CN109141210B - A kind of semiconductor pressure resistance icing detector and working method - Google Patents
A kind of semiconductor pressure resistance icing detector and working method Download PDFInfo
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- CN109141210B CN109141210B CN201811131681.XA CN201811131681A CN109141210B CN 109141210 B CN109141210 B CN 109141210B CN 201811131681 A CN201811131681 A CN 201811131681A CN 109141210 B CN109141210 B CN 109141210B
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- 239000004065 semiconductor Substances 0.000 title claims abstract description 100
- 238000000034 method Methods 0.000 title claims abstract description 15
- 238000009413 insulation Methods 0.000 claims abstract description 15
- 239000004020 conductor Substances 0.000 claims description 7
- 238000001514 detection method Methods 0.000 claims description 7
- 238000010586 diagram Methods 0.000 description 5
- 238000012544 monitoring process Methods 0.000 description 5
- 238000013461 design Methods 0.000 description 3
- 230000001133 acceleration Effects 0.000 description 2
- 230000007547 defect Effects 0.000 description 2
- 239000000428 dust Substances 0.000 description 2
- 238000005259 measurement Methods 0.000 description 2
- 239000013307 optical fiber Substances 0.000 description 2
- 230000003044 adaptive effect Effects 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000000903 blocking effect Effects 0.000 description 1
- 230000007812 deficiency Effects 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000003780 insertion Methods 0.000 description 1
- 230000037431 insertion Effects 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
- 238000002955 isolation Methods 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 230000002093 peripheral effect Effects 0.000 description 1
- 239000007787 solid Substances 0.000 description 1
- 239000002344 surface layer Substances 0.000 description 1
- 238000012360 testing method Methods 0.000 description 1
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01B—MEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
- G01B7/00—Measuring arrangements characterised by the use of electric or magnetic techniques
- G01B7/02—Measuring arrangements characterised by the use of electric or magnetic techniques for measuring length, width or thickness
- G01B7/06—Measuring arrangements characterised by the use of electric or magnetic techniques for measuring length, width or thickness for measuring thickness
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B64—AIRCRAFT; AVIATION; COSMONAUTICS
- B64D—EQUIPMENT FOR FITTING IN OR TO AIRCRAFT; FLIGHT SUITS; PARACHUTES; ARRANGEMENT OR MOUNTING OF POWER PLANTS OR PROPULSION TRANSMISSIONS IN AIRCRAFT
- B64D15/00—De-icing or preventing icing on exterior surfaces of aircraft
- B64D15/20—Means for detecting icing or initiating de-icing
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- Engineering & Computer Science (AREA)
- Aviation & Aerospace Engineering (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Geophysics And Detection Of Objects (AREA)
- Measuring Fluid Pressure (AREA)
- Investigating Or Analyzing Materials By The Use Of Electric Means (AREA)
Abstract
The present invention relates to a kind of semiconductor pressure resistance icing detector and working methods, including semiconductor fixed frame, the semiconductor fixed frame with the covering of wing to be measured for being fixedly connected, being equipped with inside the semiconductor fixed frame can be along the semiconductor that it is axially slided up and down, the semiconductor bottom end and the insulation ball end thereof contacts being located inside covering, the other end and pressure sensor contacts of insulation ball, pressure sensor is fixed on the tip of the thimble inside covering, the thimble other end is connect by spring with wing to be measured, icing detector structure of the invention is simple, precision is high, high reliablity, meet the requirements of one's work such as Flight Safety guarantee and reference flight.
Description
Technical field
The present invention relates to technical field of aerospace, and in particular to a kind of semiconductor pressure resistance icing detector and working method.
Background technique
In the big high latitude area in paramos or humidity surface icing phenomenon can occur for the aircrafts such as aircraft.Aircraft surfaces knot
Ice can seriously affect flying quality, or even the consequences such as cause aircraft out of control, it is therefore desirable to be designed simultaneously to icing detection system
Improve the precision of icing detector.
