CN109108578B - Method for processing core part on semiconductor packaging equipment - Google Patents
Method for processing core part on semiconductor packaging equipment Download PDFInfo
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- CN109108578B CN109108578B CN201810986146.6A CN201810986146A CN109108578B CN 109108578 B CN109108578 B CN 109108578B CN 201810986146 A CN201810986146 A CN 201810986146A CN 109108578 B CN109108578 B CN 109108578B
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Abstract
The invention relates to a processing method of a core part on semiconductor packaging equipment, wherein a rectangular Peek plate is positioned and clamped on bench vice of a vertical milling machine, and the lower surface, the upper surface and the side surface are roughly processed; roughly machining the lower surface and the upper surface on a grinding machine; the stainless steel four-edge milling cutter is used for processing the upper surface, and the twist drill is used for drilling a bottom hole of the threaded hole on the upper surface; roughly machining a bolt hole and a bottom hole of a stainless steel positioning hole by using a four-edge tungsten steel milling cutter; the twist drill drills a bottom hole of a black photosensitive original point on the upper surface, and the drill bit processes an assembly hole of the black photosensitive original point; finish machining the lower surface by a stainless steel four-edge milling cutter; installing a stainless steel bushing on a bottom hole of the stainless steel positioning hole, and installing a black PEEK cylindrical material on a bottom hole of the black photosensitive original point; roughly machining a stainless steel bushing of a stainless steel positioning hole by using a tungsten steel four-edge milling cutter, and finely machining the stainless steel positioning hole by using the tungsten steel four-edge milling cutter to form the stainless steel positioning hole; finely machining the lower surface and the upper surface by using a tungsten steel grinding wheel; roughly machining a packaging position groove by using a four-edge tungsten steel milling cutter.
Description
Technical Field
The invention relates to a processing method of a core part on semiconductor packaging equipment.
Background
At present, a common processing method needs to prevent PEEK material from collapsing and lacking in the processing process, and also needs to guarantee the surface smoothness and the position degree of groove size, the processing quality and the processing efficiency are difficult to guarantee in single piece processing, and the existing processing technology is small-batch processing.
Disclosure of Invention
The invention aims to overcome the defects in the prior art and provides a method for processing a core part on semiconductor packaging equipment.
The purpose of the invention is realized by the following technical scheme:
the processing method of the core part on the semiconductor packaging equipment is characterized in that: comprises the following steps:
1) preparing a rectangular Peek plate, positioning and clamping the Peek plate on a vertical milling machine bench clamp by using the rough surfaces of the side surface and the upper surface, and roughly processing the lower surface by using a tungsten steel finger-shaped milling cutter with the diameter phi of 20mm to ensure that the surface roughness is 3.2 mu m; turning over the part, positioning and clamping the part by using rough surfaces of the side surface and the lower surface, and roughly machining the upper surface to ensure that the surface roughness is 3.2 um; the rough surfaces of the upper surface and the lower surface are positioned and clamped, and the side surface is roughly processed to ensure that the surface roughness is 3.2 um;
2) positioning the rough surfaces of the side surface and the upper surface on a grinding machine, clamping the rough surfaces by using a stop block, and roughly machining the lower surface by using a tungsten steel grinding wheel to ensure that the roughness is 1.6 mu m; turning over the part, positioning the part by using the rough surfaces of the side surface and the lower surface, clamping the part by using a stop block, roughly processing the upper surface, and reserving a 0.1mm allowance for the thickness;
3) positioning one side and two end faces of a clamping position by using a precise bench clamp on a machine tool, clamping the other side of the clamping position, firstly processing the upper surface by using a stainless steel four-edge milling cutter with the edge diameter phi of 10mm, then drilling a bottom hole of a threaded hole on the upper surface by using a threo-type twist drill with the diameter phi of 3.2mm, and tapping by using an M4 screw tap to finish the processing of the threaded hole; then milling the shape by a stainless steel four-edge milling cutter with the diameter of the cutting edge phi of 10mm, roughly machining a bolt hole by a tungsten steel four-edge milling cutter with the diameter of the cutting edge phi of 4mm STK and
and bottom hole of stainless steel positioning hole
Then using a new cutter with the diameter of phi 4mm to finish the workpiece
And
