CN109104550A - Camera module and its photosensory assembly - Google Patents
Camera module and its photosensory assembly Download PDFInfo
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- CN109104550A CN109104550A CN201710471827.4A CN201710471827A CN109104550A CN 109104550 A CN109104550 A CN 109104550A CN 201710471827 A CN201710471827 A CN 201710471827A CN 109104550 A CN109104550 A CN 109104550A
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- packaging body
- optical filter
- photosensory assembly
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- 239000000758 substrate Substances 0.000 claims abstract description 125
- 238000004806 packaging method and process Methods 0.000 claims abstract description 102
- 230000003287 optical effect Effects 0.000 claims abstract description 84
- 238000000465 moulding Methods 0.000 claims abstract description 20
- 238000005538 encapsulation Methods 0.000 claims abstract description 8
- 239000003292 glue Substances 0.000 abstract description 13
- 238000004026 adhesive bonding Methods 0.000 abstract description 8
- 239000000084 colloidal system Substances 0.000 abstract description 8
- 230000000712 assembly Effects 0.000 abstract 1
- 238000000429 assembly Methods 0.000 abstract 1
- 238000000034 method Methods 0.000 description 15
- 230000008569 process Effects 0.000 description 8
- 239000000428 dust Substances 0.000 description 7
- 239000004743 Polypropylene Substances 0.000 description 6
- 239000000463 material Substances 0.000 description 6
- 238000003825 pressing Methods 0.000 description 6
- 238000001914 filtration Methods 0.000 description 5
- 229920000106 Liquid crystal polymer Polymers 0.000 description 4
- 239000004977 Liquid-crystal polymers (LCPs) Substances 0.000 description 4
- -1 Polypropylene Polymers 0.000 description 4
- 238000010009 beating Methods 0.000 description 4
- 239000012535 impurity Substances 0.000 description 4
- 229910044991 metal oxide Inorganic materials 0.000 description 4
- 150000004706 metal oxides Chemical class 0.000 description 4
- 229920001155 polypropylene Polymers 0.000 description 4
- 239000004065 semiconductor Substances 0.000 description 4
- 238000005516 engineering process Methods 0.000 description 3
- 230000007613 environmental effect Effects 0.000 description 3
- 239000003344 environmental pollutant Substances 0.000 description 3
- 230000017525 heat dissipation Effects 0.000 description 3
- 238000004519 manufacturing process Methods 0.000 description 3
- 231100000719 pollutant Toxicity 0.000 description 3
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 2
- 241000218202 Coptis Species 0.000 description 2
- 235000002991 Coptis groenlandica Nutrition 0.000 description 2
- 239000004677 Nylon Substances 0.000 description 2
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 2
- 229910000831 Steel Inorganic materials 0.000 description 2
- 229910052782 aluminium Inorganic materials 0.000 description 2
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 2
- 239000003990 capacitor Substances 0.000 description 2
- 239000000919 ceramic Substances 0.000 description 2
- 230000000295 complement effect Effects 0.000 description 2
- 229920001577 copolymer Polymers 0.000 description 2
- 238000011161 development Methods 0.000 description 2
- 239000006185 dispersion Substances 0.000 description 2
- 239000003822 epoxy resin Substances 0.000 description 2
- 238000003384 imaging method Methods 0.000 description 2
- 230000006872 improvement Effects 0.000 description 2
- 238000001746 injection moulding Methods 0.000 description 2
- 239000004973 liquid crystal related substance Substances 0.000 description 2
- 229920001778 nylon Polymers 0.000 description 2
- 238000012536 packaging technology Methods 0.000 description 2
- 229920000647 polyepoxide Polymers 0.000 description 2
- 238000012545 processing Methods 0.000 description 2
- 239000010959 steel Substances 0.000 description 2
- 230000000007 visual effect Effects 0.000 description 2
- 230000000694 effects Effects 0.000 description 1
- 230000005611 electricity Effects 0.000 description 1
- 238000011835 investigation Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
- H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
- H04N23/50—Constructional details
- H04N23/55—Optical parts specially adapted for electronic image sensors; Mounting thereof
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
- H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
- H04N23/50—Constructional details
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- Engineering & Computer Science (AREA)
- Multimedia (AREA)
- Signal Processing (AREA)
- Studio Devices (AREA)
Abstract
The present invention relates to a kind of camera module and its photosensory assemblies, photosensitive element includes substrate, photosensitive element, packaging body and optical filter, photosensitive element is set to the first surface of substrate, it is electrically connected photosensitive element with substrate, then the packaging body around photosensitive element is formed by way of encapsulated moulding in the first surface of substrate, and with the integrally formed optical filter of packaging body, and optical filter is located at photosensitive element back on the side of substrate, therefore optical filter by glue-line without being attached on packaging body, but with encapsulation body by integral forming, the step of eliminating gluing, it can be to avoid generation excessive glue phenomenon, preventing colloid from falling to influences image quality on photosensitive element.
