CN109173925A - It is classified the multilevel structure dusty material and preparation method thereof of discrete high-efficiency evaporating - Google Patents
It is classified the multilevel structure dusty material and preparation method thereof of discrete high-efficiency evaporating Download PDFInfo
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- CN109173925A CN109173925A CN201810849994.2A CN201810849994A CN109173925A CN 109173925 A CN109173925 A CN 109173925A CN 201810849994 A CN201810849994 A CN 201810849994A CN 109173925 A CN109173925 A CN 109173925A
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B01—PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
- B01J—CHEMICAL OR PHYSICAL PROCESSES, e.g. CATALYSIS OR COLLOID CHEMISTRY; THEIR RELEVANT APPARATUS
- B01J2/00—Processes or devices for granulating materials, e.g. fertilisers in general; Rendering particulate materials free flowing in general, e.g. making them hydrophobic
- B01J2/10—Processes or devices for granulating materials, e.g. fertilisers in general; Rendering particulate materials free flowing in general, e.g. making them hydrophobic in stationary drums or troughs, provided with kneading or mixing appliances
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- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
- C23C14/24—Vacuum evaporation
- C23C14/32—Vacuum evaporation by explosion; by evaporation and subsequent ionisation of the vapours, e.g. ion-plating
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- Application Of Or Painting With Fluid Materials (AREA)
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Abstract
The invention discloses a kind of multilevel structure dusty materials and preparation method thereof for being classified discrete high-efficiency evaporating, the primary structure of multilevel structure dusty material is the primary particles of partial size 150nm~1 μm, secondary structure is 1~5 μm of agglomerated particle being made of primary particles, and tertiary structure is the dusty material for being 5~50 μm by the granularity that secondary structure forms；The partial size of the partial size > primary structure of the partial size > secondary structure of tertiary structure.Multilevel structure dusty material of the invention can pop step by step when heated, it is discrete to be classified, to realize the efficient rapid evaporation of material.
Description
Technical field
The present invention relates to field of thermal spray, and in particular to a kind of multilevel structure dusty material for being classified discrete high-efficiency evaporating and
Preparation method.
Background technique
As aero-engine develops to high thrust ratio direction, turbine inlet temperature (TIT) is continuously improved.Currently, turbine inlet temperature
Degree has been lifted to the level more than high temperature alloy operating limit, need to be in high temperature alloy table to meet hot environment job requirement
Wheat flour is for thermal barrier coating to improve service condition.
Plasma physical vapor deposits (PS-PVD), is a kind of based on plasma heating evaporation and heavy with liquid phase or gas phase
Product realizes that large area quickly prepares the new technology of thermal barrier coating.Due to PS-PVD work when input power can up to~
120kW and low operating pressure (50~200Pa), cause coating material powder that can melt, or even gasified.According to work
The difference of skill condition, PS-PVD can deposit the layer structure coating to form class air plasma spraying (APS), electron-like beam-
Column structure coating and layer/column composite construction coating of physical vapour deposition (PVD) (EB-PVD).In above structure coating, with
The column structure coating of the class EB-PVD prepared based on vapor deposition is concerned because of it with excellent thermal shock resistance.
How to realize that the high-efficiency evaporating of dusty material is the hot spot of current PS-PVD research.PS-PVD deposition column is applied
Layer, necessary condition are the higher gas phase material contents in plasma jet, and theoretical research shows high power plasma
Heat flow density in rifle can achieve 108W/m2, the material granule that about 3.5 μm of particle size can be completely melt, reduce particle benefit
It is evaporated in material.Plasma gas and the raw material powder of melting, evaporation leave nozzle together, in the chamber for being significantly lower than nozzle exit pressure
Plasma jet is formed under chamber pressure, researches show that the dusty materials of the high-temperature fusion in PS-PVD jet stream still can steam
Hair.In order to improve evaporation effect of the coating material in PS-PVD, Sulzer Metco company specially devises Metco 6700
Dusty material, as shown in Figure 1.6700 powder of Metco is the ruler as made of the primary 7YSZ particle agglomeration having a size of 70-130nm
Very little is 5-22 μm of aggregate powder of AI/Yt.6700 power applications of Metco are in the advantage of PS-PVD, when dusty material enters PS-
After PVD spray gun, the aggregate powder of AI/Yt of micron-scale can resolve into the primary particle of nano-scale, thus preferably evaporation effect
Fruit.However, in fact, obtaining " compacted zone when deposited distance is increased to 1400mm from 450mm under the conditions of same process
The tightly packed column structure-of shape structure-has more granose quasi- column structure-class EB-PVD column structure-surface
Five kinds of different microstructure coatings of quasi-nano column structure that is smooth, having larger gap between column ", and with coating material
The increase of powder feeding amount, gasification result are decreased obviously, and it is few under PS-PVD technique that this illustrates that 6700 powder of Metco only realizes
The effect of powder gradually partial gasification is measured, the high-efficiency evaporating of coating material powder still perplexs the research and application of PS-PVD.