fine holes of (3); drilling a bottom hole of a black photosensitive original point on the upper surface by using a threo-type twist drill with the diameter of phi 2.2mm, and processing an assembly hole of the black photosensitive original point with the diameter of phi 3mm by using a drill with the diameter of phi 3 mm;
4) positioning one surface and two end surfaces of a clamping position by using a precise bench clamp on a machine tool, clamping the other surface of the clamping position, and finely machining the lower surface by using a stainless steel four-edge milling cutter with the diameter of 10mm to ensure that the dimension is 7.55 +/-0.05 mm;
5) installing a stainless steel bushing on a bottom hole of the stainless steel positioning hole, and installing a black PEEK cylindrical material on a bottom hole of the black photosensitive original point to finish the processing of the black photosensitive original point;
6) positioning one side and two end faces of a clamping position by using a precise bench clamp on a machine tool, clamping the other side of the clamping position, roughly machining a stainless steel lining of a stainless steel positioning hole by using a tungsten steel four-edge milling cutter with the cutting edge diameter phi of 3mm, and finely machining the stainless steel positioning hole by using a tungsten steel four-edge milling cutter with the new cutting edge diameter phi of 3.0mm to finish machining the stainless steel positioning hole; roughly processing a packaging position groove by using a STK four-edge tungsten steel milling cutter with the diameter of phi 1.5mm, and processing a packaging position groove chamfer by using a drill with the diameter of phi 1 mm;
7) positioning the side surface and the upper surface on a grinding machine, clamping by using a stop block, and finish-machining the lower surface by using a tungsten steel grinding wheel to ensure that the surface roughness is 1.6 mu m and the flatness is 0.02; positioning the side surface and the lower surface, clamping by using a stop block, and finely machining the upper surface to ensure that the surface roughness is 1.6um and the flatness is 0.02;
8) and positioning and pressing a pressing block on one side of the side surface on a machine tool, roughly machining the packaging position groove by using a new cutting edge diameter phi 1.5mmSTK four-edge tungsten steel milling cutter by taking a stainless steel positioning hole as a reference, semi-finishing the side surface and the bottom surface of the packaging position groove by using the cutting edge diameter phi 1mmSTK four-edge tungsten steel milling cutter, and finishing the side surface and the bottom surface of the packaging position groove by using the new cutting edge diameter phi 1mmSTK four-edge tungsten steel milling cutter to ensure the dimensional tolerance of the groove.
Further, in the method for processing the core component of the semiconductor package device, in step 1), a rectangular Peek board material with a size of 150mm × 160mm × 7.75mm is prepared.
Further, in the above method for processing a core component on a semiconductor package device, in step 1), the vertical milling machine is a 16SS vertical milling machine.
Further, in the method for processing a core component on a semiconductor package device, in step 2), the grinder is a BSTM618 grinder.
Further, in the method for processing the core component on the semiconductor packaging device, the tungsten steel grinding wheel in the step 2) and the step 7) is a 2000# tungsten steel grinding wheel.
Further, in the method for processing a core component on a semiconductor package device, in step 3), the machine tool is a YCM76CNC machine tool.
Further, in the method for processing the core component on the semiconductor packaging device, in step 4), the machine tool is a YCM76CNC machine tool.
Further, in the method for processing the core component on the semiconductor package device, in step 6), the machine tool is a YCM76CNC machine tool.
Further, in the method for processing a core component on a semiconductor package device, in step 7), the grinder is a BSTM618 grinder.
Further, in the method for processing the core component on the semiconductor package device, in step 8), the machine tool is a YCM76CNC machine tool.
Compared with the prior art, the invention has obvious advantages and beneficial effects, and is embodied in the following aspects:
the process adopts CNC (computerized numerical control) to perform finish machining twice to release internal stress, and then is matched with a grinding machine, so that the requirements on the parallelism of the whole flatness, the size of the aperture and the surface finish degree are met, the stress influence in the process of processing the peek material is effectively reduced, the requirements of customers on the quality and the delivery time of series parts are met, the debugging period of problems appearing in the early stage is short, and the operation is stable;
the stress is effectively released in the process of the processing technology, the problem that the peek material is easy to deform in the finish machining process is reduced and avoided to the maximum extent, the processing consistency is ensured, the production process is simplified, the occupied area is reduced, the processing cost is reduced, the flexibility and the adaptability of the product are improved, and the method is suitable for small-batch production of parts made of various similar materials.
