CN109203264A - A kind of immersed solder diamond wire and its manufacturing method - Google Patents
A kind of immersed solder diamond wire and its manufacturing method Download PDFInfo
- Publication number
- CN109203264A CN109203264A CN201811083418.8A CN201811083418A CN109203264A CN 109203264 A CN109203264 A CN 109203264A CN 201811083418 A CN201811083418 A CN 201811083418A CN 109203264 A CN109203264 A CN 109203264A
- Authority
- CN
- China
- Prior art keywords
- solder
- diamond
- abrasive grain
- wire
- diamond abrasive
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B28—WORKING CEMENT, CLAY, OR STONE
- B28D—WORKING STONE OR STONE-LIKE MATERIALS
- B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
- B28D5/04—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by tools other than rotary type, e.g. reciprocating tools
- B28D5/045—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by tools other than rotary type, e.g. reciprocating tools by cutting with wires or closed-loop blades
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B21—MECHANICAL METAL-WORKING WITHOUT ESSENTIALLY REMOVING MATERIAL; PUNCHING METAL
- B21C—MANUFACTURE OF METAL SHEETS, WIRE, RODS, TUBES OR PROFILES, OTHERWISE THAN BY ROLLING; AUXILIARY OPERATIONS USED IN CONNECTION WITH METAL-WORKING WITHOUT ESSENTIALLY REMOVING MATERIAL
- B21C37/00—Manufacture of metal sheets, bars, wire, tubes or like semi-manufactured products, not otherwise provided for; Manufacture of tubes of special shape
- B21C37/04—Manufacture of metal sheets, bars, wire, tubes or like semi-manufactured products, not otherwise provided for; Manufacture of tubes of special shape of bars or wire
- B21C37/042—Manufacture of coated wire or bars
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B21—MECHANICAL METAL-WORKING WITHOUT ESSENTIALLY REMOVING MATERIAL; PUNCHING METAL
- B21C—MANUFACTURE OF METAL SHEETS, WIRE, RODS, TUBES OR PROFILES, OTHERWISE THAN BY ROLLING; AUXILIARY OPERATIONS USED IN CONNECTION WITH METAL-WORKING WITHOUT ESSENTIALLY REMOVING MATERIAL
- B21C37/00—Manufacture of metal sheets, bars, wire, tubes or like semi-manufactured products, not otherwise provided for; Manufacture of tubes of special shape
- B21C37/04—Manufacture of metal sheets, bars, wire, tubes or like semi-manufactured products, not otherwise provided for; Manufacture of tubes of special shape of bars or wire
- B21C37/045—Manufacture of wire or bars with particular section or properties
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B27/00—Other grinding machines or devices
- B24B27/06—Grinders for cutting-off
- B24B27/0633—Grinders for cutting-off using a cutting wire
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24D—TOOLS FOR GRINDING, BUFFING OR SHARPENING
- B24D18/00—Manufacture of grinding tools or other grinding devices, e.g. wheels, not otherwise provided for
- B24D18/0054—Manufacture of grinding tools or other grinding devices, e.g. wheels, not otherwise provided for by impressing abrasive powder in a matrix
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Polishing Bodies And Polishing Tools (AREA)
Abstract
The present invention provides a kind of immersed solder diamond wire and its manufacturing method, immersed solder diamond wire includes metal core wire, solder layer and diamond abrasive grain, the solder layer is wrapped in the outer surface of metal core wire, the part body of the diamond abrasive grain is in the solder layer, the part that the diamond abrasive grain exposes the solder layer has angular structures, and the tip of angular structures is radially arranged along diamond wire.The present invention compared to the prior art, diamond abrasive grain is adhered to using solder layer, and manufacturing process is simple, production cost is low, reduces environmental pollution, diamond abrasive grain is evenly distributed and exposed parts are angular structures, it is not easily to fall off in cutting process, long service life, cutting efficiency height.
Description
Technical field
The present invention relates to the technical fields such as the cutting of the hard brittle materials such as silicon crystal, jewel and processing and abrasive material, grinding tool,
Specifically a kind of immersed solder diamond wire and its manufacturing method.
