CN109133598B - Method and device for correcting cutting track of glass substrate - Google Patents
Method and device for correcting cutting track of glass substrate Download PDFInfo
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- CN109133598B CN109133598B CN201810901023.8A CN201810901023A CN109133598B CN 109133598 B CN109133598 B CN 109133598B CN 201810901023 A CN201810901023 A CN 201810901023A CN 109133598 B CN109133598 B CN 109133598B
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- C03—GLASS; MINERAL OR SLAG WOOL
- C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
- C03B33/00—Severing cooled glass
- C03B33/02—Cutting or splitting sheet glass or ribbons; Apparatus or machines therefor
- C03B33/023—Cutting or splitting sheet glass or ribbons; Apparatus or machines therefor the sheet or ribbon being in a horizontal position
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Abstract
The invention relates to the field of glass cutting, in particular to a method and a device for correcting a cutting track of a glass substrate. The method comprises the following steps: acquiring an expected cutting track and a cutting track before correction; determining one or more deviation points of the pre-correction cutting track deviating from the expected cutting track according to the expected cutting track and the pre-correction cutting track; and correcting the actual cutting track according to the deviation amount of the deviation point from the expected cutting track. The method and the device can ensure the cutting directness of the glass substrate, thereby improving the quality of the subsequent process.
Description
Technical Field
The invention relates to the field of glass cutting, in particular to a method and a device for correcting a cutting track of a glass substrate.
Background
When the TFT-LCD glass substrate is subjected to deep processing, the glass substrate needs to be scribed and cut, and the scribing and cutting can ensure the processing quality and accuracy of subsequent edging and the like by ensuring high straightness. In the cutting device, the processing quality and the installation quality of the guide rail have a key effect on ensuring the straightness of the scribing and cutting, the processing and the installation of a portal frame, a tool rest and various adjusting devices have great influence on the straightness, the straightness of the scribing and cutting is reduced and the deviation is increased due to the abrasion of the guide rail in the using process, and the scribing and cutting quality is reduced due to the factors, so that the subsequent processing is influenced.
At present, the prior art lacks a method capable of ensuring the straightness of glass cutting.
Disclosure of Invention
The embodiment of the invention aims to provide a method and a device for correcting a cutting track of a glass substrate, which can ensure the cutting straightness of the glass substrate so as to improve the quality of the subsequent process.
In order to achieve the above object, an embodiment of the present invention provides a method of correcting a cutting trajectory of a glass substrate for a glass substrate cutting apparatus including a cutting driving module having a longitudinal movement axis moving in a cutting direction and a lateral movement axis moving perpendicular to the cutting direction, the method including: acquiring an expected cutting track and a cutting track before correction; determining one or more deviation points of the pre-correction cutting track deviating from the expected cutting track according to the expected cutting track and the pre-correction cutting track; and correcting the actual cutting track according to the deviation amount of the deviation point from the expected cutting track.
Wherein the correcting the actual cutting trajectory according to the deviation amount of the deviation point from the desired cutting trajectory comprises: and correcting the movement speeds of the transverse movement shaft and the longitudinal movement shaft according to the deviation amount of the deviation point from the expected cutting track so as to correct the actual cutting track.
Wherein the deviation amount comprises a longitudinal perpendicular distance of the deviation point from a starting point of the desired cutting trajectory and a perpendicular distance of the deviation point from the desired cutting trajectory.
Wherein the correcting the moving speeds of the transverse moving axis and the longitudinal moving axis according to the deviation amount of the deviation point from the desired cutting trajectory comprises: modifying the speed of movement of the transverse axis of motion and the longitudinal axis of motion according to the following equation:
wherein M isiIs a longitudinal perpendicular distance from the start point of the desired cutting track to the ith deviation point in the end point direction from the start point of the desired cutting track, NiIs the vertical distance, V, of the ith deviation point from the desired cutting pathi1Is the corrected movement speed of the longitudinal movement axis from the i-1 st deviation point to the i-th deviation point, Vi2The corrected motion speed of the transverse motion shaft when the transverse motion shaft moves from the ith-1 deviation point to the ith deviation point is V, the motion speed of the cutting driving module before correction is V, and i is a natural number.
