CN109174588A - A kind of the electronic beam curing adhering device and method compound for multiple material - Google Patents
A kind of the electronic beam curing adhering device and method compound for multiple material Download PDFInfo
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- CN109174588A CN109174588A CN201811126497.6A CN201811126497A CN109174588A CN 109174588 A CN109174588 A CN 109174588A CN 201811126497 A CN201811126497 A CN 201811126497A CN 109174588 A CN109174588 A CN 109174588A
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05D—PROCESSES FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05D3/00—Pretreatment of surfaces to which liquids or other fluent materials are to be applied; After-treatment of applied coatings, e.g. intermediate treating of an applied coating preparatory to subsequent applications of liquids or other fluent materials
- B05D3/14—Pretreatment of surfaces to which liquids or other fluent materials are to be applied; After-treatment of applied coatings, e.g. intermediate treating of an applied coating preparatory to subsequent applications of liquids or other fluent materials by electrical means
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Abstract
The invention discloses a kind of electronic beam curing adhering device and method compound for multiple material.This electronic beam curing adhering device compound for multiple material, including membrane material unwinding device, glue stations, set composite, electronic beam curing device and the membrane material wrap-up being sequentially connected.A kind of electronic beam curing adhering method that application adhering device progress multiple material is compound is also disclosed simultaneously.The present invention proposes to be completed compound, solidification between decoration industry and the various substrates of Flexible-Packaging Industry, Nian Jie with electronic beam curing, and electron beam can penetrate ink in the curing process and aluminizer makes Rapid adhesive curing, to quickly complete compound sticking.
Description
Technical field
The present invention relates to a kind of electronic beam curing adhering device and method compound for multiple material, belongs to material solidification
Bonding field.
Background technique
Currently, decoration industry and Flexible-Packaging Industry are all still carrying out storeroom using the complex method of hot setting adhesive
It is compound.The hot compound isocyano generally by dual-component polyurethane adhesive and hydroxyl carry out cross-linking reaction, reach
Solidification with it is Nian Jie.But the reaction speed of this type is slower, curing time is long, needs to cure 24~48 hours at 50~60 DEG C
Bonding can just be completed and carry out the performance detection of product, cause manufacturer that can not hold the quality of product at the first time；If
There are quality problems for composite adhesive, and it will cause a large amount of waste products.How to solidify immediately and finds that the quality of product is asked in time
Topic, becomes the problem of tradesman extremely pays close attention to.It is typically contained in the two-component thermosetting type adhesion agent of commercial type simultaneously
Primary aromatic diamine (PAA), is carcinogenic substance, is unfavorable for the health of operator and user.
And at this point, ultraviolet light (UV) curing method receives the pass of row those skilled in the art by its quick-setting advantage
Note.UV curing method can be shortened the construction period effectively, and examine properties of product in time.But it for opaque membrane material, wears
Permeability is inadequate, it is difficult to and it is compound, it is only effective to transparent membrane material.Due in adhesive system there is also photoinitiator, in solidification process
With penetrating odor.And the film that decoration industry and Flexible-Packaging Industry use is due to ink printing, it is essentially opaque
Material, therefore, ultraviolet light solidification are not appropriate for being applied to decoration industry and Flexible-Packaging Industry.
It is desirable to solve the dedicated rapid curing of adhesive that multiple material is compound in Flexible-Packaging Industry and decoration industry
Method and apparatus problem guarantees to solidify immediately after a variety of film substrates are compound, and carries out control to product quality.
Summary of the invention
The purpose of the present invention is to provide a kind of electronic beam curing adhering device and method compound for multiple material, relates to
And a kind of new curing mode of composite adhesive, in particular to it is a kind of for Flexible-Packaging Industry and the plastic film of decoration industry
With plastic film, plastic film and metal coiled material, the multiple materials such as metal coiled material and metal coiled material are compound to be consolidated for electron beam
Change the method and apparatus of adhesive.
The technical solution used in the present invention is:
A kind of electronic beam curing adhering device compound for multiple material, including be sequentially connected membrane material unwinding device,
Glue stations, set composite, electronic beam curing device and membrane material wrap-up.
In the another kind electronic beam curing adhering device compound for multiple material, between glue stations and set composite also
Equipped with drying tunnel drying unit.
In electronic beam curing adhering device, glue stations is used for the adhesive even spread with double bond structure to film material
On material.
In electronic beam curing adhering device, set composite is used to carry out the thin-film material after gluing with another thin-film material
It is compound.