Existing aircraft ice detector mainly uses optical fiber and pneumatic principle to carry out icing detection, deposits in structure design
In certain defect and problem, for example, traditional pneumatic type ice-sensor in order t o can not by the foreign matters such as ice blockage and dust into
Row is differentiated, and leads to that air-hole blockage phenomenon occurs when dust blocking air inlet, icing detection signal alarm causes traditional icing to believe
Number sensor false alarm rate is high.Therefore, there is an urgent need to carry out adaptive improvement to it, and icing detection precision is improved, needs to design
Invent a kind of device that can monitor airframe icing situation and icing thickness on-line.
Summary of the invention
The purpose of the present invention is to overcome above-mentioned the deficiencies in the prior art, providing a kind of semiconductor pressure resistance icing detector,
Structure is simple, precision is high, highly reliable, can be used for the icing monitoring and early warning of aircraft wing frozen surface, and pass through calibration meter
Calculation obtains icing thickness, can satisfy the requirements of one's work such as Flight Safety guarantee and reference flight.
To achieve the above object, the present invention adopts the following technical solutions:
A kind of semiconductor pressure resistance icing detector, including semiconductor fixed frame, the semiconductor fixed frame be used for it is to be measured
The covering of wing is fixedly connected, be equipped with inside the semiconductor fixed frame can along the semiconductor that it is axially slided up and down, described half
Conductor bottom end and the insulation ball end thereof contacts being located inside covering, the other end and pressure sensor contacts of the ball that insulate, pressure pass
Sensor is fixed on the tip of the thimble inside covering, and the thimble other end is connect by spring with wing to be measured.
Further, the semiconductor geometries are cylinder, and side circumferential surface is equipped with multiple sliding blocks, the bottom of semiconductor
It is connected with semiconductor lead, the semiconductor lead is used to form closed circuit with external system.
Further, the semiconductor fixed frame is the cylindrical type tube structure to match with semiconductor geometries, described half
The fixed inner circumferential surface connect of conductor is equipped with multiple sliding slots to match with the sliding block, and it is long that the track length is greater than sliding block
Degree, the semiconductor fixed frame bottom face are equipped with opening, and the opening is contacted for semiconductor bottom end with insulation ball.
Further, the spring uses light spring.
Further, the thimble includes cylindrical section and conical section, and the pressure sensor is fixed on the tip of conical section
Position, described cylindrical section one end are fixedly connected with conical section, and the other end is equipped with set shaft part, and the diameter of the set shaft part is less than cylinder
Section diameter, the light spring are placed on shaft part, the end face connection of light spring one end and cylindrical section, the other end and machine to be measured
The internal structure of the wing connects.
Further, it is equipped in the through-hole and is passed with pressure through there is through-hole in the cylindrical section, conical section and set shaft part
The sensor conductor of sensor connection.
The invention also discloses a kind of working methods of semiconductor pressure resistance icing detector, comprising the following steps:
Step 1: before aircraft flight, semiconductor pressure resistance icing detector is demarcated, set in the circuit of semiconductor into
The electric signal threshold of row alarm.
Step 2: multiple semiconductor pressure resistance icing detectors being mounted on wing to be measured, when aircraft flight, to semiconductor
Current variation value and the detection of icing thickness real-time perfoming in link circuit.
Further, in the step 1, semiconductor pressure resistance icing detector is demarcated in icing tunnel environment.
Further, the specific works method of the step 2 are as follows: when plane wing surfaces freeze, semiconductor is made in pressure
With the lower variation that resistance value occurs, electric current generates variation in the circuit connecting with semiconductor, according to the current signal changing value of acquisition
Icing thickness is calculated in real time, when current variation value is more than threshold, is alarmed.
Further, when icing THICKNESS CALCULATION, extraneous factor is compensated using the pressure value that pressure sensor detects
The variation of caused semiconductor resistance value.
