CN109195324B - Circuit board jointed board and manufacturing method thereof - Google Patents
Circuit board jointed board and manufacturing method thereof Download PDFInfo
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- CN109195324B CN109195324B CN201810743569.5A CN201810743569A CN109195324B CN 109195324 B CN109195324 B CN 109195324B CN 201810743569 A CN201810743569 A CN 201810743569A CN 109195324 B CN109195324 B CN 109195324B
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/14—Structural association of two or more printed circuits
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/14—Structural association of two or more printed circuits
- H05K1/142—Arrangements of planar printed circuit boards in the same plane, e.g. auxiliary printed circuit insert mounted in a main printed circuit
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0097—Processing two or more printed circuits simultaneously, e.g. made from a common substrate, or temporarily stacked circuit boards
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/20—Details of printed circuits not provided for in H05K2201/01 - H05K2201/10
- H05K2201/2009—Reinforced areas, e.g. for a specific part of a flexible printed circuit
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- Microelectronics & Electronic Packaging (AREA)
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Abstract
The invention provides a circuit board jointed board which comprises at least two PCB single boards, two first process edges arranged oppositely and at least one second process edge connected between the two first process edges, wherein the at least two PCB single boards are respectively arranged at two opposite sides of the second process edge and positioned between the two first process edges, each PCB single board is connected with the adjacent first process edge through a first connecting rib, each PCB single board is also connected with the second process edge through a second connecting rib, and the side edge of at least one PCB single board connected with the second process edge is a nonlinear side edge. In addition, the invention also provides a manufacturing method of the circuit board jointed board. The circuit board jointed board has better overall strength and stability.
Description
Technical Field
The invention relates to the technical field of printed circuit boards, in particular to a circuit board spliced board and a manufacturing method thereof.
Background
In the manufacturing process of a Printed Circuit Board (PCB), in order to improve the chip mounting efficiency of electronic components such as resistors and capacitors, a plurality of PCB single boards with small sizes are usually spliced into a Circuit Board spliced Board with large sizes, the PCB single boards forming the Circuit Board spliced Board are mostly connected through connecting ribs, and process edges are arranged around the whole Circuit Board spliced Board so as to improve the overall strength of the Circuit Board spliced Board. As shown in fig. 1, in the schematic plan view of the jointed board of the circuit board in the prior art, for the PCB single boards with regular linear side edges, when the jointed board of the circuit board is formed, the gaps between the PCB single boards are relatively uniform, so that the connecting ribs matched with the PCB single boards can be conveniently arranged between the PCB single boards to realize the connection between the PCB single boards.
However, for the PCB single boards with irregular non-linear side edges, when the circuit board jointed board is formed, the gaps between the side edges of the adjacent PCB single boards are not uniform, so that the PCB single boards cannot be connected by the connecting ribs, which is not favorable for improving the overall strength of the circuit board jointed board and affects the quality of the circuit board jointed board.
Disclosure of Invention
In view of the above problems in the prior art, the present invention provides a circuit board jointed board to solve the problem that the irregular edge PCB veneers cannot be provided with the matched connecting ribs when forming the jointed board, thereby improving the overall strength and stability of the circuit board jointed board formed by the irregular non-linear side edge PCB veneers.
In addition, the invention also provides a manufacturing method of the circuit board jointed board.
The utility model provides a circuit board makeup, includes two at least PCB veneers, two relative first technology limit that set up and connect in at least one second technology limit between two first technology limits, two at least PCB veneers set up respectively in the relative both sides on second technology limit just are located between two first technology limits, each PCB veneer is through first splice bar and adjacent first technology limit is connected, each PCB veneer still through the second splice bar with second technology limit is connected, wherein, at least one PCB veneer with the side that second technology limit is connected is nonlinear line type side.
Each PCB single board comprises a first side edge, a second side edge, a third side edge and a fourth side edge, wherein the first side edge and the second side edge are opposite, the third side edge and the fourth side edge are opposite, the first side edge and the second side edge are linear side edges and are parallel to the first process edge, and the third side edge and the fourth side edge are nonlinear side edges and are arranged along the extending direction of the second process edge.
The first side edge and the second side edge adjacent to the first technical edge are connected with the first technical edge through first connecting ribs, and the first side edge and the second side edge of two adjacent PCB single plates are connected through third connecting ribs.
