CN109132003B - Product processing method using protective film - Google Patents
Product processing method using protective film Download PDFInfo
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- CN109132003B CN109132003B CN201710448310.3A CN201710448310A CN109132003B CN 109132003 B CN109132003 B CN 109132003B CN 201710448310 A CN201710448310 A CN 201710448310A CN 109132003 B CN109132003 B CN 109132003B
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
- B65B—MACHINES, APPARATUS OR DEVICES FOR, OR METHODS OF, PACKAGING ARTICLES OR MATERIALS; UNPACKING
- B65B33/00—Packaging articles by applying removable, e.g. strippable, coatings
- B65B33/02—Packaging small articles, e.g. spare parts for machines or engines
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
- B65B—MACHINES, APPARATUS OR DEVICES FOR, OR METHODS OF, PACKAGING ARTICLES OR MATERIALS; UNPACKING
- B65B61/00—Auxiliary devices, not otherwise provided for, for operating on sheets, blanks, webs, binding material, containers or packages
- B65B61/04—Auxiliary devices, not otherwise provided for, for operating on sheets, blanks, webs, binding material, containers or packages for severing webs, or for separating joined packages
- B65B61/06—Auxiliary devices, not otherwise provided for, for operating on sheets, blanks, webs, binding material, containers or packages for severing webs, or for separating joined packages by cutting
- B65B61/065—Auxiliary devices, not otherwise provided for, for operating on sheets, blanks, webs, binding material, containers or packages for severing webs, or for separating joined packages by cutting by punching out
Abstract
The invention provides a product processing method using a protective film, which comprises the following steps: attaching the protective film to a substrate to form a substrate composite layer with a film-forming shape, wherein a region, corresponding to the film-forming shape, on the substrate composite layer is a cavity, and a region, corresponding to the non-film-forming shape, on the substrate composite layer is covered with the protective film; performing film forming processing on the substrate composite layer with the film-formed shape; removing the protective film on the base composite layer after film forming; and cutting the substrate composite layer with the protective film removed according to the shape of the preset product to obtain the product. By applying the technical scheme of the invention, the problem of high product forming difficulty in the prior art is solved.
Description
Technical Field
The invention relates to the technical field of precision element processing, in particular to a product processing method utilizing a protective film.
Background
Currently, when producing products with special shape and size requirements, it is common to use a film forming process on a base material and to obtain the desired product by blanking. In this case, since the film formation layer on the base is different from the base material, there is a problem that cracks, burrs, chips, and the like are generated at the time of punching operation.
Disclosure of Invention
The invention provides a product processing method by using a protective film, which aims to solve the problem of high product forming difficulty in the prior art.
The invention provides a product processing method by utilizing a protective film, which comprises the following steps: attaching the protective film to a substrate to form a substrate composite layer with a film-forming shape, wherein a region, corresponding to the film-forming shape, on the substrate composite layer is a cavity, and a region, corresponding to the non-film-forming shape, on the substrate composite layer is covered with the protective film; performing film forming processing on the substrate composite layer with the film-formed shape; removing the protective film on the base composite layer after film forming; and cutting the substrate composite layer with the protective film removed according to the shape of the preset product to obtain the product.
Further, the forming process of the base composite layer having the shape of the film includes: attaching a protective film to the substrate to form a substrate composite layer; and cutting the protective film on the substrate according to the shape of the formed film in the preset product, and removing the part of the protective film on the substrate, which has the shape of the formed film in the preset product, so as to form a substrate composite layer having the shape of the formed film.
Further, the forming process of the base composite layer having the shape of the film includes: cutting the protective film according to the shape of the formed film in a preset product to obtain the protective film with the shape of the formed film; a protective film having a film-formed shape is attached to a substrate to form a substrate composite layer having a film-formed shape.
Further, the base material of the matrix comprises an organic plastic.
Further, the film formation process is one of uniform film formation, non-uniform film formation, and precise film formation.
