CN109148346B - Semiconductor substrate handling device - Google Patents
Semiconductor substrate handling device Download PDFInfo
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- CN109148346B CN109148346B CN201810940495.4A CN201810940495A CN109148346B CN 109148346 B CN109148346 B CN 109148346B CN 201810940495 A CN201810940495 A CN 201810940495A CN 109148346 B CN109148346 B CN 109148346B
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- 239000004065 semiconductor Substances 0.000 title claims abstract description 56
- 239000000758 substrate Substances 0.000 title claims abstract description 56
- 230000005540 biological transmission Effects 0.000 claims abstract description 77
- 238000005452 bending Methods 0.000 claims abstract description 36
- 230000007246 mechanism Effects 0.000 claims abstract description 20
- 238000007599 discharging Methods 0.000 claims abstract description 19
- 238000004140 cleaning Methods 0.000 claims abstract description 8
- 239000007921 spray Substances 0.000 claims description 7
- 230000000903 blocking effect Effects 0.000 claims description 5
- 238000003825 pressing Methods 0.000 claims description 4
- 244000309464 bull Species 0.000 claims 2
- 239000000428 dust Substances 0.000 abstract description 7
- 230000003749 cleanliness Effects 0.000 abstract description 3
- 238000007667 floating Methods 0.000 abstract description 3
- 239000002245 particle Substances 0.000 abstract description 3
- 238000000034 method Methods 0.000 description 12
- 230000008569 process Effects 0.000 description 8
- 235000012431 wafers Nutrition 0.000 description 8
- 238000004519 manufacturing process Methods 0.000 description 6
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 4
- 230000008901 benefit Effects 0.000 description 4
- 229910052710 silicon Inorganic materials 0.000 description 4
- 239000010703 silicon Substances 0.000 description 4
- 230000009471 action Effects 0.000 description 3
- 230000006872 improvement Effects 0.000 description 3
- 239000010813 municipal solid waste Substances 0.000 description 3
- 238000010521 absorption reaction Methods 0.000 description 2
- 230000009286 beneficial effect Effects 0.000 description 2
- 238000006243 chemical reaction Methods 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 238000001914 filtration Methods 0.000 description 2
- 239000008187 granular material Substances 0.000 description 2
- 238000006467 substitution reaction Methods 0.000 description 2
- 230000004075 alteration Effects 0.000 description 1
- 238000013473 artificial intelligence Methods 0.000 description 1
- 238000009412 basement excavation Methods 0.000 description 1
- 239000004566 building material Substances 0.000 description 1
- 238000010276 construction Methods 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 239000012535 impurity Substances 0.000 description 1
- 238000011031 large-scale manufacturing process Methods 0.000 description 1
- 239000004973 liquid crystal related substance Substances 0.000 description 1
- 230000004807 localization Effects 0.000 description 1
- 230000015654 memory Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000009423 ventilation Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67017—Apparatus for fluid treatment
- H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67739—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
- H01L21/67742—Mechanical parts of transfer devices
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67739—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
- H01L21/67745—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber characterized by movements or sequence of movements of transfer devices
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Robotics (AREA)
- Cleaning Or Drying Semiconductors (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
- Warehouses Or Storage Devices (AREA)
Abstract
The invention discloses a semiconductor substrate carrying device which comprises a feeding support frame, wherein an output port of a bending output frame is fixedly connected with a discharging transmission frame, the middle position of a transmission shaft is fixedly connected with a feeding transmission wheel, the middle position of a bending rotating shaft is fixedly connected with a bending transmission wheel, the middle position of the discharging transmission frame is uniformly and rotatably connected with the discharging transmission wheel, the inner side of the bending output frame is fixedly connected with a supporting connecting rod, one end of the supporting connecting rod, which is far away from the bending output frame, is fixedly connected with an accurate bending auxiliary mechanism, and the middle position of the discharging transmission frame is fixedly connected with a wind cleaning mechanism. The semiconductor substrate carrying device achieves the purposes of improving the bending transmission precision of the semiconductor substrate, avoiding collision between the semiconductor substrate and equipment in the transmission process, ensuring that the semiconductor substrate is not damaged, removing floating dust particles of the substrate in the transmission process, ensuring the surface cleanliness of the substrate and improving the accuracy of subsequent processing of the substrate.
Description
Technical Field
The invention relates to the technical field of semiconductors, in particular to a semiconductor substrate conveying device.