Background technique
Diamond wire be by diamond abrasive grain certain technique be consolidated in steel wire surface made of a kind of cutting tools, multi-panel
After the diamond abrasive grain of body shape is cemented in steel wire surface, under the protection of diamond abrasive grain, steel wire is not direct to be contacted with workpiece,
Not easy damaged is greatly improved service life, cutting efficiency and the precision of steel wire.The diamond wire of photovoltaic industry mainstream is main at present
There are plating diamond wire and resin diamond wire.Diamond wire is electroplated in process of production, in order to improve coating to the handle of diamond abrasive
Holding force, thickness of coating will usually reach 2/3 of abrasive size or so, therefore the electroplating time of diamond wire is long, and production efficiency is low, separately
Outside upper sand speed is slow, and diamond abrasive grain is easy to reunite, and the process is more complicated, and environmental pollution is larger.In the manufacture of resin diamond wire
In the process, diamond abrasive grain, resin, solvent are uniformly mixed first in certain proportion and are made into slurry, surface is made to be coated with slurry
Steel wire with certain speed by mold and curing oven, to obtain finished product diamond wire, wherein the gauge orifice on mold limits gold
The diameter of rigid line, the effect of curing oven are the slurries that drying is attached on steel wire.But the steel wire for being coated with slurry passes through on mold
When gauge orifice, gauge orifice plays the role of a scraping to the slurry for being coated in steel wire surface, and the power that this scraping generates makes gold
Hard rock abrasive grain is attached to the surface of steel wire with the state of " lodging ", i.e., under the action of scraping power, the Buddha's warrior attendant stone mill of polyhedral
The exposed part in pulp surface of grain is planar section, rather than faceted portions, i.e. state shown in attached drawing 1.In lodging state
Diamond abrasive grain can not apply stronger cutting force to material to be cut, to leverage the cutting efficiency of diamond wire.And
Scraping effect easily causes diamond abrasive grain to be unevenly distributed, and generates agglomeration, and the cutting stability of diamond wire is poor.Using existing
Silicon wafer cut by diamond wire, required time is long, and efficiency is very low, is not able to satisfy production requirement.
Summary of the invention
In order to overcome the above-mentioned deficiencies of the prior art, the object of the present invention is to provide a kind of immersed solder diamond wire and its manufactures
Method.
In order to achieve the above objectives, the technical solution adopted by the present invention to solve the technical problems is:
A kind of immersed solder diamond wire, including metal core wire, solder layer and diamond abrasive grain, the solder layer are wrapped in metal core
The outer surface of line, for the part body of the diamond abrasive grain in the solder layer, the diamond abrasive grain exposes the weldering
The part of the bed of material has angular structures, and the tip of angular structures is radially arranged along diamond wire.
The present invention compared to the prior art, diamond abrasive grain is adhered to using solder layer, and manufacturing process is simple, production cost
It is low, environmental pollution is reduced, diamond abrasive grain is evenly distributed and exposed parts are angular structures, and it is not easily to fall off in cutting process, make
Long with the service life, cutting efficiency is high.
Further, the diamond abrasive grain exposes outside the exposed parts of solder layer and diamond abrasive grain is embedded in solder layer
Built-in part length ratio be 1/3-2/3.
Using the above preferred scheme, it is ensured that diamond abrasive grain can stablize attachment, not easily to fall off, improve cutting stability.
Further, the line footpath of the metal core wire is 30-150 μm.
Further, the metal core wire is steel wire, copper wire or alloy wire.
Further, the cross section of the metal core wire is circular, square or triangle.
Further, the diamond abrasive grain material is diamond or is boron carbide, boron nitride synthetic diamond material.
Further, the granularity of the diamond abrasive grain is 6-30 μm.
Using the above preferred scheme, diamond abrasive grain has stable angular structures, improves the cutting performance of diamond wire.
Further, the solder layer material be tinbase, copper-based, manganese base, it is one or more in Ni-based, Ti-based solder.
Further, the periphery of the metal core wire is equipped with the first spiral groove extended spirally along its length, described
The outer surface of solder layer is equipped with the second spiral groove with the first spiral groove location matches.
Using the above preferred scheme, the first spiral groove had not only improved the adhesive ability of solder layer, but also can ensure that solder
The second spiral groove is formed after attachment on solder layer, the second spiral groove improves cutting convenient for timely chip removal in cutting process
Efficiency.
Further, the metal core wire is the twisted wire that surrounds of seven filaments, wherein during a filament is in
The heart, other six roots of sensation filament helical forms are wound on the periphery of central metal filament.