Further, the cutting of the protective film on the substrate according to the shape of the film formed in the preset product includes: dividing a film forming shape region and a stress release region on the protective film according to the shape of a formed film in a preset product; the cutting tool cuts the protective film according to the film forming shape area and the stress release area; wherein the cutting depth when the protective film is cut according to the film formation shape area and the stress release area is greater than or equal to the thickness of the protective film.
Further, the film thickness of the base composite layer after the film formation is not more than the thickness of the protective film.
Further, the thickness of the protective film is not more than 200 μm.
By applying the technical scheme of the invention, after the matrix composite layer with the film-forming shape is formed, the matrix composite layer with the film-forming shape is subjected to film-forming processing, the protective film on the matrix composite layer subjected to film-forming processing is removed, and the matrix composite layer without the protective film is cut according to the preset product shape to obtain the product.
Drawings
The accompanying drawings, which are incorporated in and constitute a part of this application, illustrate embodiments of the invention and, together with the description, serve to explain the invention and not to limit the invention. In the drawings:
fig. 1 is a flow chart illustrating a method for processing a first type of product using a protective film according to a first embodiment of the present invention;
FIG. 2 is a flow chart illustrating a method for processing a second type of product using a protective film according to a first embodiment of the present invention;
FIG. 3 is a flow chart illustrating a method for processing a first type of product using a protective film according to a second embodiment of the present invention;
FIG. 4 is a flow chart illustrating a method for processing a second type of product using a protective film according to a second embodiment of the present invention;
FIG. 5 illustrates a front view of a protective film with negative lines provided in accordance with an embodiment of the present invention;
fig. 6 shows a top view of the protective film of fig. 5 with the negative lines.
Wherein the figures include the following reference numerals:
10. a protective film; 20. a substrate; 30. a release film; 40. forming a film; 50. a cavity; a. uniformly forming a film; b. forming a film unevenly; c. accurately forming a film; l, the shade line.
Detailed Description
The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. The following description of at least one exemplary embodiment is merely illustrative in nature and is in no way intended to limit the invention, its application, or uses. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
It is noted that the terminology used herein is for the purpose of describing particular embodiments only and is not intended to be limiting of example embodiments according to the present application. As used herein, the singular forms "a", "an" and "the" are intended to include the plural forms as well, and it should be understood that when the terms "comprises" and/or "comprising" are used in this specification, they specify the presence of stated features, steps, operations, devices, components, and/or combinations thereof, unless the context clearly indicates otherwise.
The relative arrangement of the components and steps, the numerical expressions and numerical values set forth in these embodiments do not limit the scope of the present invention unless specifically stated otherwise. Meanwhile, it should be understood that the sizes of the respective portions shown in the drawings are not drawn in an actual proportional relationship for the convenience of description. Techniques, methods, and apparatus known to those of ordinary skill in the relevant art may not be discussed in detail but are intended to be part of the specification where appropriate. In all examples shown and discussed herein, any particular value should be construed as merely illustrative, and not limiting. Thus, other examples of the exemplary embodiments may have different values. It should be noted that: like reference numbers and letters refer to like items in the following figures, and thus, once an item is defined in one figure, further discussion thereof is not required in subsequent figures.
In the description of the present invention, it is to be understood that the orientation or positional relationship indicated by the orientation words such as "front, rear, upper, lower, left, right", "lateral, vertical, horizontal" and "top, bottom", etc. are usually based on the orientation or positional relationship shown in the drawings, and are only for convenience of description and simplicity of description, and in the case of not making a reverse description, these orientation words do not indicate and imply that the device or element being referred to must have a specific orientation or be constructed and operated in a specific orientation, and therefore, should not be considered as limiting the scope of the present invention; the terms "inner and outer" refer to the inner and outer relative to the profile of the respective component itself.
