CN109119182A - A kind of conductive silver paste and preparation method thereof - Google Patents
A kind of conductive silver paste and preparation method thereof Download PDFInfo
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- CN109119182A CN109119182A CN201710492068.XA CN201710492068A CN109119182A CN 109119182 A CN109119182 A CN 109119182A CN 201710492068 A CN201710492068 A CN 201710492068A CN 109119182 A CN109119182 A CN 109119182A
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- Prior art keywords
- conductive silver
- silver paste
- solvent
- filler
- agent
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
- H01B1/20—Conductive material dispersed in non-conductive organic material
- H01B1/22—Conductive material dispersed in non-conductive organic material the conductive material comprising metals or alloys
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
- H01B1/20—Conductive material dispersed in non-conductive organic material
- H01B1/24—Conductive material dispersed in non-conductive organic material the conductive material comprising carbon-silicon compounds, carbon or silicon
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B13/00—Apparatus or processes specially adapted for manufacturing conductors or cables
Abstract
The present invention provides a kind of conductive silver pastes and preparation method thereof, by weight percentage, comprising: 1%~50% binder, 15%~75% solvent, 1%~30% filler and 1%~5% auxiliary agent.Conductive silver paste resistance value prepared according to the methods of the invention is low, can be used for the surface of liquid crystal display, plasma display, electroluminescent display, touch screen, solar battery and other electronic instruments, and adhesive force is excellent.
Description
Technical field
The present invention relates to Material Fields, more particularly, to a kind of conductive silver paste and preparation method thereof.
Background technique
Currently, with the development of electronic equipment, the demand of touch screen is increasing, therefore, to needed for manufacture touch screen
Conductive silver paste demand is also increasing.But traditional conductive silver paste uses main component of the metallic silver particles as silver paste,
Although the conductive silver paste of preparation can preferably be combined with substrate, resistance value is larger, is typically at least greater than 30 Europe, and mix work
Skill is complicated, limits the application of conductive silver paste.
Therefore, it is badly in need of that a kind of resistance value is low, the simple conductive silver paste of hybrid technique.
Summary of the invention
Have low-resistance silver powder, carbon dust, carbon fiber and graphene for filler in view of the above problems, the present invention selects, especially
It is carbon dust, carbon fiber and when graphene when filler, due to carbon dust, carbon fiber and graphene have electrical conductance is high, resistivity is low,
Therefore the features such as large specific surface area, high electron mobility, can significantly reduce the resistance value of conductive silver paste.
The present invention provides a kind of conductive silver pastes, by weight percentage, comprising: and 1%~50% binder, 15%~
75% solvent, 1%~30% filler and 1%~5% auxiliary agent.
In above-mentioned conductive silver paste, including 5%~25% filler.
In above-mentioned conductive silver paste, filler includes the one or more of silver powder, carbon dust, carbon fiber and graphene.
In above-mentioned conductive silver paste, binder includes the one or more of epoxy resin, organic siliconresin and phenolic resin.
In above-mentioned conductive silver paste, solvent includes ether solvent (such as ether), esters solvent (such as ethyl acetate) and/or alcohol
Class solvent (such as ethyl alcohol).
In above-mentioned conductive silver paste, auxiliary agent includes defoaming agent (such as BYK-141), levelling agent (such as BYK-333), coupling agent
(such as silane coupling agent) and thickener (such as cellulose ether, polyacrylate) it is one or more.
The present invention also provides a kind of methods for preparing conductive silver paste, comprising the following steps:
Binder is mixed with solvent, auxiliary agent, dispersion is added;And filler is added, grinding, dispersion obtain conductive silver
Slurry.
In the above-mentioned methods, by weight percentage, binder is 1%~50%, and solvent is 15%~75%, and filler is
1%~30% and auxiliary agent be 1%~5%.
In the above-mentioned methods, filler includes the one or more of silver powder, carbon dust, carbon fiber and graphene.
In the above-mentioned methods, binder includes the one or more of epoxy resin, organic siliconresin and phenolic resin.
In the above-mentioned methods, solvent includes that ether solvent (such as ether), esters solvent (such as ethyl acetate) and/or alcohols are molten
Agent (such as ethyl alcohol).
