CN109148633B - Ultrathin reinforced glass back plate for photovoltaic module, preparation method of ultrathin reinforced glass back plate and photovoltaic module comprising ultrathin reinforced glass back plate - Google Patents
Ultrathin reinforced glass back plate for photovoltaic module, preparation method of ultrathin reinforced glass back plate and photovoltaic module comprising ultrathin reinforced glass back plate Download PDFInfo
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- CN109148633B CN109148633B CN201811241763.XA CN201811241763A CN109148633B CN 109148633 B CN109148633 B CN 109148633B CN 201811241763 A CN201811241763 A CN 201811241763A CN 109148633 B CN109148633 B CN 109148633B
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- 239000011521 glass Substances 0.000 title claims abstract description 219
- 238000002360 preparation method Methods 0.000 title claims abstract description 19
- 238000004519 manufacturing process Methods 0.000 claims abstract description 7
- 229920005989 resin Polymers 0.000 claims description 69
- 239000011347 resin Substances 0.000 claims description 69
- 238000001723 curing Methods 0.000 claims description 59
- 239000003822 epoxy resin Substances 0.000 claims description 44
- 229920000647 polyepoxide Polymers 0.000 claims description 44
- 239000003795 chemical substances by application Substances 0.000 claims description 29
- 239000002253 acid Substances 0.000 claims description 21
- 239000002994 raw material Substances 0.000 claims description 21
- KRHYYFGTRYWZRS-UHFFFAOYSA-N Fluorane Chemical compound F KRHYYFGTRYWZRS-UHFFFAOYSA-N 0.000 claims description 20
- 238000005406 washing Methods 0.000 claims description 20
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims description 18
- 239000007822 coupling agent Substances 0.000 claims description 17
- 238000002791 soaking Methods 0.000 claims description 16
- 150000001282 organosilanes Chemical class 0.000 claims description 14
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 claims description 12
- 238000003698 laser cutting Methods 0.000 claims description 9
- 239000011248 coating agent Substances 0.000 claims description 8
- 238000000576 coating method Methods 0.000 claims description 8
- 238000005553 drilling Methods 0.000 claims description 8
- 239000007788 liquid Substances 0.000 claims description 8
- 238000004140 cleaning Methods 0.000 claims description 7
- 238000004806 packaging method and process Methods 0.000 claims description 7
- 239000011259 mixed solution Substances 0.000 claims description 6
- 239000000203 mixture Substances 0.000 claims description 6
- 238000000034 method Methods 0.000 claims description 5
- 239000005361 soda-lime glass Substances 0.000 claims description 5
- 239000005341 toughened glass Substances 0.000 claims description 5
- 238000007605 air drying Methods 0.000 claims description 4
- 125000002723 alicyclic group Chemical group 0.000 claims description 3
- 239000012153 distilled water Substances 0.000 claims description 3
- 239000001038 titanium pigment Substances 0.000 claims description 3
- 150000008064 anhydrides Chemical group 0.000 claims description 2
- 239000005329 float glass Substances 0.000 claims description 2
- 238000007747 plating Methods 0.000 claims description 2
- 238000002834 transmittance Methods 0.000 abstract description 21
- 238000010248 power generation Methods 0.000 abstract description 9
- 239000000126 substance Substances 0.000 abstract description 7
- 238000005496 tempering Methods 0.000 abstract description 7
- 238000012545 processing Methods 0.000 abstract description 4
- 238000011900 installation process Methods 0.000 abstract description 2
- 238000005452 bending Methods 0.000 description 6
- 230000000052 comparative effect Effects 0.000 description 6
- VEXZGXHMUGYJMC-UHFFFAOYSA-N Hydrochloric acid Chemical compound Cl VEXZGXHMUGYJMC-UHFFFAOYSA-N 0.000 description 4
- HEMHJVSKTPXQMS-UHFFFAOYSA-M Sodium hydroxide Chemical compound [OH-].[Na+] HEMHJVSKTPXQMS-UHFFFAOYSA-M 0.000 description 3
- GWEVSGVZZGPLCZ-UHFFFAOYSA-N Titan oxide Chemical compound O=[Ti]=O GWEVSGVZZGPLCZ-UHFFFAOYSA-N 0.000 description 3
- 230000000712 assembly Effects 0.000 description 3
- 238000000429 assembly Methods 0.000 description 3
- 239000000463 material Substances 0.000 description 3
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 2
- 229910052782 aluminium Inorganic materials 0.000 description 2
- 239000011353 cycloaliphatic epoxy resin Substances 0.000 description 2
- 230000007547 defect Effects 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- VYKXQOYUCMREIS-UHFFFAOYSA-N methylhexahydrophthalic anhydride Chemical compound C1CCCC2C(=O)OC(=O)C21C VYKXQOYUCMREIS-UHFFFAOYSA-N 0.000 description 2
- 238000005554 pickling Methods 0.000 description 2
- 229920000298 Cellophane Polymers 0.000 description 1
- 229920002160 Celluloid Polymers 0.000 description 1
- 239000004593 Epoxy Substances 0.000 description 1
- 239000006087 Silane Coupling Agent Substances 0.000 description 1
- 229910000831 Steel Inorganic materials 0.000 description 1
- 230000009471 action Effects 0.000 description 1
- 239000002313 adhesive film Substances 0.000 description 1
- 239000003513 alkali Substances 0.000 description 1
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 1
- 238000007796 conventional method Methods 0.000 description 1
- 230000007797 corrosion Effects 0.000 description 1
- 238000005260 corrosion Methods 0.000 description 1
- 239000013078 crystal Substances 0.000 description 1
- 230000003670 easy-to-clean Effects 0.000 description 1
- 230000005684 electric field Effects 0.000 description 1