According to another aspect of the present invention, there is also provided a device for correcting a cutting trajectory of a glass substrate, the device being used for a glass substrate cutting apparatus including a cutting driving module having a longitudinal movement axis moving in a cutting direction and a lateral movement axis moving perpendicular to the cutting direction, the device including: the acquisition module is used for acquiring an expected cutting track and a cutting track before correction; a determining module, configured to determine, according to the desired cutting trajectory and the pre-correction cutting trajectory, one or more deviation points at which the pre-correction cutting trajectory deviates from the desired cutting trajectory; and the correction module is used for correcting the actual cutting track according to the deviation amount of the deviation point deviating from the expected cutting track.
Wherein the correcting the actual cutting trajectory according to the deviation amount of the deviation point from the desired cutting trajectory comprises: and correcting the movement speeds of the transverse movement shaft and the longitudinal movement shaft according to the deviation amount of the deviation point from the expected cutting track so as to correct the actual cutting track.
Wherein the deviation amount comprises a longitudinal perpendicular distance of the deviation point from a starting point of the desired cutting trajectory and a perpendicular distance of the deviation point from the desired cutting trajectory.
Wherein the correcting the moving speeds of the transverse moving axis and the longitudinal moving axis according to the deviation amount of the deviation point from the desired cutting trajectory comprises: modifying the speed of movement of the transverse axis of motion and the longitudinal axis of motion according to the following equation:
wherein M isiIs a distance from the i-th deviation point in the direction from the starting point to the end point of the expected cutting track to the expected cuttingLongitudinal vertical distance of track start, NiIs the vertical distance, V, of the ith deviation point from the desired cutting pathi1Is the corrected movement speed of the longitudinal movement axis from the i-1 st deviation point to the i-th deviation point, Vi2The corrected motion speed of the transverse motion shaft when the transverse motion shaft moves from the ith-1 deviation point to the ith deviation point is V, the motion speed of the cutting driving module before correction is V, and i is a natural number.
According to yet another aspect of the present invention, there is also provided a machine-readable storage medium having stored thereon instructions for causing a machine to perform the method of the present invention.
Through the technical scheme, the uncorrected cutting track and the expected cutting track are compared, and the actual correction track is corrected according to the deviation degree of the cutting track before correction, so that the cutting deviation caused by the cutting device can be corrected, the straightness of the corrected actual cutting track can be ensured, and the adverse effect of the cutting of the glass substrate on the quality of the subsequent process is prevented.
Additional features and advantages of embodiments of the invention will be set forth in the detailed description which follows.
Drawings
The accompanying drawings, which are included to provide a further understanding of the embodiments of the invention and are incorporated in and constitute a part of this specification, illustrate embodiments of the invention and together with the description serve to explain the embodiments of the invention without limiting the embodiments of the invention. In the drawings:
fig. 1 is an example of a structure of a cutting device to which the method and apparatus for correcting a cutting trajectory of a glass substrate according to the embodiment of the present invention is applied;
FIG. 2 is a flow chart of a method for correcting a cutting trajectory of a glass substrate according to an embodiment of the present invention;
FIG. 3 is a flow chart of a method of correcting a cutting trajectory of a glass substrate according to another embodiment of the present invention;
FIG. 4 is a reference diagram illustrating a method of correcting a cutting trace of a glass substrate according to another embodiment of the present invention;
FIG. 5 is a block diagram of an apparatus for correcting a cutting trajectory of a glass substrate according to an embodiment of the present invention; and
fig. 6 is a partial schematic view of an apparatus for correcting a cutting trajectory of a glass substrate according to an embodiment of the present invention.
Description of the reference numerals
1: a cutter wheel 2: knife rest
3: and (4) guide rod: servo motor
5: a portal frame 6: guide rail
7: the cutting platform 10: acquisition module
20: the determination module 30: correction module
Detailed Description
The following detailed description of embodiments of the invention refers to the accompanying drawings. It should be understood that the detailed description and specific examples, while indicating embodiments of the invention, are given by way of illustration and explanation only, not limitation.
Fig. 1 is an example of a structure of a cutting device to which the method and apparatus for correcting a cutting trajectory of a glass substrate according to the embodiment of the present invention are applied. As shown in fig. 1, the cutting device for scribing and cutting the TFT-LCD glass substrate mainly includes a cutter wheel 1, a cutter frame 2, a guide rod 3, a servo motor 4, a gantry 5, and a guide rail 6, and the cutting device can be mounted on a cutting platform 7 to cut the glass substrate placed on the cutting platform 7. The line AB in the figure shows the longitudinal direction when the glass substrate is cut. The tool rest 2 and the servo motor 4 are arranged on the portal frame 5, and the servo motor 4 drives the guide rod 3 to move, so that the tool rest 2 can move along the portal frame 5 along the transverse direction (namely the direction vertical to the AB line) vertical to the cutting direction. The gantry 5 is movable along the guide rail 6 and thus movable in the longitudinal direction to scribe and cut the cutter wheel 1 on the glass substrate along a straight line AB. Wherein the guide rails 6 are mounted on both sides of the cutting platform 7.