Spatially relative terms, such as "above … …," "above … …," "above … …," "above," and the like, may be used herein for ease of description to describe one device or feature's spatial relationship to another device or feature as illustrated in the figures. It will be understood that the spatially relative terms are intended to encompass different orientations of the device in use or operation in addition to the orientation depicted in the figures. For example, if a device in the figures is turned over, devices described as "above" or "on" other devices or configurations would then be oriented "below" or "under" the other devices or configurations. Thus, the exemplary term "above … …" can include both an orientation of "above … …" and "below … …". The device may be otherwise variously oriented (rotated 90 degrees or at other orientations) and the spatially relative descriptors used herein interpreted accordingly.
It should be noted that the terms "first", "second", and the like are used to define the components, and are only used for convenience of distinguishing the corresponding components, and the terms have no special meanings unless otherwise stated, and therefore, the scope of the present invention should not be construed as being limited.
As shown in fig. 1 to 2, according to an embodiment of the present invention, there is provided a product processing method using a protective film, the method including forming a base composite layer having a shape of a film 40 by attaching the protective film 10 to a base 20, and forming a cavity in a region of the base composite layer corresponding to the shape of the film 40, covering the region of the base composite layer corresponding to the shape of the film 40 with the protective film 10, performing a film formation process on the base composite layer having the shape of the film 40, removing the protective film 10 from the base composite layer after the film formation process, and cutting the base composite layer from which the protective film 10 is removed according to a predetermined product shape to obtain a product.
By applying the configuration mode, after the matrix composite layer with the film-forming shape is formed, the matrix composite layer with the film-forming shape 40 is subjected to film-forming processing, the protective film 10 on the matrix composite layer after the film-forming processing is removed, and the matrix composite layer with the protective film 10 removed is subjected to cutting processing according to the preset product shape to obtain a product. Compared with the mode of buffering blanking stress by covering a protective film on a formed film in the prior art, the mode of the invention avoids the problems of cracking, burrs, chipping and the like caused by the difference between the formed film layer and a base material because the formed film does not need to be cut.
Further, as shown in fig. 1 and 2, as a first embodiment of the present invention, in order to obtain a base composite layer having a film-formed shape, the base composite layer having the shape of the film 40 may be formed by attaching the protective film 10 on the base 20 to form the base composite layer, cutting the protective film 10 on the base 20 according to the shape of the film 40 in a predetermined product, and removing a portion of the protective film 10 on the base 20 having the shape of the film 40 in the predetermined product.
Specifically, in the present invention, in order to increase the production yield of the product, the protective film 10 is attached to the substrate 20 to form a substrate composite layer, and after the attachment is completed, the protective film 10 on the substrate 20 is cut in accordance with the shape of the film formed in the predetermined product to form a plurality of protective film portions corresponding to the structure of the shape of the film formed on the protective film 10. After the cutting is completed, portions of the protective film formed on the protective film 10 corresponding to the plurality of film-formed shape structures are removed to form a base composite layer having a film-formed shape.
In the present invention, the base material of the base 20 includes organic plastics such as PET, PP, PE, etc., but is not limited thereto. The protective film 10 includes acrylic, silicone, polyurethane, and other protective films having adhesives, and various self-adhesive protective films. Further, in the present invention, the thickness of the protective film 10 is not more than 200 μm. In order to obtain a substrate composite layer having the shape of the film 40, a cutting jig may be designed according to the shape of the film 40 to be obtained. In order to ensure that the portion of the protective film cut corresponding to the shape of the formed film 40 in the preset product can smoothly peel off the protective film 10, the cutting depth of the cutting jig may be set to be greater than or equal to the thickness of the protective film 10.
In the present invention, the cutting of the portion of the protective film corresponding to the shape of the formed film 40 in the predetermined product may be performed after the protective film 10 is attached to the substrate 20, or may be performed before the protective film 10 is attached to the substrate 20. As shown in fig. 3 and 4, according to the second embodiment of the present invention, the formation process of the base composite layer having the shape of the film 40 includes: the protective film 10 is cut according to the shape of the film 40 in a preset product to obtain the protective film 10 having the shape of the film 40, and the protective film 10 having the shape of the film 40 is attached to the substrate 20 to form a substrate composite layer having the shape of the film 40.