Beneficial effects of the present invention:
1. semiconductor pressure resistance icing detector of the invention, structure is simple, is calculated using the piezoresistive characteristic of semiconductor winged
The icing thickness of machine aerofoil surface overcomes the high problem of false alert rate present in traditional aircraft ice detector, reliability
It is high.
2. semiconductor pressure resistance icing detector of the invention compensates semiconductor caused by extraneous factor using pressure sensor
The variation of resistance value, testing result is accurate, and precision is high, meets the requirements of one's work such as Flight Safety guarantee and reference flight.
Detailed description of the invention
The accompanying drawings constituting a part of this application is used to provide further understanding of the present application, and the application's shows
Meaning property embodiment and its explanation do not constitute the restriction to the application for explaining the application.
Fig. 1 is icing detector of the present invention and covering assembling schematic diagram；
Fig. 2 is semiconductor structure schematic diagram of the present invention；
Fig. 3 is semiconductor fixed rack structure schematic diagram of the present invention；
Fig. 4 is thimble structure schematic diagram of the present invention；
Fig. 5 is use state diagram of the present invention；
Wherein, 1. semiconductor fixed frame, 1-1. sliding slot, 1-2. opening, 2. coverings, 3. semiconductors, 3-1. sliding block, 3-2. half
Conductor, 4. insulation balls, 5. pressure sensors, 5-1. sensor conductor, 6. thimbles, 6-1. cylindrical section, 6-2. conical section, 6-
3. set shaft part, 6-4. through-hole, 7. springs.
Specific embodiment
It is noted that following detailed description is all illustrative, it is intended to provide further instruction to the application.Unless another
It indicates, all technical and scientific terms used herein has usual with the application person of an ordinary skill in the technical field
The identical meanings of understanding.
It should be noted that term used herein above is merely to describe specific embodiment, and be not intended to restricted root
According to the illustrative embodiments of the application.As used herein, unless the context clearly indicates otherwise, otherwise singular
Also it is intended to include plural form, additionally, it should be understood that, when in the present specification using term "comprising" and/or " packet
Include " when, indicate existing characteristics, step, operation, device, component and/or their combination.
In order to facilitate narration, if there is "upper", "lower", " left side " " right side " printed words in the present invention, only expression and attached drawing itself
Upper and lower, left and right direction it is consistent, not to structure rise restriction effect, it is only for convenient for description the present invention and simplification retouch
It states, rather than the equipment of indication or suggestion meaning or element must have a particular orientation, and be constructed and operated in a specific orientation,
Therefore it is not considered as limiting the invention.
As background technique is introduced, existing aircraft ice detector carries out icing spy using optical fiber and pneumatic principle
Survey, there are problems that in design certain defect and, in view of the above-mentioned problems, present applicant proposes a kind of semiconductor pressure resistance icing detections
Device.
In a kind of exemplary embodiment of the application, as shown in Figs. 1-5, a kind of semiconductor pressure resistance icing detector, including
Semiconductor fixed frame 1, in use, semiconductor fixed frame is fixedly connected with the covering 2 of wing to be measured by rivet, on the covering
Equipped with the mounting hole for installing semiconductor pressure resistance icing detector, being equipped with inside the semiconductor fixed frame can be in its axial direction
The semiconductor 3 of lower slider, the semiconductor bottom end and 4 end thereof contacts of insulation ball being located inside covering mounting hole, insulate ball
The other end is contacted with pressure sensor 5, and pressure sensor is fixed on the tip of the thimble 6 inside covering mounting hole, described
The thimble other end is connect by spring 7 with wing to be measured.
The semiconductor 3 is cylindrical structure, is uniformly distributed with multiple sliding blocks on the external peripheral surface of the semiconductor
3-1, the bottom of the semiconductor are equipped with semiconductor lead 3-2, and the semiconductor lead passes through covering and is used for and external system
Control device connection forms closed circuit and moves along the chute when semiconductor is by pressure, generates change in resistance, be closed back accordingly
Current signal variation is transferred to the control device of external system in road.