Additional features and advantages of the invention will be set forth in the description which follows, and in part will be obvious from the description, or may be learned by the practice of the invention. The objectives and other advantages of the invention will be realized and attained by the structure particularly pointed out in the written description and claims hereof as well as the appended drawings.
Drawings
In order to more clearly illustrate the technical solutions of the embodiments of the present invention, the drawings needed to be used in the embodiments will be briefly described below, it should be understood that the following drawings only illustrate some embodiments of the present invention and therefore should not be considered as limiting the scope, and for those skilled in the art, other related drawings can be obtained according to the drawings without inventive efforts.
FIG. 1: a schematic structural diagram of a core component on a semiconductor packaging device;
FIG. 2 a: a schematic front view diagram of positioning and clamping in step 1);
FIG. 2 b: the positioning and clamping side view schematic diagram of the step 1);
FIG. 3 a: the positioning and clamping front view schematic diagram of the step 2);
FIG. 3 b: the positioning and clamping side view schematic diagram of the step 2);
FIG. 4 a: the positioning and clamping front view schematic diagram of the step 3);
FIG. 4 b: the positioning and clamping side view schematic diagram of the step 3);
FIG. 5: the process schematic diagram of step 6);
FIG. 6 a: step 7) positioning and clamping a front view schematic diagram;
FIG. 6 b: the positioning and clamping side view of the step 7);
FIG. 7: a process schematic of step 8);
the meaning of the reference symbols in the figures:
wherein: 101-package position groove, 102-upper surface, 103-black photosensitive origin, 104-stainless steel positioning hole, 105-side surface, 106-lower surface, 107-threaded hole.
Detailed Description
The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. The components of embodiments of the present invention generally described and illustrated in the figures herein may be arranged and designed in a wide variety of different configurations. Thus, the following detailed description of the embodiments of the present invention, presented in the figures, is not intended to limit the scope of the invention, as claimed, but is merely representative of selected embodiments of the invention. All other embodiments, which can be derived by a person skilled in the art from the embodiments of the present invention without making any creative effort, shall fall within the protection scope of the present invention.
It should be noted that: like reference numbers and letters refer to like items in the following figures, and thus, once an item is defined in one figure, it need not be further defined and explained in subsequent figures. Meanwhile, in the description of the present invention, the directional terms and the sequence terms, etc. are used only for distinguishing the description, and are not to be construed as indicating or implying relative importance.
As shown in fig. 1, the upper core component of the semiconductor package device is a plate structure, and includes an upper surface 102, a lower surface 106, and a side surface 105, where the upper surface 102 is provided with a package position slot 101, a black photosensitive origin 103, a stainless steel positioning hole 104, and a threaded hole 107.