Using the above preferred scheme, the intensity of metal core wire can be improved using twisted wire structure, reduce breakage ratio, while
The adhesive ability of solder layer and diamond abrasive grain can be improved, wear-resisting property is improved.
The manufacturing method of immersed solder diamond wire, includes the following steps:
Step 1, solder is prepared: solid solder being first added into solder container, is completely melt it；
Step 2, diamond abrasive grain is added, is dispersed in diamond abrasive grain in solder；
Step 3, by cleaning equipment, the dirts such as oxide on surface, the grease stain of metal core wire the cleaning of metal core wire: are removed
Object；
Step 4, the coating of scaling powder: metal core wire is made to pass through the container for filling scaling powder；
Step 5, metal core wire is entered into solder container, metal core wire surface is made to coat one layer of solder；
Step 6, blowing is generated to metal core wire surface solder by air knife, the corner angle of diamond abrasive grain protrude solder table
Face forms diamond wire after being quickly cooled down；
Step 7, pass through winding system take-up.
Using the above preferred scheme, manufacturing process is simple, and production cost is low, reduces environmental pollution；Air knife technique ensures
Diamond abrasive grain is evenly distributed and exposed parts are angular structures, and solder can increase itself and metal core wire and diamond abrasive grain
Between adhesive force, not easily to fall off, long service life in cutting process, cutting efficiency is high.
Further, in immersed solder diamond wire manufacturing process, the temperature of solder container is 200-600 DEG C；The line of metal core wire
Speed is 5-200m/min；The air pressure of air knife is 0.1-7MPa.
Using the above preferred scheme, the reasonable air pressure of air knife ensures the suitable height of protrusion of diamond abrasive grain, and sword is high out
Degree is 6-9 μm, while air knife outlet air improves outlet efficiency convenient for solder consolidation.
Further, the quality proportioning of diamond abrasive grain and solder are as follows: diamond abrasive grain, 1-10%；Solder, 90-99%.
Using the above preferred scheme, go out sword rate and adhesion convenient for forming stable diamond abrasive grain, sword rate is 50- out
500/mm.
Further, step 6 further includes step 61, the detection of diamond wire surface characteristic: after diamond wire forming, passes through vision
Particle on-line detector acquires diamond wire surface image, and obtain diamond abrasive grain goes out sword rate and height of protrusion data.
Further, step 6 further includes step 62, and sword rate adjusts out: when the Buddha's warrior attendant of vision particle on-line detector detection
When going out sword rate less than setting range lower limit value of stone mill grain is to hold according to past solder with initial diamond abrasive grain and solder proportion
Diamond abrasive grain is added in device；When the sword rate that goes out of the diamond abrasive grain of vision particle on-line detector detection is greater than on setting range
When limit value, solder is added into solder container for foundation with initial diamond abrasive grain and solder proportion.
Further, step 6 further includes step 63, height of protrusion adjustment: when the gold of vision particle on-line detector detection
When the height of protrusion of hard rock abrasive grain is lower than setting range lower limit value, the air pressure of air knife is turned up；When vision particle on-line detector
When the height of protrusion of the diamond abrasive grain of detection is higher than setting range upper limit value, the air pressure of air knife is turned down.
Using the above preferred scheme, go out sword rate and height of protrusion convenient for forming stable diamond abrasive grain, it is ensured that Buddha's warrior attendant
Line mass keeps stablizing.
Detailed description of the invention
In order to more clearly explain the embodiment of the invention or the technical proposal in the existing technology, to embodiment or will show below
There is attached drawing needed in technical description to be briefly described, it should be apparent that, the accompanying drawings in the following description is only this
Some embodiments of invention for those of ordinary skill in the art without creative efforts, can be with
It obtains other drawings based on these drawings.
Fig. 1 is the structural schematic diagram of prior art resin diamond wire；
Fig. 2 is the structural schematic diagram of one embodiment of the present invention；
Fig. 3 is the structural schematic diagram of another embodiment of the present invention；
Fig. 4 is the structural schematic diagram of another embodiment of the present invention；
Fig. 5 is the manufacturing flow chart of one embodiment of the present invention；
Fig. 6 is the manufacturing flow chart of another embodiment of the present invention.
The title of number and corresponding component represented by letter in figure:
1- metal core wire；2- solder layer；3- diamond abrasive grain；The first spiral groove of 11-；12- filament；21- second
Spiral groove.