Fig. 2 is a flowchart of a method for correcting a cutting trajectory of a glass substrate according to an embodiment of the present invention. As shown in fig. 2, the method of the present invention comprises the steps of:
step S210, a desired cutting trajectory and a cutting trajectory before correction are acquired. The desired cutting trajectory is a straight line in the cutting direction, as indicated by line AB in fig. 4. However, due to factors such as aging of the cutting equipment, vibration of the cutting table, or instability of the equipment, the cutting trajectory before correction often deviates from the desired cutting trajectory. As shown in the left half of fig. 4, an example of the cutting trajectory before correction is shown, and a broken line L1 in fig. 4 represents the cutting trajectory before correction.
A coordinate system can be established by taking the transverse movement direction and the longitudinal movement direction of the cutting driving module as coordinate axes, and the expected cutting track and the cutting track before correction can be input by a coordinate input mode or stored in a storage device in a coordinate mode. The pre-correction cutting trajectory may also be obtained by recording the movement trajectory of the cutting drive module (e.g., determining the coordinates of a point on the cutting trajectory at a particular time based on the movement distance in the lateral direction and the movement distance in the longitudinal direction at the particular time). For example, since the desired cutting trajectory is a straight line, the desired cutting trajectory may be input by setting coordinates of a start point and an end point (e.g., a point a and a point B) of the desired cutting trajectory, or the coordinates of the start point and the end point may also be stored in a storage device for reading by the control system.
For the pre-correction cutting track, for example, the motion track of the cutting driving module may be recorded in real time and stored in the storage device, or the pre-correction cutting track may be determined according to a plurality of motion tracks recorded in a specific time period. In practice it may also be provided that the correction function for the cutting trajectory can be selectively activated or deactivated. When the cutting track of the device is found to not meet the straightness requirement, the correction function can be started, so that the cutting track can be corrected according to the cutting track before correction determined by the recorded motion track of the cutting driving module and the input (or stored) expected cutting track.
Step S220, determining one or more deviation points at which the pre-correction cutting trajectory deviates from the desired cutting trajectory according to the desired cutting trajectory and the pre-correction cutting trajectory. The deviation point may be a vertex of the deviation portion in the deviation direction, as shown in fig. 4, and may be C1, D1, E1. The number and the positions of the deviation points can be determined according to the deviation degree of the cutting track before correction.
For example, the vertex of the deviated portion in the deviated direction may be selected as the deviated point from the coordinates of the corrected before-cutting trajectory in the coordinate system established as described above. For example, the line AB may be taken as a longitudinal coordinate axis, so that on the cutting trajectory before correction, a point with the largest absolute value of the transverse coordinate value is selected as a deviation point from a curve between two adjacent points with longitudinal coordinate values of 0; alternatively, on the cutting trajectory before correction, several points at equal intervals may be selected as deviation points on the basis of the longitudinal distance from the curve between two adjacent points whose longitudinal coordinate values are 0. The deviation point can also be input in a manual input mode, for example, a plurality of points are selected from the corrected cutting track as the deviation point after the correction is determined, and the coordinates of the deviation point are input into the control system.
And step S230, correcting the actual cutting track according to the deviation amount of the deviation point from the expected cutting track. The cutting trajectory deviating from the desired cutting trajectory can be compensated for by the deviation, for example, it can be corrected in reverse, so that the cutting trajectory approaches the desired cutting trajectory.
Fig. 3 is a flowchart of a method of correcting a cutting trajectory of a glass substrate according to another embodiment of the present invention. As shown in fig. 3, the correction of the cutting trajectory may preferably be achieved by:
and S330, correcting the movement speeds of the transverse movement shaft and the longitudinal movement shaft according to the deviation amount of the deviation point from the expected cutting track so as to correct the actual cutting track. By controlling the speed of the transverse movement axis and the longitudinal movement axis of the cutting driving module, the inherent deviation caused by equipment or environmental factors can be compensated, and the cutting track can be controlled.
