CN109104796B - Chip assembly positioning fixture and method for super-radiation light-emitting diode - Google Patents
Chip assembly positioning fixture and method for super-radiation light-emitting diode Download PDFInfo
- Publication number
- CN109104796B CN109104796B CN201811174442.2A CN201811174442A CN109104796B CN 109104796 B CN109104796 B CN 109104796B CN 201811174442 A CN201811174442 A CN 201811174442A CN 109104796 B CN109104796 B CN 109104796B
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- cylinder
- chip
- heat sink
- nozzle
- diameter
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- 238000000034 method Methods 0.000 title claims abstract description 11
- 230000000007 visual effect Effects 0.000 claims abstract description 7
- SBYXRAKIOMOBFF-UHFFFAOYSA-N copper tungsten Chemical compound [Cu].[W] SBYXRAKIOMOBFF-UHFFFAOYSA-N 0.000 claims description 6
- PMHQVHHXPFUNSP-UHFFFAOYSA-M copper(1+);methylsulfanylmethane;bromide Chemical compound Br[Cu].CSC PMHQVHHXPFUNSP-UHFFFAOYSA-M 0.000 claims description 3
- 239000000463 material Substances 0.000 claims description 3
- 239000010935 stainless steel Substances 0.000 claims description 3
- 229910001220 stainless steel Inorganic materials 0.000 claims description 3
- 229910000881 Cu alloy Inorganic materials 0.000 claims 1
- 229910000833 kovar Inorganic materials 0.000 claims 1
- 239000000835 fiber Substances 0.000 description 4
- 229910045601 alloy Inorganic materials 0.000 description 2
- 239000000956 alloy Substances 0.000 description 2
- 230000005855 radiation Effects 0.000 description 2
- 230000001105 regulatory effect Effects 0.000 description 2
- 239000004065 semiconductor Substances 0.000 description 2
- 230000003321 amplification Effects 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000008878 coupling Effects 0.000 description 1
- 238000010168 coupling process Methods 0.000 description 1
- 238000005859 coupling reaction Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 230000007774 longterm Effects 0.000 description 1
- 238000003199 nucleic acid amplification method Methods 0.000 description 1
- 239000013307 optical fiber Substances 0.000 description 1
- 238000004806 packaging method and process Methods 0.000 description 1
- 238000001228 spectrum Methods 0.000 description 1
- 230000002269 spontaneous effect Effects 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
- H05B33/00—Electroluminescent light sources
- H05B33/10—Apparatus or processes specially adapted to the manufacture of electroluminescent light sources
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Physics & Mathematics (AREA)
- Thermal Sciences (AREA)
- Led Device Packages (AREA)
Abstract
The invention discloses a chip assembling and positioning fixture and method for a super-radiation light-emitting diode, comprising a tube shell, wherein a thermoelectric cooler is arranged in the tube shell, a second heat sink is arranged on the thermoelectric cooler, a first heat sink is arranged on the second heat sink, a chip is arranged on the first heat sink, a pin for connecting the thermoelectric cooler and an external device is also arranged on the tube shell, a nozzle is arranged on one side of the tube shell, a fixture body for aligning the chip is inserted into the nozzle, the fixture body comprises a first cylinder, the center of the first cylinder is connected with a second cylinder, a semi-cylinder is connected on the second cylinder, and a notch for aligning the chip is arranged in the middle of a rectangular surface of the semi-cylinder. The invention has no visual difference of positioning fork wires and products, has general capability of using the microscope, and can observe the relative position by using eyes at two sides, thereby avoiding error of three-dimensional position judgment caused by single-side eye positioning and having accurate positioning.
Description
Technical Field
The invention belongs to the technical field of active semiconductor light-emitting devices, and particularly relates to a chip assembly positioning fixture and method of a super-radiation light-emitting diode.
Background
The semiconductor super-radiation light-emitting diode is a single-pass light amplification device based on spontaneous radiation, and is widely applied to the fields of fiber optic gyroscopes, fiber optic sensing, short-distance fiber optic communication systems and the like due to the characteristics of high output power, wide spectrum, good long-term stability of the device, small packaging size, light weight and the like. For the super-radiation light source, the luminous point of the chip is required to be opposite to the nozzle during assembly, and if the luminous point deviates from the nozzle, a section of bare fiber part in the middle of the optical fiber can be broken due to overlarge torsion during coupling.