- 230000002708 enhancing effect Effects 0.000 description 1
- 238000003912 environmental pollution Methods 0.000 description 1
- 230000007062 hydrolysis Effects 0.000 description 1
- 238000006460 hydrolysis reaction Methods 0.000 description 1
- 230000006872 improvement Effects 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
- 238000009413 insulation Methods 0.000 description 1
- 238000010030 laminating Methods 0.000 description 1
- 238000000691 measurement method Methods 0.000 description 1
- 229910052760 oxygen Inorganic materials 0.000 description 1
- 239000001301 oxygen Substances 0.000 description 1
- 238000002161 passivation Methods 0.000 description 1
- 230000035699 permeability Effects 0.000 description 1
- 239000004033 plastic Substances 0.000 description 1
- 229920003023 plastic Polymers 0.000 description 1
- 238000013001 point bending Methods 0.000 description 1
- 229920001296 polysiloxane Polymers 0.000 description 1
- KCTAWXVAICEBSD-UHFFFAOYSA-N prop-2-enoyloxy prop-2-eneperoxoate Chemical compound C=CC(=O)OOOC(=O)C=C KCTAWXVAICEBSD-UHFFFAOYSA-N 0.000 description 1
- 230000000630 rising effect Effects 0.000 description 1
- 239000000243 solution Substances 0.000 description 1
- 239000010959 steel Substances 0.000 description 1
- 238000010998 test method Methods 0.000 description 1
- 239000004408 titanium dioxide Substances 0.000 description 1
- 238000005303 weighing Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L31/04—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof adapted as photovoltaic [PV] conversion devices
- H01L31/042—PV modules or arrays of single PV cells
- H01L31/048—Encapsulation of modules
- H01L31/049—Protective back sheets
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L31/04—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof adapted as photovoltaic [PV] conversion devices
- H01L31/054—Optical elements directly associated or integrated with the PV cell, e.g. light-reflecting means or light-concentrating means
- H01L31/0547—Optical elements directly associated or integrated with the PV cell, e.g. light-reflecting means or light-concentrating means comprising light concentrating means of the reflecting type, e.g. parabolic mirrors, concentrators using total internal reflection
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L31/18—Processes or apparatus specially adapted for the manufacture or treatment of these devices or of parts thereof
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
- Y02E10/00—Energy generation through renewable energy sources
- Y02E10/50—Photovoltaic [PV] energy
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
- Y02E10/00—Energy generation through renewable energy sources
- Y02E10/50—Photovoltaic [PV] energy
- Y02E10/52—PV systems with concentrators
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Electromagnetism (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Photovoltaic Devices (AREA)
Abstract
The application discloses an ultrathin reinforced glass back plate for a photovoltaic module, a preparation method thereof and the photovoltaic module comprising the same. The ultrathin reinforced glass backboard has the advantages of light weight, good strength, high light transmittance, good weather resistance and the like, has certain flexibility, and is not easy to damage in the transportation, processing and installation processes; the transparency is high, and the double-sided power generation is suitable; low cost, no need of chemical tempering, convenient mass production and high cost performance.
Description
Technical Field
The application relates to an ultrathin reinforced glass back plate for a photovoltaic module, a preparation method thereof and the photovoltaic module comprising the same, and belongs to the field of photovoltaics.
Background
The photovoltaic double-glass assembly is formed by packaging a battery piece between two pieces of glass. The photovoltaic double-glass assembly has the following advantages: 1) The back plate made of any one of known plastics is gradually degraded under the action of ultraviolet rays, oxygen, moisture and the like, the surface of the back plate is pulverized and cracked, and the weather-resistant problem of the assembly is thoroughly solved by using glass; 2) The light transmittance is high, the power generation amount is high, and the power generation amount is higher than that of a common photovoltaic module by more than 2 percent; 3) The insulation is good, and higher system voltage can be met, so that the system cost of the whole power station is saved; 4) The double-glass assembly has high fireproof grade and good safety; 5) The water resistance is good, and the water permeability of the glass is almost zero, so that the problem that water vapor enters the assembly to induce the hydrolysis of the EVA adhesive film is not required to be considered, and the glass is suitable for photovoltaic power stations in high humidity areas; 6) The double-glass assembly generally does not need an aluminum frame, and the electric field which causes PID (potential induced attenuation) cannot be established due to the lack of the aluminum frame, so that the possibility of PID attenuation is greatly reduced; 7) The battery is prevented from being hidden and cracked, and is easy to clean; therefore, the photovoltaic double-glass assembly has higher and higher market proportion in the field of photovoltaic assemblies, and particularly, with the rising of double-sided power generation assemblies, the demand of the market for the double-glass assembly is larger and larger.
