CN109166831A - A kind of heat dissipation patch for microelectronics - Google Patents
A kind of heat dissipation patch for microelectronics Download PDFInfo
- Publication number
- CN109166831A CN109166831A CN201810992628.2A CN201810992628A CN109166831A CN 109166831 A CN109166831 A CN 109166831A CN 201810992628 A CN201810992628 A CN 201810992628A CN 109166831 A CN109166831 A CN 109166831A
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- CN
- China
- Prior art keywords
- heat dissipation
- microelectronics
- radiating module
- layer
- substrate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
- H01L23/367—Cooling facilitated by shape of device
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
- H01L23/373—Cooling facilitated by selection of materials for the device or materials for thermal expansion adaptation, e.g. carbon
- H01L23/3735—Laminates or multilayers, e.g. direct bond copper ceramic substrates
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/46—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids
- H01L23/467—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids by flowing gases, e.g. air
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/46—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids
- H01L23/473—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids by flowing liquids
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- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Chemical & Material Sciences (AREA)
- Materials Engineering (AREA)
- Ceramic Engineering (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Abstract
The invention discloses a kind of heat dissipation patches for microelectronics, including device noumenon, radiating module is provided at the top of device noumenon, radiating module includes the copper core positioned at the metal block at top and positioned at bottom, one layer of aluminium foil layer is enclosed in the outside of copper core, the medium position of device noumenon is provided with substrate, the bottom of copper core is connected with substrate, furthermore the bottom of device noumenon is provided with pedestal, pedestal is made of multiple independent units, and adhesive-layer and hard protrusion are both provided on each unit, this kind is used for the heat dissipation patch of microelectronics, top is provided with radiating module, and bottom is provided with multiple pedestals, pedestal is directly bonded in the surface of component by adhesive-layer, and since the bottom of pedestal is provided with hard protrusion, there are certain gaps for the component and device noumenon made, it is filled using external wind-cooling heat dissipating Set the purpose that can achieve rapid cooling.
Description
Technical field
The present invention relates to microelectronic device technical field, specially a kind of heat dissipation patch for microelectronics.
Background technique
Microelectric technique be with integrated circuit, especially Large Scale integrated circuit and grow up one it is new
Technology.Its theoretical basis developed is at the end of the 19th century to the modern physics set up during the 1930s.Microelectronics
Technology includes that system circuit design, device physics, technology, material preparation, automatically test and encapsulation, assembling etc. are a series of
Special technology, microelectric technique are the summations of every technology in microelectronics.Microelectric technique is high-tech and letter
The core technology of breath industry.Microelectronic industry is infrastructural industries, why develops so fast, in addition to technology itself is to state
It is also related with its extremely strong permeability except the tremendous contribution of people's economy.In addition, modern war will be with integrated circuit for key
Technology, the high-tech war with the characteristics of electronic warfare and information war.The wherein big crucial exactly heat dissipation of microelectronics technology one is asked
It inscribes, has gathered a large amount of component, the service life reduction for the component that high temperature can make, equipment fluctuation of service in too small space.
So how to design a kind of heat dissipation patch for microelectronics, becoming us will currently be solved the problems, such as.
Summary of the invention
The purpose of the present invention is to provide a kind of heat dissipation patches for microelectronics, to solve to propose in above-mentioned background technique
The big key of wherein microelectronics technology one be exactly heat dissipation problem, a large amount of component, high temperature have been gathered in too small space
The problem of service life reduction for the component that can make, equipment fluctuation of service.
To achieve the above object, the invention provides the following technical scheme: a kind of heat dissipation patch for microelectronics, including dress
Set ontology, be provided with radiating module at the top of described device ontology, the radiating module include positioned at top metal block and
Copper core positioned at bottom is enclosed with one layer of aluminium foil layer in the outside of the copper core, and the medium position of described device ontology is provided with
Substrate, the bottom of the copper core are connected with the substrate, and the bottom of described device ontology is furthermore provided with pedestal, the bottom
Seat is made of multiple independent units, and adhesive-layer and hard protrusion are both provided on each unit.