The semiconductor fixed frame 1 is the cylindrical type tube structure to match with semiconductor geometries, the upper end blow-by,
Inside cylindrical surface is equipped with multiple sliding slot 1-1 to match with sliding block, and the length of sliding slot is greater than the length of sliding block, installation
When, semiconductor is placed in inside semiconductor fixed frame, and sliding block insertion is installed in corresponding sliding slot, and semiconductor can be solid along semiconductor
The axial direction for determining frame slides up and down, and the bottom face of the semiconductor fixed frame is equipped with circular opening 1-2, the circular open
Contact for semiconductor bottom face and insulation ball.
The insulation ball uses isolation material, can prevent measurement error caused by semiconductor and pressure sensor short circuit.
The thimble 6 includes that the cylindrical section 6-1 of integral type connection and conical section 6-2, the tip of the conical section are fixed with
Pressure sensor, the pressure sensor with insulation ball contact, insulation ball and thimble be approximate point contact, insulation ball with partly lead
Body bottom surface is point contact, by point contact, improves the variation precision of semiconductor resistance value, described cylindrical section one end and conical section one
The connection of body formula, other end integral type are connected with set shaft part 6-3, and the diameter of the set shaft part is less than the diameter of cylindrical section.The set
Spring 7 is cased on shaft part, one end of the spring and the end face of cylindrical section connect, in the wing inside the other end and wing cover
The connection of portion's structure, the spring can guarantee that pressure sensor is contacted with insulation ball, insulation ball and semiconductor bottom end face contact, institute
It states cylindrical section, conical section and set shaft part and is equipped with the through-hole 6-4 for running through entire thimble, be equipped in the through-hole and connect with pressure sensor
The sensor conductor 5-1 connect, the pressure signal for detecting pressure sensor are transferred to the control device of external system.
The spring uses light spring, can ignore light spring pressure sensor due to caused by Flight Acceleration
Variation, prevent due to spring introduce measurement error.
The invention also discloses a kind of working methods of semiconductor pressure resistance icing detector, comprising the following steps:
Step 1: flight before detector is demarcated under icing tunnel environment, setting alarm when with semiconductor link circuit
The threshold of middle current changing signal.
Step 2: arrange multiple icing detectors as needed on aircraft wing, it, can be to icing feelings when aircraft flight
Condition carries out real-time monitoring.
In the step 2, the working method of icing detector specifically: when aerofoil surface freezes, the ice of aerofoil surface
Layer can generate vertical pressure to semiconductor, and semiconductor moves in semiconductor fixed frame along the chute, and semiconductor resistor can become
Change, the current data in circuit connecting with semiconductor can generate variation, be according to curent change judgement in monitoring closed circuit
No icing, and icing thickness is calculated, when current variation value is more than threshold, alarm signal is issued, when icing thickness is calculated,
Pressure sensor can also be measured by semiconductor institute caused by the extraneous factors such as Flight Acceleration, airframe vibration, windage
By the variation of pressure, semiconductor change in resistance caused by extraneous factor is compensated, improves the computational accuracy of icing thickness.
Icing detector structure of the invention is simple, and monitoring accuracy is high, and high reliablity can be used for the knot of plane wing surfaces
Ice monitoring and early warning, and available icing thickness, can satisfy the need of the work such as Flight Safety guarantee and reference flight
It wants.
Above-mentioned, although the foregoing specific embodiments of the present invention is described with reference to the accompanying drawings, not protects model to the present invention
The limitation enclosed, those skilled in the art should understand that, based on the technical solutions of the present invention, those skilled in the art are not
Need to make the creative labor the various modifications or changes that can be made still within protection scope of the present invention.