However, one of the prominent disadvantages of the dual-glass assembly is the heavy weight, the main flow structure of the current dual-glass assembly is 2.5mm+2.5mm (the thickness of the panel and the back plate is 2.5 mm), the total thickness of the dual-glass assembly exceeds the thickness of 3.2mm of the conventional assembly, the problems of high installation and transportation cost, incapability of being applied to some roofs due to bearing problems and the like are brought, and the application of the dual-glass assembly is limited. Therefore, glass manufacturers and assembly manufacturers always thin the double-glass assembly as a direction of efforts, and at present, manufacturers apply a structure of 2mm+2mm (the thickness of the front panel and the back panel is 2 mm), but the strength performance and the like of the double-glass assembly are still not ideal, and the double-glass assembly cannot be applied on a large scale.
The traditional glass material and the processing technology are used for bottleneck in thinning, the limitation of the physical tempering thickness of the glass is the main cause, and manufacturers try to use glass with the thickness of about 1mm as backboard glass, and the chemical tempering method is adopted for enhancing the strength of the glass, but the chemical tempering method has high cost, is not easy for mass production, has large-size chemical tempering difficulty, is easy to cause environmental pollution, has easy to fade tempering stress and has poor weather resistance.
Disclosure of Invention
In order to overcome the defects of heavy weight, low processing yield and the like of a photovoltaic double-glass assembly in the prior art, the application provides an ultrathin reinforced glass backboard for a photovoltaic assembly, a preparation method thereof and a photovoltaic assembly comprising the ultrathin reinforced glass backboard.
In order to solve the technical problems, the technical scheme adopted by the application is as follows:
an ultrathin reinforced glass backboard for a photovoltaic module comprises a glass plate, wherein resin layers are adhered to the upper surface and the lower surface of the glass plate.
The applicant finds that, as the microcracks on the surface of the glass plate are firstly passivated by acid washing, then filled by epoxy resin and grown under control, the strength of the ultrathin reinforced glass back plate is greatly improved, meanwhile, the surface of the glass plate is coated with a resin layer, the surface is not easy to be corroded by water vapor and chemical substances, the surface is not easy to be scratched and damaged, the refractive index of the resin layer is similar to that of glass, and the transmittance is high; the resin layer is only used as an adhesion layer, the generating capacity of the double-glass assembly cannot be influenced, and the double-sided power generation structure has outstanding advantages.
The thickness of the ultrathin reinforced glass backboard can be controlled within 1mm, the strength is high, the weight is light, mass production is easy, the cost is low, and the defects of the existing double-glass assembly are effectively overcome. The prior art also reports that transparent non-glass materials are used as back plates, but the non-glass materials have the problems of poor weather resistance, poor water resistance, low transmittance and the like, are not suitable for double-sided power generation, and cannot be compared with double-glass assemblies.
In order to increase the front power of the photovoltaic module, preferably, a grid-shaped white reflecting layer is arranged on the resin layer on the upper surface and/or the resin layer on the lower surface of the glass plate, and the white reflecting layer is opposite to the gap between the packaging battery pieces, namely, the grid bars of the white reflecting layer are opposite to the gap between the packaging battery pieces. As a general knowledge, a plurality of battery pieces are packaged in the photovoltaic module, gaps exist between adjacent battery pieces, and the arrangement of the grid-shaped white reflecting layer enables light entering the gaps between the battery pieces to be reflected to the battery pieces, so that the power of the photovoltaic module is improved. The grid strips of the white reflecting layer are opposite to the gaps between the packaged battery pieces, namely, the light transmitted through the gaps between the battery pieces can be reflected to the battery pieces through the white reflecting layer.
Further preferably, a white reflecting layer in a grid shape is provided on the resin layer on the upper surface of the glass plate. The application has the advantages that the terms of up and down, left and right, top, bottom and the like refer to the relative positions of the back plate in normal use, namely the surface of the upper surface of the glass plate, which is in direct contact with the battery piece, is one surface packaged in the assembly, and the white reflecting layer is arranged on the resin layer on the upper surface of the glass plate, so that the falling of the white reflecting layer can be effectively prevented.
In order to better ensure the front power of the photovoltaic module, the thickness of the white reflecting layer is preferably 10-20 mu m.
In order to ensure strength and cost and improve cost performance, the glass plate is a float glass plate, preferably a soda-lime-silica glass plate, a medium-alumina glass plate or a high-alumina glass plate, and more preferably a medium-alumina glass plate.
To achieve the light weight requirement, the glass sheet has a thickness of not more than 1.5mm, more preferably not more than 1mm.
In order to satisfy both the light weight and strength requirements, the thickness of the glass plate is preferably 0.1 to 1mm, and more preferably 0.33 to 0.7mm.