Specific embodiment
Following will be combined with the drawings in the embodiments of the present invention, and technical solution in the embodiment of the present invention carries out clear, complete
Site preparation description, it is clear that described embodiments are only a part of the embodiments of the present invention, instead of all the embodiments.It is based on
Embodiment in the present invention, it is obtained by those of ordinary skill in the art without making creative efforts every other
Embodiment shall fall within the protection scope of the present invention.
In order to reach the purpose of the present invention, as shown in Fig. 2, one embodiment of the present invention are as follows: a kind of immersed solder diamond wire,
Including metal core wire 1, solder layer 2 and diamond abrasive grain 3, solder layer 2 is wrapped in the outer surface of metal core wire 1, diamond abrasive grain 3
Part body in the solder layer 2, the part that diamond abrasive grain 3 exposes solder layer 2 has angular structures, the point of angular structures
End is radially arranged along diamond wire.
The beneficial effects of the present invention are: adhering to diamond abrasive grain 3 using solder layer 2, manufacturing process is simple, production cost
It is low, environmental pollution is reduced, diamond abrasive grain is evenly distributed and exposed parts are angular structures, and it is not easily to fall off in cutting process, make
Long with the service life, cutting efficiency is high.
In other embodiments of the invention, diamond abrasive grain 3 exposes outside the exposed parts and diamond of solder layer 2
The length ratio that abrasive grain 3 is embedded in the built-in part of solder layer 2 is 1/3-2/3.Beneficial effect by adopting the above technical scheme is: really
Attachment can be stablized by protecting diamond abrasive grain, not easily to fall off, improve cutting stability.
In other embodiments of the invention, the line footpath of metal core wire 1 is 30-150 μm；Metal core wire 1 be steel wire,
Copper wire or alloy wire；The cross section of metal core wire 1 is circular, square or triangle；3 material of diamond abrasive grain be diamond or
For boron carbide, boron nitride synthetic diamond material；The granularity of diamond abrasive grain 3 is 6-30 μm；Single diamond abrasive grain 3 is at trigone
Body, square or hexagonal prism.Beneficial effect by adopting the above technical scheme is: diamond abrasive grain has stable angular structures,
Improve the cutting performance of diamond wire.
As shown in figure 3,2 material of solder layer is tinbase, copper-based, manganese base, nickel in other embodiments of the invention
It is one or more in base, Ti-based solder；The periphery of metal core wire 1 is equipped with the first spiral groove extended spirally along its length
11, the outer surface of solder layer 2 is equipped with the second spiral groove 21 with 11 location matches of the first spiral groove.Only need in metal core
The first spiral groove 11 is manufactured on line, it can the second spiral groove of self-assembling formation 21 under the blowing force of air knife after coated with solder.Using
The beneficial effect of above-mentioned technical proposal is: the first spiral groove 11 had not only improved the adhesive ability of solder layer, but also can ensure that solder
The second spiral groove 21 is formed after attachment on solder layer 2, the second spiral groove 21 improves convenient for timely chip removal in cutting process
Cutting efficiency.
As shown in figure 4, metal core wire 1 is what seven filaments 12 surrounded in other embodiments of the invention
Twisted wire, wherein a filament is in center, other six roots of sensation filament helical forms are wound on the periphery of central metal filament.
Beneficial effect by adopting the above technical scheme is: can improve the intensity of metal core wire using twisted wire structure, reduce breakage ratio, simultaneously
Also the adhesive ability of solder layer and diamond abrasive grain can be improved, wear-resisting property is improved.
As shown in figure 5, the manufacturing method of immersed solder diamond wire, includes the following steps:
Step 1, solder is prepared: solid solder being first added into solder container, is completely melt it；
Step 2, diamond abrasive grain is added, is dispersed in diamond abrasive grain in solder；
Step 3, by cleaning equipment, the dirts such as oxide on surface, the grease stain of metal core wire the cleaning of metal core wire: are removed
Object；
Step 4, the coating of scaling powder: metal core wire is made to pass through the container for filling scaling powder；
Step 5, metal core wire is entered into solder container, metal core wire surface is made to coat one layer of solder；
Step 6, blowing is generated to metal core wire surface solder by air knife, the corner angle of diamond abrasive grain protrude solder table
Face forms diamond wire after being quickly cooled down；
Step 7, pass through winding system take-up.