Summary of the invention
The purpose of the present invention is to provide a kind of multilevel structure dusty material for being classified discrete high-efficiency evaporating and its preparation sides
Method, with solve the problems, such as existing dusty material cannot in PS-PVD high-efficiency evaporating；The present invention carries out excellent from mealy structure angle
Change design, to realize high-efficiency evaporating of the coating material powder in PS-PVD.
To achieve the goals above, the present invention adopts the following technical scheme:
It is classified the multilevel structure dusty material of discrete high-efficiency evaporating, the primary structure of multilevel structure dusty material is partial size
The primary particles of 150nm~1 μm, secondary structure are 1~5 μm of agglomerated particle being made of primary particles, and tertiary structure is served as reasons
The dusty material that the granularity of secondary structure composition is 5~50 μm；The partial size > level-one knot of the partial size > secondary structure of tertiary structure
The partial size of structure.
A further improvement of the present invention lies in that multilevel structure dusty material pop step by step when heated, be classified it is discrete.
A further improvement of the present invention lies in that secondary structure is formed by primary particles by high temperature gluing knot；Tertiary structure
It is formed by secondary structure by low temperature gluing knot；The gasification temperature of the low temperature glue is lower than the gasification temperature of high-temp glue.
A further improvement of the present invention lies in that the gasification temperature of high-temp glue is 250~450 DEG C；The gasification temperature of low temperature glue
It is 100~250 DEG C.
A kind of preparation method for the multilevel structure dusty material being classified discrete high-efficiency evaporating, comprising the following steps:
Using the primary particles of 150nm~1 μm as primary structure, using high-temp glue as binder, primary particles are bonded as 1~
5 μm of second level agglomerated particle is secondary structure；
Using low temperature glue as binder, second level agglomerated particle is bonded as to 5~50 μm of three-level agglomerated particle, is three-level knot
Structure obtains the multilevel structure dusty material for being classified discrete high-efficiency evaporating；
Wherein, the gasification temperature of low temperature glue is lower than the gasification temperature of high-temp glue；The partial size > secondary structure of tertiary structure
The partial size of partial size > primary structure.
A further improvement of the present invention lies in that the gasification temperature of high-temp glue is 250~450 DEG C；The gasification temperature of low temperature glue
It is 100~250 DEG C.
A further improvement of the present invention lies in that the primary particles preparation method of partial size 150nm~1 μm be hydrothermal synthesis method,
Liquid-phase precipitation method or combustion synthesis method.
A further improvement of the present invention lies in that primary particles to be bonded as to the preparation side of second level agglomerated particle by high-temp glue
Method is ultra-fine agglomeration granulation method.
A further improvement of the present invention lies in that second level agglomerated particle to be bonded as to the system of three-level agglomerated particle by low temperature glue
Preparation Method is spray granulation or mechanical mixing method.
Relative to existing dusty material, the invention has the following advantages: multilevel structure dusty material is by can be in difference
At a temperature of the binder that evaporates bond step by step, multilevel structure dusty material tertiary structure granularity is 5~50 μm, can be effective
Guarantee the mobility of dusty material, multilevel structure dusty material can pop step by step when heated, it is discrete to be classified, and avoid large scale
Local material caused by material directly heats or small size agglomerated materials all pop simultaneously excessively intensively influences heating, level-one knot
Structure granularity is 150nm~1 μm, can effectively realize the efficient rapid evaporation of material.
Detailed description of the invention
Fig. 1 is the schematic diagram of 6700 powder of Metco；
Fig. 2 is the schematic diagram of preparation method of the present invention；
Fig. 3 (a) is the schematic diagram of the primary particles of the embodiment of the present invention 1；Fig. 3 (b) is the schematic diagram of second level agglomerated particle；
Fig. 3 (c) is tertiary structure agglomerated particle schematic diagram.
Specific embodiment
Embodiment 1
With ZrOCl2·8H2O and YCl3For raw material, the partially stabilized oxidation of hydro-thermal method synthesizing submicron class yttrium oxide is utilized
Zirconium (YSZ) particle, drying simultaneously filter out the primary particles 1 (shown in such as Fig. 3 (a)) that granularity is 150nm~1 μm, utilize gasification temperature
Primary particles are bonded as agglomerated particle using ultra-fine agglomeration granulation method at 270 DEG C for 450 DEG C of high-temp glue by degree, and are filtered out
The agglomerated particle (shown in such as Fig. 3 (b)) that partial size is 1~5 μm, as second level agglomerated particle 2, are 250 DEG C using gasification temperature
Second level agglomerated particle bonding is further bonded at 120 DEG C using spray granulation by low temperature glue, and filtering out partial size is 5~50 μm
Tertiary structure agglomerated particle 3 (such as Fig. 3 (c) shown in).
Embodiment 2
With ZrOCl2·8H2O and YCl3It is partially stabilized using liquid-phase precipitation method synthesizing submicron class yttrium oxide for raw material
The primary particles that granularity is 280nm~920nm are calcined and are filtered out in zirconium oxide (YSZ) particle, drying, are using gasification temperature
Primary particles are bonded as agglomerated particle using ultra-fine agglomeration granulation method at 150 DEG C by 250 DEG C of high-temp glue, and filter out partial size
For 1~5 μm of agglomerated particle, as second level agglomerated particle, the low temperature glue for being 100 DEG C using gasification temperature utilizes machine at 40 DEG C
Second level agglomerated particle bonding is further bonded by tool paddling process, filters out the tertiary structure agglomerated particle that partial size is 10~30 μm.