In order to ensure the transmittance and strength of the back plate, the resin layers on the upper surface and the lower surface of the glass plate are epoxy resin layers. Further preferably, the thickness of the resin layer on both the upper and lower surfaces of the glass plate is 3 to 20. Mu.m. Therefore, the strength requirement can be ensured, the transmittance can be ensured to the greatest extent, the power of the photovoltaic module is improved, and more preferably, the thickness of the resin layers on the upper surface and the lower surface of the glass plate is 5-10 mu m.
A photovoltaic module comprises the ultrathin reinforced glass backboard for the photovoltaic module, a 2-3mm thick ultra-white embossed toughened glass panel and a battery piece group packaged between the ultrathin reinforced glass backboard for the photovoltaic module and the ultra-white embossed toughened glass panel.
The preparation method of the ultrathin reinforced glass backboard for the photovoltaic module comprises the following steps:
1) Sequentially carrying out laser cutting, drilling, acid washing and airing on the glass plate for later use;
2) And (3) coating and plating the resin layer raw material on the upper surface and the lower surface of the glass plate obtained in the step (1) and curing to obtain the ultrathin reinforced glass backboard for the photovoltaic module.
The applicant finds that, because the glass is brittle, if the glass is cut by adopting a conventional method, microcracks are easily generated at the edge of the cut glass, so that the strength of the glass is damaged, and the microcracks can be effectively reduced by adopting laser cutting; the acid washing can passivate microcracks, so that the strength of the glass plate is effectively improved, wherein the hydrofluoric acid with the mass concentration of 7-15% has the best effect; the resin layer can not only effectively fill the passivated microcracks, so that the strength of the glass plate is further improved, but also effectively prevent water vapor, chemical substances and the like from corroding the surface of the glass plate and prevent the surface of the glass plate from being scratched and damaged; the refractive index of the resin layer used in the application is similar to that of glass, the transmittance is high, the resin layer is only used as an adhesion layer, the generating capacity of the double-glass assembly is not affected, and the resin layer has outstanding advantages when used in a double-sided power generation structure.
In order to further improve the strength and the power of the photovoltaic module, the preparation method of the ultrathin reinforced glass backboard for the photovoltaic module further comprises the following steps of 3) coating a white reflecting layer on a resin layer on the upper surface and/or a resin layer on the lower surface of a glass plate, wherein the white reflecting layer is made of a mixture of epoxy resin and titanium pigment;
the raw material components of the resin layer in the step 2) are a mixture of epoxy resin and a curing agent; or the raw material components of the resin layer in the step 2) are a mixture of epoxy resin, an organosilane coupling agent and a curing agent. Preferably, the raw material components of the resin layer in the step 2) are a mixture of epoxy resin, an organosilane coupling agent and a curing agent, so that the strength of the backboard can be improved more obviously.
When the raw material components of the resin layer comprise epoxy resin and a curing agent, the preparation method of the ultrathin reinforced glass backboard for the photovoltaic module comprises the following steps of:
1) Sequentially carrying out laser cutting, drilling, acid washing and air drying on a glass plate for later use, wherein the acid washing is carried out by soaking and cleaning in hydrofluoric acid with the mass concentration of 7% -15% for 1-5 minutes at the temperature of 30-50 ℃, and then soaking and rinsing in pure water for 3-7 minutes;
2) Vertically immersing the glass plate obtained in the step 1) in a mixed solution of epoxy resin and a curing agent, then vertically lifting the glass plate upwards at a speed of 1-3mm/s, curing the glass plate for 4+/-1 h at 10-30 ℃ in sequence after the glass plate completely leaves the liquid level, curing the glass plate for 4+/-1 h at 70-90 ℃ and finally curing the glass plate for 2+/-0.5 h at 150-180 ℃ to obtain the ultrathin reinforced glass backboard for the photovoltaic module;
3) If a grid-shaped white reflecting layer is arranged on the resin layer on the upper surface of the glass plate and/or the resin layer on the lower surface of the glass plate, coating a white reflecting layer on the resin layer on the upper surface of the glass plate and/or the resin layer on the lower surface of the glass plate obtained in the step 2), and curing to obtain the ultrathin reinforced glass backboard for the photovoltaic module;
when the raw material components of the resin layer comprise epoxy resin, an organosilane coupling agent and a curing agent, the preparation method of the ultrathin reinforced glass back plate for the photovoltaic module comprises the following steps:
1) Sequentially carrying out laser cutting, drilling, acid washing and air drying on a glass plate for later use, wherein the acid washing is carried out by soaking and cleaning in hydrofluoric acid with the mass concentration of 7% -15% for 1-5 minutes at the temperature of 30-50 ℃, and then soaking and rinsing in pure water for 3-7 minutes;
2.1 The upper surface and the lower surface of the glass plate obtained in the step 1) are pretreated by using an organosilane coupling agent;
2.2 Soaking the glass plate obtained in the step 2.1) in distilled water for 0.5-1.5h;
2.3 Vertically immersing the glass plate obtained in the step 2.2) in a mixed solution of epoxy resin and a curing agent, then vertically lifting the glass plate upwards at a speed of 1-3mm/s, curing the glass plate for 4+/-1 h at 10-30 ℃ after the glass plate completely leaves the liquid level, curing the glass plate for 4+/-1 h at 70-90 ℃ and finally curing the glass plate for 2+/-0.5 h at 150-180 ℃ to obtain the ultrathin reinforced glass backboard for the photovoltaic module;
3) And if the grid-shaped white reflecting layer is arranged on the resin layer on the upper surface of the glass plate and/or the resin layer on the lower surface of the glass plate, coating the white reflecting layer on the resin layer on the upper surface of the glass plate and/or the resin layer on the lower surface of the glass plate obtained in the step 2.3), and curing to obtain the ultra-thin reinforced glass backboard for the photovoltaic module.
