CN109166668B - Method for manufacturing conductive film - Google Patents
Method for manufacturing conductive film Download PDFInfo
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- CN109166668B CN109166668B CN201810936417.7A CN201810936417A CN109166668B CN 109166668 B CN109166668 B CN 109166668B CN 201810936417 A CN201810936417 A CN 201810936417A CN 109166668 B CN109166668 B CN 109166668B
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B13/00—Apparatus or processes specially adapted for manufacturing conductors or cables
- H01B13/0026—Apparatus for manufacturing conducting or semi-conducting layers, e.g. deposition of metal
Abstract
The present invention relates to a method for manufacturing a conductive film. The manufacturing method comprises the following steps: the method comprises the steps of unreeling PET, enabling nano silver wire slurry to enter through a slit type coating head and covering a slit type coating surface; curing in an oven, and rolling the prepared nano silver wire coating semi-finished film; thirdly, the nano silver wire coating semi-finished film is unreeled again, and the polymer protective layer liquid enters through the micro-concave coating head and covers the micro-concave coating surface; fourthly, ultraviolet curing is conducted, and the manufactured semi-finished protective layer film is rolled; fifthly, re-unreeling the protective layer semi-finished film, and allowing the hardening liquid to enter through the micro-concave coating head and cover the micro-concave coating surface; sixthly, ultraviolet curing and rolling a final product, namely the nano silver wire conductive film.
Description
Technical Field
The present invention relates to a method for manufacturing a conductive film, and more particularly, to a method for manufacturing a conductive film of silver nanowires.
Background
The liquid crystal writing pad commonly used in the market at present utilizes a structure of a double-layer conductive film and a middle clamp liquid crystal, and the conductive film generally consists of a base layer (PET) and an ITO conductive layer. This method causes the liquid crystal layer of the intermediate jig to come into contact with the ITO conductive layer, which affects the conductivity of the conductive layer; in addition, the conductive layer is in contact with the liquid crystal layer, and does not play a role in reducing the fluidity of the liquid crystal layer. When the liquid crystal has too high fluidity, the liquid crystal can droop or decline due to the action of gravity and fluidity when the large-size handwriting board is hung vertically, and the display effect is influenced.
Disclosure of Invention
The invention aims to provide a conducting layer in a conducting film, which is not in direct contact with a liquid crystal layer, so that the influence of the liquid crystal layer on the conductivity of the conducting layer is avoided; the cured layer is in contact with the liquid crystal layer, so that the cured layer functions as a method for manufacturing a conductive film that reduces the fluidity of liquid crystal. The present invention also provides a method for manufacturing a conductive film, which can improve the adhesion of liquid crystal and reduce the fluidity of liquid crystal, and can protect the conductive layer when applied to liquid crystal writing pads of different sizes.
The technical solution of the present invention is a method for manufacturing a conductive film, comprising the steps of:
the method comprises the steps of unreeling PET, enabling nano silver wire slurry to enter through a slit type coating head and covering a slit type coating surface;
curing in an oven, and rolling the prepared nano silver wire coating semi-finished film;
thirdly, the nano silver wire coating semi-finished film is unreeled again, and the polymer protective layer liquid enters through the micro-concave coating head and covers the micro-concave coating surface;
fourthly, ultraviolet curing is conducted, and the manufactured semi-finished protective layer film is rolled;
fifthly, re-unreeling the protective layer semi-finished film, and allowing the hardening liquid to enter through the micro-concave coating head and cover the micro-concave coating surface;
sixthly, ultraviolet curing and rolling a final product, namely the nano silver wire conductive film.
Preferably, the method comprises the following steps: the process includes:
(1.1) PET is black or transparent;
(1.2) the coating thickness of the nano silver wire slurry is 0.1-2 um, and the coating speed is 5-50 m/min.
Preferably, the method comprises the following steps: the process further comprises:
(2.1) curing temperature: 60-120 ℃; air volume of each drying oven: 1000m3/3H～3000m3/3H。
Preferably, the method comprises the following steps: the process step three further includes:
(3.1) the polymer protective layer is one or more selected from polysiloxane polymer, acrylic polymer and urethane polymer, and has one or more layers.
Preferably, the method comprises the following steps: the process step fifthly further comprises:
(5.1) coating one or more hardened layers on the surface of the protective layer.
Preferably, the method comprises the following steps: the process step fifthly further comprises:
(5.2) coating two hardened layers on the surface of the protective layer, wherein the hardened coating thickness of the first layer is 0.1-5 um, and the hardened coating thickness of the second layer is 0.5-10 um.
Compared with the prior art, the invention has the beneficial effects that:
the conductive film can improve the adhesive force of liquid crystal, reduce the liquidity of the liquid crystal, and can protect the conductive layer when applied to liquid crystal writing boards with different sizes.