With this arrangement, the protective film 10 can be placed on another member to perform cutting of the portion of the protective film corresponding to the shape of the formed film 40 in the predetermined product, and the protective film 10 having the shape of the formed film 40 in the predetermined product is placed on the base 20 after the cutting is completed. As the second embodiment of the present invention, in order to facilitate the peeling of the protective film, other components may be specifically provided as the release film 30.
Further, in the present invention, in order to reduce the deformation of the product generated when the excess protective film is torn off after the film formation, the protective film 10 may be first attached to the substrate 20 to form a substrate composite layer, the film formation shape region and the stress release region are divided on the protective film 10 according to the shape of the film 40 in the predetermined product, the cutter cuts the protective film 10 according to the film formation shape region and the stress release region to form a substrate composite layer having the shape of the film, then performs the film formation process on the substrate composite layer having the shape of the film 40, and finally performs the cutting process on the substrate composite layer after the film formation process according to the predetermined product shape to obtain the product.
By applying the product processing method, the film forming shape area and the stress release area are divided on the protective film, so that the influence of stress generated in film forming on the shape and the size of a product can be reduced, and the product deformation generated when the redundant protective film is torn after the film forming is reduced. Specifically, in the present invention, the product is an assembly of the substrate 20 covered with the film 40, and the predetermined product shape includes triangles, rectangles, squares, pentagons, circles and other irregular structural shapes with various sizes. The predetermined product shape as defined herein refers to a sample size of the product, and the size of the shape of the actually obtained product is allowed to be slightly different from the predetermined product shape.
Specifically, as shown in fig. 5 and 6, the film formation region corresponds to the void 50, and the stress relief region corresponds to the shadow line L. By improving the design of the cutting jig, when the cutting jig is used for cutting the protective film 10, the edge corresponding to the shape of the formed film in the preset product can generate the female line L, as a first embodiment of the present invention, the structural shape of the formed film is a circular structure, four circular cavities 50 are cut on the protective film 10 according to the shape of the preset product through the function of the cutting jig, four female lines L are uniformly distributed along the circumference of the circular cavities 50, and through the function of the female lines L, the stress generated during film forming can be reduced during film forming, so that the influence on the shape and size of the formed film in the preset product is avoided. Moreover, the shadow line L also can reduce the product deformation generated when the redundant protective film is removed from the base composite layer after the film forming processing, thereby improving the product yield.
In the first embodiment of the present invention, in order to prevent damage to the substrate 20 and to ensure smooth peeling of the cut protective film, the cutting depth of the jig may be set to be the same as the protective film 10. Alternatively, as another embodiment of the present invention, the cutting depth of the jig may be set to be greater than the thickness of the protective film 10.
Further, in the present invention, the cutting the substrate composite layer after the film forming process according to the predetermined product shape includes: the protective film 10 on the base composite layer after the film formation process is removed, and the base composite layer from which the protective film 10 is removed is cut.
Specifically, the thickness of the film 40 formed on the base composite layer after the film forming process is not more than the thickness of the protective film 10. Specifically, as shown in fig. 1 and 2, the film formation process includes three kinds, which are uniform film formation a, non-uniform film formation b, and precise film formation c, respectively. Wherein the uniform film formation a is a vapor deposition film formation, the non-uniform film formation b is a liquid phase film formation, and the precise film formation c is a 3D printing type. In the embodiment of the present invention, the film formation process for the base composite layer specifically includes a gas deposition film formation method using CVD, PVD, PECVD, or the like, and a liquid film formation method using a suspension, dimple, slit, or the like, as well as a precision film formation method.
Further, in order to ensure the yield of the product, the cutting process of the base composite layer from which the protective film 10 is removed includes cutting along the shape edge of the desired product so that the shape size of the resulting product is equal to or larger than the preset product shape size specified by the customer, but the excess should not exceed the maximum range specified by the customer. Specifically, in the present invention, as shown in fig. 1, the shape and size of the first type of product obtained by cutting is equal to the shape and size of the preset product, and as shown in fig. 2, the shape and size of the second type of preset product obtained by cutting is larger than the shape and size of the preset product. In order to ensure the yield of products and facilitate the module installation, the cutting size of the cutting treatment on the substrate composite layer after the film forming processing is set to be larger than the shape and size of a preset product.