The conventional scheme of the current assembly is that an eyepiece of a microscope is replaced by an eyepiece with a cross wire scale, in the assembly process, the cross position of the cross wire is aligned to the center of a light emitting surface of a chip, one shaft is parallel to the edge of the chip, the other shaft is perpendicular to a light emitting surface of the chip, the shaft perpendicular to the light emitting surface is aligned to the direction of a nozzle, the position of a heat sink is adjusted left and right, and when the shaft perpendicular to the light emitting surface passes through the center of the nozzle, the light emitting surface of the chip is also aligned to the center of the nozzle, and the position is the optimal position. However, the classical scheme needs to confirm the position of the chip by using the cross hair on the ocular, and the vision difference exists between the mark and the real object on the ocular, so that the method has certain difficulty in the capability of using the microscope for staff operation and the position determination, and the classical scheme uses the single-side eye to observe the cross hair on the ocular to determine the position of the chip, and when the single-side eye observes, errors exist in the three-dimensional position judgment of the object.
Disclosure of Invention
The invention aims to provide a chip assembly positioning fixture and method for a super-radiation light-emitting diode, which are used for solving the problems in the prior art, and the invention has the advantages that the vision difference of positioning fork wires and products is not existed, the capability of a microscope is generally required, in addition, two eyes are used for observing the relative positions, the error of three-dimensional position judgment caused by single-side eye positioning is not generated, and the positioning is accurate.
In order to achieve the above purpose, the invention adopts the following technical scheme:
the utility model provides a super radiation emitting diode's chip equipment positioning fixture, includes the tube shell, is provided with thermoelectric cooler in the tube shell, and thermoelectric cooler is provided with the second heat sink, is provided with first heat sink on the second heat sink, sets up the chip on the first heat sink, still is provided with the pin that is used for connecting thermoelectric cooler and external device on the tube shell, and one side of tube shell is equipped with the nozzle, alternates in the nozzle and has the anchor clamps body that is used for aiming at the chip, the anchor clamps body includes first cylinder, and the center of first cylinder is connected with the second cylinder, is connected with the halfcylinder on the second cylinder, and the middle part of the rectangle face of halfcylinder is provided with the notch that is used for aiming at the chip.
Further, the diameter of the first cylinder is larger than the inner diameter of the nozzle, the diameter of the second cylinder is smaller than the inner diameter of the nozzle, and the diameter of the semi-cylinder is equal to the diameter of the second cylinder.
Further, the diameter of the first cylinder is 2.2-2.4mm, the inner diameter of the nozzle is 1.2-1.3mm, and the diameter of the second cylinder is 1.0-1.1mm.
Further, the length of the first cylinder is 10mm, the length of the half cylinder is 3mm, and the distance between the half cylinder and the chip is 1.5mm when the jig body is inserted in the nozzle.
Further, the width of the notch is 0.1-0.5mm.
Further, the first heat sink is an aluminum nitride heat sink, and the second heat sink is a tungsten copper heat sink.
Further, the clamp body material is tungsten copper, stainless steel or a wrought alloy.
A method for assembling and positioning the chip of super-radiation LED includes such steps as putting thermoelectric cooler in tube shell, putting the second heat sink on thermoelectric cooler, putting the first heat sink on the second heat sink, regulating the position of the second heat sink, putting the chip on proper position, inserting the fixture body into tube shell from nozzle, rotating the fixture body, and regulating the second heat sink and chip to align the luminous surface of chip with notch.
Compared with the prior art, the invention has the following beneficial technical effects:
when the device is used, the chip is placed at a proper visual position, the clamp body is inserted into the tube shell from the nozzle, the clamp body is rotated, the semi-cylindrical diameter surface is upwards, the second heat sink and the chip are adjusted left and right, so that the light-emitting surface of the chip and the notch are aligned, namely, the chip is right opposite to the nozzle at the moment, the clamp body is directly placed at the product position, the visual difference of a positioning fork wire and the product does not exist, the capability of the microscope is generally required, the positioning is accurate, the eyes at two sides are adopted for observing the relative position, and the error of three-dimensional position judgment caused by single-side eye positioning cannot be generated.
Further, by defining the dimensions of the clamp body, it is enabled to be more accurately aligned with the chip without affecting the normal operation of the other components.
The method of the invention has no visual difference of positioning fork wires and products, has general capability of using the microscope, and can observe the relative position by eyes at two sides, thereby avoiding error of three-dimensional position judgment caused by single-side eye positioning and having accurate positioning.