Claims (9)
1. a kind of semiconductor pressure resistance icing detector, which is characterized in that including semiconductor fixed frame, the semiconductor fixed frame is used
It is fixedly connected in the covering of wing to be measured, is partly led inside the semiconductor fixed frame equipped with what can axially be slided up and down along it
Body, the semiconductor bottom end connect with the insulation ball end thereof contacts being located inside covering, the other end and the pressure sensor for the ball that insulate
Touching, pressure sensor are fixed on the tip of the thimble inside covering, and the thimble other end passes through spring and wing to be measured
Connection；
The semiconductor fixed frame is the cylindrical type tube structure to match with semiconductor geometries, and the semiconductor fixation connects interior
Circumferential surface is equipped with multiple sliding slots to match with sliding block, and the track length is greater than length, and the semiconductor is fixed
Frame bottom face is equipped with opening, and the opening is contacted for semiconductor bottom end with insulation ball.
2. a kind of semiconductor pressure resistance icing detector as described in claim 1, which is characterized in that the semiconductor geometries are circle
Cylindricality, side circumferential surface are equipped with multiple sliding blocks, and the bottom of semiconductor is connected with semiconductor lead.
3. a kind of semiconductor pressure resistance icing detector as described in claim 1, which is characterized in that the spring uses lightweight bullet
Spring.
4. a kind of semiconductor pressure resistance icing detector as claimed in claim 3, which is characterized in that the thimble includes cylindrical section
And conical section, the pressure sensor are fixed on the tip position of conical section, described cylindrical section one end is fixedly connected with conical section,
The other end is equipped with set shaft part, and the diameter of the set shaft part is less than cylindrical section diameter, and the light spring is placed on shaft part, lightweight
The connection of the end face of spring one end and cylindrical section, the other end are connect with the internal structure of wing to be measured.
5. a kind of semiconductor pressure resistance icing detector as claimed in claim 4, which is characterized in that the cylindrical section, conical section
And the sensor conductor connecting with pressure sensor is equipped in the through-hole through there is through-hole in set shaft part.
6. a kind of working method of the described in any item semiconductor pressure resistance icing detectors of claim 1-5, which is characterized in that packet
Include following steps:
Step 1: before aircraft flight, semiconductor pressure resistance icing detector being demarcated, sets in the circuit of semiconductor and is reported
Alert electric signal threshold；
Step 2: multiple semiconductor pressure resistance icing detectors being mounted on wing to be measured, when aircraft flight, semiconductor is connected
Current variation value and the detection of icing thickness real-time perfoming in circuit.
7. working method as claimed in claim 6, which is characterized in that in the step 1, to semiconductor pressure resistance icing detector
It is demarcated in icing tunnel environment.
8. working method as claimed in claim 6, which is characterized in that the specific works method of the step 2 are as follows: aircraft wing
When surface freezes, the variation of resistance value occurs under pressure for semiconductor, and electric current generates variation in the circuit connecting with semiconductor,
Icing thickness is calculated in real time according to the current signal changing value of acquisition, when current variation value is more than threshold, is alarmed.
9. working method as claimed in claim 8, which is characterized in that when icing THICKNESS CALCULATION, detected using pressure sensor
Obtained pressure value compensates the variation of semiconductor resistance value caused by extraneous factor.