Background
With the vigorous development of the semiconductor industry in China in recent years, project enterprises develop dominant resources by relying on local and unique conditions, the deep excavation potential improves the production technology level of project products, the semiconductor wafer, liquid crystal factory building materials, equipment and construction industry projects can fully exert the technical leading advantages and talent advantages, the technical improvement and the improvement of the technical level of the enterprises are realized, advanced technical equipment is purchased, large-scale production and operation are adopted, the market competitiveness of the enterprises is improved, the local resources are fully utilized, the development and production of semiconductor automation equipment are mainly utilized, the sustainable development of the enterprises is promoted, the enterprises are facilitated to make the production main industry of the products of the strong semiconductor automation conveying equipment, the industry chain of the enterprises is extended, and the breakthrough in the aspect of the development of industry clusters is promoted. Through implementation of the project, the project company can obtain larger economic benefit and social benefit, further break through of local high and new technology industry is driven, and sustainable development of local national economy is promoted.
The semiconductor chip manufacturing production line is accelerated and invested in China, and the situation of high-grade scenery gas is hopeful to be maintained in 2018. According to the statistics of the domestic wafer factories, 15 wafer factories are built at present, the total investment amount is 5700 hundred million yuan, and the production is expected to be put into operation in the year 2020. In addition, the upgrading of consumer electronic products such as mobile phones and computers greatly improves the demand for semiconductor chips. At present, domestic silicon wafer manufacturers can only partially supply 8-inch silicon wafers, and 12-inch silicon wafers basically need to be imported in total. Under the situation of tension supply and demand, domestic wafer manufacturers face the risk of shortage of goods sources, and the localization and substitution process of the silicon wafers is not slow. Meanwhile, under the promotion of high demands of downstream Internet of things and artificial intelligence, the semiconductor industry is expected to continue to maintain a high-altitude situation under the pulling of downstream demands of memories, consumer electronics, automobile electronics and the like for 18 years.
At present, the accuracy of the bending process in the transmission of the semiconductor substrate is low, the conversion accuracy of the direction of the semiconductor substrate is low, the semiconductor substrate is easy to wear in the steering process, and the long-distance transmission process of the substrate is easy to be stained with dust, so that the subsequent processing operation of the substrate is influenced.
Disclosure of Invention
(one) solving the technical problems
Aiming at the defects of the prior art, the invention provides a semiconductor substrate carrying device, which solves the problems that the accuracy of the bending process in the conventional semiconductor substrate transmission is low, the conversion accuracy of the direction of the semiconductor substrate is low, the substrate is easy to wear in the steering process, dust is easy to be stained in the long-distance substrate transmission process, and the follow-up processing operation of the substrate is influenced.
(II) technical scheme
In order to achieve the above purpose, the invention is realized by the following technical scheme: the utility model provides a semiconductor substrate handling device, includes the feeding support frame, the output fixedly connected with of feeding support frame turns to output the frame, the output port fixedly connected with ejection of compact transmission frame of turning to output the frame, the even fixedly connected with fixed bearing in surface of feeding support frame, turning to output frame and ejection of compact transmission frame, fixed bearing is located the inside rotation that feeds the support frame and is connected with the transmission shaft, the intermediate position fixedly connected with feeding transmission wheel of transmission shaft, fixed bearing is located the inside rotation that turns to output the frame and is connected with the turning pivot, the intermediate position fixedly connected with turning transmission wheel of turning pivot, the intermediate position of ejection of compact transmission frame evenly rotates and is connected with ejection of compact transmission wheel, the top of feeding transmission wheel is provided with semiconductor substrate, the right side of semiconductor substrate is provided with supplementary turning rod, the inboard fixedly connected with support link of turning to output the frame, the one end fixedly connected with accurate turning auxiliary mechanism of turning to output frame is kept away from to the support link, the intermediate position fixedly connected with wind-cleaning mechanism of ejection of compact transmission frame.
Preferably, the accurate auxiliary mechanism that turns over includes the restriction pivot, the bottom and the supporting link fixed connection of restriction pivot, the top rotation of restriction pivot is connected with circular roller, the restriction keeps off the groove on the surface of circular roller.
Preferably, the bottom cover of restriction pivot is equipped with the torsional spring, the top and the circular roller one side fixed connection of torsional spring, the bottom and the support connecting rod fixed connection of torsional spring.