The third side edge and the fourth side edge respectively comprise a plurality of protruding parts arranged at intervals, concave parts are formed between the adjacent protruding parts, the protruding parts of the third side edge and the protruding parts of the fourth side edge are arranged in a mutually staggered mode in a direction parallel to the second process edge, and the concave parts of the third side edge and the concave parts of the fourth side edge are arranged in a mutually staggered mode in a direction parallel to the second process edge.
The second connecting rib is arranged on the protruding portion of the third side edge and/or the protruding portion of the fourth side edge, and the PCB single board is connected with the second technical edge through the second connecting rib arranged on the protruding portion of the third side edge and/or the protruding portion of the fourth side edge.
A manufacturing method of a circuit board jointed board comprises the following steps:
providing at least two PCB single boards, two first process edges and at least one second process edge;
arranging the two first process edges oppositely, and connecting at least one second process edge between the two first process edges;
arranging the at least two PCB single boards at two sides of the second technical edge and between the two first technical edges;
connecting each PCB single board with the adjacent first process edge through a first connecting rib;
and connecting each PCB single board with the second technical edge through a second connecting rib, wherein the side edge of at least one PCB single board connected with the second technical edge is a nonlinear side edge.
Each PCB single board comprises a first side edge, a second side edge, a third side edge and a fourth side edge, wherein the first side edge and the second side edge are opposite, the third side edge and the fourth side edge are opposite, the first side edge and the second side edge are linear side edges and are parallel to the first process edge, and the third side edge and the fourth side edge are nonlinear side edges and are arranged along the extending direction of the second process edge.
The first side edge and the second side edge adjacent to the first technical edge are connected with the first technical edge through first connecting ribs, and the first side edge and the second side edge of two adjacent PCB single plates are connected through third connecting ribs.
The third side edge and the fourth side edge respectively comprise a plurality of protruding parts arranged at intervals, concave parts are formed between the adjacent protruding parts, the protruding parts of the third side edge and the protruding parts of the fourth side edge are arranged in a mutually staggered mode in a direction parallel to the second process edge, and the concave parts of the third side edge and the concave parts of the fourth side edge are arranged in a mutually staggered mode in a direction parallel to the second process edge.
The second connecting rib is arranged on the protruding portion of the third side edge and/or the protruding portion of the fourth side edge, and the PCB single board is connected with the second technical edge through the second connecting rib arranged on the protruding portion of the third side edge and/or the protruding portion of the fourth side edge.
In the circuit board jointed board and the manufacturing method thereof provided by the embodiment of the invention, at least one second process edge is arranged between two oppositely arranged first process edges, so that at least two PCB single boards can be respectively arranged at two sides of the second process edges, the nonlinear side edge of each PCB single board is adjacent to the second process edge, and the nonlinear side edge of each PCB single board is connected with the second process edge through the connecting rib, so that the problem that the PCB single board with an irregular edge cannot be provided with the matched connecting rib when the jointed board is formed can be solved, and the integral strength and the stability of the circuit board jointed board formed by the PCB single boards with the irregular nonlinear side edges are effectively improved.
Drawings
In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings used in the description of the embodiments or the prior art will be briefly described below, it is obvious that the drawings in the following description are only some embodiments of the present invention, and for those skilled in the art, other drawings can be obtained according to the drawings without creative efforts.
FIG. 1 is a schematic plan view of a prior art circuit board panel;
FIG. 2 is a schematic plan view of a circuit board panel according to a first embodiment of the present invention;
FIG. 3 is a schematic plan view of a circuit board panel according to a second embodiment of the present invention;
fig. 4 is a flow chart of a method for manufacturing a circuit board panel according to an embodiment of the invention.
Detailed Description
The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
Spatially relative terms such as "below …", "below …", "below", "above …", "above", and the like may be used herein for ease of description to describe one element or feature's relationship to another element(s) or feature(s) as illustrated in the figures. It will be understood that when an element or layer is referred to as being "on," "connected to," or "coupled to" another element or layer, it can be directly on, connected or coupled to the other element or layer or intervening elements or layers may be present.
It is to be understood that the terminology used herein is for the purpose of describing particular embodiments only and is not intended to be limiting of the invention. As used herein, the singular forms "a", "an" and "the" are intended to include the plural forms as well, unless the context clearly indicates otherwise. Further, the terms "comprises" and/or "comprising," when used in this specification, specify the presence of stated features, integers, steps, elements, and/or components, but do not preclude the presence or addition of one or more other features, integers, steps, elements, components, and/or groups thereof.