The specific processing technology steps of the core parts on the semiconductor packaging equipment are as follows:
1) as shown in fig. 2a and 2b, a rectangular Peek plate with the thickness of 150mm × 160mm × 7.75mm is prepared, the Peek plate is positioned and clamped by rough surfaces of a side surface 105 and an upper surface 102 on a bench vice of a 16SS vertical milling machine, and a tungsten steel finger-shaped milling cutter with the diameter of phi 20mm is used for rough machining a lower surface 106 to ensure that the surface roughness is 3.2 um; turning over the part, roughly positioning and clamping the part by using the rough surfaces of the side surface 105 and the lower surface 106, roughly machining the upper surface 102, and ensuring that the surface roughness is 3.2 um; the upper surface 102 and the lower surface 106 are roughly positioned and clamped, and the side surface 105 is roughly machined, so that the surface roughness is guaranteed to be 3.2 um;
2) as shown in fig. 3a and 3b, the BSTM618 grinding machine is roughly positioned by the side surface 105 and the upper surface 102, clamped by a stop block, and roughly machined by a 2000# tungsten steel grinding wheel to form the lower surface 106, so as to ensure the roughness of 1.6 um; turning over the part, positioning the part by using rough surfaces of the side surface 105 and the lower surface 106, clamping the part by using a stop block, roughly processing the upper surface 102, and reserving 0.1mm allowance for thickness;
3) as shown in fig. 4a and 4b, a YCM76CNC machine tool is positioned by a precise bench vice with one clamping surface and two end surfaces and clamped by the other clamping surface, the upper surface 102 is firstly processed by a stainless steel four-edge milling cutter with the diameter phi of 10mm, then a threo type twist drill with the diameter phi of 3.2mm is used for drilling a bottom hole of a threaded hole 107 on the upper surface 102, and the threaded hole 107 is tapped by an M4 screw tap to finish the processing of the threaded hole 107; then milling the shape by a stainless steel four-edge milling cutter with the diameter of the cutting edge phi of 10mm, roughly machining a bolt hole by a tungsten steel four-edge milling cutter with the diameter of the cutting edge phi of 4mm STK and
and bottom hole of stainless steel positioning hole
Then adding a new cutter with the diameter of phi 4mmWorker's tool
And
fine holes of (3); drilling a bottom hole of the black photosensitive origin 103 on the upper surface 102 by using a threo-type twist drill with the diameter of phi 2.2mm, and processing an assembly hole of the black photosensitive origin 103 with the diameter of phi 3mm by using a drill with the diameter of phi 3 mm;
4) positioning one surface and two end surfaces of a clamping position on a YCM76CNC machine tool by using a precise bench clamp, clamping the other surface of the clamping position, and finely machining the lower surface 106 by using a stainless steel four-edge milling cutter with the diameter phi of 10mm, wherein the dimension is ensured to be 7.55 +/-0.05 mm;
5) installing a stainless steel bushing on the bottom hole of the stainless steel positioning hole 104, and installing a black PEEK cylindrical material on the bottom hole of the black light sensing original point 103 to finish the processing of the black light sensing original point 103;
6) as shown in fig. 5, a precision bench vice is used on a YCM76CNC machine tool to position one side and two end surfaces of a clamping position, and the other side of the clamping position is clamped, a tungsten steel four-edge milling cutter with the diameter of a cutting edge phi of 3mm is used for roughly machining a stainless steel lining of a stainless steel positioning hole 104, a tungsten steel four-edge milling cutter with the diameter of a new cutting edge phi of 3.0mm is used for finely machining the stainless steel positioning hole 104, and the machining of the stainless steel positioning hole 104 is completed; roughly machining a packaging position groove 101 by using a STK four-edge tungsten steel milling cutter with the diameter of phi 1.5mm, and machining a packaging position groove chamfer by using a drill with the diameter of phi 1 mm;
7) as shown in fig. 6a and 6b, the side surface 105 and the upper surface 102 are positioned on a BSTM618 grinding machine, clamped by a block, and the lower surface is finished by a 2000# tungsten steel grinding wheel, so that the surface roughness is 1.6um and the flatness is 0.02; positioning the side surface 105 and the lower surface 106, clamping by using a stop block, and finishing the upper surface 102 to ensure that the surface roughness is 1.6um and the flatness is 0.02;
8) as shown in fig. 7, the YCM76CNC machine tool uses the side surface and the pressing block to position and compact, uses the stainless steel positioning hole 104 as the reference, uses the new cutting edge diameter phi 1.5mm STK four-edge tungsten steel milling cutter to roughly process the packaging position groove 101, uses the cutting edge diameter phi 1mm STK four-edge tungsten steel milling cutter to semi-finish process the side surface and the bottom surface of the packaging position groove, uses the new cutting edge diameter phi 1mm STK four-edge tungsten steel milling cutter to finish process the side surface and the bottom surface of the packaging position groove, and ensures the dimensional tolerance of the groove.
The core parts of the semiconductor packaging equipment are easy to generate surface scratches, unqualified sizes, thick knife lines in the slotted holes, easy deformation, easy collapse of the peek material and the like in the processing process. The process adopts CNC twice finish machining to release internal stress, and then is matched with a grinding machine, so that the size, the surface smoothness and the position degree of a packaging position groove are ensured, the requirements of the whole flatness and the parallelism are met, the requirements of customers on the quality and the delivery period of series parts are met, the production cost is reduced, the debugging period of problems appearing in the early stage is short, the operation is stable, the production efficiency is improved, and the normal operation of production is ensured.