Preferably, the auxiliary bending rod comprises a limiting frame, a threaded connecting rod is connected to the middle position of the top end of the limiting frame in a threaded mode, a hand-operated rod is fixedly connected to one end of the threaded connecting rod, which is located outside the limiting frame, a lower pressing plate is rotatably connected to one end of the threaded connecting rod, which is located inside the limiting frame, a limiting deflector rod is fixedly connected to one side of the outer portion of the limiting frame, and the limiting deflector rod is symmetrically arranged with the accurate bending auxiliary mechanism.
Preferably, the wind cleaning mechanism comprises a fixed side frame, the bottom end of the fixed side frame is fixedly connected with the discharging transmission frame, and fans are fixedly connected to two sides of the top end inside the fixed side frame.
Preferably, one end of the fan is communicated with a vent pipe, two sides of the inner wall of the fixed side frame are uniformly and fixedly connected with vent nozzles, and one end of the vent pipe away from the fan is communicated with the vent nozzles.
Preferably, the intermediate position fixedly connected with edulcoration frame on fixed side frame top, the inside bottom fixedly connected with electric fan of edulcoration frame, the inside position fixedly connected with filter screen that is located electric fan top of edulcoration frame.
Preferably, the outer surfaces of the feeding support frame, the bending output frame and the discharging transmission frame are fixedly connected with motors, and the output shafts of the motors are fixedly connected with driving rotating wheels.
Preferably, the driven rotating wheels are fixedly connected at the axle centers of the transmission shaft, the bending rotating shaft and the discharging transmission wheel.
Preferably, the driven rotating wheel is in transmission connection with the driving rotating wheel through a belt.
(III) beneficial effects
The invention provides a semiconductor substrate conveying device. The beneficial effects are as follows:
(1) The semiconductor substrate carrying device is powered on to rotate through the motor, the motor drives the transmission shaft, the bending rotating shaft and the discharging transmission wheel to rotate through the belt, so that the transmission of the semiconductor substrate is realized, when the semiconductor substrate is transmitted to the bending output frame, the limiting deflector rod is clamped with the limiting baffle groove, so that the limiting deflector rod rotates under the limitation of taking the limiting rotating shaft as the center of a circle, the round roller drives the torsion spring to twist, when the semiconductor substrate is transmitted to the discharging transmission frame, the limiting deflector rod is separated from the limiting baffle groove, the torsion spring drives the limiting baffle groove to reset, the bending of the angle is accurately ensured in the transmission process, the purposes of improving the bending transmission precision of the semiconductor substrate, avoiding collision between the semiconductor substrate and equipment and ensuring that the semiconductor substrate is not damaged are achieved.
(2) This semiconductor substrate handling device, through fan circular telegram work, the fan drives the air and spouts from the spray tube that ventilates through the breather pipe, and high-speed air blows to the base plate surface, and the dust floats in the sky, and the outside absorption air of electric fan simultaneously, the tiny particle in the filter screen filtering air have reached the purpose of clear away the floating dust granule of transmission in-process base plate, guarantee base plate surface cleanliness factor, the accuracy of the follow-up processing of improvement base plate.
Drawings
FIG. 1 is a schematic view of the overall structure of the present invention;
FIG. 2 is a schematic structural view of the precise bending auxiliary mechanism of the present invention;
FIG. 3 is a schematic view of the structure of the auxiliary bending bar of the present invention;
FIG. 4 is a schematic view of the structure of the wind cleaning mechanism of the present invention;
fig. 5 is a schematic diagram of the structure of the present invention at a.
In the figure: 1 a feeding support frame, 2 a bending output frame, 3 a discharging transmission frame, 4 a fixed bearing, 5 a transmission shaft, 6 a feeding transmission wheel, 7 a bending rotating shaft, 8 a bending transmission wheel, 9 a discharging transmission wheel, 10 a semiconductor substrate, 11 an auxiliary bending rod, 111 a limiting frame, 112 a threaded connecting rod, 113 a hand rocker, 114 a lower pressing plate, 115 a limiting deflector rod, 12 a supporting connecting rod, 13 a precise bending auxiliary mechanism, 131 a limiting rotating shaft, 132 a round roller, 133 a limiting baffle slot, 134 a torsion spring, 14 a wind cleaning mechanism, 141 a fixed side frame, 142 a fan, 143 a ventilating pipe, 144 a ventilating spray pipe, 145 a impurity removing frame, 146 an electric fan, 147 a filter screen, 15 a motor, 16 a driving rotating wheel, 17 a driven rotating wheel and 18 a belt.