The glass plate is vertically immersed in the mixed liquid of the epoxy resin and the curing agent, namely, the glass plate is vertically connected with the liquid level.
In order to further improve the performances such as weather resistance and strength of the back plate, in the step 2), the raw material components of the resin layer comprise the following components in mass ratio of 1: (0.5-1.2) epoxy resin and curing agent, or the raw material components of the resin layer comprise the following components in mass ratio of 1: (0.5-1.2): (0.01-0.03), a curing agent and an organosilane coupling agent, wherein the curing agent in the raw material components of the resin layer is an anhydride curing agent, the organosilane coupling agent is at least one of KH-550 or KH-560, and the epoxy resin is preferably alicyclic epoxy resin.
In order to better improve the front power of the component, in the step 3), the white reflecting layer is made of epoxy resin and titanium pigment with the mass ratio of 1: (0.8-2) a mixture. Step 3) includes step 3) in both cases.
The applicant finds that the ultra-thin reinforced glass backboard obtained through the above procedures has the advantages that the strength is greatly improved because the micro-cracks on the surface of the glass are passivated by acid washing and then filled with epoxy resin, and the growth is controlled, meanwhile, the surface of the glass is coated with a resin layer, the glass is not easy to scratch or damage, the refractive index of the epoxy resin layer is similar to that of the glass, the transmittance is high, and the ultra-thin reinforced glass backboard is also remarkably advantageous when being used for a double-sided power generation structure.
The technology not mentioned in the present application refers to the prior art.
The ultrathin reinforced glass backboard has the advantages of light weight, high strength, high light transmittance, good weather resistance, strong corrosion resistance and the like, has certain flexibility, and is not easy to damage in the transportation, processing and installation processes; the transparency is high, and the double-sided power generation is suitable; low cost, no need of chemical tempering, convenient mass production and high cost performance.
Drawings
FIG. 1 is a schematic view of the structure of an ultra-thin reinforced glass backsheet for a photovoltaic module in example 1;
FIG. 2 is a schematic structural view of an ultra-thin reinforced glass backsheet for a photovoltaic module in example 4;
FIG. 3 is a top view of FIG. 2;
in the figure, 1 is a glass plate, 2 is an epoxy resin layer, 3 is a white reflecting layer, and 4 is a grid bar.
Detailed Description
For a better understanding of the present application, the following examples are further illustrated, but are not limited to the following examples.
The ultra-thin reinforced glass backboard for the photovoltaic module comprises a glass board, wherein epoxy resin layers are adhered to the upper surface and the lower surface of the glass board, the epoxy resin layer on the upper surface of the glass board is defined as an epoxy resin layer I, the epoxy resin layer on the lower surface of the glass board is defined as an epoxy resin layer II, the glass board is a soda-lime-silica glass board (Luoyang glass), a medium-alumina glass board (south glass group) or a high-alumina glass board (south glass group), and the thickness of the glass board is 0.1-1mm.
In order to improve the front power of the photovoltaic module, a grid-shaped white reflecting layer is arranged on the resin layer on the upper surface of the glass plate, grid strips of the white reflecting layer correspond to gaps between the packaged battery pieces, and the battery pieces are positioned in grids of the white reflecting layer during packaging.