Beneficial effect by adopting the above technical scheme is: manufacturing process is simple, and production cost is low, reduces environmental pollution；Wind
Knife technique ensures that diamond abrasive grain is evenly distributed and exposed parts are angular structures, solder can increase its with metal core wire and
Adhesive force between diamond abrasive grain, not easily to fall off, long service life in cutting process, cutting efficiency are high.
In other embodiments of the invention, in immersed solder diamond wire manufacturing process, the temperature of solder container is 200-
600℃；The linear velocity of metal core wire is 5-200m/min；The air pressure of air knife is 0.1-7MPa.Having by adopting the above technical scheme
Beneficial effect is: the reasonable air pressure of air knife ensures that the suitable height of protrusion of diamond abrasive grain, height of protrusion are 6-9 μm, height of protrusion
Refer on diamond wire diamond exposure highest point to the distance of diamond wire solder layer；Air knife outlet air simultaneously mentions convenient for solder consolidation
High outlet efficiency.
In other embodiments of the invention, the quality proportioning of diamond abrasive grain and solder are as follows: diamond abrasive grain, 1-
10%；Solder, 90-99%.Beneficial effect by adopting the above technical scheme, which is easy for forming stable diamond abrasive grain, goes out sword rate,
Sword rate is 50-500/mm out, and sword rate refers to the diamond wire out blade diamond quantity all in every mm length interior lines circumference out
Summation.
It is the metal core wire using 85 μm below, inlet wire linear velocity is 30m/min, and the granularity of diamond abrasive grain is 20 μm,
The quality accounting of diamond abrasive grain is 6%, and the air pressure of air knife is 0.3MPa, the property list for the diamond wire being fabricated:
The height of protrusion of diamond wire of the present invention and cutting efficiency are significantly improved as can be seen from the above table.
As shown in fig. 6, step 6 further includes step 61, diamond wire surface characteristic in other embodiments of the invention
Detection: after diamond wire forming, by vision particle on-line detector, diamond wire surface image is acquired, diamond abrasive grain is obtained
Go out sword rate and height of protrusion data.Diamond fretsaw analyzer specifically can be used in vision particle on-line detector.
Step 6 further includes step 62, and sword rate adjusts out: before batch micro operations production, obtaining diamond abrasive grain by experiment
In solder ratio range, the corresponding relation data of sword rate is respectively gone out with ratio and diamond wire.Go out sword rate in being produced in batches
When adjustment, when the diamond abrasive grain of vision particle on-line detector detection is when going out sword rate less than setting range lower limit value, with first
Diamond abrasive grain and the solder proportion of beginning is foundation, and increment needed for calculating diamond abrasive grain corresponding to sword rate difference is past
The diamond abrasive grain of corrresponding quality is added in solder container；When the sword out of the diamond abrasive grain of vision particle on-line detector detection
It when rate is greater than setting range upper limit value, is matched with initial diamond abrasive grain and solder as foundation, it is right to calculate sword rate difference institute
Increment needed for the solder answered adds the solder of corrresponding quality into solder container.
Step 6 further includes step 63, height of protrusion adjustment: when the height of protrusion of vision particle on-line detector detection is lower than
When setting range lower limit value, the air pressure of air knife is turned up；When the height of protrusion of vision particle on-line detector detection is higher than setting
When range higher limit, the air pressure of air knife is turned down.Beneficial effect by adopting the above technical scheme is: convenient for forming stable Buddha's warrior attendant
Stone grit protrusion rate and height of protrusion, it is ensured that Buddha's warrior attendant line mass keeps stablizing.
The above embodiments merely illustrate the technical concept and features of the present invention, and its object is to allow ordinary skill people
Member can understand the contents of the present invention and be implemented, it is not intended to limit the scope of the present invention, it is all according to the present invention
Equivalent change or modification made by Spirit Essence, should be covered by the scope of protection of the present invention.
Claims (10)
1. a kind of immersed solder diamond wire, which is characterized in that including metal core wire, solder layer and diamond abrasive grain, the solder layer is wrapped up in
The outer surface of metal core wire is overlayed on, the part body of the diamond abrasive grain is in the solder layer, the diamond abrasive grain
The part for exposing the solder layer has angular structures.
2. immersed solder diamond wire according to claim 1, it is characterised in that: the line footpath of the metal core wire is 30-150 μm；
The metal core wire is steel wire, copper wire or alloy wire.
3. immersed solder diamond wire according to claim 2, it is characterised in that: the granularity of the diamond abrasive grain is 6-30 μm.