In the above-mentioned methods, auxiliary agent includes defoaming agent (such as BYK-141), levelling agent (such as BYK-333), coupling agent (such as silicon
Alkane coupling agent) and thickener (such as cellulose ether, polyacrylate) is one or more.
The present invention by screening filler, to the optimization of the content and ratio of filler, prepare conductive silver paste to provide
Formula and method so that filler with substrate have good combination while, the resistance value of conductive silver paste can be significantly reduced, make
The resistance value for the conductive silver paste that must be prepared is below 20 Europe.
Specific embodiment
The following examples can make those skilled in the art that the present invention be more fully understood, but not limit in any way
The present invention.
The present invention selects 1%~50% binder (one kind or more of epoxy resin, organic siliconresin and phenolic resin
Kind), 15%~75% solvent (ether solvent, esters solvent and/or alcohols solvent), 1%~30% filler (silver powder, carbon
Powder, carbon fiber and graphene it is one or more) and 1%~5% auxiliary agent (defoaming agent, levelling agent, coupling agent and thickener);
Binder is mixed with solvent first, later, auxiliary agent is added, with 5000~7000r/ minutes revolving speed high speeds point
It dissipates;And filler is added, grinding 20~after sixty minutes, with 20~40 points of revolving speed high speed dispersion of 5000~7000r/ minutes
Clock obtains the conductive silver paste.
It in invention, is combined by the first dispersion of binder, solvent and auxiliary agent, forms substrate, while utilizing the ratio of filler
Surface area is big, is easier to the features such as dispersion, allows the filler being added substantially effectively in conjunction with substrate;And hybrid technique letter
It is single.
Embodiment 1
Weigh 50 parts of epoxy resin and the mixing dispersion of 45 parts of ethyl acetate solvents, be added 4 parts of auxiliary agents (defoaming agent, levelling agent,
Coupling agent and thickener), high speed dispersion adds 1 part of silver powder, is fully ground 40 minutes, high speed dispersion is made after 30 minutes and leads
Electric silver paste.Through being screen printed onto PET film, 150 degree are toasted 30 minutes, its resistance value, the measurement knot of resistance value are surveyed after solidification
Fruit see the table below 1.
Embodiment 2
Weigh 20 parts of organic siliconresins and the mixing dispersion of 75 parts of ether solvents, be added 2 parts of auxiliary agents (defoaming agent, coupling agent and
Thickener), high speed dispersion adds 3 parts of carbon dusts, is fully ground 20 minutes, conductive silver paste is made after 30 minutes in high speed dispersion.Through
It is screen printed onto PET film, 150 degree are toasted 30 minutes, its resistance value are surveyed after solidification, the measurement result of resistance value see the table below 1.
Embodiment 3
30 parts of phenolic resin and 60 parts of alcohol solvent mixing dispersions are weighed, are added 5 parts of auxiliary agents (coupling agent and thickener), it is high
Speed dispersion, adds 5 parts of carbon fibers, is fully ground 60 minutes, conductive silver paste is made in high speed dispersion after twenty minutes.Through silk-screen printing
In PET film, 150 degree are toasted 30 minutes, its resistance value are surveyed after solidification, the measurement result of resistance value see the table below 1.
Embodiment 4
40 parts of organic siliconresins and 49 parts of alcohol solvent mixing dispersions are weighed, 1 part of auxiliary agent (coupling agent), high speed point is added
It dissipates, adds 10 parts of graphenes, be fully ground 30 minutes, conductive silver paste is made after 25 minutes in high speed dispersion.Through being screen printed onto
In PET film, 150 degree are toasted 30 minutes, its resistance value are surveyed after solidification, the measurement result of resistance value see the table below 1.
Embodiment 5
30 parts of epoxy resin and the mixing dispersion of 52 parts of alcohol solvents are weighed, are added 3 parts of auxiliary agents (coupling agent), high speed dispersion,
15 parts of graphenes are added, are fully ground 50 minutes, conductive silver paste is made after 35 minutes in high speed dispersion.Through being screen printed onto PET
On film, 150 degree are toasted 30 minutes, its resistance value are surveyed after solidification, the measurement result of resistance value see the table below 1.