TABLE 1 structural parameters for examples-1-16 and comparative examples 1-3
In the above examples, the raw material components of the resin layer include 1:0.9:0.02 of alicyclic epoxy resin (Japanese cellophane 2021P), curing agent methyl hexahydrophthalic anhydride (Zhejiang alpha chemical engineering Co., ltd.) and organosilane coupling agent KH-550; the white reflecting layer is made of epoxy resin (pure epoxy acrylate 4210, keta) and titanium dioxide (HZA 101 anatase titanium dioxide, fangfang Hengzechemical Co., ltd.) in a mass ratio of 1:1, a preparation method of an ultrathin reinforced glass back plate for a photovoltaic module, which comprises the following steps:
1) Sequentially carrying out laser cutting, drilling, acid washing and airing on a glass plate for later use, wherein the acid washing is carried out by soaking and cleaning in 10% hydrofluoric acid for 3 minutes at the temperature of 40 ℃, soaking and rinsing in pure water for 5 minutes, and airing at room temperature until no water drops are formed on the surface;
2.1 Pre-treating the upper and lower surfaces of the glass plate with an organosilane coupling agent (soaking for 30 minutes with the organosilane coupling agent);
2.2 Immersing the glass plate obtained in the step 2.1) in distilled water for 1h, and removing residues after pretreatment;
2.3 Vertically immersing the glass plate obtained in the step 2.2) in a mixed solution of epoxy resin and a curing agent, then vertically lifting the glass plate upwards at a speed of 1-3mm/s, and curing the glass plate for 4 hours at 20 ℃ after the glass plate completely leaves the liquid level, for 4 hours at 80 ℃ and finally for 2 hours at 180 ℃; the lifting speed determines the thickness of the epoxy resin layer, and in each example, the lifting speed corresponding to the thickness of 3 mu m is 1.1mm/s, and the lifting times are 1 time; the lifting speed corresponding to the thickness of 5 mu m is 1.8mm/s, and the lifting times are 1 time; lifting speed corresponding to the thickness of 10 mu m is 2mm/s, and lifting times are 1 time; lifting speed corresponding to the thickness of 16 mu m is 2.5mm/s, and lifting times are 2 times; the lifting speed corresponding to the thickness of 25 mu m is 2.5mm/s, and the lifting times are 3 times; the lifting times are 2 times or 3 times, namely, the lifting needs to be repeatedly immersed for 2 times or 3 times;
5) If the photovoltaic module comprises a reflecting layer, coating a white reflecting layer on the resin layer on the upper surface of the glass plate, and performing ultraviolet curing to obtain the ultrathin reinforced glass backboard for the photovoltaic module;
table 2 table of the properties of the back sheet obtained in each of the above examples
The test method of each performance in the table above: the weight is measured in a weighing manner; the light transmittance is measured by a light transmittance tester; temperature resistance is measured with reference to national standard GB 157632; the bending strength is measured by a glass four-point bending strength tester; the impact strength measurement method is that 227g steel balls are used for freely falling at the height of 1 m; observing whether the glass has cracks and damages, and if the glass is intact, passing through; the acid and alkali resistance measuring method comprises the steps of respectively soaking a glass plate in a sodium hydroxide solution with the concentration of 1mol/L and hydrochloric acid with the concentration of 1mol/L for 24 hours, and if the attenuation is less than 3%, passing through the glass plate, and specifically referring to GB/T31034-2014; the adhesion refers to the adhesion of the epoxy layer on the glass plate, measured with reference to GB/T9286.
As can be seen from examples 1-3, the strength, transmittance and temperature resistance of the soda-lime-silica glass plate, the middle-alumina glass plate or the high-alumina glass plate can meet the requirements, the strength of the soda-lime-silica glass plate is slightly worse than that of the middle-alumina glass plate or the high-alumina glass plate, and the cost performance of the middle-alumina glass plate is highest;
as can be seen from examples 2 and 9-12, the glass plate has a thickness of 0.33-1mm, and the light transmittance, the temperature resistance, the bending strength, the impact strength and the like can meet the requirements, while the glass plate with a thickness of 0.33-0.7mm has more obvious advantages;
as can be seen from examples 2 and 4-8, the white reflection layer thickness has negligible influence on weight, and the light transmittance, the temperature resistance, the bending strength, the impact strength and the like can meet the requirements;
as can be seen from examples 2 and 13-16, when the thickness of the resin film is greater than 20 μm, the decrease in light transmittance is more remarkable, and in order to achieve the balance of weight, strength and light transmittance, the resin layer thickness is 3-20 μm, and the performance requirements are satisfied, preferably 5-10 μm;
as is apparent from examples 2 and comparative examples 1 to 3, when a glass sheet having a thickness of 0.4 to 2mm is not coated with a resin layer, the bending strength and impact strength of the glass sheet do not reach the standards, and the glass sheet having a thickness of 2.5mm is not coated with a resin layer, and although the light transmittance, temperature resistance, bending strength, impact strength and the like can be satisfied, the weight is 5 times or more than that of the glass sheet having a thickness of 0.4mm, and it is apparent that the resin layer of the present application is significantly reduced in weight without affecting the light transmittance, and the heat resistance, bending strength, impact strength and the like can also satisfy the requirements, and the glass is not required to be chemically reinforced, with low cost and strong practicability.
Example 17
Substantially the same as in example 2, except that: the resin layer comprises the following raw material components in percentage by mass: 0.9 cycloaliphatic epoxy resin (Japanese celluloid 2021P) and curing agent methyl hexahydrophthalic anhydride (Zhejiang alpha chemical engineering Co., ltd.) and the preparation method of the ultra-thin reinforced glass back plate for the photovoltaic module comprises the following steps:
1) Sequentially carrying out laser cutting, drilling, acid washing and airing on a glass plate for later use, wherein the acid washing is carried out by soaking and cleaning in 10% hydrofluoric acid for 3 minutes at the temperature of 40 ℃, soaking and rinsing in pure water for 5 minutes, and airing at room temperature until no water drops are formed on the surface;
2) And (2) vertically immersing the glass plate obtained in the step (1) in a mixed solution of epoxy resin and a curing agent, then vertically lifting at a speed of 1.8mm/s, and after the glass plate completely leaves the liquid level, sequentially curing for 4 hours at 20 ℃, curing for 4 hours at 80 ℃ and finally curing for 2 hours at 150 ℃ to obtain the ultrathin reinforced glass backboard for the photovoltaic module.