Description
Technical field
The present invention relates to field of camera technology, more particularly to a kind of camera module and its photosensory assembly.
Background technique
In recent years, become increasingly popular to be applied to such as personal electric product, vapour for obtaining the camera module of image
Vehicle field, medical domain etc., such as camera module have become for portable electronic devices such as smart phone, tablet computers
One of standard fitting.The camera module for being applied to portable electronic device can not only obtain image, but also can help
Portable electronic device realizes the functions such as instant video call.With the increasingly lightening development trend of portable electronic device and
User requires higher and higher imaging to the overall dimensions and camera module of camera module for the image quality of camera module
Ability is proposed harsher requirement.That is, the development trend of portable electronic device requires camera module subtracting
Imaging capability is further increased and strengthened on the basis of few size.
The camera module packaging technology generallyd use now is COB (Chip On Board) packaging technology, that is, camera shooting mould
Wiring board, photosensitive element, the bracket etc. of group are made into respectively, then successively by passive electronic component, photosensitive element and bracket
Encapsulation is in the circuit board.However the camera module size that this packaged type is formed is larger, is unable to satisfy what size increasingly reduced
Trend.
In order to solve this problem, moulding technology is introduced into camera module field, and moulding technology allows camera module in quilt
Make bracket integrally formed in the circuit board during production.
However the modes of emplacement of optical filter is still by the way of traditional: optical filter directly being passed through to glue-line and is attached to encapsulation
Side of the body far from substrate.It is easy to produce excessive glue phenomenon in this way, the glue of spilling, which can be fallen on photosensitive element, to be influenced
Image quality.
Summary of the invention
Based on this, it is necessary to which in view of the above technical problems, providing one kind can prevent colloid from falling to avoid excessive glue phenomenon is generated
Drop down onto the camera module and its photosensory assembly on photosensitive element.
A kind of photosensory assembly, comprising:
Substrate, including the first surface and second surface being oppositely arranged；
Photosensitive element, is set to the first surface of the substrate, and is electrically connected with the substrate；
Packaging body and optical filter, the packaging body is around the photosensitive element encapsulated moulding in the first table of the substrate
Face, the optical filter and the encapsulation body by integral forming, and the optical filter is located at the photosensitive element back on the substrate
Side.
Above-mentioned photosensory assembly has at least the following advantages:
Photosensitive element is set to the first surface of substrate, is electrically connected photosensitive element with substrate, then the of substrate
One surface forms the packaging body around photosensitive element by way of encapsulated moulding, and with the integrally formed optical filtering of packaging body
Piece, and optical filter is located at photosensitive element back on the side of substrate, therefore optical filter is not necessarily to be attached on packaging body by glue-line,
But the step of with encapsulating body by integral forming, eliminating gluing, it can prevent colloid from falling to photosensitive to avoid excessive glue phenomenon is generated
Image quality is influenced on element.
In one of the embodiments, the optical filter be attached directly to the photosensitive element back on the substrate table
Face.Photosensitive element is prevented to be exposed in space, it is possible to prevente effectively from dust impurity, which is fallen on, influences image quality on photosensitive element.
The optical filter and the photosensitive element have back between the surface of the substrate in one of the embodiments,
There is spacing, an accommodating chamber is collectively formed in the packaging body and the optical filter.Optical filter is not necessarily to be arranged by glue-line in packaging body
On, it can be to avoid excessive glue phenomenon, and can prevent from external dust impurity from falling to influencing image quality on photosensitive element.
In one of the embodiments, further include conductive connecting, the photosensitive element by the conductive connecting with
The substrate electrical connection.Conductive connecting is formed by way of routing, technical maturity, and step is easy.
The photosensitive element includes photosurface and the non-sense that is oppositely arranged with the photosurface in one of the embodiments,
Smooth surface, the non-photo-sensing face are set to the first surface of the substrate, and the photosurface includes photosensitive area and is located at described photosensitive
The non-photo-sensing area of area side, the conductive connecting and the non-photo-sensing area are embedded at the packaging body.Conductive connecting will not
Damage is touched by any, while reducing influence of the environmental factor to conductive connecting, such as temperature, so that photosensitive element and base
Electric connection between plate is stablized, and can further decrease the size of the XY axis direction of photosensory assembly.