In electronic beam curing adhering device, electronic beam curing device is equipped with electronics and accelerates generator, and electronics accelerates generator
Accelerate electronics for generating, thus adhesive of the rapid curing with double bond structure.
A kind of electronic beam curing adhering method compound for multiple material is using device above-mentioned, to a variety of films
Material carries out electronic beam curing bonding.
Further, a variety of thin-film materials are at least one of plastic film, metal coiled material.
Preferably, a variety of thin-film materials are polychloroethylene film, polyethylene terephthalate film, polypropylene screen, polyethylene
Film, PA membrane, polyimide film, o-phenyl phenol film, polyvinylidene chloride film, polyvinyl alcohol film, polylactic acid membrane, aluminium foil,
At least one of aluminizer, copper foil, tinplate coiled material, stainless steel coiled material.
Further, solidifying bonding adhesive used is the solvent-based adhesive with double bond structure, no-solvent type gluing
At least one of agent, aqueous adhesive.
Preferably, solidifying bonding adhesive used is polyurethane tackifier, esters of acrylic acid adhesive, epoxies glue
At least one of stick and the modified adhesive of these adhesive.
The beneficial effects of the present invention are:
The present invention propose to be completed with electronic beam curing between decoration industry and the various substrates of Flexible-Packaging Industry it is compound,
Solidification, bonding, electron beam (EB) can penetrate the non-transparent materials such as ink and aluminizer in the curing process, keep adhesive quick
Solidification, to quickly complete compound sticking.
Compared with prior art, advantages of the present invention is as follows:
1) have a wide range of application, suitable for various transparent compound with nontransparent membrane material.Ultraviolet light solidifies to being coated with ink
The penetration power of nontransparent membrane material is poor, therefore can be only applied to the composite curing of transparent membrane material；And electronic beam curing then to ink very
Penetration power to aluminizer is strong, can effectively activate the double bond structure in adhesive, free radical is generated, to complete adhesive
Solidification.
2) quality and performance of laminated film and material are held immediately.Radical reaction activity is very high, therefore electron beam is solid
Time needed for changing is shorter, and the film of compound one meter of length generally only needs 0.1~0.5 second time, and client can be immediately right
Compound good product carries out performance detection, to effectively hold product quality, reduce because cannot immediately testing product performance due to
The waste for the material that may cause.
3) adhesive strength is high, function admirable.Because having double bond structure in adhesive, and after high-velocity electrons open double bond,
It reacts rapidly between free radical, is bonded together between free radical, form the glue-line of high crosslink density, improve the performance of product.
4) high temperature resistant of laminated film easy to accomplish and boiling resistance energy.Since the bond densities between double bond are high, make colloid
With more excellent high temperature resistance and boiling resistance energy.
5) high production efficiency.The recombination velocity of the Film laminated equipment of subsidiary electronic beam curing can reach 600 ms/min,
And it is compound after zero point solidification can be completed in several seconds, effectively shorten the duration.And the compound need of traditional Polyurethane composite adhesive
It to be cured 24~48 hours at 50~60 DEG C.
6) energy conservation and environmental protection.The compound energy consumption of traditional hot setting adhesive is very high, and contains in adhesive system
Primary aromatic diamine (PAA), thus then want to find more energy saving and environmentally friendly complex method in industry.And ultraviolet light solidification and electricity
Beamlet solidification attracts attention, 6 color printers wide at 60 cun, under conditions of 1000 feet/min of recombination velocities, ultraviolet light
Solidification energy consumption is 343KW, and electronic beam curing energy consumption is only 185KW.And because the crosslink density of electron beam is up to 98%, in system
The noxious materials such as no photoinitiator, primary aromatic diamine residual, thus it is more environmentally-friendly.
Detailed description of the invention
Fig. 1 is a kind of schematic diagram of apparatus of the present invention；
Fig. 2 is the schematic diagram of another apparatus of the present invention.
Specific embodiment
A kind of electronic beam curing adhering device compound for multiple material, including be sequentially connected membrane material unwinding device,
Glue stations, set composite, electronic beam curing device and membrane material wrap-up.The schematic diagram of the visible attached drawing 1 of this device.
The present invention also provides another electronic beam curing adhering devices compound for multiple material, including are sequentially connected
Membrane material unwinding device, glue stations, drying tunnel drying unit, set composite, electronic beam curing device and membrane material wrap-up.This
A kind of schematic diagram of the visible attached drawing 2 of device.Attached device shown in Fig. 2 is the glue stations and compound dress in 1 shown device of attached drawing
Drying tunnel drying unit is equipped between setting.