For a further understanding of the present invention, the process for preparing the product of the first embodiment of the present invention will be described in detail with reference to FIGS. 1, 5 and 6.
Firstly, a protective film 10 is attached to a substrate 20 to form a substrate composite layer, a film forming shape area and a stress release area are divided on the protective film 10 according to the shape of a formed film 40 in a preset product, a cutter cuts the protective film 10 according to the film forming shape area and the stress release area so as to punch the shape and the size of the formed film 40 in the preset product specified by a customer on the protective film of the substrate 20, wherein the cutting depth of the protective film 10 when the protective film 10 is cut according to the shape of the formed film 40 is equal to the thickness of the protective film 10.
Specifically, as shown in fig. 5 and 6, the film formation region corresponds to the void 50, and the stress relief region corresponds to the shadow line L. By improving the design of the cutting jig, when the cutting jig is used for cutting the protective film 10, the negative lines L can be generated at the edge corresponding to the shape of the formed film 40 in a preset product, as a first embodiment of the present invention, the structural shape of the formed film 40 is a circular structure, four circular cavities 50 are cut on the protective film 10 according to the shape of the formed film 40 by the action of the cutting jig, the four negative lines L are uniformly distributed along the circumference of the circular cavities 50, and by the action of the negative lines L, the stress generated during film forming can be reduced during film forming, so that the influence on the shape and size of the formed film 40 is avoided. Moreover, the shadow line L also can reduce the product deformation generated when the redundant protective film is removed from the base composite layer after the film forming processing, thereby improving the product yield.
Second, a portion of the protective film corresponding to the shape of the formed film 40 in the predetermined product is removed from the protective film 10 to form a base composite layer having the shape of the formed film 40 in the predetermined product. As shown in fig. 5, the shape of the film 40 is circular.
Third, the base composite layer having the shape of the film 40 is subjected to film formation processing, and the excess protective film 10 is removed. Cutting or punching along the edges of the desired predetermined product shape to obtain the desired product, wherein the size of the first type of product is equal to the size of the predetermined product, as shown in fig. 1.
In order to ensure the yield of the product and facilitate the module installation, as shown in fig. 2, when the substrate composite layer after the film forming process is cut, the shape and size of the obtained second type product are larger than the shape and size of the preset product.
As a second embodiment of the present invention, as shown in fig. 3 and 4, in obtaining a base composite layer having a shape of the film 40 in the predetermined product, before attaching the protective film 10 to the base 20, the protective film 10 may be cut according to the shape of the film 40 in the predetermined product to obtain the protective film 10 having the shape of the film 40 in the predetermined product, and then the protective film 10 having the shape of the film 40 in the predetermined product may be attached to the base 20 to form the base composite layer. Specifically, the protective film 10 is attached to the release film 30, a film formation shape region and a stress release region are divided on the protective film 10 according to the shape of the formed film 40 in the preset product, and the cutter cuts the protective film 10 on the release film 30 according to the film formation shape region and the stress release region to obtain the protective film 10 having the shape of the formed film 40 in the preset product.
This second embodiment is performed by placing the protective film 10 on the release film 30 when cutting the shape of the film 40 in a predetermined product, punching the shape and size of the film 40 in the predetermined product as desired on the protective film 10 using a cutter, and removing a portion of the protective film corresponding to the shape of the film 40 in the predetermined product to form the protective film 10 having the shape of the film 40 in advance. Then, the protective film 10 formed in advance in the shape of the film 40 is bonded to the surface of the substrate 20 by a roll-to-roll bonding apparatus, so that a substrate composite layer in the shape of the film 40 is formed. And finally, performing film forming processing on the substrate composite layer, and cutting the substrate composite layer subjected to film forming processing to obtain a product.