Referring to fig. 2, a first embodiment of the invention provides a Circuit Board assembly 10, which includes at least two Printed Circuit Board (PCB) boards 11, two first technical edges 13 disposed in parallel, and at least one second technical edge 15 connected between the two first technical edges 13. In this embodiment, the number of the PCB single board 11 is two, the number of the first process edges 13 is two, and the number of the second process edges 15 is one.
In this embodiment, the PCB single board 11 is located between the two first technical edges 13, and each PCB single board 11 is connected to the adjacent first technical edge 13 through the first connecting rib 111. The at least two PCB veneers 11 are disposed on two opposite sides of the second technical edge 15 and between the two first technical edges 13, and each PCB veneer 11 is further connected with the second technical edge 15 through a second connecting rib 113. Wherein, the side edge of at least one PCB single board 11 connected with the second technical edge 15 is a nonlinear side edge. The non-linear side edge means that the side edge of the PCB single plate is provided with a convex and concave structure instead of a smooth and continuous straight line.
In this embodiment, each PCB board 11 includes a first side 1101 and a second side 1102 opposite to each other, and a third side 1103 and a fourth side 1104 opposite to each other, where the first side 1101 and the second side 1102 are linear sides and arranged parallel to the first technical edge 13, and the third side 1103 and the fourth side 1104 are non-linear sides and arranged along the extending direction of the second technical edge 15. The third side 1103 and the fourth side 1104 each include a plurality of protruding portions T arranged at intervals, a recessed portion O is formed between the adjacent protruding portions T, the protruding portions T of the third side 1103 and the protruding portions T of the fourth side 1104 are arranged in a staggered manner in a direction parallel to the second process edge 15, and similarly, the recessed portions O of the third side 1103 and the recessed portions O of the fourth side 1104 are arranged in a staggered manner in a direction parallel to the second process edge 15.
The PCB single board 11 is connected to the second technical edge 15 through a second connecting rib 113 disposed on the protruding portion T of the third side edge 1103 and/or the protruding portion T of the fourth side edge 1104. For example, when the circuit board jointed board 10 includes one second technical edge 15, the PCB single board 11 located at one side of the second technical edge 15 is connected to the second technical edge 15 through the second connecting rib 113 disposed on the protruding portion T of the third side edge 1103, and meanwhile, the PCB single board 11 located at the other side of the second technical edge 15 is connected to the second technical edge 15 through the second connecting rib 113 disposed on the protruding portion T of the fourth side edge 1104. In other embodiments, when the circuit board jointed board 10 includes a plurality of the second technical edges 15, the PCB single board 11 located between two adjacent second technical edges 15 is connected to one of the second technical edges 15 through the second connecting rib 113 disposed on the protruding portion T of the third side edge 1103, and is connected to the other second technical edge 15 through the second connecting rib 113 disposed on the protruding portion T of the fourth side edge 1104.
It is understood that in other embodiments, the circuit board panels 10 may include three second technical edges 15, one second technical edge 15 is shown in fig. 2, and the other two second technical edges (not shown) are respectively connected to the ends of the two first technical edges 13, so as to form a closed square frame structure together with the two first technical edges 13. That is, the three second process edges are sequentially arranged at intervals, the second process edge 15 shown in fig. 2 is located between the other two second process edges, and one PCB single board 11 is arranged between two adjacent second process edges, that is, the PCB single board 11 and the second process edges are sequentially arranged at intervals. It is understood that one of the two other second technical edges is connected to the protrusion T of the third side 1103 of one of the PCB single boards 11 through the second connection rib, and the other two other second technical edges is connected to the protrusion T of the fourth side 1104 of the other PCB single board 11 through the second connection rib.
Referring to fig. 3, a second embodiment of the present invention provides a circuit board jointed board 20, which includes four PCB boards 21 with the same shape, two first technical edges 23 disposed opposite to each other, and a second technical edge 25, wherein the second technical edge 25 is vertically connected between the two first technical edges 23, and forms an i-shaped structure together with the two first technical edges 23. The four PCB veneers 21 are arranged in a matrix, wherein two PCB veneers 21 are located at one side of the second technical edge 25, and the other two PCB veneers 21 are located at the other side of the second technical edge 25. The PCB single board 21 adjacent to the first technical edge 23 is connected to the first technical edge 23 through a first connecting rib 211, two adjacent PCB single boards 21 located on the same side of the second technical edge 25 are connected to each other through a third connecting rib 215, and each PCB single board 21 is connected to the second technical edge 25 through a second connecting rib 213. Wherein, the side edge of at least one PCB veneer 21 connected with the second technical edge 25 is a nonlinear side edge. The non-linear side edge means that the side edge of the PCB single plate is provided with a convex and concave structure instead of a smooth and continuous straight line.
