en) * | 2019-04-09 | 2020-10-15 | 深圳市华星光电半导体显示技术有限公司 | Area light source device and manufacturing method therefor, display device |
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| CN112635625A (en) * | 2020-12-31 | 2021-04-09 | 深圳全息界科技有限公司 | Splicing type LED module packaging process |
| CN114842758A (en) * | 2022-04-19 | 2022-08-02 | Tcl华星光电技术有限公司 | Manufacturing method of spliced display panel and spliced display panel |
| CN115430587A (en) * | 2021-06-02 | 2022-12-06 | 深圳市奥拓电子股份有限公司 | Processing method for anti-climbing glue of LED lamp bead, display screen and storage medium |
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| CN112635625A (en) * | 2020-12-31 | 2021-04-09 | 深圳全息界科技有限公司 | Splicing type LED module packaging process |
| CN115430587A (en) * | 2021-06-02 | 2022-12-06 | 深圳市奥拓电子股份有限公司 | Processing method for anti-climbing glue of LED lamp bead, display screen and storage medium |
| CN114842758A (en) * | 2022-04-19 | 2022-08-02 | Tcl华星光电技术有限公司 | Manufacturing method of spliced display panel and spliced display panel |
| WO2023201895A1 (en) * | 2022-04-19 | 2023-10-26 | Tcl华星光电技术有限公司 | Manufacturing method for tiled display panel, and tiled display panel |
Also Published As
| Publication number | Publication date |
|---|---|
| CN109215520B (en) | 2020-07-10 |
| WO2020073525A1 (en) | 2020-04-16 |
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