In this embodiment, the cutting the substrate composite layer after the film forming process according to the predetermined product shape includes: removing the protective film 10 on the base composite layer after film forming; the base composite layer from which the protective film 10 is removed is subjected to a cutting process. Specifically, the thickness of the film 40 formed on the base composite layer after the film forming process is not more than the thickness of the protective film 10. In the present invention, as shown in fig. 3 and 4, the film formation process includes three kinds, which are uniform film formation a, non-uniform film formation b, and precise film formation c, respectively. Wherein the uniform film formation a is a vapor deposition film formation, the non-uniform film formation b is a liquid phase film formation, and the precise film formation c is a 3D printing type. In the embodiment of the present invention, the film formation process for the base composite layer specifically includes a gas deposition film formation method using CVD, PVD, PECVD, or the like, and a liquid film formation method using a suspension, dimple, slit, or the like, as well as a precision film formation method.
Further, in order to ensure the yield of the product, the cutting process of the base composite layer from which the protective film 10 is removed includes cutting or punching along the shape edge of the desired product so that the shape size of the resulting product is equal to or larger than the preset product shape size specified by the customer, but the excess should not exceed the maximum range specified by the customer. Specifically, as shown in fig. 3, the shape and size of the first type of product obtained by cutting through the cutter according to the second embodiment of the present invention are equal to those of the preset product, and as shown in fig. 4, the shape and size of the second type of product obtained by cutting are greater than those of the preset product. In order to ensure the yield of products and facilitate the module installation, the cutting size of the cutting treatment on the substrate composite layer after the film forming processing is set to be larger than the shape and size of a preset product.
For a further understanding of the present invention, the following description will discuss in detail the process of producing a product according to a second embodiment of the present invention with reference to fig. 3, 5 and 6.
Firstly, the protective film 10 is attached to the release film 30, a film forming shape area and a stress release area are divided on the protective film 10 according to the shape of the formed film 40 in the preset product, and the cutting tool cuts the protective film 10 on the release film 30 according to the film forming shape area and the stress release area to obtain the protective film 10 with the shape of the formed film 40 in the preset product. And attaching the protective film having the shape of the formed film 40 in the preset product to the substrate 20 by using a roll-to-roll attaching device to form a substrate composite layer, wherein the cutting depth of the protective film 10 when the protective film 10 is cut according to the shape of the formed film 40 in the preset product is equal to the thickness of the protective film 10.
Specifically, as shown in fig. 5 and 6, the film formation region corresponds to the void 50, and the stress relief region corresponds to the shadow line L. Through carrying out the design improvement to cutting tool, when using this cutting tool to carry out the cutting operation of protection film 10, can be in the edge production negative line L of the shape of corresponding filming 40 in predetermineeing the product, through the cutting tool effect, form four circular cavities 50 according to the shape cutting of the shape of filming 40 in predetermineeing the product on protection film 10, there are four negative lines L along circular cavity 50's circumference evenly distributed, through the negative line L effect, when carrying out the film forming man-hour, can reduce the stress that produces when filming, thereby avoid leading to the fact the influence to shape and the size of filming 40 in predetermineeing the product. Moreover, the shadow line L also can reduce the product deformation generated when the redundant protective film is removed from the base composite layer after the film forming processing, thereby improving the product yield.
Second, a portion of the protective film corresponding to the shape of the formed film 40 in the predetermined product is removed from the protective film 10 to form a base composite layer having the shape of the formed film 40 in the predetermined product. Wherein, as shown in fig. 5, the preset product is circular in shape.
Third, a film forming process is performed on the base composite layer having the shape of the film 40 formed in the predetermined product, and the excess protective film 10 is removed. Cutting or punching along the edges of the desired predetermined product shape to obtain the desired product. In order to ensure the yield of products and facilitate the module installation, the cutting size of the cutting treatment on the base composite layer after the film forming processing is set to be larger than the shape and size of a preset product. Wherein, as shown in fig. 3, the shape and size of the first type product obtained according to the second embodiment of the present invention is equal to the shape and size of the preset product.