The deviation amount may include a longitudinal perpendicular distance of the deviation point from a starting point of the desired cutting trajectory and a perpendicular distance of the deviation point from the desired cutting trajectory. As shown in fig. 4, the longitudinal perpendicular distance M1 of the deviation point from the desired cutting trajectory and the barycentric distance N1 of the deviation point from the line AB are shown.
Here, steps S310 and S320 in the embodiment shown in fig. 3 synchronize steps S210 and S220, and thus, a description will not be repeated.
Thus, the movement speeds of the transverse movement axis and the longitudinal movement axis can be corrected according to the following equation:
wherein M isiIs a longitudinal perpendicular distance from the start point of the desired cutting track to the ith deviation point in the end point direction from the start point of the desired cutting track, NiIs the vertical distance, V, of the ith deviation point from the desired cutting pathi1Is the corrected movement speed of the longitudinal movement axis from the i-1 st deviation point to the i-th deviation point, Vi2The corrected motion speed of the transverse motion shaft when the transverse motion shaft moves from the ith-1 deviation point to the ith deviation point is V, the motion speed of the cutting driving module before correction is V, and i is a natural number. The minus sign "-" in the above formula indicates the opposite direction, i.e., the opposite direction from the direction in which the deviation point deviates from the AB line.
The above-described embodiment is equivalent to superimposing the trajectory symmetrical to the pre-correction cutting trajectory as shown in the right half of fig. 4 on the pre-correction cutting trajectory, thereby compensating the offset of the pre-correction cutting trajectory to conform to the desired cutting trajectory. As an appropriate modification to the above embodiment, after the deviation point is determined, a symmetrical point of the deviation point about the line AB may be determined, the vertical distance from the point a and the vertical distance from the line AB may be determined, and the velocity of the longitudinal motion axis and the velocity of the lateral motion axis may be corrected using the above equation, in which case the velocity of the lateral motion axis is corrected without the negative sign.
Fig. 5 is a block diagram illustrating an apparatus for correcting a cutting trajectory of a glass substrate according to an embodiment of the present invention. As shown in fig. 5, the apparatus includes: an obtaining module 10, configured to obtain a desired cutting trajectory and a cutting trajectory before correction; a determining module 20, configured to determine, according to the desired cutting trajectory and the pre-correction cutting trajectory, one or more deviation points at which the pre-correction cutting trajectory deviates from the desired cutting trajectory; and a correction module 30 for correcting the actual cutting trajectory according to the deviation amount of the deviation point from the desired cutting trajectory.
Wherein the correcting the actual cutting trajectory according to the deviation amount of the deviation point from the desired cutting trajectory comprises: and correcting the movement speeds of the transverse movement shaft and the longitudinal movement shaft according to the deviation amount of the deviation point from the expected cutting track so as to correct the actual cutting track.
Wherein the deviation amount comprises a longitudinal perpendicular distance of the deviation point from a starting point of the desired cutting trajectory and a perpendicular distance of the deviation point from the desired cutting trajectory.
Wherein modifying the speed of movement of the transverse axis of motion and the longitudinal axis of motion is modifiable according to the method described above.
The above detailed description of the method for correcting the cutting trajectory of the glass substrate is also applicable to the apparatus of the present invention, and thus will not be described repeatedly.
The following illustrates the process of correcting the cutting track of the glass substrate according to the present invention:
first, the corrected cutting trajectory L1 and the expected cutting trajectory AB line as shown in the left part of fig. 4 are confirmed, and deviation points C1, D1, E1 deviating from the AB line are determined on L1;
as an example of the above-mentioned variant embodiment, the points of symmetry C2, D2, E2 of C1, D1, E1, or the trajectory of symmetry L2 of L1 may be determined, determining the points C2, D2, E2 at which the trajectory L2 deviates from the AB line;
determining the length P1 of the expected cutting track AB line;
determining longitudinal perpendicular distances M1, M2 and M3 of the deviation points C1, D1 and E1 from the starting point A of the ideal reticle AB;
determining the vertical distances N1, N2 and N3 from the deviation points C1, D1 and E1 to the AB line (N1, N2 and N3 are used for distinguishing positive and negative, for example, the distance in the left direction of the AB can be positive, and the distance in the right direction can be negative, and if the motor installation direction changes or the sign of the steering parameter change can be changed correspondingly);
as shown in fig. 6, which is a schematic diagram of a control procedure of the servo motor, M1, M2, M3 and P1 can be written into addresses D200, D202, D204 and D206 respectively, and N1, N2, N3 and 0 can be written into addresses D300, D302, D304 and D306 respectively; where the starting point a and the end point B of the AB line may also be considered as deviation points, in this case, the value 0 of the write address D306 represents the vertical distance of the B point from the AB line, and the value P1 of the write address D206 represents the longitudinal vertical distance of the B point from the starting point a of the desired cutting trajectory AB line. In this case, the offset points correspond to A, C1, D1, E1, and B in this order.