In this embodiment, each of the PCB boards 21 includes a first side 2101 and a second side 2102 and a third side 2103 and a fourth side 2104, where the first side 2101 and the second side 2102 are linear sides and are disposed parallel to the first technical edge 23, and the third side 2103 and the fourth side 2104 are nonlinear sides and are disposed along an extending direction of the second technical edge 25. The third side 2103 and the fourth side 2014 each include a plurality of protrusions T disposed at intervals, a recess O is formed between adjacent protrusions T, the protrusions T of the third side 2103 and the protrusions T of the fourth side 2104 are staggered in a direction parallel to the second process side 25, and similarly, the recesses O of the third side 2103 and the recesses O of the fourth side 2104 are staggered in a direction parallel to the second process side 25.
The PCB single board 21 is connected to the second technical edge 25 through a second connection rib 213 disposed on the projection T of the third side 2103 and/or the projection T of the fourth side 2104. It is understood that in other embodiments, the circuit board panels 20 may further include two second technical edges (not shown) respectively connected to the ends of the two first technical edges 23, so as to form a closed square frame structure together with the two first technical edges 23. That is, the three second process edges are sequentially arranged at intervals, the second process edge 25 shown in fig. 3 is located between the other two second process edges, and a PCB single board 21 is arranged between the two adjacent second process edges, that is, the PCB single board 21 and the second process edges are sequentially arranged at intervals. The connection relationship between the other two second process edges and the PCB single board 21 is the same as the connection relationship between the second process edge 25 and the PCB single board 21 shown in fig. 3, and is not described herein again.
It is understood that the PCB single board is not limited to the shape shown in fig. 2 or 3, and may be a polygon such as a triangle, a pentagon, a hexagon, etc. The PCB single plates comprise at least one nonlinear side edge, and when a plurality of PCB single plates form a circuit board jointed board, if the nonlinear side edge is adjacent to the first technical edge, the nonlinear side edge is directly connected with the first technical edge through a first connecting rib; if the nonlinear side edge of one of the PCB single boards is adjacent to the linear side edge or the nonlinear side edge of the other PCB single board, a second technical edge is arranged between the nonlinear side edge of one of the PCB single boards and the linear side edge or the nonlinear side edge of the other PCB single board, and the second technical edge are connected through a second connecting rib respectively. The nonlinear side edge of one of the PCB single plates is connected with the second process edge through a second connecting rib, the linear side edge or the nonlinear side edge of the other PCB single plate adjacent to the nonlinear side edge is also connected with the second process edge through a second connecting rib, so that the second process edge is arranged between the nonlinear side edges of the two adjacent PCB single plates or between the nonlinear side edge of one of the two adjacent PCB single plates and the linear side edge of the other PCB single plate, and the second process edge is connected with the two adjacent PCB single plates through the second connecting rib.
Referring to fig. 4, in an embodiment of the present invention, a method for manufacturing a circuit board assembly is further provided, where the method at least includes:
step S101: providing at least two PCB single boards, two first process edges and at least one second process edge;
step S102: arranging the two first technical edges in parallel relatively, and connecting at least one second technical edge between the two first technical edges;
step S103: arranging the at least two PCB single boards at two sides of the second technical edge and between the two first technical edges;
step S104: connecting each PCB single board with the adjacent first process edge through a first connecting rib;
step S105: and connecting each PCB single board with the second technical edge through a second connecting rib, wherein the side edge of at least one PCB single board connected with the second technical edge is a nonlinear side edge.
Preferably, each of the PCB boards includes a first side and a second side opposite to each other, and a third side and a fourth side opposite to each other, where the first side and the second side are linear sides and arranged parallel to the first process side, and the third side and the fourth side are nonlinear sides and arranged along an extending direction of the second process side.
Preferably, the first side edge and the second side edge adjacent to the first technical edge are connected to the first technical edge through a first connecting rib, and the first side edge and the second side edge of two adjacent PCB single boards are connected to each other through a third connecting rib.
Preferably, the third side and the fourth side each include a plurality of protruding portions arranged at intervals, a recessed portion is formed between adjacent protruding portions, the protruding portions of the third side and the protruding portions of the fourth side are arranged in a staggered manner in a direction parallel to the second process side, and the recessed portions of the third side and the recessed portions of the fourth side are arranged in a staggered manner in a direction parallel to the second process side.
