CN109112540A - A kind of preparation method for dodging erosion solution additive and the sudden strain of a muscle erosion liquid comprising the additive - Google Patents

A kind of preparation method for dodging erosion solution additive and the sudden strain of a muscle erosion liquid comprising the additive Download PDF

Info

Publication number
CN109112540A
CN109112540A CN201810902208.0A CN201810902208A CN109112540A CN 109112540 A CN109112540 A CN 109112540A CN 201810902208 A CN201810902208 A CN 201810902208A CN 109112540 A CN109112540 A CN 109112540A
Authority
CN
China
Prior art keywords
parts
sudden strain
muscle
added
erosion
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN201810902208.0A
Other languages
Chinese (zh)
Inventor
吕永刚
赵东昊
郑峰
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Suzhou Nale Electronics Technology Co Ltd
Original Assignee
Suzhou Nale Electronics Technology Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Suzhou Nale Electronics Technology Co Ltd filed Critical Suzhou Nale Electronics Technology Co Ltd
Priority to CN201810902208.0A priority Critical patent/CN109112540A/en
Publication of CN109112540A publication Critical patent/CN109112540A/en
Pending legal-status Critical Current

Links

Classifications

    • CCHEMISTRY; METALLURGY
    • C23COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23FNON-MECHANICAL REMOVAL OF METALLIC MATERIAL FROM SURFACE; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL; MULTI-STEP PROCESSES FOR SURFACE TREATMENT OF METALLIC MATERIAL INVOLVING AT LEAST ONE PROCESS PROVIDED FOR IN CLASS C23 AND AT LEAST ONE PROCESS COVERED BY SUBCLASS C21D OR C22F OR CLASS C25
    • C23F1/00Etching metallic material by chemical means
    • C23F1/10Etching compositions
    • C23F1/14Aqueous compositions
    • C23F1/16Acidic compositions
    • C23F1/18Acidic compositions for etching copper or alloys thereof

Landscapes

  • Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • General Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • ing And Chemical Polishing (AREA)

Abstract

It the invention discloses a kind of sudden strain of a muscle erosion solution additive for wiring board processing and its include that the preparation method of liquid is lost in the sudden strain of a muscle of the additive, sudden strain of a muscle erosion solution additive of the invention is by weight, by following material composition: 5-20 parts of propyl alcohol, 1-5 parts of metronidazole, 0.5-5 parts of pyrazoles, 0.5-5 parts of sulfanilamide (SN), 0.5-5 parts of sulphathiazole, 0.5-5 parts of sulfuric acid, 50-100 parts of deionized water.The sudden strain of a muscle erosion liquid obtained according to the preparation method for dodging erosion liquid in invention dodges to copper coating board processing and loses high-efficient and PCB surface without obvious hole.