The parameters can be set manually or after being determined by the operation of a control program. After the parameters are set, the control program can correct the motion speed of the cutting driving module in each section according to the equation.
For example, in the section from a to C1, the corrected longitudinal movement speed V11 and the corrected lateral movement speed V12 are:
from the section C1 to D1, the corrected longitudinal movement speed V21 and the corrected transverse movement speed V22 are:
similarly, in the section E1 to B, the corrected longitudinal moving speed V41 and the corrected transverse moving speed V42 are (M4 is P1, and N4 is 0 in the following equation):
when the cutting track changes, the number of the deviation points can be properly increased or decreased so as to revise the cutting track again.
Although the embodiments of the present invention have been described in detail with reference to the accompanying drawings, the embodiments of the present invention are not limited to the details of the above embodiments, and various simple modifications can be made to the technical solutions of the embodiments of the present invention within the technical idea of the embodiments of the present invention, and the simple modifications all belong to the protection scope of the embodiments of the present invention.
It should be noted that the various features described in the above embodiments may be combined in any suitable manner without departing from the scope of the invention. In order to avoid unnecessary repetition, the embodiments of the present invention do not describe every possible combination.
Those skilled in the art will understand that all or part of the steps in the apparatus according to the above embodiments may be implemented by a program, which is stored in a storage medium and includes several instructions to enable a single chip, a chip, or a processor (processor) to execute all or part of the steps of the apparatus according to the various embodiments of the present application. And the aforementioned storage medium includes: a U-disk, a removable hard disk, a Read-Only Memory (ROM), a Random Access Memory (RAM), a magnetic disk or an optical disk, and other various media capable of storing program codes.
In addition, any combination of various different implementation manners of the embodiments of the present invention is also possible, and the embodiments of the present invention should be considered as disclosed in the embodiments of the present invention as long as the combination does not depart from the spirit of the embodiments of the present invention.
Claims (3)
1. A method of correcting a glass substrate cutting trajectory for a glass substrate cutting apparatus including a cutting drive module having a longitudinal axis of motion in a cutting direction and a transverse axis of motion perpendicular to the cutting direction, the method comprising:
acquiring an expected cutting track and a cutting track before correction;
determining one or more deviation points of the pre-correction cutting track deviating from the expected cutting track according to the expected cutting track and the pre-correction cutting track; and
correcting the movement speeds of the transverse movement shaft and the longitudinal movement shaft according to the deviation amount of the deviation point from the expected cutting track so as to correct the actual cutting track;
the deviation amount comprises a longitudinal vertical distance of the deviation point from the starting point of the desired cutting track and a vertical distance of the deviation point from the desired cutting track;
the correcting the moving speeds of the transverse moving axis and the longitudinal moving axis according to the deviation amount of the deviation point from the expected cutting track comprises:
modifying the speed of movement of the transverse axis of motion and the longitudinal axis of motion according to the following equation:
wherein M isiIs a longitudinal perpendicular distance from the start point of the desired cutting track to the ith deviation point in the end point direction from the start point of the desired cutting track, NiFor the ith deviation point from theVertical distance of desired cutting path, Vi1Is the corrected movement speed of the longitudinal movement axis from the i-1 st deviation point to the i-th deviation point, Vi2Is the corrected moving speed of the transverse moving shaft from the i-1 th deviation point to the i-th deviation point, V1For the corrected speed of movement, V, of the longitudinal axis of movement2I is a natural number, i is the movement speed before correction of the transverse movement axis.