The photosensitive element includes photosurface and the non-sense that is oppositely arranged with the photosurface in one of the embodiments,
Smooth surface, the non-photo-sensing face are set to the first surface of the substrate, and the photosurface includes photosensitive area and is located at described photosensitive
The non-photo-sensing area of area side has spacing between the conductive connecting and the non-photo-sensing area and the inner wall of the packaging body.
Conductive connecting is exposed in space, therefore conductive connecting is visual in assembling, is conducive to quickly find breaking part.
It in one of the embodiments, further include electronic component, the electronic component is set to the first table of the substrate
Face, and be electrically connected with the substrate, the electronic component is embedded at the packaging body.Electronic component is prevented to be directly exposed to space
Interior, electronic component will not be infected with the pollutants such as dust, will not influence photosensitive element, avoid pollution photosensitive element and to image
There are the bad phenomenons such as dirty stain in mould group.
A kind of photosensory assembly, comprising:
Substrate, including the first surface and second surface being oppositely arranged；
Photosensitive element, is set to the first surface of the substrate, and is electrically connected with the substrate；And
The first of substrate is arranged in packaging body, including integrally formed first part and second part, the first part
Surface and at least partly structure for encapsulating photosensitive element, photosensitive element and extraneous light described in the second part face pass through institute
It states second part and reaches the photosensitive element.
Above-mentioned photosensory assembly has at least the following advantages:
Photosensitive element is set to the first surface of substrate, is electrically connected photosensitive element with substrate, then the of substrate
One surface forms the packaging body around photosensitive element by way of encapsulated moulding, and packaging body includes integrally formed first
Point and second part, first part the first surface of substrate is set and encapsulates at least partly structure of photosensitive element, as holding
It carries the supporting body of optical section, second part face photosensitive element and extraneous light and reaches photosensitive element by second part, therefore
The step of gluing is eliminated since first part and second part are integrally formed as the filtering structure of filtering external light
It suddenly, can be to avoid generation excessive glue phenomenon.
A kind of camera module, comprising:
Photosensory assembly as described in any of the above one；And
Optical section is set to the top surface of the packaging body.
The optical section includes voice coil motor, lens barrel and camera lens, the voice coil motor setting in one of the embodiments,
In the top surface of the packaging body, the lens barrel is set in the voice coil motor, and the camera lens is set in the lens barrel；Or
The optical section includes microscope base, lens barrel and camera lens in one of the embodiments, and the microscope base is set to the envelope
The top surface of body is filled, the lens barrel is set on the microscope base, and the lens barrel is set in the lens barrel.
Above-mentioned camera module has at least the following advantages:
Photosensitive element is set to the first surface of substrate, is electrically connected photosensitive element with substrate, then the of substrate
One surface forms the packaging body around photosensitive element by way of encapsulated moulding, and with the integrally formed optical filtering of packaging body
Piece, and optical filter is located at photosensitive element back on the side of substrate, therefore optical filter is not necessarily to be attached on packaging body by glue-line,
But the step of with encapsulating body by integral forming, eliminating gluing, it can prevent colloid from falling to photosensitive to avoid excessive glue phenomenon is generated
Image quality is influenced on element.Then optical section is set to the top surface of packaging body.
Detailed description of the invention
Fig. 1 is the cross-sectional view of the camera module in first embodiment；
Fig. 2 is the cross-sectional view of the camera module in second embodiment；
Fig. 3 is the cross-sectional view of the camera module in third embodiment.
Specific embodiment
In order to make the foregoing objectives, features and advantages of the present invention clearer and more comprehensible, with reference to the accompanying drawing to the present invention
Specific embodiment be described in detail.Many details are explained in the following description in order to fully understand this hair
It is bright.But the invention can be embodied in many other ways as described herein, those skilled in the art can be not
Similar improvement is done in the case where violating intension of the present invention, therefore the present invention is not limited to the specific embodiments disclosed below.
It should be noted that it can directly on the other element when element is referred to as " being fixed on " another element
Or there may also be elements placed in the middle.When an element is considered as " connection " another element, it, which can be, is directly connected to
To another element or it may be simultaneously present centering elements.Term as used herein " vertical ", " horizontal ", " left side ",
" right side " and similar statement for illustrative purposes only, are not meant to be the only embodiment.