Description

A kind of preparation method for dodging erosion solution additive and the sudden strain of a muscle erosion liquid comprising the additive
Technical field
The present invention relates to circuit board etching fields, lose solution additive more particularly to a kind of sudden strain of a muscle and include the sudden strain of a muscle of the additive Lose the preparation method of liquid.
Background technique
In the process of printed wiring board, in order to realize the preparation of unleaded product, it will usually in the substrate of semiconductor The unleaded metal layer of upper coating cupric, and occurred instead after the developing process link to wiring board using etching solution and metal layer It answers, and the part of printed patterns non-on wiring board is etched dissolution to form the route of wiring board.Usually select copper erosion Liquid is carved to handle wiring board.But etch effect will be brought bad if the formula of etching solution is unreasonable, etch boundary The problems such as fuzzy and etching efficiency is low.
Summary of the invention
There is provided one kind the present invention solves the technical problem of the present invention may be implemented to carry out fast-etching to wiring board And it not will cause the sudden strain of a muscle erosion solution additive of the etching obscurity boundary of wiring board and the preparation side for dodging erosion liquid it includes the additive Method.
In order to solve the above technical problems, one technical scheme adopted by the invention is that: the present invention provides a kind of sudden strains of a muscle to lose liquid Additive, by weight, by following material composition: 5-20 parts of propyl alcohol, 1-5 parts of metronidazole, 0.5-5 parts of pyrazoles, sulfanilamide (SN) 0.5-5 Part, 0.5-5 parts of sulphathiazole, 0.5-5 parts of sulfuric acid, 50-100 parts of deionized water.
Preferably, solution additive is lost in the sudden strain of a muscle, and by weight, by following material composition: 8-15 parts of propyl alcohol, metronidazole 2-4 parts, 1-3 parts of pyrazoles, 1-3 parts of sulfanilamide (SN), 1-3 parts of sulphathiazole, 1-3 parts of sulfuric acid, 70-90 parts of deionized water.
Preferably, solution additive is lost in the sudden strain of a muscle, and by weight, by following material composition: 10 parts of propyl alcohol, metronidazole 2 Part, 1 part of pyrazoles, 1 part of sulfanilamide (SN), 1 part of sulphathiazole, 1 part of sulfuric acid, 84 parts of deionized water.
Preferably, the preparation method of the sudden strain of a muscle erosion solution additive, includes the following steps:
(1) sulfuric acid is slowly added into deionized water, dissolution is complete;
(2) sulphathiazole is added into the solution of step (1), and system temperature is increased to 70 degrees Celsius, adjusts revolving speed to 20- 30 revs/min, until without insoluble matter in system;
(3) metronidazole, pyrazoles and sulfanilamide (SN) are added into the solution of step (2), stirs uniform to system.
Preferably, the preparation method of the sudden strain of a muscle erosion liquid, includes the following steps:
(1) deionized water of 720 parts by volume is added into reaction kettle;
(2) 140 parts by volume of sulfuric acid of 61.5% concentration is added into reaction kettle, stirs evenly;
(3) 85 parts by volume of hydrogen peroxide of 34.5% concentration is added into reaction kettle, stirs evenly;
(4) sudden strain of a muscle described in any one of claim 1-3 claim is added into reaction kettle and loses 30 parts by volume of liquid, stirring is equal It is even;
(5) 30 parts by weight of copper powder are added into reaction kettle, and open cooling device in copper powder course of dissolution, it is ensured that is warm in reaction kettle Degree is no more than 40 degrees Celsius.
Preferably, the copper powder is added in reaction kettle in three times.
The beneficial effects of the present invention are: sudden strain of a muscle erosion solution additive of the invention using propyl alcohol play in wiring board copper it is quick Dissolution, and in metronidazole, pyrazoles are etched dissolution to the copper ion in wiring board under the action of sulfanilamide (SN) and sulphathiazole, because And can be improved the etching efficiency to wiring board using the sudden strain of a muscle erosion liquid that sudden strain of a muscle erosion solution additive of the invention is prepared, greatly subtract Lack etching period, and avoided etching non-uniform phenomenon, improves the efficiency and yields of circuit board etching.
Detailed description of the invention
To describe the technical solutions in the embodiments of the present invention more clearly, make required in being described below to embodiment Attached drawing is briefly described, in which:
Fig. 1 is that the picture of the PCB surface of liquid processing under the microscope is lost using the sudden strain of a muscle of the embodiment of the present invention 1;
Fig. 2 is that the picture of the PCB surface of liquid processing under the microscope is lost using the sudden strain of a muscle of the embodiment of the present invention 2;
Fig. 3 is that the picture of the PCB surface of liquid processing under the microscope is lost using the sudden strain of a muscle of the embodiment of the present invention 3;
Fig. 4 is that the picture of the PCB surface of liquid processing under the microscope is lost using the sudden strain of a muscle of the embodiment of the present invention 4;
Fig. 5 is that the picture of the PCB surface of liquid processing under the microscope is lost using the sudden strain of a muscle of the embodiment of the present invention 5.
Specific embodiment
The technical scheme in the embodiments of the invention will be clearly and completely described below, it is clear that described implementation Example is only a part of the embodiments of the present invention, instead of all the embodiments.Based on the embodiments of the present invention, this field is common Technical staff's all other embodiment obtained without making creative work belongs to the model that the present invention protects It encloses.