Further, the hard protrusion is in semi-cylindrical, hard protrusion with a thickness of 2mm, the adhesive-layer covers
It covers on hard protrusion.
Further, the substrate is made using brass material, while being a seal cavity in the inside of substrate,
It is internal filled with coolant liquid.
Further, the radiating module is equidistantly arranged in the top of substrate, while being arranged between the radiating module
Fluted, the depth of the groove is 1.5mm.
Compared with prior art, the beneficial effects of the present invention are: this kind is used for the heat dissipation patch of microelectronics, it is arranged at top
There is a radiating module, and bottom is provided with multiple pedestals, pedestal is directly bonded in the surface of component by adhesive-layer, and due to
The bottom of pedestal is provided with hard protrusion, the component made and device noumenon there are certain gap, and air-cooled using outside dissipates
Thermal can achieve the purpose of rapid cooling；In addition to this, the radiating module at the top of device noumenon, increases heat dissipation
Surface area, is more conducive to distributing for temperature, and the aluminium foil layer wrapped up outside copper core, can reduce the oxidation of copper core surface；No
Only in this way, being a seal cavity inside used substrate, it is filled with coolant liquid inside it, coolant liquid circulates, more
Be conducive to distributing for temperature.
Detailed description of the invention
Fig. 1 is overall structure diagram of the invention；
Fig. 2 is cross-sectional view of the invention；
Fig. 3 is bottom substance schematic diagram of the invention；
In figure: 1- groove；2- radiating module；3- device noumenon；4- substrate；5- copper core；6- metal block；7- aluminium foil layer；8-
Pedestal；9- adhesive-layer；10- hard protrusion.
Specific embodiment
Following will be combined with the drawings in the embodiments of the present invention, and technical solution in the embodiment of the present invention carries out clear, complete
Site preparation description, it is clear that described embodiments are only a part of the embodiments of the present invention, instead of all the embodiments.It is based on
Embodiment in the present invention, it is obtained by those of ordinary skill in the art without making creative efforts every other
Embodiment shall fall within the protection scope of the present invention.
In the description of the present invention, it should be noted that term " on ", "lower", "inner", "outside" " end ", " front end ",
The orientation or positional relationship of the instructions such as " rear end ", " both ends ", " one end ", " other end " is orientation based on the figure or position
Relationship is merely for convenience of description of the present invention and simplification of the description, rather than the device or element of indication or suggestion meaning must have
There is specific orientation, be constructed and operated in a specific orientation, therefore is not considered as limiting the invention.In addition, term " the
One ", " second " is used for descriptive purposes only and cannot be understood as indicating or suggesting relative importance.
In the description of the present invention, it should be noted that unless otherwise clearly defined and limited, term " installation " " is set
Set/offer ", " connection ", etc., shall be understood in a broad sense, such as " connection ", may be a fixed connection, be also possible to detachably connect
It connects, or is integrally connected；It can be mechanical connection, be also possible to be electrically connected；It can be directly connected, intermediate matchmaker can also be passed through
Jie is indirectly connected, and can be the connection inside two elements.It for the ordinary skill in the art, can be with concrete condition
Understand the concrete meaning of above-mentioned term in the present invention.
Fig. 1-3 is please referred to, the present invention provides a kind of technical solution: a kind of heat dissipation patch for microelectronics, including device
Ontology 3, the top of described device ontology 3 are provided with radiating module 2, the radiating module 2 include positioned at top metal block 6 with
And the copper core 5 positioned at bottom, one layer of aluminium foil layer 7, the medium position of described device ontology 3 are enclosed in the outside of the copper core 5
It is provided with substrate 4, the bottom of the copper core 5 is connected with the substrate 4, and connection is more close, be conducive to the transmitting of temperature, this
The bottom of external described device ontology 3 is provided with pedestal 8, and the pedestal 8 is made of multiple independent units, and each unit is mutually not
Interference, under the premise of not influencing bonding quality, increases whole heat dissipation area, heat dissipation effect is more preferable, and each unit
On be both provided with adhesive-layer 9 and hard protrusion 10.Basic structure of the invention is constituted above.