Drawings
FIG. 1 is a top view of a clamp body of the present invention;
FIG. 2 is a side view of the clamp body of the present invention;
fig. 3 is a schematic overall structure of the present invention.
Wherein: 1. a first cylinder; 2. a second cylinder; 3. a semi-cylinder; 4. grooving; 5. a first heat sink; 6. a chip; 7. a second heat sink; 8. a thermoelectric refrigerator; 9. a tube shell; 10. a nozzle; 11. pins.
Detailed Description
The invention is described in further detail below with reference to the attached drawing figures:
referring to fig. 1 to 3, a chip assembling positioning fixture for super-radiation light emitting diode comprises a tube shell 9, wherein a thermoelectric cooler 8 (TEC) is arranged in the tube shell 9, a second heat sink 7 is arranged on the tube shell 8, a first heat sink 5 is arranged on the second heat sink 7, a chip 6 is arranged on the first heat sink 5, a pin 11 for connecting the thermoelectric cooler 8 and an external device is further arranged on the tube shell 9, a nozzle 10 is arranged on one side of the tube shell 9, a fixture body for aligning the chip 6 is inserted into the nozzle 10, the fixture body comprises a first cylinder 1, the center of the first cylinder 1 is connected with a second cylinder 2, a half cylinder 3 is connected to the second cylinder 2, a notch 4 for aligning the chip 6 is arranged in the middle of a rectangular surface of the half cylinder 3, the diameter of the first cylinder 1 is larger than the inner diameter of the nozzle 10, the diameter of the second cylinder 2 is smaller than the inner diameter of the nozzle 10, the diameter of the half cylinder 3 is equal to the diameter of the second cylinder 2, the diameter of the first cylinder 1 is 2.2-2.4mm, the inner diameter of the nozzle 10 is 1.2-1.3.3 mm, the diameter of the half cylinder is 1.2-1.3mm, the width of the second cylinder is 1.3mm, the half cylinder is 1.3mm, and the length of the half cylinder is 1.3mm, and the length is 0.3 mm, when the length of the half cylinder is 1.3mm, and the length is 1.3mm, the length is 1mm, and the length is 0mm, and the length is the length, and the length is 1.
The first heat sink 5 is an aluminum nitride heat sink, the second heat sink 7 is a tungsten copper heat sink, and the material of the clamp body is tungsten copper, stainless steel or a wrought alloy.
A chip assembling and positioning method of super-radiation light-emitting diode comprises the steps of placing a thermoelectric cooler 8 in a tube shell 9, placing a second heat sink 7 on the thermoelectric cooler 8, placing a first heat sink 5 on the second heat sink 7, adjusting the position of the second heat sink 7, placing a chip 6 at a proper visual position, inserting a clamp body into the tube shell 9 from a nozzle 10, rotating the clamp body, enabling the diameter of a semi-cylinder 3 to face upwards, and adjusting the second heat sink 7 and the chip 6 left and right, so that the light-emitting surface of the chip 6 is aligned with a notch 4, namely, the chip 6 is right opposite to the nozzle 10 at the moment.
The operation of the present invention is described in detail below:
the invention adopts a fixture body for positioning, the fixture body is composed of 2 concentric cylinders and 1 semi-cylinder, the concentric circles of the fixture body are thinned along the axial direction, the semi-cylinder is formed by cutting the second cylinder 2 from the diameter position at the thin end of the fixture, and the center of the semi-cylinder 3 is provided with a notch 4 as thin as 0.1mm-0.5 mm. The thermoelectric cooler 8 is placed in the tube shell 9, the second heat sink 7 is placed on the thermoelectric cooler 8, the first heat sink 5 is placed on the second heat sink 7, the position of the second heat sink 7 is adjusted, the chip 6 is placed at a proper visual position, and then the clamp body is inserted into the tube shell 9 from the outer side of the nozzle 10. The diameter (2.2-2.4 mm) of the first cylinder 1 is larger than the inner diameter (1.2-1.3 mm) of the nozzle, and the part is clamped outside the nozzle 10 and has the length of 10mm; the diameter (1.0-1.1 mm) of the second cylinder 2 is slightly smaller than the inner diameter (1.2-1.3 mm) of the nozzle, and is inserted into the tube shell 9 through the nozzle 10; the semi-cylinder 3 is obtained by cutting the second cylinder 2 from the diameter position, and the length is 3mm; the total length of the clamp body is that when the clamp body is plugged into the innermost part of the pipe orifice, the distance between the semi-cylinder 3 and the chip 6 is 1.5mm. The fixture body is rotated to enable the diameter surface of the semi-cylinder 3 to face upwards, and the second heat sink 7 and the chip 6 are adjusted left and right, so that the light emitting surface of the chip 6 is aligned with the notch 4, namely the chip 6 is opposite to the nozzle 10 at the moment.