Solution additive is lost in sudden strain of a muscle of the invention, using propyl alcohol and cooperates pyrazoles and metronidazole, sulfanilamide (SN) and sulphathiazole to dodge Cracking dissolved efficiency can be had to the copper ion in wiring board by losing liquid, by sudden strain of a muscle erosion solution additive of the invention and sulfuric acid and pair Oxygen water is used in compounding, and adds copper powder in dodging erosion liquid, so that the sudden strain of a muscle erosion effect for dodging erosion liquid is good, the phenomenon that no paste side.
The effect for dodging erosion liquid is determined to use following analysis method in the present invention: by the PCB surface by dodging erosion processing It observes under an electron microscope, observe the smooth degree on surface and obvious hole whether occurs.
For the content that the present invention will be described in detail, it is as follows now to enumerate embodiment:
Embodiment 1
Each substance by weight, is prepared: 5 g of propyl alcohol, metronidazole 1 according to the following formulation in the sudden strain of a muscle erosion formula of liquid of the present embodiment G, pyrazoles 0.5g, 0.5 g of sulfanilamide (SN), 0.5 g of sulphathiazole, sulfuric acid 0.5 g, deionized water 50g.
The sudden strain of a muscle erosion solution additive is prepared as follows:
(1) sulfuric acid is slowly added into deionized water, dissolution is complete;
(2) sulphathiazole is added into the solution of step (1), and system temperature is increased to 70 degrees Celsius, adjusts revolving speed to 20- 30 revs/min, until without insoluble matter in system;
(3) metronidazole, pyrazoles and sulfanilamide (SN) are added into the solution of step (2), stirs uniform to system.
The process for preparation of the sudden strain of a muscle erosion liquid of the present embodiment carries out as follows:
(1) deionized water of 720 ml is added into beaker;
(2) 140 ml of sulfuric acid of 61.5% concentration is added into beaker, stirs evenly;
(3) 85 ml of hydrogen peroxide of 34.5% concentration is added into beaker, stirs evenly;
(4) it is added into beaker and loses 30 ml of liquid according to sudden strain of a muscle prepared by abovementioned steps, stirred evenly;
(5) copper powder is added into beaker in three times, 10 g are added every time, opens cooling water in copper powder course of dissolution, it is ensured that beaker Interior temperature is no more than 40 degrees Celsius.
The sudden strain of a muscle erosion liquid prepared using this implementation is sprayed on PCB surface to be processed after five minutes, in microscopically observation, knot Fruit is as shown in Figure 1.
Embodiment 2
Each substance by weight, is prepared: 8 g of propyl alcohol, metronidazole according to the following formulation in the sudden strain of a muscle erosion formula of liquid of the present embodiment 2 g, 1 g of pyrazoles, 1 g of sulfanilamide (SN), 1 g of sulphathiazole, sulfuric acid 1 g, deionized water 70g.
The preparing process of the sudden strain of a muscle erosion solution additive and sudden strain of a muscle erosion liquid is carried out referring to embodiment 1.
The sudden strain of a muscle erosion liquid prepared using this implementation is sprayed on PCB surface to be processed after five minutes, in microscopically observation, knot Fruit is as shown in Figure 2.
Embodiment 3
Each substance by weight, is prepared: 10 g of propyl alcohol, first nitre according to the following formulation in the sudden strain of a muscle erosion formula of liquid of the present embodiment 4 g of azoles, 3 g of pyrazoles, 3 g of sulfanilamide (SN), 3 g of sulphathiazole, 3 g of sulfuric acid, 84 g of deionized water.
The preparing process of the sudden strain of a muscle erosion solution additive and sudden strain of a muscle erosion liquid is carried out referring to embodiment 1.
The sudden strain of a muscle erosion liquid prepared using this implementation is sprayed on PCB surface to be processed after five minutes, in microscopically observation, knot Fruit is as shown in Figure 3.
Embodiment 4
Each substance by weight, is prepared: 15 g of propyl alcohol, first nitre according to the following formulation in the sudden strain of a muscle erosion formula of liquid of the present embodiment 5 g of azoles, 5 g of pyrazoles, 5 g of sulfanilamide (SN), 5 g of sulphathiazole, 5 g of sulfuric acid, 90 g of deionized water.
The preparing process of the sudden strain of a muscle erosion solution additive and sudden strain of a muscle erosion liquid is carried out referring to embodiment 1.
The sudden strain of a muscle erosion liquid prepared using this implementation is sprayed on PCB surface to be processed after five minutes, in microscopically observation, knot Fruit is as shown in Figure 4.
Embodiment 5
Each substance by weight, is prepared: 20 g of propyl alcohol, first nitre according to the following formulation in the sudden strain of a muscle erosion formula of liquid of the present embodiment 3 g of azoles, 4 g of pyrazoles, 4 g of sulfanilamide (SN), 4 g of sulphathiazole, 4 g of sulfuric acid, 100 g of deionized water.
The preparing process of the sudden strain of a muscle erosion solution additive and sudden strain of a muscle erosion liquid is carried out referring to embodiment 1.
The sudden strain of a muscle erosion liquid prepared using this implementation is sprayed on PCB surface to be processed after five minutes, in microscopically observation, knot Fruit is as shown in Figure 5.
For the wiring board of sudden strain of a muscle erosion liquid processing after five minutes in various embodiments of the present invention after microscope amplifies, surface has one Determine roughness, but without obvious hole, illustrates that the etch effect of the sudden strain of a muscle erosion liquid of various embodiments of the present invention is good.
The above description is only an embodiment of the present invention, is not intended to limit the scope of the invention, all to utilize this hair Equivalent structure or equivalent flow shift made by bright description is applied directly or indirectly in other relevant technology necks Domain is included within the scope of the present invention.