Electronic beam curing adhering device of the invention is further illustrated below:
Gluing of the glue stations for composite film material is used, by the adhesive even spread with double bond structure to film
On material.
Set composite is used to carry out the thin-film material after gluing with another thin-film material compound.
Electronic beam curing device be for Film laminated after, enable adhesive rapidly cured device, convenient in time test
Comprehensive performance after product is compound.Electronic beam curing device is equipped with electronics and accelerates generator, and electronics accelerates generator for generating
Accelerate electronics, thus adhesive of the rapid curing with double bond structure.The curing mechanism of electronic beam curing device is to be added by electronics
Fast generator generates high-velocity electrons, and when penetrating film, huge energy can activate the double bond of adhesive, forms free radical, thus
Carry out curing reaction.
Drying tunnel drying unit be used for the adhesive containing organic solvent or moisture, can by glue-line organic solvent or
The drying of person's moisture.
Membrane material winding, unwinding device for unreel before compound gluing and it is compound after winding synchronization control be used, membrane material is wound
At reel, facilitate storage, transport, carrying.
A kind of electronic beam curing adhering method compound for multiple material is using device above-mentioned, to a variety of films
Material carries out electronic beam curing bonding.
Further, a variety of thin-film materials are at least one of plastic film, metal coiled material.
Preferably, a variety of thin-film materials are polychloroethylene film (PVC), polyethylene terephthalate film (PET), polypropylene
Film (PP), PA membrane (PA), polyimide film (PI), o-phenyl phenol film (OPP), gathers inclined two chloroethene at polyethylene film (PE)
Alkene film (PVDC), polyvinyl alcohol film (PVA), polylactic acid membrane (PLA), aluminium foil, aluminizer, copper foil, tinplate coiled material, stainless-steel roll
At least one of material.
Further, solidifying bonding adhesive used is the solvent-based adhesive with double bond structure, no-solvent type gluing
At least one of agent, aqueous adhesive.
Preferably, solidifying bonding adhesive used is polyurethane tackifier, esters of acrylic acid adhesive, epoxies glue
At least one of stick and the modified adhesive of these adhesive.Polyurethane tackifier can selected from polyurethane adhesive or
Modified polyurethane adhesive, esters of acrylic acid adhesive can be selected from acrylate adhesive or modified acrylic ester adhesion agent,
Epoxies adhesive can be selected from epoxy adhesive or modified epoxy acrylic ester adhesive.
The device of the invention is described further in conjunction with the type of adhesive: when adhesive is solvent-based adhesive or water
When property adhesive, need to open drying tunnel drying unit, by adhesive solvent composition or water evaporation go out adhesive system；Work as glue
When stick is solventless adhesive, drying tunnel drying unit is not required to heat, or no setting is required drying tunnel drying unit.It is not provided with drying
The electronic beam curing adhering device of road drying unit is attached way of realization shown in FIG. 1, and the electron beam of drying tunnel drying unit is arranged
Solidification adhering device is attached way of realization shown in Fig. 2.
Electronic beam curing method of the invention is to generate to accelerate electronics in electronics acceleration equipment, by opening when composite membrane
Double bond structure in adhesive component forms free radical to which polymerization reaction occur.
Electronic beam curing adhering method application range of the invention is the various film materials of Flexible-Packaging Industry and decoration industry
Material and the compound sticking between metal coiled material and plate.
The contents of the present invention are described in further detail below by way of specific embodiment.Original used in embodiment
Material unless otherwise specified, can be obtained from routine business approach.
Embodiment 1:
The composition of adhesive raw materials quality used in embodiment 1 is as follows:
PET film with printed patterns is compound with PE film:
1) adhesive of embodiment 1 is added in the glue groove of glue stations, is spread evenly across the PET film with printed patterns
On.
2) after gluing, the PET film with printed patterns glued enters set composite, compound with the progress of PE film, multiple
Closing speed is 600 ms/min.
3) after compound, laminated film is solidified by electronic beam curing device, then unreels, wind by membrane material
Device carries out control winding.
4) it intercepts the above laminated film and carries out peel strength, boiling, primary aromatic diamine (PAA) and smell test.
Transparent PET film is compound with PE film:
1) adhesive of embodiment 1 is added in the glue groove of glue stations, is spread evenly across on transparent PET film respectively.
2) after gluing, the transparent PET film glued enters set composite, and compound with the progress of PE film, recombination velocity is
600 ms/min.