The conductive layer is not in direct contact with the liquid crystal layer, so that the influence of the liquid crystal layer on the conductivity of the conductive layer is avoided.
The cured layer of the present invention is in contact with the liquid crystal layer, so that the cured layer functions to reduce the fluidity of the liquid crystal.
Drawings
FIG. 1 is a schematic view of the first and second steps of the manufacturing method of the present invention;
FIG. 2 is a schematic view of the processes from the third step to the sixth step of the manufacturing method of the present invention.
Detailed Description
The invention will be further described in detail with reference to the following figures and examples:
the conductive film is a composite layer structure formed by coating, nano silver wires covered on the coating surface, a high polymer protective layer and a hardening layer.
The polymer protective layer comprises one or more selected from polysiloxane polymers, acrylic polymers and urethane polymers, and has one or more layers.
The method for manufacturing the conductive film comprises the following steps:
referring to fig. 1, a PET film is unwound, and nano silver wire slurry enters and covers a slit type coating surface through a slit type coating head; wherein, the coating thickness of the nano silver wire slurry is 0.8um, the resistance value can be adjusted according to the coating thickness, and the coating speed is 20 m/min;
curing in an oven, and rolling the prepared nano silver wire coating semi-finished film; wherein, the curing temperature is: 80 ℃; air volume of each drying oven: 2000m3/3H；
Referring to fig. 2, a nano silver wire coating semi-finished film is unreeled again, and a polymer protective layer liquid enters through a micro-concave coating head and covers a micro-concave coating surface;
fourthly, UV curing is conducted, and the manufactured semi-finished protective layer film is rolled;
fifthly, re-unreeling the protective layer semi-finished film, and allowing the hardening liquid to enter through the micro-concave coating head and cover the micro-concave coating surface; wherein, two hardened layers are respectively coated on the surface of the nano silver wire layer, the first hardened coating thickness is 0.5um, the second hardened coating thickness is 2um, and the hardness 1H adopts Japanese JIS5400 standard;
sixthly, performing UV curing, namely drying in a baking oven at a normal temperatureAir volume: 800m3And rolling the final product, namely the nano silver wire conductive film.
The above-mentioned embodiments are only preferred embodiments of the present invention, and all equivalent changes and modifications made within the scope of the claims of the present invention should be covered by the claims of the present invention.
Claims (14)
1. A method for manufacturing a conductive film, comprising:
(1) unreeling PET, enabling nano silver wire slurry to enter through a slit type coating head and covering a slit type coating surface, wherein the coating thickness of the nano silver wire slurry is 0.5-1 um, and the coating speed is 5-50 m/min;
(2) curing in an oven, and rolling the prepared nano silver wire coating semi-finished film;
(3) unreeling the nano silver wire coating semi-finished film again, and allowing a macromolecule protective layer liquid to enter through a micro-concave coating head and cover a micro-concave coating surface, wherein the macromolecule protective layer is one or more of polysiloxane polymers, acrylic polymers and urethane polymers;
(4) ultraviolet curing, and rolling the prepared semi-finished protective layer film;
(5) unreeling the protective layer semi-finished product film again, and allowing hardening liquid to enter through the micro-concave coating head and cover the micro-concave coating surface;
(6) ultraviolet curing, and rolling the final product, namely the nano silver wire conductive film.
2. The method for manufacturing the conductive film according to claim 1, wherein the process step further includes:
(1.1) PET is black or transparent.
3. The method for manufacturing the conductive film according to claim 1, wherein the steps further include:
(2.1) curing temperature: 60-120 ℃; air volume of each drying oven: 1000m3/3H～3000m3/3H。
4. The method for manufacturing the conductive film according to claim 3, wherein the step iii further includes:
(3.1) the structure of the polymer protective layer is one or more layers.
5. The method for manufacturing the conductive film according to claim 1, wherein the step of fifthly further comprises:
(5.1) coating one or more hardened layers on the surface of the protective layer.
6. The method for manufacturing the conductive film according to claim 1, wherein the step of fifthly further comprises:
(5.2) coating two hardened layers on the surface of the protective layer, wherein the hardened coating thickness of the first layer is 0.1-5 um, and the hardened coating thickness of the second layer is 0.5-10 um.
7. A method for manufacturing a conductive film, comprising:
(1) unreeling PET, enabling nano silver wire slurry to enter through a slit type coating head and covering a slit type coating surface, wherein the coating thickness of the nano silver wire slurry is 0.5-1 um, and the coating speed is 5-50 m/min;
(2) curing in an oven, and rolling the prepared nano silver wire coating semi-finished film;
(3) unreeling the nano silver wire coating semi-finished film again, and allowing a macromolecule protective layer liquid to enter through a micro-concave coating head and cover a micro-concave coating surface, wherein the macromolecule protective layer is one or more of polysiloxane polymers, acrylic polymers and urethane polymers;
(4) ultraviolet curing, and rolling the prepared semi-finished protective layer film;
(5) unreeling the protective layer semi-finished product film again, and allowing hardening liquid to enter through the micro-concave coating head and cover the micro-concave coating surface to form a first hardening layer;
(6) ultraviolet curing, namely rolling the prepared nano silver wire semi-finished conductive film;
(7) unreeling the protective layer semi-finished product film again, and allowing hardening liquid to enter through the micro-concave coating head and cover the micro-concave coating surface to form a second hardening layer;
(8) ultraviolet curing, and rolling the final product, namely the nano silver wire conductive film.