Claims (6)

1. solution additive is lost in a kind of sudden strain of a muscle, by weight, by following material composition: 5-20 parts of propyl alcohol, 1-5 parts of metronidazole, pyrazoles 0.5-5 parts, 0.5-5 parts of sulfanilamide (SN), 0.5-5 parts of sulphathiazole, 0.5-5 parts of sulfuric acid, 50-100 parts of deionized water.
2. solution additive is lost in sudden strain of a muscle according to claim 2, by weight, by following material composition: 8-15 parts of propyl alcohol, first 2-4 parts of nitre azoles, 1-3 parts of pyrazoles, 1-3 parts of sulfanilamide (SN), 1-3 parts of sulphathiazole, 1-3 parts of sulfuric acid, 70-90 parts of deionized water.
3. solution additive is lost in sudden strain of a muscle according to claim 2, by weight, by following material composition: 10 parts of propyl alcohol, first nitre 2 parts of azoles, 1 part of pyrazoles, 1 part of sulfanilamide (SN), 1 part of sulphathiazole, 1 part of sulfuric acid, 84 parts of deionized water.
4. the preparation method of the sudden strain of a muscle erosion solution additive as described in any one of claim 1-3 claim, which is characterized in that Include the following steps:
(1) sulfuric acid is slowly added into deionized water, dissolution is complete;
(2) sulphathiazole is added into the solution of step (1), and system temperature is increased to 70 degrees Celsius, adjusts revolving speed to 20- 30 revs/min, until without insoluble matter in system;
(3) metronidazole, pyrazoles and sulfanilamide (SN) are added into the solution of step (2), stirs uniform to system.
5. the preparation method comprising the sudden strain of a muscle erosion liquid for dodging erosion solution additive described in any one of claim 1-3 claim, It is characterized by comprising the following steps:
(1) deionized water of 720 parts by volume is added into reaction kettle;
(2) 140 parts by volume of sulfuric acid of 61.5% concentration is added into reaction kettle, stirs evenly;
(3) 85 parts by volume of hydrogen peroxide of 34.5% concentration is added into reaction kettle, stirs evenly;
(4) sudden strain of a muscle described in any one of claim 1-3 claim is added into reaction kettle and loses 30 parts by volume of solution additive, It stirs evenly;
(5) 30 parts by weight of copper powder are added into reaction kettle, and open cooling device in copper powder course of dissolution, it is ensured that is warm in reaction kettle Degree is no more than 40 degrees Celsius.
6. the preparation method according to claim 5 for dodging erosion liquid, which is characterized in that reaction kettle is added in the copper powder in three times It is interior.
CN201810902208.0A 2018-08-09 2018-08-09 A kind of preparation method for dodging erosion solution additive and the sudden strain of a muscle erosion liquid comprising the additive Pending CN109112540A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN201810902208.0A CN109112540A (en) 2018-08-09 2018-08-09 A kind of preparation method for dodging erosion solution additive and the sudden strain of a muscle erosion liquid comprising the additive

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN201810902208.0A CN109112540A (en) 2018-08-09 2018-08-09 A kind of preparation method for dodging erosion solution additive and the sudden strain of a muscle erosion liquid comprising the additive

Publications (1)

Publication Number Publication Date
CN109112540A true CN109112540A (en) 2019-01-01

Family

ID=64852138

Family Applications (1)