2. An apparatus for correcting a cutting trajectory of a glass substrate for a glass substrate cutting device including a cutting driving module having a longitudinal movement axis moving in a cutting direction and a lateral movement axis moving perpendicular to the cutting direction, the apparatus comprising:
the acquisition module is used for acquiring an expected cutting track and a cutting track before correction;
a determining module, configured to determine, according to the desired cutting trajectory and the pre-correction cutting trajectory, one or more deviation points at which the pre-correction cutting trajectory deviates from the desired cutting trajectory; and
the correction module is used for correcting the movement speeds of the transverse movement shaft and the longitudinal movement shaft according to the deviation amount of the deviation point deviating from the expected cutting track so as to correct the actual cutting track; the offset comprises a longitudinal perpendicular distance of the offset point from a start of the desired cutting trajectory;
modifying the speed of movement of the transverse axis of motion and the longitudinal axis of motion based on the amount of deviation of the deviation point from the desired cutting path comprises:
modifying the speed of movement of the transverse axis of motion and the longitudinal axis of motion according to the following equation:
wherein M isiIs a longitudinal perpendicular distance from the start point of the desired cutting track to the ith deviation point in the end point direction from the start point of the desired cutting track, NiIs the vertical distance, V, of the ith deviation point from the desired cutting pathi1Is the corrected movement speed of the longitudinal movement axis from the i-1 st deviation point to the i-th deviation point, Vi2The corrected motion speed of the transverse motion shaft when the transverse motion shaft moves from the ith-1 deviation point to the ith deviation point is V, the motion speed of the cutting driving module before correction is V, and i is a natural number.
3. A machine-readable storage medium having stored thereon instructions for causing a machine to perform the method of claim 1.
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| CN111832147A (en) * | 2019-09-26 | 2020-10-27 | 法国圣戈班玻璃公司 | Method, apparatus and system for glass bending |
| CN117742239B (en) * | 2024-02-19 | 2024-05-14 | 南京超颖新能源科技有限公司 | Vertical correction system and correction method for machine tool |
Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP1094376A1 (en) * | 1999-10-22 | 2001-04-25 | Gerber Scientific Products, Inc. | A method of compensating for cutter deflection |
| CN104204977A (en) * | 2012-03-21 | 2014-12-10 | 三菱电机株式会社 | Track control device |
| CN104529141A (en) * | 2014-12-17 | 2015-04-22 | 上海维宏电子科技股份有限公司 | Method for realizing automatic distance compensation in glass cutting system |
| CN104615084A (en) * | 2015-01-23 | 2015-05-13 | 大连理工大学 | Machining feed speed optimized tool path curve contour error compensation method |
| CN104843982A (en) * | 2014-02-18 | 2015-08-19 | 均豪精密工业股份有限公司 | Visual measurement compensating system and method thereof |
| CN107463150A (en) * | 2017-09-14 | 2017-12-12 | 上海维宏电子科技股份有限公司 | Realize that digital control system crosses the method that quadrant second compensation controls based on dynamic model |
-
2018
- 2018-08-09 CN CN201810901023.8A patent/CN109133598B/en active Active
Patent Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP1094376A1 (en) * | 1999-10-22 | 2001-04-25 | Gerber Scientific Products, Inc. | A method of compensating for cutter deflection |
| CN104204977A (en) * | 2012-03-21 | 2014-12-10 | 三菱电机株式会社 | Track control device |
| CN104843982A (en) * | 2014-02-18 | 2015-08-19 | 均豪精密工业股份有限公司 | Visual measurement compensating system and method thereof |
| CN104529141A (en) * | 2014-12-17 | 2015-04-22 | 上海维宏电子科技股份有限公司 | Method for realizing automatic distance compensation in glass cutting system |
| CN104615084A (en) * | 2015-01-23 | 2015-05-13 | 大连理工大学 | Machining feed speed optimized tool path curve contour error compensation method |
| CN107463150A (en) * | 2017-09-14 | 2017-12-12 | 上海维宏电子科技股份有限公司 | Realize that digital control system crosses the method that quadrant second compensation controls based on dynamic model |
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Effective date of registration: 20200914 Address after: 050035 No. 9, the Yellow River Avenue, hi tech Zone, Hebei, Shijiazhuang Applicant after: DONGXU OPTOELECTRONIC TECHNOLOGY Co.,Ltd. Address before: The 100075 Beijing Seahawks Fengtai District Science City Road No. 9 Building No. 2 room 266 (Park) Applicant before: TUNGHSU TECHNOLOGY GROUP Co.,Ltd. Applicant before: TUNGHSU GROUP Co.,Ltd. |
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