Unless otherwise defined, all technical and scientific terms used herein and belong to technical field of the invention
The normally understood meaning of technical staff is identical.Term as used herein in the specification of the present invention is intended merely to description tool
The purpose of the embodiment of body, it is not intended that in the limitation present invention.Each technical characteristic of embodiment described above can carry out arbitrarily
Combination, for simplicity of description, it is not all possible to each technical characteristic in above-described embodiment combination be all described, so
And as long as there is no contradiction in the combination of these technical features, it all should be considered as described in this specification.
Camera module in one embodiment, including photosensory assembly and optical section.Specifically, photosensory assembly include substrate,
Photosensitive element, packaging body and optical filter.Optical section includes lens barrel and camera lens, and camera lens is set in lens barrel.
Substrate includes the first surface and second surface being oppositely arranged, and photosensitive element is set to the first surface of substrate, and
It is electrically connected with substrate.Packaging body around photosensitive element encapsulated moulding in the first surface of substrate, optical filter and packaging body one at
Type, and optical filter is located at photosensitive element back on the side of substrate.
Photosensitive element is set to the first surface of substrate, is electrically connected photosensitive element with substrate, then the of substrate
One surface forms the packaging body around photosensitive element by way of encapsulated moulding, and with the integrally formed optical filtering of packaging body
Piece, and optical filter is located at photosensitive element back on the side of substrate, therefore optical filter is not necessarily to be attached on packaging body by glue-line,
But the step of with encapsulating body by integral forming, eliminating gluing, it can prevent colloid from falling to photosensitive to avoid excessive glue phenomenon is generated
Image quality is influenced on element.
Certainly, in other embodiments, photosensory assembly can also include substrate, photosensitive element and packaging body.Substrate
Including the first surface and second surface being oppositely arranged, photosensitive element is set to the first surface of substrate, and is electrically connected with substrate.
Packaging body includes integrally formed first part and second part, and first part is set to the first surface of substrate, and encapsulates sense
At least partly structure of optical element, second part is right against photosensitive element, and extraneous light reaches photosensitive member by second part
Part.That is, the second part of packaging body acts as the effect of optical filter.Therefore, the step of eliminating gluing, it is possible to prevente effectively from producing
Raw excessive glue phenomenon, preventing colloid from falling to influences image quality on photosensitive element.
Referring to Fig. 1, for the camera module 100 in first embodiment.The camera module 100 includes photosensory assembly 110
And optical section 120.Photosensory assembly 110 includes substrate 111, photosensitive element 112, packaging body 113 and optical filter 114.Optical section 120
Including voice coil motor 121, lens barrel 122 and camera lens 123.
Substrate 111 includes the first surface 1111 and second surface 1112 being oppositely arranged.Substrate 111 is wiring board, such as
It can be hard circuit board, ceramic substrate (without soft board), or Rigid Flex, or be soft board, when substrate 111 is
When soft board, stiffening plate can be set in the second surface 1112 of substrate 111, to enhance the intensity of substrate 111.
Photosensitive element 112 is set to the first surface 1111 of substrate 111, and is electrically connected with substrate 111.Photosensitive element 112
It can be CCD (Charge-coupled Device, charge coupled cell) or CMOS (Complementary Metal
Oxide Semiconductor, metal oxide semiconductor device).
Photosensitive element 112 includes photosurface 1121 and the non-photo-sensing face 1122 being arranged back on photosurface 1121, non-photo-sensing
Face 1122 is set on the first surface 1111 of substrate 111 by glue-line.Photosurface 1121 includes photosensitive area and non-photo-sensing area, sense
Light area is located at middle part, and non-photo-sensing area is arranged around photosensitive area.Certainly, in other implementations, non-photo-sensing area can also be only
Positioned at the side of photosensitive area.Light is incident from camera lens 123 and reaches photosurface 1121, and photosurface 1121 converts optical signals into electricity
Signal, and be transferred on connector by substrate 111.
Specific in first embodiment, photosensitive element 112 is electrically connected by conductive connecting 115 with substrate 111.It is conductive
Connecting line 115 can be gold thread, copper wire, aluminum steel or silver wire etc..The both ends of conductive connecting 115 respectively with photosensitive element
112 and substrate 111 be electrically connected, conductive connecting 115 can be formed by way of just beating: using wiring tool from substrate 111
To the direction routing of photosensitive element 112.Conductive connecting 115 can also be formed by way of counter beat: using wiring tool from
Direction routing of the photosensitive element 112 to substrate 111.The camber of the conductive connecting 115 formed by the way of counter beat is less than just
The conductive connecting 115 that the mode of beating is formed.Conductive connecting 115 is formed by way of routing, technical maturity, and step is simple.