4. immersed solder diamond wire according to claim 3, it is characterised in that: the solder layer material is tinbase, copper-based, manganese
It is one or more in base, Ni-based, Ti-based solder.
5. a kind of manufacturing method of immersed solder diamond wire, for any immersed solder diamond wire of manufacturing claims 1-4, feature
It is: includes the following steps:
Step 1, solder is prepared: solid solder being first added into solder container, is completely melt it；
Step 2, diamond abrasive grain is added, is dispersed in diamond abrasive grain in solder；
Step 3, by cleaning equipment, oxide on surface, the grease stain dirt of metal core wire the cleaning of metal core wire: are removed；
Step 4, the coating of scaling powder: metal core wire is made to pass through the container for filling scaling powder；
Step 5, metal core wire is entered into solder container, metal core wire surface is made to coat one layer of solder；
Step 6, blowing is generated to metal core wire surface solder by air knife, the corner angle of diamond abrasive grain protrude solder surface, warp
After rapid cooling, diamond wire is formed；
Step 7, pass through winding system take-up.
6. the manufacturing method of immersed solder diamond wire according to claim 5, it is characterised in that: immersed solder diamond wire manufacturing process
In, the temperature of solder container is 200-600 DEG C；The linear velocity of metal core wire is 5-200m/min；The air pressure of air knife is 0.1-
7MPa。
7. the manufacturing method of immersed solder diamond wire according to claim 6, it is characterised in that: the matter of diamond abrasive grain and solder
Amount proportion are as follows: diamond abrasive grain, 1-10%；Solder, 90-99%.
8. the manufacturing method of immersed solder diamond wire according to claim 7, it is characterised in that: step 6 further include:
Step 61, diamond wire surface characteristic detects: by vision particle on-line detector, acquiring diamond wire surface image, obtains
Diamond abrasive grain goes out sword rate and height of protrusion data.
9. the manufacturing method of immersed solder diamond wire according to claim 8, it is characterised in that: step 6 further include:
Step 62, sword rate adjusts out: when the sword rate that goes out of the diamond abrasive grain of vision particle on-line detector detection is less than setting model
When enclosing lower limit value, diamond abrasive grain is added into solder container for foundation with initial diamond abrasive grain and solder proportion；Work as view
When going out sword rate greater than setting range upper limit value of the diamond abrasive grain of particle on-line detector detection is felt, with initial Buddha's warrior attendant stone mill
Grain adds solder into solder container with solder proportion for foundation.
10. the manufacturing method of immersed solder diamond wire according to claim 9, it is characterised in that: step 6 further includes step 63,
Height of protrusion adjustment: when the height of protrusion of the diamond abrasive grain of vision particle on-line detector detection is lower than setting range lower limit value
When, the air pressure of air knife is turned up；When the height of protrusion of the diamond abrasive grain of vision particle on-line detector detection is higher than setting model
When placing limit value, the air pressure of air knife is turned down.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201811083418.8A CN109203264B (en) | 2018-09-18 | 2018-09-18 | Dip-soldering diamond wire and manufacturing method thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201811083418.8A CN109203264B (en) | 2018-09-18 | 2018-09-18 | Dip-soldering diamond wire and manufacturing method thereof |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN109203264A true CN109203264A (en) | 2019-01-15 |
| CN109203264B CN109203264B (en) | 2021-04-06 |
Family
ID=64984738
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201811083418.8A Active CN109203264B (en) | 2018-09-18 | 2018-09-18 | Dip-soldering diamond wire and manufacturing method thereof |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN109203264B (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112776195A (en) * | 2019-11-01 | 2021-05-11 | 苏州阿特斯阳光电力科技有限公司 | Silicon wafer processing method, grooving main roller and slicing equipment |
Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| GB479767A (en) * | 1935-09-05 | 1938-02-10 | Carborundum Co | Improvements in or relating to abrasive articles and methods and apparatus for manufacturing the same |