The method has the advantages that the effective stress release of the working procedures is realized in the arrangement of the processing technological process, the problem that the peek material is easy to deform in the finish machining process is reduced and avoided to the maximum extent, the processing consistency is ensured, the production working procedures are simplified, the occupied area is reduced, the processing cost is reduced, the flexibility and the adaptability of the product are improved, and the method is suitable for small-batch production of parts made of various similar materials.
The above description is only a preferred embodiment of the present invention and is not intended to limit the present invention, and various modifications and changes may be made by those skilled in the art. Any modification, equivalent replacement, or improvement made within the spirit and principle of the present invention should be included in the protection scope of the present invention. It should be noted that: like reference numbers and letters refer to like items in the following figures, and thus, once an item is defined in one figure, it need not be further defined and explained in subsequent figures.
The above description is only for the specific embodiments of the present invention, but the scope of the present invention is not limited thereto, and any person skilled in the art can easily conceive of the changes or substitutions within the technical scope of the present invention, and shall be covered by the scope of the present invention. Therefore, the protection scope of the present invention shall be subject to the protection scope of the claims.
It is noted that, herein, relational terms such as first and second, and the like may be used solely to distinguish one entity or action from another entity or action without necessarily requiring or implying any actual such relationship or order between such entities or actions. Also, the terms "comprises," "comprising," or any other variation thereof, are intended to cover a non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements does not include only those elements but may include other elements not expressly listed or inherent to such process, method, article, or apparatus. Without further limitation, an element defined by the phrase "comprising an … …" does not exclude the presence of other identical elements in a process, method, article, or apparatus that comprises the element.
Claims (10)
1. The processing method of the core part on the semiconductor packaging equipment is characterized in that: comprises the following steps:
1) preparing a rectangular Peek plate, positioning and clamping the Peek plate on a vertical milling machine bench clamp by using the rough surfaces of the side surface and the upper surface, and roughly processing the lower surface by using a tungsten steel finger-shaped milling cutter with the diameter phi of 20mm to ensure that the surface roughness is 3.2 mu m; turning over the part, positioning and clamping the part by using rough surfaces of the side surface and the lower surface, and roughly machining the upper surface to ensure that the surface roughness is 3.2 um; the rough surfaces of the upper surface and the lower surface are positioned and clamped, and the side surface is roughly processed to ensure that the surface roughness is 3.2 um;
2) positioning the rough surfaces of the side surface and the upper surface on a grinding machine, clamping the rough surfaces by using a stop block, and roughly machining the lower surface by using a tungsten steel grinding wheel to ensure that the roughness is 1.6 mu m; turning over the part, positioning the part by using the rough surfaces of the side surface and the lower surface, clamping the part by using a stop block, roughly processing the upper surface, and reserving a 0.1mm allowance for the thickness;
3) positioning one side and two end faces of a clamping position by using a precise bench clamp on a machine tool, clamping the other side of the clamping position, firstly processing the upper surface by using a stainless steel four-edge milling cutter with the edge diameter phi of 10mm, then drilling a bottom hole of a threaded hole on the upper surface by using a threo-type twist drill with the diameter phi of 3.2mm, and tapping by using an M4 screw tap to finish the processing of the threaded hole; then milling the shape by a stainless steel four-edge milling cutter with the diameter of the cutting edge phi of 10mm, roughly machining a bolt hole by a tungsten steel four-edge milling cutter with the diameter of the cutting edge phi of 4mm STK and
and bottom hole of stainless steel positioning hole
Then using a new cutter with the diameter of phi 4mm to finish the workpiece
And
fine holes of (3); drilling a bottom hole of a black photosensitive original point on the upper surface by using a threo-type twist drill with the diameter of phi 2.2mm, and processing an assembly hole of the black photosensitive original point with the diameter of phi 3mm by using a drill with the diameter of phi 3 mm;