Preferably, the second connecting rib is disposed on the protruding portion of the third side and/or the protruding portion of the fourth side, and the PCB single board is connected to the second technical side through the second connecting rib disposed on the protruding portion of the third side and/or the protruding portion of the fourth side.
It is understood that the steps of the manufacturing method of the circuit board jointed board and the specific implementation thereof can also refer to the related description in the embodiments shown in fig. 2 and fig. 3, and the description thereof is omitted.
According to the circuit board jointed board and the manufacturing method thereof provided by the embodiment of the invention, at least one second process edge is arranged between two oppositely arranged first process edges, so that at least two PCB single boards can be respectively arranged at two sides of the second process edges, the nonlinear side edge of each PCB single board is adjacent to the second process edge, and the nonlinear side edge of each PCB single board is connected with the second process edge through the second connecting rib, so that the problem that the PCB single boards with irregular edges cannot be provided with the matched connecting ribs when the jointed board is formed can be solved, and the integral strength and the stability of the circuit board jointed board formed by the PCB single boards with irregular nonlinear sides are effectively improved.
It should be noted that, in this document, the terms "comprises," "comprising," or any other variation thereof, are intended to cover a non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements does not include only those elements but may include other elements not expressly listed or inherent to such process, method, article, or apparatus. Without further limitation, an element defined by the phrase "comprising an … …" does not exclude the presence of other like elements in a process, method, article, or apparatus that comprises the element. In addition, the above-mentioned serial numbers of the embodiments of the present invention are merely for description, and do not represent the merits of the embodiments.
While the invention has been described with reference to a preferred embodiment, it will be understood by those skilled in the art that various changes in form and detail may be made therein without departing from the spirit and scope of the invention.
Claims (6)
1. A circuit board jointed board comprises two PCB single boards, and is characterized in that the circuit board jointed board further comprises two first technical edges which are oppositely arranged and a second technical edge which is connected between the two first technical edges, the two PCB single boards are respectively arranged at two opposite sides of the second technical edge and positioned between the two first technical edges, each PCB single board is connected with the adjacent first technical edge through a first connecting rib, each PCB single board is also connected with the second technical edge through a second connecting rib, and the side edge of at least one PCB single board connected with the second technical edge is a nonlinear side edge; the non-linear side edge refers to that the side edge of the PCB single plate is provided with a convex and concave structure instead of a smooth and continuous straight line;
each PCB single board comprises a first side edge, a second side edge, a third side edge and a fourth side edge, wherein the first side edge and the second side edge are opposite, the first side edge and the second side edge are linear side edges and are arranged in parallel to the first process edge, and the third side edge and the fourth side edge are nonlinear side edges and are arranged along the extending direction of the second process edge;
the third side with the fourth side includes the bulge that a plurality of intervals set up each other, and is adjacent form the depressed part between the bulge, the bulge of third side with between the bulge of fourth side is at a parallel with the direction on second technology limit is crisscross arranges each other, the depressed part of third side with between the depressed part on fourth side at a parallel with the direction on second technology limit is crisscross arranges each other.
2. The circuit board panel according to claim 1, wherein the first side edge and the second side edge adjacent to the first technical edge are connected to the first technical edge by a first connecting rib, and the first side edge and the second side edge of two adjacent PCB single boards are connected by a third connecting rib.
3. The circuit board panel according to any one of claims 1 to 2, wherein the second connecting rib is provided on the protruding portion of the third side and/or the protruding portion of the fourth side, and the PCB single board is connected to the second technical side through the second connecting rib provided on the protruding portion of the third side and/or the protruding portion of the fourth side.
4. A manufacturing method of a circuit board jointed board is characterized by comprising the following steps:
providing two PCB single boards, two first technical edges and a second technical edge;
arranging the two first process edges oppositely, and connecting one second process edge between the two first process edges;
arranging the two PCB single boards on two sides of the second technical edge and between the two first technical edges;
connecting each PCB single board with the adjacent first process edge through a first connecting rib;
connecting each PCB single board with the second technical edge through a second connecting rib, wherein the side edge of at least one PCB single board connected with the second technical edge is a nonlinear side edge; the non-linear side edge refers to that the side edge of the PCB single plate is provided with a convex and concave structure instead of a smooth and continuous straight line;
each PCB single board comprises a first side edge, a second side edge, a third side edge and a fourth side edge, wherein the first side edge and the second side edge are opposite, the first side edge and the second side edge are linear side edges and are arranged in parallel to the first process edge, and the third side edge and the fourth side edge are nonlinear side edges and are arranged along the extending direction of the second process edge;
the third side with the fourth side includes the bulge that a plurality of intervals set up each other, and is adjacent form the depressed part between the bulge, the bulge of third side with between the bulge of fourth side is at a parallel with the direction on second technology limit is crisscross arranges each other, the depressed part of third side with between the depressed part on fourth side at a parallel with the direction on second technology limit is crisscross arranges each other.