It certainly, in other embodiments, can also be by the non-photo-sensing face 1122 of photosensitive element 112 and substrate
Conductive bumps are set, such as conductive bumps can be soldered ball, photosensitive element 112 is electrically connected by soldered ball with substrate 111 between 111
It connects.
Specific in first embodiment, photosensory assembly 110 further includes electronic component 116, and electronic component 116 is set to base
The first surface 1111 of plate 111, and be electrically connected with substrate 111.Specifically, electronic component 116 can be resistance, capacitor, two poles
Pipe, triode, potentiometer, relay or driver.
Packaging body 113 is around 112 encapsulated moulding of photosensitive element in the first surface 1111 of substrate 111, optical filter 114 and envelope
It fills body 113 to be integrally formed, and optical filter 114 is located at photosensitive element 112 back on the side of substrate 111.That is, optical filter 114
In the side of the photosurface 1121 of photosensitive element 112.Packaging body 113 includes close to the inner wall of photosensitive element 112 and far from photosensitive
The outer wall of element 112.
Packaging body 113 and optical filter 114 can be formed by molded mode.For example, using injection molding machine, by embedding
Enter moulding process the wiring board after carrying out SMT technique carried out molding to form packaging body 113 and optical filter 114, or with partly leading
Common mould pressing process forms packaging body 113 and optical filter 114 in body encapsulation.The mode that packaging body 113 and optical filter 114 are formed
It can choose Shooting Technique or mould pressing process etc..Packaging body 113 after molding is securely connected with substrate 111, with traditional mirror
Seat is compared by glue-line bonding, and the bonding force between packaging body 113 and substrate 111 is much greater.
Using Shooting Technique to form packaging body 113 and the material of optical filter 114 can be nylon, LCP (Liquid
Crystal Polymer, polymeric liquid crystal copolymer), PP (Polypropylene, polypropylene) etc., formed using mould pressing process
The material of packaging body 113 and optical filter 114 can be epoxy resin.It will be apparent to a skilled person that aforementioned can be with
The manufacture of selection and the material that can choose, the mode that can be implemented of the invention, is not this as an example
The limitation of invention.
Specific in first embodiment, optical filter 114 is attached directly to photosensitive element 112 back on the table of substrate 111
Face.That is, optical filter 114 is attached directly to the photosurface 1121 of photosensitive element 112.Accordingly it is possible to prevent the exposure of photosensitive element 112
Image quality is influenced in space, effectively avoiding dust impurity from falling on photosensitive element 112.
Specific in first embodiment, electronic component 116 is set to the first surface 1111 of substrate 111, and is embedded at
In packaging body 113.Therefore, electronic component 116 is covered by packaging body 113, will not be directly exposed in space, more specifically
It says, is not exposed in the environment communicated with photosensitive element 112, thus when being assembled into camera module 100, electronic component 116
The pollutants such as dust will not be infected with, photosensitive element 112 will not be influenced, photosensitive element 112 is avoided pollution and makes camera module
100 there are the bad phenomenons such as dirty stain.
Certainly, in other embodiments, electronic component 116 is set to the first surface 1111 of substrate 111, and is located at
Outside packaging body 113.That is, electronic component 116 is not wrapped by packaging body 113, thus the heat dissipation performance of electronic component 116 compared with
It is good.Electronic component 116 be located at packaging body 113 it is outer when in two kinds of situation: electronic component 116 is located at the inner wall side of packaging body 113,
The good heat dispersion performance of electronic component 116；Electronic component 116 is located at the outer wall side of packaging body 113, can reduce conductive connection
Safe distance between line 115 and the inner wall of packaging body 113 further reduces the size of entire photosensory assembly 110.
Specific in first embodiment, the non-photo-sensing area of photosensitive element 112 is embedded at packaging body 113, conductive connecting
115 are embedded at completely in packaging body 113.Therefore, conductive connecting 115 will not be directly exposed to exterior space, thus assembling
When camera module 100 so that conductive connecting 115 not will receive it is any touch damage, while reducing environmental factor to conduction
The influence of connecting line 115, such as temperature, so that the electric connection between photosensitive element 112 and substrate 111 is stablized.