Detailed Description
The following description of the embodiments of the present invention will be made clearly and completely with reference to the accompanying drawings, in which it is apparent that the embodiments described are only some embodiments of the present invention, but not all embodiments. All other embodiments, which can be made by those skilled in the art based on the embodiments of the invention without making any inventive effort, are intended to be within the scope of the invention.
1. Referring to fig. 1-5, the present invention provides a technical solution: the utility model provides a semiconductor substrate handling device, including feeding support frame 1, the output fixedly connected with of feeding support frame 1 turns over output frame 2, the output port fixedly connected with ejection of compact transmission frame 3 of output of turning over output frame 2, feeding support frame 1, the even fixedly connected with fixed bearing 4 in surface of turning over output frame 2 and ejection of compact transmission frame 3, fixed bearing 4 is located the inside rotation of feeding support frame 1 and is connected with transmission shaft 5, the intermediate position fixedly connected with feeding transmission wheel 6 of transmission shaft 5, fixed bearing 4 is located the inside rotation of turning over output frame 2 and is connected with turning over pivot 7, the intermediate position fixedly connected with turning over transmission wheel 8 of turning over pivot 7, the even rotation of intermediate position of ejection of compact transmission frame 3 is connected with ejection of compact transmission wheel 9, the top of feeding transmission wheel 6 is provided with semiconductor substrate 10, the right side of semiconductor substrate 10 is provided with supplementary turning lever 11, the inboard fixedly connected with support link 12 of turning over output frame 2, the one end fixedly connected with accurate turning over auxiliary mechanism 13 of keeping away from turning over output frame 2, the intermediate position fixedly connected with clean wind mechanism 14 of ejection of compact transmission frame 3. The accurate turning auxiliary mechanism 13 comprises a limiting rotating shaft 131, the bottom end of the limiting rotating shaft 131 is fixedly connected with the supporting connecting rod 12, the top end of the limiting rotating shaft 131 is rotationally connected with a round roller 132, and a limiting blocking groove 133 is formed in the surface of the round roller 132. The bottom cover of restriction pivot 131 is equipped with torsional spring 134, and the top and the circular roller 132 one side fixed connection of torsional spring 134, the bottom and the support connecting rod 12 fixed connection of torsional spring 134. The auxiliary bending rod 11 comprises a limiting frame 111, a threaded connecting rod 112 is connected to the middle position of the top end of the limiting frame 111 in a threaded mode, a hand-operated rod 113 is fixedly connected to one end of the threaded connecting rod 112, located outside the limiting frame 111, a lower pressing plate 114 is rotatably connected to one end of the threaded connecting rod 112, located inside the limiting frame 111, a limiting deflector rod 115 is fixedly connected to one side of the outer portion of the limiting frame 111, and the limiting deflector rod 115 and the accurate bending auxiliary mechanism 13 are symmetrically arranged. The wind cleaning mechanism 14 comprises a fixed side frame 141, the bottom end of the fixed side frame 141 is fixedly connected with the discharging transmission frame 3, and two sides of the top end inside the fixed side frame 141 are fixedly connected with fans 142. One end of the fan 142 is communicated with a vent pipe 143, two sides of the inner wall of the fixed side frame 141 are uniformly and fixedly connected with a vent spray pipe 144, and one end of the vent pipe 143 far away from the fan 142 is communicated with the vent spray pipe 144. The middle position at the top end of the fixed side frame 141 is fixedly connected with a trash frame 145, the bottom end inside the trash frame 145 is fixedly connected with an electric fan 146, and a filter screen 147 is fixedly connected to the position inside the trash frame 145 and above the electric fan 146. The outer surfaces of the feeding support frame 1, the bending output frame 2 and the discharging transmission frame 3 are fixedly connected with a motor 15, and an output shaft of the motor 15 is fixedly connected with a driving rotating wheel 16. The axes of the transmission shaft 5, the bending rotating shaft 7 and the discharging transmission wheel 9 are fixedly connected with a driven rotating wheel 17. The driven runner 17 is in driving connection with the driving runner 16 by a belt 18.