Embodiment 3
Using zirconium oxide and lanthana as raw material, using combustion synthesis method synthesize zirconic acid lanthanum, filter out granularity be 150nm~
The primary particles of 300nm, the high-temp glue for being 320 DEG C using gasification temperature will be first using ultra-fine agglomeration granulation method at 180 DEG C
Beginning particle is bonded as agglomerated particle, as second level agglomerated particle, and the low temperature glue for being 120 DEG C using gasification temperature is utilized at 55 DEG C
Second level agglomerated particle bonding is further bonded by mechanical mixing method, filters out the tertiary structure agglomerated particle that partial size is 5~25 μm.
Embodiment 4
With ZrOCl2·8H2O and La (NO3)3·6H2O is raw material, utilizes liquid-phase precipitation method synthesizing submicron grade particles zirconic acid
Lanthanum, filtering, drying calcine and filter out the primary particles that granularity is 150nm~280nm, the height for being 280 DEG C using gasification temperature
Primary particles are bonded as agglomerated particle using ultra-fine agglomeration granulation method at 160 DEG C by warm glue, and filtering out partial size is 1~5 μm
Agglomerated particle, as second level agglomerated particle, the low temperature glue for being 150 DEG C using gasification temperature utilizes spray granulation at 90 DEG C
Second level agglomerated particle bonding is further bonded, the tertiary structure agglomerated particle that partial size is 10~45 μm is filtered out.
Claims (9)
1. being classified the multilevel structure dusty material of discrete high-efficiency evaporating, which is characterized in that the level-one knot of multilevel structure dusty material
Structure is the primary particles of partial size 150nm~1 μm, and secondary structure is 1~5 μm of agglomerated particle being made of primary particles, three-level
Structure is the dusty material for being 5~50 μm by the granularity that secondary structure forms；The partial size of the partial size > secondary structure of tertiary structure
The partial size of > primary structure.
2. the multilevel structure dusty material of the discrete high-efficiency evaporating of classification according to claim 1, which is characterized in that multistage knot
Structure dusty material pops step by step when heated, it is discrete to be classified.
3. the multilevel structure dusty material of the discrete high-efficiency evaporating of classification according to claim 1, it is characterised in that: second level knot
Structure is formed by primary particles by high temperature gluing knot；Tertiary structure is formed by secondary structure by low temperature gluing knot；The low temperature
The gasification temperature of glue is lower than the gasification temperature of high-temp glue.
4. the multilevel structure dusty material of the discrete high-efficiency evaporating of classification according to claim 3, it is characterised in that: high-temp glue
Gasification temperature be 250~450 DEG C；The gasification temperature of low temperature glue is 100~250 DEG C.
5. a kind of preparation method for the multilevel structure dusty material for being classified discrete high-efficiency evaporating, which is characterized in that including following step
It is rapid:
Using the primary particles of 150nm~1 μm as primary structure, using high-temp glue as binder, primary particles are bonded as 1~5 μm
Second level agglomerated particle, be secondary structure；
Using low temperature glue as binder, second level agglomerated particle is bonded as to 5~50 μm of three-level agglomerated particle, is tertiary structure, obtains
The multilevel structure dusty material of discrete high-efficiency evaporating must be classified；
Wherein, the gasification temperature of low temperature glue is lower than the gasification temperature of high-temp glue；The partial size of the partial size > secondary structure of tertiary structure
The partial size of > primary structure.
6. a kind of preparation method of multilevel structure dusty material for being classified discrete high-efficiency evaporating according to claim 5,
Be characterized in that: the gasification temperature of high-temp glue is 250~450 DEG C；The gasification temperature of low temperature glue is 100~250 DEG C.
7. a kind of preparation method of multilevel structure dusty material for being classified discrete high-efficiency evaporating according to claim 5,
Be characterized in that: the primary particles preparation method of partial size 150nm~1 μm is hydrothermal synthesis method, liquid-phase precipitation method or combustion synthesis method.
8. a kind of preparation method for the multilevel structure dusty material for being classified discrete high-efficiency evaporating according to claim 5, special
Sign is: primary particles are bonded as the preparation method of second level agglomerated particle by high-temp glue as ultra-fine agglomeration granulation method.
9. a kind of preparation method for the multilevel structure dusty material for being classified discrete high-efficiency evaporating according to claim 5, special
Sign is: second level agglomerated particle is bonded as the preparation method of three-level agglomerated particle by low temperature glue as spray granulation or machinery
Paddling process.
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| US6099976A (en) * | 1995-06-07 | 2000-08-08 | Lemelson; Jerome H. | Synthetic diamond overlays for gas turbine engine parts having thermal barrier coatings |
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2018
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| US6099976A (en) * | 1995-06-07 | 2000-08-08 | Lemelson; Jerome H. | Synthetic diamond overlays for gas turbine engine parts having thermal barrier coatings |
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