4) positioning one surface and two end surfaces of a clamping position by using a precise bench clamp on a machine tool, clamping the other surface of the clamping position, and finely machining the lower surface by using a stainless steel four-edge milling cutter with the diameter of 10mm to ensure that the dimension is 7.55 +/-0.05 mm;
5) installing a stainless steel bushing on a bottom hole of the stainless steel positioning hole, and installing a black PEEK cylindrical material on a bottom hole of the black photosensitive original point to finish the processing of the black photosensitive original point;
6) positioning one side and two end faces of a clamping position by using a precise bench clamp on a machine tool, clamping the other side of the clamping position, roughly machining a stainless steel lining of a stainless steel positioning hole by using a tungsten steel four-edge milling cutter with the cutting edge diameter phi of 3mm, and finely machining the stainless steel positioning hole by using a tungsten steel four-edge milling cutter with the new cutting edge diameter phi of 3.0mm to finish machining the stainless steel positioning hole; roughly processing a packaging position groove by using a STK four-edge tungsten steel milling cutter with the diameter of phi 1.5mm, and processing a packaging position groove chamfer by using a drill with the diameter of phi 1 mm;
7) positioning the side surface and the upper surface on a grinding machine, clamping by using a stop block, and finish-machining the lower surface by using a tungsten steel grinding wheel to ensure that the surface roughness is 1.6 mu m and the flatness is 0.02; positioning the side surface and the lower surface, clamping by using a stop block, and finely machining the upper surface to ensure that the surface roughness is 1.6um and the flatness is 0.02;
8) and positioning and pressing a pressing block on one side of the side surface on a machine tool, roughly machining the packaging position groove by using a new cutting edge diameter phi 1.5mmSTK four-edge tungsten steel milling cutter by taking a stainless steel positioning hole as a reference, semi-finishing the side surface and the bottom surface of the packaging position groove by using the cutting edge diameter phi 1mmSTK four-edge tungsten steel milling cutter, and finishing the side surface and the bottom surface of the packaging position groove by using the new cutting edge diameter phi 1mmSTK four-edge tungsten steel milling cutter to ensure the dimensional tolerance of the groove.
2. The method as claimed in claim 1, wherein the step of processing the core component on the semiconductor package device comprises: step 1), preparing a rectangular Peek plate material with the thickness of 150mm multiplied by 160mm multiplied by 7.75 mm.
3. The method as claimed in claim 1, wherein the step of processing the core component on the semiconductor package device comprises: step 1), the vertical milling machine is a 16SS vertical milling machine.
4. The method as claimed in claim 1, wherein the step of processing the core component on the semiconductor package device comprises: and step 2), the grinding machine is a BSTM618 grinding machine.
5. The method as claimed in claim 1, wherein the step of processing the core component on the semiconductor package device comprises: step 2) and step 7), the tungsten steel grinding wheel is a 2000# tungsten steel grinding wheel.
6. The method as claimed in claim 1, wherein the step of processing the core component on the semiconductor package device comprises: and step 3), the machine tool is a YCM76CNC machine tool.
7. The method as claimed in claim 1, wherein the step of processing the core component on the semiconductor package device comprises: and step 4), the machine tool is a YCM76CNC machine tool.
8. The method as claimed in claim 1, wherein the step of processing the core component on the semiconductor package device comprises: and step 6), the machine tool is a YCM76CNC machine tool.
9. The method as claimed in claim 1, wherein the step of processing the core component on the semiconductor package device comprises: and 7), the grinding machine is a BSTM618 grinding machine.
10. The method as claimed in claim 1, wherein the step of processing the core component on the semiconductor package device comprises: and step 8), the machine tool is a YCM76CNC machine tool.
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| CN106862966A (en) * | 2015-12-11 | 2017-06-20 | 焱智精密机械（上海）有限公司 | The processing method of thin plate |
| CN105563040A (en) * | 2016-01-20 | 2016-05-11 | 哈尔滨汽轮机厂有限责任公司 | Machining method of steam seal measuring snap-gauge |
| CN106624658A (en) * | 2016-12-30 | 2017-05-10 | 科瑞自动化技术（苏州）有限公司 | Manufacturing method for capsule filling part of medical equipment |
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