Certainly, in other embodiments, conductive connecting 115 can also be partially embedded in packaging body 113, part
Packaging body 113 is exposed to, processing step is simplified.
Voice coil motor 121 is set to the top surface of packaging body 113.Such as voice coil motor 121 can be assembled in envelope by glue-line
The top surface of body 113 is filled, lens barrel 122 is set in voice coil motor 121, and camera lens 123 is set in lens barrel 122.
Certainly, in other embodiments, voice coil motor 121 can also be substituted using microscope base, microscope base is set by glue-line
It is placed in the top surface of packaging body 113, lens barrel 122 is set on microscope base, and camera lens 123 is set in lens barrel 122.
Above-mentioned camera module 100 and its photosensory assembly 110 have at least the following advantages:
Photosensitive element 112 is set to the first surface 1111 of substrate 111, photosensitive element 112 is made to pass through conductive connecting
115 are electrically connected with substrate 111, are then formed by way of encapsulated moulding in the first surface 1111 of substrate 111 around sense
The packaging body 113 of optical element 112, and with the integrally formed optical filter 114 of packaging body 113, and optical filter 114 is attached directly to feel
Optical element 112 is back on the surface of substrate 111, therefore optical filter 114 is not necessarily to be attached on packaging body 113 by glue-line, but
The step of being integrally formed with packaging body 113, eliminating gluing can prevent colloid from falling to photosensitive to avoid excessive glue phenomenon is generated
Image quality is influenced on element 112.
Referring to Fig. 2, for the camera module 200 in second embodiment.The camera module 200 includes photosensory assembly 210
And optical section 220.Photosensory assembly 210 includes substrate 211, photosensitive element 212, packaging body 213 and optical filter 214.Optical section 220
Including voice coil motor 221, lens barrel 222 and camera lens 223.
Substrate 211 includes the first surface 2111 and second surface 2112 being oppositely arranged.Substrate 211 is wiring board, such as
It can be hard circuit board, ceramic substrate (without soft board), or Rigid Flex, or be soft board, when substrate 211 is
When soft board, stiffening plate can be set in the second surface 2112 of substrate 211, to enhance the intensity of substrate 211.
Photosensitive element 212 is set to the first surface 2111 of substrate 211, and is electrically connected with substrate 211.Photosensitive element 212
It can be CCD (Charge-coupled Device, charge coupled cell) or CMOS (Complementary Metal
Oxide Semiconductor, metal oxide semiconductor device).
Photosensitive element 212 includes photosurface 2121 and the non-photo-sensing face 2122 being arranged back on photosurface 2121, non-photo-sensing
Face 2122 is set on the first surface 2111 of substrate 211 by glue-line.Photosurface 2121 is including photosensitive area and is located at photosensitive area
The non-photo-sensing area of side, photosensitive area are located at middle part, and non-photo-sensing area is arranged around photosensitive area.Certainly, in other implementations,
Non-photo-sensing area can also be only located at the side of photosensitive area.Light is incident from camera lens 223 and reaches photosurface 2121, photosurface 2121
Electric signal is converted optical signals into, and is transferred on connector by substrate 211.
Specific in second embodiment, photosensitive element 212 is electrically connected by conductive connecting 215 with substrate 211.It is conductive
Connecting line 215 can be gold thread, copper wire, aluminum steel or silver wire etc..The both ends of conductive connecting 215 respectively with photosensitive element
212 and substrate 211 be electrically connected, conductive connecting 215 can be formed by way of just beating: using wiring tool from substrate 211
To the direction routing of photosensitive element 212.Conductive connecting 215 can also be formed by way of counter beat: using wiring tool from
Direction routing of the photosensitive element 212 to substrate 211.The camber of the conductive connecting 215 formed by the way of counter beat is less than just
The conductive connecting 215 that the mode of beating is formed.Conductive connecting 215 is formed by way of routing, technical maturity, and step is simple.
It certainly, in other embodiments, can also be by the non-photo-sensing face 2122 of photosensitive element 212 and substrate
Conductive bumps are set, such as conductive bumps can be soldered ball, photosensitive element 212 is electrically connected by soldered ball with substrate 211 between 211
It connects.
Specific in second embodiment, photosensory assembly 210 further includes electronic component 216, and electronic component 216 is set to base
The first surface 2111 of plate 211, and be electrically connected with substrate 211.Specifically, electronic component 216 can be resistance, capacitor, two poles
Pipe, triode, potentiometer, relay or driver.