Embodiment 6
5 parts of phenolic resin and 74 parts of alcohol solvent mixing dispersions are weighed, are added 1 part of auxiliary agent (coupling agent and thickener), it is high
Speed dispersion, adds 20 parts of carbon dusts, is fully ground 40 minutes, conductive silver paste is made in high speed dispersion after forty minutes.Through silk-screen printing
In PET film, 150 degree are toasted 30 minutes, its resistance value are surveyed after solidification, the measurement result of resistance value see the table below 1.
Embodiment 7
1 part of epoxy resin and 70 parts of ethyl acetate solvent mixing dispersions are weighed, 4 parts of auxiliary agents (coupling agent and thickenings are added
Agent), high speed dispersion adds 25 parts of graphenes, is fully ground 40 minutes, conductive silver paste is made after 30 minutes in high speed dispersion.Through
It is screen printed onto PET film, 150 degree are toasted 30 minutes, its resistance value are surveyed after solidification, the measurement result of resistance value see the table below 1.
Embodiment 8
50 parts of epoxy resin and 15 parts of alcohol solvent mixing dispersions are weighed, are added 5 parts of auxiliary agents (coupling agent and thickener), it is high
Speed dispersion, adds 30 parts of graphenes, is fully ground 40 minutes, conductive silver paste is made after 30 minutes in high speed dispersion.Through screen printing
In PET film, 150 degree are toasted 30 minutes brush, its resistance value are surveyed after solidification, the measurement result of resistance value see the table below 1.
Comparative example 1
50 parts of epoxy resin and 45.5 parts of ethyl acetate solvent mixing dispersions are weighed, 4 parts of auxiliary agents (coupling agent and thickenings are added
Agent), high speed dispersion adds 0.5 part of silver powder, is fully ground 40 minutes, conductive silver paste is made after 30 minutes in high speed dispersion.Organizine
Net is printed in PET film, and 150 degree are toasted 30 minutes, its resistance value is surveyed after solidification, the measurement result of resistance value see the table below 1.
Comparative example 2
46 parts of phenolic resin and the mixing dispersion of 15 parts of alcohol solvents are weighed, are added 4 parts of auxiliary agents (coupling agent), high speed dispersion,
35 parts of carbon dusts are added, are fully ground 40 minutes, conductive silver paste is made after 30 minutes in high speed dispersion.It is thin through being screen printed onto PET
On film, 150 degree are toasted 30 minutes, its resistance value are surveyed after solidification, the measurement result of resistance value see the table below 1.
The above number is parts by weight, and high speed dispersion is all made of the dispersion of SOWER high speed dispersion agent, and grinding uses SOWER tri-
Roller mill grinding.
The above resistance value is all made of method measurement commonly used in the art, and measurement result is as shown in table 1 below:
Table 1, test result
Filer content | Resistance value (Europe) | |
Embodiment 1 | 1% | 20 |
Embodiment 2 | 3% | 19 |
Embodiment 3 | 5% | 15 |
Embodiment 4 | 10% | 12 |
Embodiment 5 | 15% | 11 |
Embodiment 6 | 20% | 13 |
Embodiment 7 | 25% | 14 |
Embodiment 8 | 30% | 20 |
Comparative example 1 | 0.5% | 35 |
Comparative example 2 | 35% | 30 |
It can be seen from the embodiment 1 to 8 in table 1 by the present invention in that with the low silver powder of electrical conductance height and resistivity, carbon
Powder, carbon fiber and graphene are filler, when filler weight content is in the range of 1%~30%, since filler can be with base
Material effectively combines, so that the conductive silver paste resistance value of preparation is below 20 Europe;Especially when filler weight content is 5%~25%
When in range, since filler may be uniformly dispersed in substrate at this time, the area in conjunction with substrate increases, and binding force becomes strong, makes
The resistance value for the conductive silver paste that must be prepared is below 15 Europe.
It, can not since filler addition is very few from the comparative example 1 and 2 in table 1 as can be seen that when filer content is lower than 1%
Satisfaction prepares the needs of conductive silver paste, so that the conductive silver paste resistivity of preparation is up to 35 Europe;When filer content is higher than 30%,
It is easy to reunite since filer content is excessive, can not be evenly dispersed in the substrate, therefore, the conductive silver paste resistance value of preparation is also higher,
Up to 30 Europe.