When the semiconductor substrate conveying device is used, the motor 15 drives the transmission shaft 5, the bending rotating shaft 7 and the discharging transmission wheel 9 to rotate through the belt 18 through the electrified rotation of the motor 15, so that the transmission of the semiconductor substrate 10 is realized, when the semiconductor substrate 10 is transmitted to the bending output frame 2, the limiting deflector 115 is clamped with the limiting blocking groove 133, so that the limiting deflector 115 rotates under the limitation of taking the limiting rotating shaft 131 as the center of a circle, the round roller 132 drives the torsion spring 134 to twist, when the semiconductor substrate 10 is transmitted to the discharging transmission frame 3, the limiting deflector 115 is separated from the limiting blocking groove 133, the torsion spring 134 drives the limiting blocking groove 133 to reset, the bending of an angle is accurately ensured in the transmission process, and the purposes of improving the bending transmission precision of the semiconductor substrate, avoiding the collision between the semiconductor substrate and equipment and ensuring that the semiconductor substrate is not damaged are achieved. Through fan 142 circular telegram work, fan 142 drives the air and spouts from ventilation spray tube 144 through breather pipe 143, and high-speed air blows to the base plate surface, and the dust floats in the sky, and the outside absorption air of electric fan 146 simultaneously, the tiny particle in the filtering air of filter screen 147 has reached the purpose of clear away the floating dust granule of base plate in the transmission process, guarantees base plate surface cleanliness factor, improves the accuracy of the follow-up processing of base plate.
It is noted that relational terms such as first and second, and the like are used solely to distinguish one entity or action from another entity or action without necessarily requiring or implying any actual such relationship or order between such entities or actions. Moreover, the terms "comprises," "comprising," or any other variation thereof, are intended to cover a non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements does not include only those elements but may include other elements not expressly listed or inherent to such process, method, article, or apparatus. Without further limitation. The term "comprising" an element defined by the term "comprising" does not exclude the presence of other identical elements in a process, method, article or apparatus that comprises the element.
Although embodiments of the present invention have been shown and described, it will be understood by those skilled in the art that various changes, modifications, substitutions and alterations can be made therein without departing from the principles and spirit of the invention, the scope of which is defined in the appended claims and their equivalents.
Claims (8)
1. Semiconductor substrate handling device, including feeding support frame (1), its characterized in that: the utility model discloses a feeding support frame, including feeding support frame (1), fixed bearing (4) are located feeding support frame (1), the output fixedly connected with of feeding support frame (1) is bent output frame (2), the output port fixedly connected with ejection of compact transmission frame (3) of bending output frame (2), feeding support frame (1), bent output frame (2), output port fixedly connected with ejection of compact transmission frame (3), feeding support frame (2), bent output frame (2) and ejection of compact transmission frame (3), the top of feeding transmission frame (6) is provided with semiconductor substrate (10), the right side of semiconductor substrate (10) is provided with supplementary bent bull stick (11), the intermediate position fixedly connected with feeding transmission wheel (6) of transmission axle (5), fixed bearing (4) are located the inside rotation of bent output frame (2) is connected with bent pivot (7), the intermediate position fixedly connected with bent transmission wheel (8) of bent pivot (7), the intermediate position evenly rotates and is connected with ejection of compact transmission wheel (9), the top of feeding transmission frame (3) is provided with semiconductor substrate (10), the right side of supplementary bent bull stick (11), the accurate output of connecting rod (12) is kept away from to the fixed connection of connecting rod (13), the middle position of the discharging transmission frame (3) is fixedly connected with an air cleaning mechanism (14); the accurate turning auxiliary mechanism (13) comprises a limiting rotating shaft (131), the bottom end of the limiting rotating shaft (131) is fixedly connected with the supporting connecting rod (12), the top end of the limiting rotating shaft (131) is rotatably connected with a round roller (132), and a limiting blocking groove (133) is formed in the surface of the round roller (132); the auxiliary bending rod (11) comprises a limiting frame (111), a threaded connecting rod (112) is connected to the middle position of the top end of the limiting frame (111) in a threaded mode, a hand-operated rod (113) is fixedly connected to one end of the threaded connecting rod (112) located outside the limiting frame (111), a lower pressing plate (114) is rotatably connected to one end of the threaded connecting rod (112) located inside the limiting frame (111), a limiting deflector rod (115) is fixedly connected to one side of the outside of the limiting frame (111), and the limiting deflector rod (115) and the accurate bending auxiliary mechanism (13) are symmetrically arranged.