Packaging body 213 is around 212 encapsulated moulding of photosensitive element in the first surface 2111 of substrate 211, optical filter 214 and envelope
It fills body 213 to be integrally formed, and optical filter 214 is located at photosensitive element 212 back on the side of substrate 211.That is, optical filter 214
In the side of the photosurface 2121 of photosensitive element 212.Packaging body 213 includes close to the inner wall of photosensitive element 212 and far from photosensitive
The outer wall of element 212.
Packaging body 213 and optical filter 214 can be formed by molded mode.For example, using injection molding machine, by embedding
Enter moulding process the wiring board after carrying out SMT technique carried out molding to form packaging body 213 and optical filter 214, or with partly leading
Common mould pressing process forms packaging body 213 and optical filter 214 in body encapsulation.The mode that packaging body 213 and optical filter 214 are formed
It can choose Shooting Technique or mould pressing process etc..Packaging body 213 after molding is securely connected with substrate 211, with traditional mirror
Seat is compared by glue-line bonding, and the bonding force between packaging body 213 and substrate 211 is much greater.
Using Shooting Technique to form packaging body 213 and the material of optical filter 214 can be nylon, LCP (Liquid
Crystal Polymer, polymeric liquid crystal copolymer), PP (Polypropylene, polypropylene) etc., formed using mould pressing process
The material of packaging body 213 and optical filter 214 can be epoxy resin.It will be apparent to a skilled person that aforementioned can be with
The manufacture of selection and the material that can choose, the mode that can be implemented of the invention, is not this as an example
The limitation of invention.
Specific in second embodiment, optical filter 214 and photosensitive element 212 have back between the surface of substrate 211
There is spacing, an accommodating chamber A is collectively formed in packaging body 213 and optical filter 214.Therefore, optical filter 214 is not necessarily to exist by glue-line setting
, can be to avoid excessive glue phenomenon on packaging body 213, and can prevent from external dust impurity from falling on photosensitive element 212 influencing
Image quality.
Specific in second embodiment, electronic component 216 is set to the first surface 2111 of substrate 211, and is embedded at
In packaging body 213.Therefore, electronic component 216 is covered by packaging body 213, will not be directly exposed in space, more specifically
It says, is not exposed in the environment communicated with photosensitive element 212, thus when being assembled into camera module 200, electronic component 216
The pollutants such as dust will not be infected with, photosensitive element 212 will not be influenced, photosensitive element 212 is avoided pollution and makes camera module
200 there are the bad phenomenons such as dirty stain.
Certainly, in other embodiments, electronic component 216 is set to the first surface 2111 of substrate 211, and is located at
Outside packaging body 213.That is, electronic component 216 is not wrapped by packaging body 213, thus the heat dissipation performance of electronic component 216 compared with
It is good.Electronic component 216 be located at packaging body 213 it is outer when in two kinds of situation: electronic component 216 is located at the inner wall side of packaging body 213,
The good heat dispersion performance of electronic component 216；Electronic component 216 is located at the outer wall side of packaging body 213, can reduce conductive connection
Safe distance between line 215 and the inner wall of packaging body 213 further reduces the size of entire photosensory assembly 210.
Specific in second embodiment, the non-photo-sensing area of photosensitive element 212 is embedded at packaging body 213, conductive connecting
215 are embedded at completely in packaging body 213.Therefore, conductive connecting 215 will not be directly exposed to exterior space, thus assembling
When camera module 200 so that conductive connecting 215 not will receive it is any touch damage, while reducing environmental factor to conduction
The influence of connecting line 215, such as temperature, so that the electric connection between photosensitive element 212 and substrate 211 is stablized, and can be into one
Step reduces the size of the XY axis direction of photosensory assembly 210.
Certainly, in other embodiments, conductive connecting 215 can also be partially embedded in packaging body 213, part
Packaging body 213 is exposed to, processing step is simplified.
Certainly, referring to Fig. 3, in the third embodiment, conductive connecting 215 and non-photo-sensing area and packaging body 213
There is spacing between inner wall.Conductive connecting 215 is exposed in space, therefore conductive connecting 215 is visual in assembling, favorably
In quickly investigation breaking part, and be conducive to the heat dissipation of conductive connecting 215.
Voice coil motor 221 is set to the top surface of packaging body 213.Such as voice coil motor 221 can be assembled in envelope by glue-line
The top surface of body 213 is filled, lens barrel 222 is set in voice coil motor 221, and camera lens 223 is set in lens barrel 222.