In order to ensure the yield of the product and facilitate the module installation, as shown in fig. 4, when the substrate composite layer after the film forming process is cut, the shape and size of the obtained second type product are larger than the shape and size of the preset product.
As described above, the method for processing a product using a protective film according to the present invention has high production efficiency, low production cost, and high product yield, and thus, various products having precise requirements for shape processing, including optical devices, sensor devices, and the like, can be manufactured by the method for processing a product according to the present invention.
The above description is only a preferred embodiment of the present invention and is not intended to limit the present invention, and various modifications and changes may be made by those skilled in the art. Any modification, equivalent replacement, or improvement made within the spirit and principle of the present invention should be included in the protection scope of the present invention.
Claims (5)
1. A method for processing a product using a protective film, comprising:
attaching a protective film (10) to a substrate (20) to form a substrate composite layer with a shape of a formed film (40), wherein a region corresponding to the shape of the formed film (40) on the substrate composite layer is a cavity, and a region corresponding to a non-formed shape on the substrate composite layer is covered with the protective film (10);
performing film forming processing on the base composite layer having the shape of the formed film (40);
removing the protective film (10) on the base composite layer after film forming;
cutting the base composite layer with the protective film (10) removed according to a preset product shape to obtain the product;
wherein the formation process of the matrix composite layer having the shape of the film (40) includes: attaching a protective film (10) to the substrate (20) to form a substrate composite layer; cutting the protective film (10) on the substrate (20) according to the shape of the formed film (40) in a preset product, and removing the part of the protective film (10) on the substrate (20) with the shape of the formed film (40) in the preset product to form a substrate composite layer with the shape of the formed film (40);
the cutting of the protective film (10) on the substrate (20) according to the shape of the film (40) formed in the predetermined product comprises: dividing a film forming shape area and a stress release area on the protective film (10) according to the shape of a formed film (40) in a preset product; a cutter cuts the protective film (10) according to the film forming shape area and the stress release area; wherein a cutting depth at which the protective film (10) is cut in accordance with the film formation shape area and the stress release area is greater than or equal to a thickness of the protective film (10).
2. The product processing method using a protective film according to claim 1, wherein a base material of the base (20) comprises an organic plastic.
3. The method for processing a product using a protective film according to claim 1, wherein the film formation process is one of uniform film formation, non-uniform film formation, and precise film formation.
4. A product processing method using a protective film according to any one of claims 1 to 3, wherein a film formation thickness on the base composite layer after film formation processing is not more than a thickness of the protective film (10).
5. The product processing method using a protective film according to any one of claims 1 to 3, wherein the thickness of the protective film (10) is not more than 200 μm.
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| JP4363029B2 (en) * | 2002-11-06 | 2009-11-11 | ソニー株式会社 | Manufacturing method of split wave plate filter |
| JP2010509106A (en) * | 2006-11-14 | 2010-03-25 | コントラ ビジョン リミテッド | Improved overlay printing |
| US8088241B2 (en) * | 2008-06-03 | 2012-01-03 | Cafepress.Com | Applique printing process and machine |
| KR101202346B1 (en) * | 2009-04-16 | 2012-11-16 | 삼성디스플레이 주식회사 | Mask frame assembly for thin layer deposition, manufacturing method of the same and manufacturing method of organic light emitting display device there used |
| KR101154400B1 (en) * | 2009-12-03 | 2012-06-15 | 현대자동차주식회사 | Membrane electrode assembly |
| CN104157550B (en) * | 2014-07-28 | 2016-08-31 | 京东方科技集团股份有限公司 | Film patterning method and mask plate |
| DE102015100863B4 (en) * | 2015-01-21 | 2022-03-03 | Infineon Technologies Ag | Method of handling a product substrate and a bonded substrate system |
| CN106444205B (en) * | 2016-07-21 | 2019-05-17 | 中山大学 | The preparation method and transfer technique that color electrophoresis shows membrane material are in application wherein |
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2017
- 2017-06-14 CN CN201710448310.3A patent/CN109132003B/en active Active
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