Further, hard protrusion 10 is in semi-cylindrical, the hard protrusion 10 with a thickness of 2mm, it is described viscous
Glue-line 9 is covered on hard protrusion 10.
In the present embodiment, hard protrusion 10 can will form the gap of a 2mm between adhesive-layer 9 and component, when
External air-cooled radiating device is in use, air-flow can take away heat by gap.
Further, the substrate 4 is made using brass material, while being a seal chamber in the inside of substrate 4
Body is filled with coolant liquid inside it.The radiating module 2 is equidistantly arranged in the top of substrate 4, while the radiating module
Fluted 1 is arranged between 2, the depth of the groove 1 is 1.5mm.
In the present embodiment, coolant liquid can be circulated in the inside of substrate 4, thus generation when taking away component work
Heat, and the groove 1 between radiating module 2 increases the contact area of radiating module 2 Yu air, effectively raises scattered
Thermal effect.
Working principle: firstly, this kind is used for the heat dissipation patch of microelectronics, being provided with radiating module 2 at top, and in bottom
Multiple pedestals 8 are provided with, pedestal 8 is directly bonded in the surface of component by adhesive-layer 9, and since the bottom of pedestal 8 is arranged
There is hard protrusion 10, there are certain gaps for the component made and device noumenon 3, can reach using external air-cooled radiating device
To the purpose of rapid cooling；In addition to this, positioned at the radiating module 2 at 3 top of device noumenon, the surface area of heat dissipation is increased, more
Added with the aluminium foil layer 7 for distributing, and wrapping up outside copper core 5 for being conducive to temperature, the oxidation on 5 surface of copper core can be reduced；Moreover,
It is a seal cavity inside used substrate 4, is filled with coolant liquid inside it, coolant liquid is circulated, is more conducive to
Temperature distributes.
It although an embodiment of the present invention has been shown and described, for the ordinary skill in the art, can be with
A variety of variations, modification, replacement can be carried out to these embodiments without departing from the principles and spirit of the present invention by understanding
And modification, the scope of the present invention is defined by the appended.
Claims (4)
1. a kind of heat dissipation patch for microelectronics, including device noumenon (3), it is characterised in that: the top of described device ontology (3)
Portion is provided with radiating module (2), and the radiating module (2) includes the metal block (6) positioned at top and the copper core positioned at bottom
(5), it is enclosed with one layer of aluminium foil layer (7) in the outside of the copper core (5), the medium position of described device ontology (3) is provided with base
The bottom of plate (4), the copper core (5) is connected with the substrate (4), is furthermore provided in the bottom of described device ontology (3)
Pedestal (8), the pedestal (8) are made of multiple independent units, and adhesive-layer (9) and hard is both provided on each unit
Matter protrusion (10).
2. a kind of heat dissipation patch for microelectronics according to claim 1, it is characterised in that: the hard is raised (10)
In semi-cylindrical, the hard raised (10) with a thickness of 2mm, the adhesive-layer (9) is covered on hard raised (10).
3. a kind of heat dissipation patch for microelectronics according to claim 1, it is characterised in that: the substrate (4) uses
Brass material is made, while being a seal cavity in the inside of substrate (4), is filled with coolant liquid inside it.