Claims (4)
1. The chip assembly positioning clamp for the super-radiation light-emitting diode is characterized by comprising a tube shell (9), wherein a thermoelectric refrigerator (8) is arranged in the tube shell (9), a second heat sink (7) is arranged on the thermoelectric refrigerator (8), a first heat sink (5) is arranged on the second heat sink (7), a super-radiation light-emitting diode chip (6) is arranged on the first heat sink (5), a pin (11) for connecting the thermoelectric refrigerator (8) and an external device is further arranged on the tube shell (9), a nozzle (10) is arranged on one side of the tube shell (9), a clamp body for aligning the chip (6) is inserted in the nozzle (10), the clamp body comprises a first cylinder (1), the center of the first cylinder (1) is connected with a second cylinder (2), a semi-cylinder (3) is connected on the second cylinder (2), and a notch (4) for aligning the chip (6) is arranged in the middle of a rectangular surface of the semi-cylinder (3).
The diameter of the first cylinder (1) is larger than the inner diameter of the nozzle (10), the diameter of the second cylinder (2) is smaller than the inner diameter of the nozzle (10), and the diameter of the semi-cylinder (3) is equal to the diameter of the second cylinder (2); the diameter of the first cylinder (1) is 2.2-2.4mm, the inner diameter of the nozzle (10) is 1.2-1.3mm, and the diameter of the second cylinder (2) is 1.0-1.1mm; the length of the first cylinder (1) is 10mm, the length of the semi-cylinder (3) is 3mm, and when the clamp body is inserted into the nozzle (10), the distance between the semi-cylinder (3) and the chip (6) is 1.5mm; the width of the notch groove (4) is 0.1-0.5mm;
when the fixture is used, the semi-cylindrical body (3) is turned to face upwards in diameter, and the second heat sink (7) and the chip (6) are adjusted left and right, so that the luminous surface of the chip (6) is aligned with the notch (4), namely the chip (6) is opposite to the nozzle (10) at the moment.
2. The chip assembly positioning fixture of a superluminescent diode according to claim 1, characterized in that the first heat sink (5) is an aluminum nitride heat sink and the second heat sink (7) is a tungsten copper heat sink.
3. The die assembly positioning fixture for superluminescent diode according to claim 1, wherein the fixture body material is tungsten copper alloy, stainless steel or kovar.
4. A chip assembling and positioning method for a super-radiation light-emitting diode is characterized in that a thermoelectric cooler (8) is placed in a tube shell (9), a second heat sink (7) is placed on the thermoelectric cooler (8), a first heat sink (5) is placed on the second heat sink (7), the position of the second heat sink (7) is adjusted, a chip (6) is placed at a proper visual position, a clamp body is inserted into the tube shell (9) from a nozzle (10), the clamp body is rotated, the diameter of a semi-cylinder (3) faces upwards, and the second heat sink (7) and the chip (6) are adjusted left and right, so that the light emitting surface of the chip (6) is aligned with a notch (4), namely, the chip (6) is right opposite to the nozzle (10) at the moment.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201811174442.2A CN109104796B (en) | 2018-10-09 | 2018-10-09 | Chip assembly positioning fixture and method for super-radiation light-emitting diode |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201811174442.2A CN109104796B (en) | 2018-10-09 | 2018-10-09 | Chip assembly positioning fixture and method for super-radiation light-emitting diode |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN109104796A CN109104796A (en) | 2018-12-28 |
| CN109104796B true CN109104796B (en) | 2023-09-22 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN201811174442.2A Active CN109104796B (en) | 2018-10-09 | 2018-10-09 | Chip assembly positioning fixture and method for super-radiation light-emitting diode |
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| CN (1) | CN109104796B (en) |
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| CN113325512A (en) * | 2021-08-03 | 2021-08-31 | 西安中科华芯测控有限公司 | Lithium niobate integrated optical device and temperature-changing stability improving method |
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2018
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Also Published As
| Publication number | Publication date |
|---|---|
| CN109104796A (en) | 2018-12-28 |
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