Example 18
Substantially the same as in example 2, except that: the curing in step 2.3) was carried out at 100℃for 10 hours.
Example 19
Substantially the same as in example 2, except that: the curing in step 2.3) was carried out for 10 hours at 80 ℃.
Example 20
Substantially the same as in example 2, except that: the curing in step 2.3) was carried out for 10 hours at 180 ℃.
Example 21
Substantially the same as in example 2, except that: the curing in step 2.3) is carried out sequentially for 4 hours at 5 ℃, for 4 hours at 60 ℃ and for 2 hours at 140 ℃.
Example 22
Substantially the same as in example 2, except that: the curing in step 2.3) is performed sequentially for 4 hours at 40 ℃, for 4 hours at 100 ℃ and for 2 hours at 190 ℃.
Example 23
Substantially the same as in example 2, except that: the resin layer comprises the following raw material components in percentage by mass: 0.4:0.008 epoxy resin, curing agent and silicone coupling agent.
Example 24
Substantially the same as in example 2, except that: the resin layer comprises the following raw material components in percentage by mass: 1.3:0.04 epoxy resin, curing agent and organosilicon coupling agent.
Example 25
Substantially the same as in example 2, except that: the epoxy resin used was E-56D.
Example 26
Substantially the same as in example 2, except that: the epoxy resin used was 6101.
Example 27
Substantially the same as in example 2, except that: the acid used for pickling in the step 1) is hydrochloric acid with the mass concentration of 10%.
Example 28
Substantially the same as in example 2, except that: the mass concentration of hydrofluoric acid in step 1) was 5%.
Comparative example 4
Substantially the same as in example 2, except that: the pickling in step 1) is replaced by plasma cleaning.
Comparative example 5
Substantially the same as in example 2, except that: the acid washing in the step 1) is replaced by water washing.
TABLE 3 Performance Table of the backplanes obtained in examples 17-26
As can be seen from examples 2 and 17, the pretreatment of the silane coupling agent can significantly improve the strength of the back sheet (although all satisfying the requirements of > 200MPa, the data show that the strength of example 2 is significantly higher than that of example 17); as can be seen from examples 18-22, the strength, adhesion and light transmittance of the back sheet can be better ensured by staged curing, and the most preferred curing method is to sequentially cure for 4+ -1 h at 10-30deg.C, 4+ -1 h at 70-90deg.C, and finally 2+ -0.5 at 150-180deg.C; as can be seen from examples 23 to 24, the optimum ratio of the epoxy resin, the curing agent and the organosilane coupling agent is 1: (0.5-1.2): (0.01-0.03), so that the light transmittance and the strength of the backboard can be better ensured; from examples 2 and examples 25-26, the advantages of the cycloaliphatic epoxy resin in terms of strength and light transmittance are most evident; as can be seen from examples 27 to 39 and comparative examples 4 to 5, the strength of the glass sheet can be improved by acid washing, and the improvement of hydrofluoric acid with a mass concentration of 7 to 15% is most remarkable, and for this reason, the applicant considers that the passivation effect of hydrofluoric acid on glass microcracks is the best and the synergy with the resin layer is the best.
Application examples
A backboard: the backboard obtained in each example is a rectangle with the size of 1658mm multiplied by 992 mm;
a panel: an ultrawhite embossed tempered glass panel;
a battery piece: a single-crystal double-sided battery piece of 156mm multiplied by 156mm, 60 pieces of each photovoltaic module;
and (3) packaging: packaging the battery piece between the back plate and the panel by using a laminating machine to obtain a photovoltaic module;
table 4 performance tables of photovoltaic modules obtained in examples
From the table, it can be seen that the addition of the white reflecting layer can obviously improve the front power of the photovoltaic module. And the advantages of examples 2-8 over comparative documents 2-3 in terms of weight saving are apparent. In example 12, a glass plate having a thickness of 1mm was used, and a 2mm thick ultrawhite embossed tempered glass was used as a panel.