To sum up, the present invention is by the screening with low-resistance filler, and by the excellent of filer content and ratio
Change, so that the conductive silver paste resistance of preparation is lower, can be used for PET, the preparation of ito thin film, it can also be used to liquid crystal display
(LCD), plasma display (PDP), electroluminescent display (EL/OLED), touch screen (TouchPanel), solar battery
And the surface of other electronic instruments, adhesive force are excellent.
It will be understood by those skilled in the art that above embodiments are only exemplary embodiments, without departing substantially from spirit of the invention
In the case where range, a variety of variations can be carried out, replaced and changed.
Claims (12)
1. a kind of conductive silver paste, which is characterized in that by weight percentage, comprising: 1%~50% binder, 15%~75%
Solvent, 1%~30% filler and 1%~5% auxiliary agent.
2. conductive silver paste according to claim 1, which is characterized in that including 5%~25% filler.
3. conductive silver paste according to claim 1, which is characterized in that the filler includes silver powder, carbon dust, carbon fiber and stone
Black alkene it is one or more.
4. conductive silver paste according to claim 1, which is characterized in that the binder includes epoxy resin, organosilicon tree
Rouge and phenolic resin it is one or more.
5. conductive silver paste according to claim 1, which is characterized in that the solvent include ether solvent, esters solvent and/
Or alcohols solvent.
6. conductive silver paste according to claim 1, which is characterized in that the auxiliary agent includes defoaming agent, levelling agent, coupling agent
It is one or more with thickener.
7. a kind of method for preparing conductive silver paste, which comprises the following steps:
Binder is mixed with solvent, auxiliary agent, dispersion is added;And
Filler is added, grinding, dispersion obtain the conductive silver paste.
8. the binder is 1%~50% the method according to the description of claim 7 is characterized in that by weight percentage,
The solvent is 15%~75%, and the filler is 1%~30% and the auxiliary agent is 1%~5%.
9. the method according to the description of claim 7 is characterized in that the filler includes silver powder, carbon dust, carbon fiber and graphene
It is one or more.
10. the method according to the description of claim 7 is characterized in that the binder include epoxy resin, organic siliconresin and
Phenolic resin it is one or more.
11. the method according to the description of claim 7 is characterized in that the solvent include ether solvent, esters solvent and/or
Alcohols solvent.
12. the method according to the description of claim 7 is characterized in that the auxiliary agent include defoaming agent, levelling agent, coupling agent and
Thickener it is one or more.
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Citations (5)
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JP2003217348A (en) * | 2002-01-21 | 2003-07-31 | Matsushita Electric Ind Co Ltd | Conductive paste, manufacturing method therefor and light-transmissive touch panel using this |
CN101582300A (en) * | 2009-06-25 | 2009-11-18 | 彩虹集团公司 | Environment-friendly low-temperature cured carbon-silver slurry |
CN103113786A (en) * | 2013-03-07 | 2013-05-22 | 苏州牛剑新材料有限公司 | Graphene conductive ink and preparation method thereof |
CN105244076A (en) * | 2015-11-02 | 2016-01-13 | 云南师范大学 | Environment-friendly and low-filling conductive silver paste and preparation method thereof |
CN105632588A (en) * | 2016-02-22 | 2016-06-01 | 昆山海斯电子有限公司 | High-conductivity silver paste and preparation method thereof |
-
2017
- 2017-06-26 CN CN201710492068.XA patent/CN109119182A/en active Pending
Patent Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2003217348A (en) * | 2002-01-21 | 2003-07-31 | Matsushita Electric Ind Co Ltd | Conductive paste, manufacturing method therefor and light-transmissive touch panel using this |
CN101582300A (en) * | 2009-06-25 | 2009-11-18 | 彩虹集团公司 | Environment-friendly low-temperature cured carbon-silver slurry |
CN103113786A (en) * | 2013-03-07 | 2013-05-22 | 苏州牛剑新材料有限公司 | Graphene conductive ink and preparation method thereof |
CN105244076A (en) * | 2015-11-02 | 2016-01-13 | 云南师范大学 | Environment-friendly and low-filling conductive silver paste and preparation method thereof |
CN105632588A (en) * | 2016-02-22 | 2016-06-01 | 昆山海斯电子有限公司 | High-conductivity silver paste and preparation method thereof |
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