2. The semiconductor substrate handling device according to claim 1, wherein: the bottom cover of restriction pivot (131) is equipped with torsional spring (134), the top and the circular roller (132) one side fixed connection of torsional spring (134), the bottom and the support connecting rod (12) fixed connection of torsional spring (134).
3. The semiconductor substrate handling device according to claim 1, wherein: the air cleaning mechanism (14) comprises a fixed side frame (141), the bottom end of the fixed side frame (141) is fixedly connected with the discharging transmission frame (3), and fans (142) are fixedly connected to two sides of the top end inside the fixed side frame (141).
4. A semiconductor substrate handling device according to claim 3, wherein: one end of the fan (142) is communicated with a vent pipe (143), two sides of the inner wall of the fixed side frame (141) are uniformly and fixedly connected with a vent spray pipe (144), and one end of the vent pipe (143) away from the fan (142) is communicated with the vent spray pipe (144).
5. The semiconductor substrate handling device according to claim 4, wherein: the middle position at fixed side frame (141) top fixedly connected with edulcoration frame (145), the inside bottom fixedly connected with electric fan (146) of edulcoration frame (145), the inside position fixedly connected with filter screen (147) that are located electric fan (146) top of edulcoration frame (145).
6. The semiconductor substrate handling device according to claim 1, wherein: the outer surfaces of the feeding support frame (1), the bending output frame (2) and the discharging transmission frame (3) are fixedly connected with a motor (15), and an output shaft of the motor (15) is fixedly connected with a driving rotating wheel (16).
7. The semiconductor substrate handling device according to claim 1, wherein: the axle center of transmission axle (5), bent pivot (7) and ejection of compact transmission wheel (9) department all fixedly connected with driven runner (17).
8. The semiconductor substrate handling device according to claim 7, wherein: the driven rotating wheel (17) is in transmission connection with the driving rotating wheel (16) through a belt (18).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810940495.4A CN109148346B (en) | 2018-08-17 | 2018-08-17 | Semiconductor substrate handling device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810940495.4A CN109148346B (en) | 2018-08-17 | 2018-08-17 | Semiconductor substrate handling device |
Publications (2)
| Publication Number | Publication Date |
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| CN109148346A CN109148346A (en) | 2019-01-04 |
| CN109148346B true CN109148346B (en) | 2023-12-22 |
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| CN201810940495.4A Active CN109148346B (en) | 2018-08-17 | 2018-08-17 | Semiconductor substrate handling device |
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| CN (1) | CN109148346B (en) |
Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH09142622A (en) * | 1995-11-22 | 1997-06-03 | Honda Motor Co Ltd | Roller conveyer device |
| CN101284603A (en) * | 2007-04-09 | 2008-10-15 | 株式会社日本设计工业 | Roller unit for conveying sheet material and conveyer for sheet material |
| TW201029901A (en) * | 2008-11-28 | 2010-08-16 | Ihi Corp | Diverging device for conveying equipment |
| CN101835698A (en) * | 2007-10-22 | 2010-09-15 | 应用材料股份有限公司 | Methods and apparatus for transporting substrate carriers |
| JP2012218910A (en) * | 2011-04-12 | 2012-11-12 | Daifuku Co Ltd | Transport conveyor and transport facility |
| CN208570570U (en) * | 2018-08-17 | 2019-03-01 | 浙江雅市晶科技有限公司 | A kind of semiconductor substrate handling device |
-
2018
- 2018-08-17 CN CN201810940495.4A patent/CN109148346B/en active Active
Patent Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH09142622A (en) * | 1995-11-22 | 1997-06-03 | Honda Motor Co Ltd | Roller conveyer device |
| CN101284603A (en) * | 2007-04-09 | 2008-10-15 | 株式会社日本设计工业 | Roller unit for conveying sheet material and conveyer for sheet material |
| CN101835698A (en) * | 2007-10-22 | 2010-09-15 | 应用材料股份有限公司 | Methods and apparatus for transporting substrate carriers |
| TW201029901A (en) * | 2008-11-28 | 2010-08-16 | Ihi Corp | Diverging device for conveying equipment |
| JP2012218910A (en) * | 2011-04-12 | 2012-11-12 | Daifuku Co Ltd | Transport conveyor and transport facility |
| CN208570570U (en) * | 2018-08-17 | 2019-03-01 | 浙江雅市晶科技有限公司 | A kind of semiconductor substrate handling device |
Also Published As
| Publication number | Publication date |
|---|---|
| CN109148346A (en) | 2019-01-04 |
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