Claims (9)
1. A preparation method of an ultrathin reinforced glass backboard for a photovoltaic module is characterized by comprising the following steps of: the method comprises the following steps:
1) Sequentially carrying out laser cutting, drilling, acid washing and airing on the glass plate for later use;
2) Coating and plating the resin layer raw material on the upper surface and the lower surface of the glass plate obtained in the step 1), and curing to obtain the ultrathin reinforced glass backboard for the photovoltaic module;
the raw material components of the resin layer in the step 2) comprise epoxy resin and curing agent; or the raw material components of the resin layer in the step 2) comprise epoxy resin, curing agent and organosilicon coupling agent;
when the raw material components of the resin layer comprise epoxy resin and a curing agent, the preparation method of the ultrathin reinforced glass backboard for the photovoltaic module comprises the following steps of:
1) Sequentially carrying out laser cutting, drilling, acid washing and air drying on a glass plate for later use, wherein the acid washing is carried out by soaking and cleaning in hydrofluoric acid with the mass concentration of 7% -15% for 1-5 minutes at the temperature of 30-50 ℃, and then soaking and rinsing in pure water for 3-7 minutes;
2) Vertically immersing the glass plate obtained in the step 1) in a mixed solution of epoxy resin and a curing agent, then vertically lifting the glass plate upwards at a speed of 1-3mm/s, curing the glass plate for 4+/-1 h at 10-30 ℃ in sequence after the glass plate completely leaves the liquid level, curing the glass plate for 4+/-1 h at 70-90 ℃ and finally curing the glass plate for 2+/-0.5 h at 150-180 ℃ to obtain the ultrathin reinforced glass backboard for the photovoltaic module;
3) If a grid-shaped white reflecting layer is arranged on the resin layer on the upper surface of the glass plate and/or the resin layer on the lower surface of the glass plate, coating a white reflecting layer on the resin layer on the upper surface of the glass plate and/or the resin layer on the lower surface of the glass plate obtained in the step 2), and curing to obtain the ultrathin reinforced glass backboard for the photovoltaic module;
when the raw material components of the resin layer comprise epoxy resin, an organosilane coupling agent and a curing agent, the preparation method of the ultrathin reinforced glass back plate for the photovoltaic module comprises the following steps:
1) Sequentially carrying out laser cutting, drilling, acid washing and air drying on a glass plate for later use, wherein the acid washing is carried out by soaking and cleaning in hydrofluoric acid with the mass concentration of 7% -15% for 1-5 minutes at the temperature of 30-50 ℃, and then soaking and rinsing in pure water for 3-7 minutes;
2.1 The upper surface and the lower surface of the glass plate obtained in the step 1) are pretreated by using an organosilane coupling agent;
2.2 Soaking the glass plate obtained in the step 2.1) in distilled water for 0.5-1.5h;
2.3 Vertically immersing the glass plate obtained in the step 2.2) in a mixed solution of epoxy resin and a curing agent, then vertically lifting the glass plate upwards at a speed of 1-3mm/s, curing the glass plate for 4+/-1 h at 10-30 ℃ after the glass plate completely leaves the liquid level, curing the glass plate for 4+/-1 h at 70-90 ℃ and finally curing the glass plate for 2+/-0.5 h at 150-180 ℃ to obtain the ultrathin reinforced glass backboard for the photovoltaic module;
3) And if the grid-shaped white reflecting layer is arranged on the resin layer on the upper surface of the glass plate and/or the resin layer on the lower surface of the glass plate, coating the white reflecting layer on the resin layer on the upper surface of the glass plate and/or the resin layer on the lower surface of the glass plate obtained in the step 2.3), and curing to obtain the ultra-thin reinforced glass backboard for the photovoltaic module.
2. The method of manufacturing according to claim 1, wherein: in the step 2), the raw material components of the resin layer comprise the following components in percentage by mass: (0.5-1.2) epoxy resin and curing agent, or the raw material components of the resin layer comprise the following components in mass ratio of 1: (0.5-1.2): (0.01-0.03), a curing agent and an organosilane coupling agent, wherein the curing agent in the raw material components of the resin layer is an anhydride curing agent, the organosilane coupling agent is at least one of KH-550 or KH-560, and the epoxy resin is alicyclic epoxy resin.
3. The preparation method according to claim 1 or 2, characterized in that: in the step 3), the white reflecting layer is made of epoxy resin and titanium pigment with the mass ratio of 1: (0.8-2) a mixture.
4. The preparation method according to claim 1 or 2, characterized in that: the ultrathin reinforced glass backboard for the photovoltaic module comprises a glass plate, wherein resin layers are attached to the upper surface and the lower surface of the glass plate; and a grid-shaped white reflecting layer is arranged on the resin layer on the upper surface of the glass plate and/or the resin layer on the lower surface of the glass plate, and the white reflecting layer is opposite to a gap between the packaged battery piece.
5. The method of manufacturing according to claim 4, wherein: the resin layer on the upper surface of the glass plate is provided with a grid-shaped white reflecting layer, the gap between the white reflecting layer and the packaged battery piece is opposite, and the thickness of the white reflecting layer is 10-20 mu m.
6. The preparation method according to claim 1 or 2, characterized in that: the glass plate is a float glass plate, and the thickness of the glass plate is not more than 1.5mm; the resin layers on the upper surface and the lower surface of the glass plate are both epoxy resin layers.
7. The method of manufacturing according to claim 6, wherein: the glass plate is a soda-lime-silica glass plate, a medium alumina glass plate or a high alumina glass plate.
8. The preparation method according to claim 1 or 2, characterized in that: the thickness of the glass plate is 0.1-1mm; the thickness of the resin layer on the upper and lower surfaces of the glass plate is 3-20 μm.
9. The preparation method according to claim 1 or 2, characterized in that: and packaging the battery piece group between an ultrathin reinforced glass backboard for the photovoltaic module and an ultra-white embossed toughened glass panel with the thickness of 2-3mm to form the photovoltaic module.
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| CN112599628B (en) * | 2020-12-30 | 2022-11-29 | 杭州福斯特应用材料股份有限公司 | Grid back plate, preparation method thereof and photovoltaic module |
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| CN114242822A (en) * | 2022-01-11 | 2022-03-25 | 龙焱能源科技（杭州）有限公司 | Double-glass thin film photovoltaic module and production method thereof |
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