Priority Applications (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201811131681.XA CN109141210B (en) | 2018-09-27 | 2018-09-27 | A kind of semiconductor pressure resistance icing detector and working method |
| LU101694A LU101694B1 (en) | 2018-09-27 | 2019-09-20 | Semiconductor piezoresistive icing detector and workling method thereof |
| PCT/CN2019/107110 WO2020063491A1 (en) | 2018-09-27 | 2019-09-20 | Semiconductor piezoresistive icing detector and working method |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201811131681.XA CN109141210B (en) | 2018-09-27 | 2018-09-27 | A kind of semiconductor pressure resistance icing detector and working method |
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| Publication Number | Publication Date |
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| CN109141210A CN109141210A (en) | 2019-01-04 |
| CN109141210B true CN109141210B (en) | 2019-10-15 |
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|---|---|
| CN (1) | CN109141210B (en) |
| LU (1) | LU101694B1 (en) |
| WO (1) | WO2020063491A1 (en) |
Families Citing this family (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109141210B (en) * | 2018-09-27 | 2019-10-15 | 山东大学 | A kind of semiconductor pressure resistance icing detector and working method |
| CN109781017B (en) * | 2019-03-21 | 2020-09-01 | 四川嘉瑞丰科技有限公司 | Rapid calibration method of optical fiber type icing sensor |
| CN115628876B (en) * | 2022-12-08 | 2023-03-14 | 中国航空工业集团公司沈阳空气动力研究所 | Icing wind tunnel icing and substrate material adhesion force measuring device |
| CN117006003A (en) * | 2023-03-29 | 2023-11-07 | 哈尔滨理工大学 | Intelligent ultrasonic deicing method for wind driven generator blade |
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| JPS5559302A (en) * | 1978-10-30 | 1980-05-02 | Mayekawa Mfg Co Ltd | Freezing thickness detector |
| CN103954209A (en) * | 2014-05-13 | 2014-07-30 | 湖南大学 | Ice coating monitoring system and method for fan blade based on piezoelectric materials |
| CN106017750A (en) * | 2015-03-26 | 2016-10-12 | 森萨塔科技公司 | Semiconductor strain gauge |
| CN108061534A (en) * | 2017-10-30 | 2018-05-22 | 哈尔滨理工大学 | A kind of novel electric power circuit Snow Thickness monitors system |
| CN108180819A (en) * | 2017-12-22 | 2018-06-19 | 太原理工大学 | A kind of ice layer thickness measuring device based on magnetoelastic material |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| GB2475553A (en) * | 2009-11-24 | 2011-05-25 | Qinetiq Ltd | A sensor arrangement for determining the rate of ice formation |
| CN103512484B (en) * | 2013-09-29 | 2016-08-17 | 华北水利水电大学 | Brill formula ice layer thickness automatic measuring instrument and measuring method thereof |
| CN108195282B (en) * | 2017-12-22 | 2020-11-03 | 太原理工大学 | Ice layer thickness measuring device based on piezoresistive sensor |
| CN109141210B (en) * | 2018-09-27 | 2019-10-15 | 山东大学 | A kind of semiconductor pressure resistance icing detector and working method |
-
2018
- 2018-09-27 CN CN201811131681.XA patent/CN109141210B/en active Active
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2019
- 2019-09-20 WO PCT/CN2019/107110 patent/WO2020063491A1/en active Application Filing
- 2019-09-20 LU LU101694A patent/LU101694B1/en active IP Right Grant
Patent Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5559302A (en) * | 1978-10-30 | 1980-05-02 | Mayekawa Mfg Co Ltd | Freezing thickness detector |
| CN103954209A (en) * | 2014-05-13 | 2014-07-30 | 湖南大学 | Ice coating monitoring system and method for fan blade based on piezoelectric materials |
| CN106017750A (en) * | 2015-03-26 | 2016-10-12 | 森萨塔科技公司 | Semiconductor strain gauge |
| CN108061534A (en) * | 2017-10-30 | 2018-05-22 | 哈尔滨理工大学 | A kind of novel electric power circuit Snow Thickness monitors system |
| CN108180819A (en) * | 2017-12-22 | 2018-06-19 | 太原理工大学 | A kind of ice layer thickness measuring device based on magnetoelastic material |
| CN108444375A (en) * | 2018-02-05 | 2018-08-24 | 哈尔滨工程大学 | A kind of ice model tank ice layer thickness real-time measurement apparatus and measuring system |
Also Published As
| Publication number | Publication date |
|---|---|
| CN109141210A (en) | 2019-01-04 |
| LU101694A1 (en) | 2020-03-31 |
| WO2020063491A1 (en) | 2020-04-02 |
| LU101694B1 (en) | 2020-08-03 |
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