| CN101209505A (en) * | 2006-12-26 | 2008-07-02 | 浙江工业大学 | Method for preparing metal binding agent diamond scroll saw |
| CN201979390U (en) * | 2010-12-30 | 2011-09-21 | 河南富耐克超硬材料有限公司 | Fret saw |
| CN102352503A (en) * | 2011-10-31 | 2012-02-15 | 长沙岱勒新材料科技有限公司 | Preparation method of diamond wire and prepared diamond wire |
| CN102492367A (en) * | 2011-12-07 | 2012-06-13 | 天津大学 | Low-melting-point metal adhesive and diamond wire saw obtained by metal adhesion |
| CN106794570A (en) * | 2014-08-21 | 2017-05-31 | 3M创新有限公司 | Coated abrasive article and preparation method with multiplex abrasive grain structure |
| CN108081137A (en) * | 2017-12-08 | 2018-05-29 | 华中科技大学 | A kind of emery wheel double excitation trimming device and method with gas-liquid parallel connection tubular type |
-
2018
- 2018-09-18 CN CN201811083418.8A patent/CN109203264B/en active Active
Patent Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| GB479767A (en) * | 1935-09-05 | 1938-02-10 | Carborundum Co | Improvements in or relating to abrasive articles and methods and apparatus for manufacturing the same |
| CN101209505A (en) * | 2006-12-26 | 2008-07-02 | 浙江工业大学 | Method for preparing metal binding agent diamond scroll saw |
| CN201979390U (en) * | 2010-12-30 | 2011-09-21 | 河南富耐克超硬材料有限公司 | Fret saw |
| CN102352503A (en) * | 2011-10-31 | 2012-02-15 | 长沙岱勒新材料科技有限公司 | Preparation method of diamond wire and prepared diamond wire |
| CN102492367A (en) * | 2011-12-07 | 2012-06-13 | 天津大学 | Low-melting-point metal adhesive and diamond wire saw obtained by metal adhesion |
| CN106794570A (en) * | 2014-08-21 | 2017-05-31 | 3M创新有限公司 | Coated abrasive article and preparation method with multiplex abrasive grain structure |
| CN108081137A (en) * | 2017-12-08 | 2018-05-29 | 华中科技大学 | A kind of emery wheel double excitation trimming device and method with gas-liquid parallel connection tubular type |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112776195A (en) * | 2019-11-01 | 2021-05-11 | 苏州阿特斯阳光电力科技有限公司 | Silicon wafer processing method, grooving main roller and slicing equipment |
Also Published As
| Publication number | Publication date |
|---|---|
| CN109203264B (en) | 2021-04-06 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN1852796B (en) | Superabrasive wire saw and associated methods of manufacture | |
| JP5541941B2 (en) | Fixed abrasive saw wire | |
| CN103144209B (en) | A kind of diamond fretsaw and production technology thereof | |
| JPS58223564A (en) | Whetstone and method for manufacture thereof | |
| CN103857494A (en) | Abrasive article and method of forming | |
| JPS6080562A (en) | Electrodeposited grinding wheel | |
| CN109321204A (en) | A kind of more particle agglomeration type abrasive grain bodies, preparation method and applications | |
| JP6291572B2 (en) | Nickel-coated diamond particles and method for producing the particles | |
| CN203566873U (en) | Isomerous solidification abrasive-material saw line for multi-line cutting and manufacturing device of isomerous solidification abrasive-material saw line for multi-line cutting | |
| CN102218537B (en) | Method for manufacturing pre-deformation line diamond line saw through powder metallurgy | |
| JP6191839B2 (en) | Diamond sintered ball end mill and manufacturing method thereof | |
| CN105950114B (en) | A kind of outer membrane mixing diamond spherical abrasive material and preparation method thereof | |
| TWI635931B (en) | Super abrasive wheel | |
| CN103367242B (en) | Combined trimmer and manufacturing method thereof and chemical mechanical polishing method | |
| CN109203264A (en) | A kind of immersed solder diamond wire and its manufacturing method | |
| JP2009136926A (en) | Conditioner and conditioning method | |
| CN210011174U (en) | Dip welding diamond wire | |
| CN111979572A (en) | Method for quickly adjusting thickness of thickened coating of electroplating diamond wire | |
| CN104647618B (en) | Heterogeneous fixed abrasive wire saw for multi-line cutting | |
| CN207578758U (en) | A kind of diamond wire for multi-wire saw | |
| CN206568356U (en) | Three stranded diamond fretsaws | |
| CN109195747B (en) | Super-hard abrasive grinding wheel | |
| CN206550880U (en) | A kind of diadust grinding block | |
| CN112828780B (en) | Preparation method and application method of abrasive for layered sand-planting abrasive belt | |
| CN102581383B (en) | Manufacturing method and manufacturing device of superhard abrasive fret saw |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| GR01 | Patent grant | ||
| GR01 | Patent grant |