3) after compound, laminated film is solidified by electronic beam curing device, is then wound by membrane material
Device is wound.
4) it intercepts the above laminated film and carries out peel strength, boiling, primary aromatic diamine (PAA) and smell test.
Embodiment 2:
The composition of adhesive raw materials quality used in embodiment 2 is as follows:
Transparent OPP film is compound with PET aluminizer:
1) adhesive of embodiment 2 is added in the glue groove of glue stations, is spread evenly across on a transparent OPP film.
2) after gluing, the transparent OPP film glued enters set composite, compound with the progress of PET aluminizer, compound
Speed is 500 ms/min.
3) after compound, laminated film is solidified by electronic beam curing device, then unreels, wind by membrane material
Device carries out control winding.
4) it intercepts the above laminated film and carries out peel strength, boiling, primary aromatic diamine (PAA) and smell test:
Embodiment 3:
The composition of adhesive raw materials quality used in embodiment 3 is as follows:
Copper foil and transparent PVC film are compound:
1) adhesive of embodiment 3 is added in the glue groove of glue stations, is spread evenly across on copper foil.
2) after gluing, the copper foil glued enters set composite, carries out compound, recombination velocity with transparent PVC film
It is 300 ms/min.
3) after compound, laminated film is solidified by electronic beam curing device, then unreels, wind by membrane material
Device carries out control winding.
4) it intercepts the above laminated film and carries out peel strength, boiling, primary aromatic diamine (PAA) and smell test.
Embodiment 4:
The composition of adhesive raw materials quality used in embodiment 4 is as follows:
Preparing for polyether-modified acrylate is as follows: polyether Glycols (molecular weight 2000) a) is added in a kettle
81g, ethyl acetate 42.86g, isophorone diisocyanate 19g, stir evenly and natural reaction 1 hour at room temperature；B) it rises
Temperature is reacted 5 hours to 85 DEG C, obtains the modified polyether Glycols ester of IPDI；C) temperature of reaction kettle is dropped to 60 DEG C, be added
10.65g hydroxypropyl acrylate is warming up to 80 DEG C after mixing evenly, carries out graft reaction 2 hours, obtains polyether-modified acrylic acid
Ester.
Tinplate coiled material is compound with the PVC film with printed patterns:
1) after being deployed into adhesive according to above-mentioned formula, adhesive is added in the glue groove of glue stations, even spread
In in the PVC film with printed patterns.
2) after gluing, drying tunnel is enabled, after the solvent drying in glue-line, the PVC film with printed patterns that has glued
Compound with the progress of tinplate coiled material into set composite, recombination velocity is 150 ms/min.
3) after compound, laminated film is solidified by electronic beam curing device, then unreels, wind by membrane material
Device carries out control winding.
4) it intercepts the above laminated film and carries out peel strength, boiling, primary aromatic diamine (PAA) and smell test.
Embodiment 5:
The composition of adhesive raw materials quality used in embodiment 5 is as follows:
Copper foil and transparent PVC film are compound:
1) adhesive of embodiment 5 is added in the glue groove of glue stations, is spread evenly across on copper foil.
2) after gluing, the copper foil glued enters set composite, carries out compound, recombination velocity with transparent PVC film
It is 300 ms/min.
3) after compound, laminated film is solidified by electronic beam curing device, then unreels, wind by membrane material
Device carries out control winding.
4) it intercepts the above laminated film and carries out peel strength, boiling, primary aromatic diamine (PAA) and smell test.
Comparative example 1:
The composition of adhesive raw materials quality used in comparative example 1 is as follows:
One, the PET film with printed patterns and PE film is compound:
1) adhesive of comparative example 1 is added in the glue groove of glue stations, is spread evenly across respectively with printed patterns
On PET film.
2) after gluing, the PET film with printed patterns glued enters set composite, compound with the progress of PE film, multiple
Closing speed is 600 ms/min.
3) after compound, laminated film is solidified by UV curing apparatus, then unreels, wind by membrane material
Device carries out control winding.
4) it intercepts the above laminated film and carries out peel strength, boiling, primary aromatic diamine (PAA) and smell test.
Two, transparent PET film and PE film is compound:
1) adhesive of comparative example 1 is added in the glue groove of glue stations, is spread evenly across on transparent PET film respectively.
2) after gluing, the transparent PET film glued enters set composite, and compound with the progress of PE film, recombination velocity is
600 ms/min.
3) after compound, laminated film is solidified by UV curing apparatus, then unreels, wind by membrane material
Device carries out control winding.