4. a kind of heat dissipation patch for microelectronics according to claim 1, it is characterised in that: the radiating module (2)
It equidistantly is arranged in the top of substrate (4), while fluted (1) is set between the radiating module (2), the groove (1)
Depth is 1.5mm.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810992628.2A CN109166831A (en) | 2018-08-29 | 2018-08-29 | A kind of heat dissipation patch for microelectronics |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810992628.2A CN109166831A (en) | 2018-08-29 | 2018-08-29 | A kind of heat dissipation patch for microelectronics |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN109166831A true CN109166831A (en) | 2019-01-08 |
Family
ID=64893327
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201810992628.2A Withdrawn CN109166831A (en) | 2018-08-29 | 2018-08-29 | A kind of heat dissipation patch for microelectronics |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN109166831A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112151480A (en) * | 2019-06-28 | 2020-12-29 | 比亚迪股份有限公司 | Copper heat dissipation bottom plate, preparation method thereof and IGBT module |
Citations (8)
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|---|---|---|---|---|
| CN1992243A (en) * | 2005-12-30 | 2007-07-04 | 财团法人工业技术研究院 | Substrate for direct-underground type surface source module and heat exchanger having the substrate |
| CN101312226A (en) * | 2007-05-24 | 2008-11-26 | 钜亨电子材料元件有限公司 | Luminous diode base structure possessing horizontal heat diffusion member |
| CN101331818A (en) * | 2006-04-24 | 2008-12-24 | 住友电气工业株式会社 | Heat transfer member, protruding structural member, electronic device, and electric product |
| CN101408299A (en) * | 2007-10-10 | 2009-04-15 | 富准精密工业(深圳)有限公司 | LED light fitting with heat radiating device |
| CN101660734A (en) * | 2008-08-26 | 2010-03-03 | 康舒科技股份有限公司 | Lamp source heat-dissipating module for street lamp and heat sink thereof |
| CN201533233U (en) * | 2009-10-23 | 2010-07-21 | 广东昭信光电科技有限公司 | Power supply module |
| CN201536103U (en) * | 2009-09-24 | 2010-07-28 | 佛山市顺德区顺达电脑厂有限公司 | Cylindrical welding column packaging structure for members |
| CN202058720U (en) * | 2011-05-11 | 2011-11-30 | 东藤科技股份有限公司 | Improved structure for heat radiation plate |
-
2018
- 2018-08-29 CN CN201810992628.2A patent/CN109166831A/en not_active Withdrawn
Patent Citations (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1992243A (en) * | 2005-12-30 | 2007-07-04 | 财团法人工业技术研究院 | Substrate for direct-underground type surface source module and heat exchanger having the substrate |
| CN101331818A (en) * | 2006-04-24 | 2008-12-24 | 住友电气工业株式会社 | Heat transfer member, protruding structural member, electronic device, and electric product |
| CN101312226A (en) * | 2007-05-24 | 2008-11-26 | 钜亨电子材料元件有限公司 | Luminous diode base structure possessing horizontal heat diffusion member |
| CN101408299A (en) * | 2007-10-10 | 2009-04-15 | 富准精密工业(深圳)有限公司 | LED light fitting with heat radiating device |
| CN101660734A (en) * | 2008-08-26 | 2010-03-03 | 康舒科技股份有限公司 | Lamp source heat-dissipating module for street lamp and heat sink thereof |
| CN201536103U (en) * | 2009-09-24 | 2010-07-28 | 佛山市顺德区顺达电脑厂有限公司 | Cylindrical welding column packaging structure for members |
| CN201533233U (en) * | 2009-10-23 | 2010-07-21 | 广东昭信光电科技有限公司 | Power supply module |
| CN202058720U (en) * | 2011-05-11 | 2011-11-30 | 东藤科技股份有限公司 | Improved structure for heat radiation plate |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112151480A (en) * | 2019-06-28 | 2020-12-29 | 比亚迪股份有限公司 | Copper heat dissipation bottom plate, preparation method thereof and IGBT module |
| CN112151480B (en) * | 2019-06-28 | 2023-04-07 | 比亚迪股份有限公司 | Copper heat dissipation bottom plate, preparation method thereof and IGBT module |
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| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| WW01 | Invention patent application withdrawn after publication | ||
| WW01 | Invention patent application withdrawn after publication |
Application publication date: 20190108 |