5. The manufacturing method according to claim 4, wherein a first side edge and a second side edge adjacent to the first technical edge are connected to the first technical edge through a first connecting rib, and the first side edge and the second side edge of two adjacent PCB single boards are connected through a third connecting rib.
6. The manufacturing method according to any one of claims 4 to 5, wherein the second connection rib is disposed on the protruding portion of the third side and/or the protruding portion of the fourth side, and the PCB single board is connected to the second technical side through the second connection rib disposed on the protruding portion of the third side and/or the protruding portion of the fourth side.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810743569.5A CN109195324B (en) | 2016-05-31 | 2016-05-31 | Circuit board jointed board and manufacturing method thereof |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810743569.5A CN109195324B (en) | 2016-05-31 | 2016-05-31 | Circuit board jointed board and manufacturing method thereof |
| CN201610380517.7A CN105934089B (en) | 2016-05-31 | 2016-05-31 | Multiple-printed-panel for circuit board and its manufacturing method |
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| CN201610380517.7A Division CN105934089B (en) | 2016-05-31 | 2016-05-31 | Multiple-printed-panel for circuit board and its manufacturing method |
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| CN109195324A CN109195324A (en) | 2019-01-11 |
| CN109195324B true CN109195324B (en) | 2020-06-02 |
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| CN201610380517.7A Expired - Fee Related CN105934089B (en) | 2016-05-31 | 2016-05-31 | Multiple-printed-panel for circuit board and its manufacturing method |
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| CN109195324B (en) * | 2016-05-31 | 2020-06-02 | Oppo广东移动通信有限公司 | Circuit board jointed board and manufacturing method thereof |
| CN107708301B (en) * | 2017-09-27 | 2019-06-18 | Oppo广东移动通信有限公司 | A kind of preparation method of circuit board, multiple-printed-panel for circuit board and electronic equipment |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| CN105934089B (en) * | 2016-05-31 | 2019-01-04 | 广东欧珀移动通信有限公司 | Multiple-printed-panel for circuit board and its manufacturing method |
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| US6574862B1 (en) * | 1999-02-23 | 2003-06-10 | Samsung Electro-Mechanics Co., Ltd. | Method for coupling PCB sheet |
| CN201230401Y (en) * | 2008-07-07 | 2009-04-29 | 林益明 | Electronic circuit brace board |
| CN102194715A (en) * | 2010-03-16 | 2011-09-21 | 南亚电路板股份有限公司 | Packaging substrate module and strip-shaped packaging substrate |
| CN202262067U (en) * | 2011-09-02 | 2012-05-30 | 深圳市福祺斯电子有限公司 | Printed circuit board |
| CN202231959U (en) * | 2011-09-16 | 2012-05-23 | 茂荣电子事业有限公司 | Multi-sheet circuit board and circuit board piece |
| CN203775530U (en) * | 2014-03-14 | 2014-08-13 | 华为终端有限公司 | Splicing board |
| CN204088300U (en) * | 2014-08-08 | 2015-01-07 | 上海隽壅精密工业设备有限公司 | The direct insertion framework of two-piece type matrix type MD |
-
2016
- 2016-05-31 CN CN201810743569.5A patent/CN109195324B/en not_active Expired - Fee Related
- 2016-05-31 CN CN201610380517.7A patent/CN105934089B/en not_active Expired - Fee Related
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105934089B (en) * | 2016-05-31 | 2019-01-04 | 广东欧珀移动通信有限公司 | Multiple-printed-panel for circuit board and its manufacturing method |
Also Published As
| Publication number | Publication date |
|---|---|
| CN105934089A (en) | 2016-09-07 |
| CN109195324A (en) | 2019-01-11 |
| CN105934089B (en) | 2019-01-04 |
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Address after: Changan town in Guangdong province Dongguan 523860 usha Beach Road No. 18 Applicant after: GUANGDONG OPPO MOBILE TELECOMMUNICATIONS Corp.,Ltd. Address before: Changan town in Guangdong province Dongguan 523860 usha Beach Road No. 18 Applicant before: GUANGDONG OPPO MOBILE TELECOMMUNICATIONS Corp.,Ltd. |
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