4) it intercepts the above laminated film and carries out peel strength, boiling, primary aromatic diamine (PAA) and smell test.
Three, transparent OPP film and PET aluminizer is compound:
1) adhesive of comparative example 1 is added in the glue groove of glue stations, is spread evenly across on OPP film.
2) after gluing, the OPP film glued enters set composite, and compound with the progress of PET aluminizer, recombination velocity is
500 ms/min.
3) after compound, laminated film is solidified by UV curing apparatus, is then unreeled by membrane material, wrap-up
Carry out control winding.
4) it intercepts the above laminated film and carries out peel strength, boiling, primary aromatic diamine (PAA) and smell test.
Four, copper foil and transparent PVC film is compound:
1) adhesive of comparative example 1 is added in the glue groove of glue stations, is spread evenly across on copper foil.
2) after gluing, the copper foil glued enters set composite, carries out compound, recombination velocity with transparent PVC film
It is 300 ms/min.
3) after compound, laminated film is solidified by UV curing apparatus, is then unreeled by membrane material, wrap-up
Carry out control winding.
4) it intercepts the above laminated film and carries out peel strength, boiling, primary aromatic diamine (PAA) and smell test.
Five, tinplate coiled material and the PVC film with printed patterns is compound:
1) after being deployed into adhesive according to the formula of comparative example 1, adhesive is added in the glue groove of glue stations, is uniformly applied
It is distributed in the PVC film with printed patterns.
2) after gluing, the PVC film with printed patterns glued enters set composite, is answered with tinplate coiled material
It closes, recombination velocity is 150 ms/min.
3) after compound, laminated film is solidified by UV curing apparatus, is then unreeled by membrane material, wrap-up
Carry out control winding.
4) it intercepts the above laminated film and carries out peel strength, boiling, primary aromatic diamine (PAA) and smell test:
Comparative example 2:
Comparative example 2 takes commercially available two-component PU compound adhesive.
One, the PET film with printed patterns and PE film is compound:
1) adhesive of comparative example 2 is added in the glue groove of glue stations, is spread evenly across respectively with printed patterns
On PET film.
2) after gluing, start drying tunnel, after the solvent drying in glue film, the PET with printed patterns that will glue
Film enters set composite, carries out with PE film compound.
3) it after compound, is then unreeled by membrane material, wrap-up carries out control winding and saves.
4) 50~60 DEG C are placed in solidify 24 hours.
5) it intercepts the above laminated film and carries out peel strength, boiling, primary aromatic diamine (PAA) and smell test.
Two, transparent PET film and PE film is compound:
1) adhesive of comparative example 2 is added in the glue groove of glue stations, is spread evenly across on transparent PET film respectively.
2) after gluing, start drying tunnel, after the solvent drying in glue film, the transparent PET film glued is entered multiple
It attaches together and sets, carried out with PE film compound.
3) it after compound, is then unreeled by membrane material, wrap-up carries out control winding and saves.
4) 50~60 DEG C are placed in solidify 24 hours.
5) it intercepts the above laminated film and carries out peel strength, boiling, primary aromatic diamine (PAA) and smell test.
Three, OPP film and PET aluminizer is compound:
1) adhesive of comparative example 2 is added in the glue groove of glue stations, is spread evenly across on OPP film.
2) after gluing, start drying tunnel, after the solvent drying in glue film, the OPP film glued is entered into compound dress
It sets, is carried out with PET aluminizer compound.
3) it after compound, is then unreeled by membrane material, wrap-up carries out control winding and saves.
4) 50~60 DEG C are placed in solidify 24 hours.
5) it intercepts the above laminated film and carries out peel strength, boiling, primary aromatic diamine (PAA) and smell test.
Four, copper foil and transparent PVC film is compound:
1) adhesive of comparative example 2 is added in the glue groove of glue stations, is spread evenly across on copper foil.
2) after gluing, start drying tunnel, after the solvent drying in glue film, the copper foil glued is entered into compound dress
It sets, is carried out with transparent PVC film compound.
3) it after compound, is then unreeled by membrane material, wrap-up carries out control winding and saves.
4) 50~60 DEG C are placed in solidify 24 hours.
5) it intercepts the above laminated film and carries out peel strength, boiling, primary aromatic diamine (PAA) and smell test.
Five, tinplate coiled material and the PVC film with printed patterns is compound:
1) after being deployed into adhesive according to the formula of comparative example 2, adhesive is added in the glue groove of glue stations, uniformly
It is coated in the PVC film with printed patterns.