8. The method for manufacturing a conductive film according to claim 7, wherein the process step further includes:
(1.1) PET is black or transparent.
9. The method for manufacturing the conductive film according to claim 7, wherein the steps further include:
(2.1) curing temperature: 60-120 ℃; air volume of each drying oven: 1000m3/3H～3000m3/3H。
10. The method for manufacturing a conductive film according to claim 7, wherein the step iii further includes:
(3.1) the structure of the polymer protective layer is one or more layers.
11. The method for manufacturing the conductive film according to claim 7, wherein the step of fifthly further comprises:
(5.1) the first hardening layer coating thickness of polymer protective layer surface coating is 0.1 ~ 5 um.
12. The method for manufacturing a conductive film according to claim 7, wherein the step (7) further comprises:
(7.1) the coating thickness of the second hardening layer coated on the surface of the first hardening layer is 0.5-10 um.
13. The nanosilver conductive film coating production line according to the conductive film manufacturing method of claim 7, comprising a PET unwinding device, a slit coating head, a drying channel, a winding device, a semi-finished film unwinding device, a micro-concave coating head (polymer protective layer), a UV oven, a semi-finished winding device, a semi-finished film unwinding device, a micro-concave coating head (first hardened layer), a UV oven, a semi-finished winding device, a semi-finished film unwinding device, a micro-concave coating head (second hardened layer), a UV oven, and a finished product winding device in order of production.
14. The conductive film prepared by the conductive film manufacturing method according to claim 7, which comprises a PET substrate layer, a nano silver layer, and a composite structure of a polymer protective layer, a first hardened layer and a second hardened layer.
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| CN201810936417.7A CN109166668B (en) | 2018-08-16 | 2018-08-16 | Method for manufacturing conductive film |
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| CN201810936417.7A CN109166668B (en) | 2018-08-16 | 2018-08-16 | Method for manufacturing conductive film |
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Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
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| CN104008819A (en) * | 2014-05-27 | 2014-08-27 | 东莞市鑫聚光电科技有限公司 | Production method of nanometer silver wire transparent conducting film |
| US20170113443A1 (en) * | 2015-10-27 | 2017-04-27 | Samsung Electronics Co., Ltd. | Conductive films and electronic devices including the same |
| CN107984776A (en) * | 2017-11-30 | 2018-05-04 | 清华大学深圳研究生院 | A kind of functional film and preparation method thereof |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| CN104064282B (en) * | 2014-04-30 | 2017-10-31 | 天津宝兴威科技股份有限公司 | A kind of manufacture method of high transmittance hard nanometer metallic transparent conducting film |
| JP6491759B2 (en) * | 2015-11-12 | 2019-03-27 | 富士フイルム株式会社 | Liquid crystal cell and three-dimensional liquid crystal cell |
| CN106847411B (en) * | 2015-12-07 | 2019-01-18 | 宁波惠之星新材料科技有限公司 | A kind of coating system and the method for preparing nano-silver thread conductive film using the coating system |
| CN205942637U (en) * | 2016-06-14 | 2017-02-08 | 天津宝兴威科技有限公司 | Flexible electron touch -sensitive screen of combined type |
| CN108250469B (en) * | 2016-12-29 | 2021-04-30 | 乐凯华光印刷科技有限公司 | Production process of nano silver wire transparent conductive film |
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Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104008819A (en) * | 2014-05-27 | 2014-08-27 | 东莞市鑫聚光电科技有限公司 | Production method of nanometer silver wire transparent conducting film |
| US20170113443A1 (en) * | 2015-10-27 | 2017-04-27 | Samsung Electronics Co., Ltd. | Conductive films and electronic devices including the same |
| CN107984776A (en) * | 2017-11-30 | 2018-05-04 | 清华大学深圳研究生院 | A kind of functional film and preparation method thereof |
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Address after: 518000 5th floor, building 3, No.5 Tianyuan Road, shutianpu community, Gongming street, Guangming New District, Shenzhen City, Guangdong Province Patentee after: Shenzhen liheyunji New Material Co.,Ltd. Address before: 518000 5th floor, building 3, No.5 Tianyuan Road, shutianpu community, Gongming street, Guangming New District, Shenzhen City, Guangdong Province Patentee before: SHENZHEN RECLOUD TECHNOLOGY Co.,Ltd. |
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