Application Number Title Priority Date Filing Date
CN201810902208.0A Pending CN109112540A (en) 2018-08-09 2018-08-09 A kind of preparation method for dodging erosion solution additive and the sudden strain of a muscle erosion liquid comprising the additive

Country Status (1)

Country Link
CN (1) CN109112540A (en)

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5127819A (en) * 1974-09-02 1976-03-09 Mitsubishi Gas Chemical Co Do oyobi dogokinyokagakushorieki
JPH05295365A (en) * 1992-04-24 1993-11-09 Mitsubishi Gas Chem Co Inc Surface cleaning/conditioning agent for copper-clad laminate
CN1209468A (en) * 1997-07-08 1999-03-03 美克株式会社 Micro-etching agent for copper and copper alloy
CN1336449A (en) * 2000-07-28 2002-02-20 美克株式会社 Etching agent for copper or copper alloy, micro-etching method with same, and method for mfg. printed circuit plate
CN102762770A (en) * 2010-02-15 2012-10-31 三菱瓦斯化学株式会社 Etching solution for multilayer thin film having copper layer and molybdenum layer contained therein

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5127819A (en) * 1974-09-02 1976-03-09 Mitsubishi Gas Chemical Co Do oyobi dogokinyokagakushorieki
JPH05295365A (en) * 1992-04-24 1993-11-09 Mitsubishi Gas Chem Co Inc Surface cleaning/conditioning agent for copper-clad laminate
CN1209468A (en) * 1997-07-08 1999-03-03 美克株式会社 Micro-etching agent for copper and copper alloy
CN1336449A (en) * 2000-07-28 2002-02-20 美克株式会社 Etching agent for copper or copper alloy, micro-etching method with same, and method for mfg. printed circuit plate
CN102762770A (en) * 2010-02-15 2012-10-31 三菱瓦斯化学株式会社 Etching solution for multilayer thin film having copper layer and molybdenum layer contained therein

Similar Documents

Publication Publication Date Title
DE102009037855B4 (en) Process for surface treatment of aluminum or aluminum alloys
CN105648440B (en) Liquid composition and the engraving method for using it
CN108060420B (en) Etching liquid and preparation method and application thereof
CN111519190B (en) Etching solution for stabilizing etching cone angle in copper process panel and stabilizing method
KR20140134283A (en) Selective etching method
CN110106535A (en) A kind of tin plating additive of neutrality
CN102817035B (en) Aluminium alloy chemical polishing agent used for automatic production
TW200949016A (en) Etching solution, etching pre-treating solution and etching process for copper or copper alloy
CN105861200A (en) Water-solubility washing agent and preparation method thereof
CN109537039A (en) A kind of aluminium corrosion foil pretreatment
CN108085160A (en) One kind is used for cleaning agent for printed circuit board and preparation method
CN114025489B (en) Microetching solution for copper surface treatment, application of microetching solution in PCB (printed circuit board) manufacturing process and PCB production flow
CN111423883A (en) Anode etching liquid for active matrix organic light-emitting diode display
CN107022762A (en) The application of three amido fortified phenols or three amido substituted benzene thiophenols and tiny-etching treatment fluid
CN109112540A (en) A kind of preparation method for dodging erosion solution additive and the sudden strain of a muscle erosion liquid comprising the additive
CN116607149B (en) Copper surface microetching roughening solution for IC carrier plate and preparation method and application thereof
CN111117626B (en) Flash etching liquid medicine and preparation method and application thereof
WO1990010730A1 (en) Sulfuric acid composition having low surface tension
CN109554709A (en) TFT-LCD copper molybdenum alloy etching solution
CN109706455A (en) A kind of aluminium etching solution and preparation method thereof of high etch rates and selection ratio
CN111472027B (en) Electrotinning additive and preparation method and use method thereof
CN109355711A (en) A kind of flocking additive and its application for Buddha's warrior attendant wire cutting polysilicon chip
CN106521538A (en) Bronze drum surface hydrophobic rust preventing method
KR20210056768A (en) Etchant composition for metal layer
CN112210778A (en) Tin stripping liquid

Legal Events

Date Code Title Description
PB01 Publication
PB01 Publication
SE01 Entry into force of request for substantive examination
SE01 Entry into force of request for substantive examination
RJ01 Rejection of invention patent application after publication
RJ01 Rejection of invention patent application after publication

Application publication date: 20190101