2) after gluing, start drying tunnel, by glue film solvent drying after, by the patterned PVC film glued into
Enter set composite, is carried out with tinplate coiled material compound.
3) it after compound, is then unreeled by membrane material, wrap-up carries out control winding and saves.
4) 50~60 DEG C are placed in solidify 24 hours.
5) it intercepts the above laminated film and carries out peel strength, boiling, primary aromatic diamine (PAA) and smell test.
The method of peel strength test is described as follows:
By GB/T2791-1995 " adhesive T peel strength experimental method flexible material is to flexible material ", T-type stripping is carried out
From strength test.
The method of water boiling resistance performance test is described as follows:
The laminated film that curing finishes is placed in 100 DEG C of hot water, boiling 24 hours, further according to GB/T2791-1995 " glue
Stick T peel strength experimental method flexible material is to flexible material ", carry out T-type peeling strength test.
The method of PAA primary aromatic diamine detection is described as follows:
By HG/T 4963.1-2016 " the measurement part 1 of harmful substance in paint-printing colour size product: 23 kinds of harmful virtues
The measurement gas chromatography-mass spectrography of fragrant amine ", carry out content detection.
The composite result of PET film with printed patterns and PE film is shown in Table 1.
The composite result of table 1 PET film with printed patterns and PE film
The composite result of transparent PET film and PE film is shown in Table 2.
The composite result of table 2 transparent PET film and PE film
The composite result of transparent OPP film and PET aluminizer is shown in Table 3.
The composite result of table 3 transparent OPP film and PET aluminizer
The composite result of copper foil and transparent PVC film is shown in Table 4.
The composite result of table 4 copper foil and transparent PVC film
The composite result of tinplate coiled material and the PVC film with printed patterns is shown in Table 5.
The composite result of table 5 tinplate coiled material and the PVC film with printed patterns
Claims (10)
1. a kind of electronic beam curing adhering device compound for multiple material, it is characterised in that: including the membrane material being sequentially connected
Unwinding device, glue stations, set composite, electronic beam curing device and membrane material wrap-up.
2. a kind of electronic beam curing adhering device compound for multiple material according to claim 1, it is characterised in that:
Drying tunnel drying unit is additionally provided between glue stations and set composite.
3. a kind of electronic beam curing adhering device compound for multiple material according to claim 1 or 2, feature exist
In: glue stations is used for the adhesive even spread with double bond structure to thin-film material.
4. a kind of electronic beam curing adhering device compound for multiple material according to claim 1 or 2, feature exist
In: set composite is used to carry out the thin-film material after gluing with another thin-film material compound.
5. a kind of electronic beam curing adhering device compound for multiple material according to claim 1, it is characterised in that:
Electronic beam curing device is equipped with electronics and accelerates generator, and electronics accelerates generator to accelerate electronics for generating, thus rapid curing
Adhesive with double bond structure.
6. a kind of electronic beam curing adhering method compound for multiple material, it is characterised in that: appointed using Claims 1 to 55
Device described in one carries out electronic beam curing bonding to a variety of thin-film materials.
7. a kind of electronic beam curing adhering method compound for multiple material according to claim 6, it is characterised in that:
A variety of thin-film materials are at least one of plastic film, metal coiled material.
8. a kind of electronic beam curing adhering method compound for multiple material according to claim 6 or 7, feature exist
In: a variety of thin-film materials be polychloroethylene film, polyethylene terephthalate film, polypropylene screen, polyethylene film, PA membrane,
Polyimide film, o-phenyl phenol film, polyvinylidene chloride film, polyvinyl alcohol film, polylactic acid membrane, aluminium foil, aluminizer, copper foil,
At least one of tinplate coiled material, stainless steel coiled material.
9. a kind of electronic beam curing adhering method compound for multiple material according to claim 6, it is characterised in that:
Solidifying bonding adhesive used is the solvent-based adhesive with double bond structure, in solventless adhesive, aqueous adhesive
It is at least one.
10. a kind of electronic beam curing adhering method compound for multiple material according to claim 9, feature exist
In: solidifying bonding adhesive used is polyurethane tackifier, esters of acrylic acid adhesive, epoxies adhesive and these glue
At least one of modified adhesive of stick.
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
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| CN110387208A (en) * | 2019-07-23 | 2019-10-29 | 中山市康和化工有限公司 | A kind of electronic beam curing compound adhesive, package compound film and preparation method thereof |
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