Certainly, in other embodiments, voice coil motor 221 can also be substituted using microscope base, microscope base is set by glue-line
It is placed in the top surface of packaging body 213, lens barrel 222 is set on microscope base, and camera lens 223 is set in lens barrel 222.
Above-mentioned camera module 200 and its photosensory assembly 210 have at least the following advantages:
Photosensitive element 212 is set to the first surface 2111 of substrate 211, photosensitive element 212 is made to pass through conductive connecting
215 are electrically connected with substrate 211, are then formed by way of encapsulated moulding in the first surface 2111 of substrate 211 around sense
The packaging body 213 of optical element 212, and with the integrally formed optical filter 214 of packaging body 213, optical filter 214 is located at photosensitive element
212 2121 side of photosurface, and optical filter 214 and photosensitive element 212 be back on having spacing between the surface of substrate 211,
Therefore optical filter 214 by glue-line without being attached on packaging body 213, but is integrally formed with packaging body 213, and gluing is eliminated
The step of, it can be to avoid excessive glue phenomenon be generated, preventing colloid from falling on photosensitive element 212 influences image quality.
The embodiments described above only express several embodiments of the present invention, and the description thereof is more specific and detailed, but simultaneously
It cannot therefore be construed as limiting the scope of the patent.It should be pointed out that coming for those of ordinary skill in the art
It says, without departing from the inventive concept of the premise, various modifications and improvements can be made, these belong to protection of the invention
Range.Therefore, the scope of protection of the patent of the invention shall be subject to the appended claims.
Claims (10)
1. a kind of photosensory assembly characterized by comprising
Substrate, including the first surface and second surface being oppositely arranged；
Photosensitive element, is set to the first surface of the substrate, and is electrically connected with the substrate；
Packaging body and optical filter, the packaging body is around the photosensitive element encapsulated moulding in the first surface of the substrate, institute
Optical filter and the encapsulation body by integral forming are stated, and the optical filter is located at the photosensitive element back on the one of the substrate
Side.
2. photosensory assembly according to claim 1, which is characterized in that the optical filter is attached directly to the photosensitive element
Back on the surface of the substrate.
3. photosensory assembly according to claim 1, which is characterized in that the optical filter and the photosensitive element are back on institute
Stating has spacing between the surface of substrate, an accommodating chamber is collectively formed in the packaging body and the optical filter.
4. photosensory assembly according to claim 3, which is characterized in that further include conductive connecting, the photosensitive element is logical
The conductive connecting is crossed to be electrically connected with the substrate.
5. photosensory assembly according to claim 4, which is characterized in that the photosensitive element include photosurface and with the sense
The non-photo-sensing face that smooth surface is oppositely arranged, the non-photo-sensing face are set to the first surface of the substrate, and the photosurface includes sense
Light area and the encapsulation is embedded at positioned at the non-photo-sensing area of the photosensitive area side, the conductive connecting and the non-photo-sensing area
Body.
6. photosensory assembly according to claim 4, which is characterized in that the photosensitive element include photosurface and with the sense
The non-photo-sensing face that smooth surface is oppositely arranged, the non-photo-sensing face are set to the first surface of the substrate, and the photosurface includes sense
Light area and positioned at the non-photo-sensing area of the photosensitive area side, the conductive connecting and the non-photo-sensing area and the packaging body
There is spacing between inner wall.
7. photosensory assembly according to claim 1, which is characterized in that it further include electronic component, the electronic component setting
It in the first surface of the substrate, and is electrically connected with the substrate, the electronic component is embedded at the packaging body.
8. a kind of photosensory assembly characterized by comprising
Substrate, including the first surface and second surface being oppositely arranged；
Photosensitive element, is set to the first surface of the substrate, and is electrically connected with the substrate；And
The first surface of substrate is arranged in packaging body, including integrally formed first part and second part, the first part
And at least partly structure of photosensitive element is encapsulated, photosensitive element described in the second part face and extraneous light are by described the
Two parts reach the photosensitive element.
9. a kind of camera module characterized by comprising
Photosensory assembly as claimed in any of claims 1 to 8 in one of claims；And
Optical section is set to the top surface of the packaging body.
10. camera module according to claim 9, which is characterized in that the optical section includes voice coil motor, lens barrel and mirror
Head, the voice coil motor are set to the top surface of the packaging body, and the lens barrel is set in the voice coil motor, and the camera lens is set
It is placed in the lens barrel；Or
The optical section includes microscope base, lens barrel and camera lens, and the microscope base is set to the top surface of the packaging body, the lens barrel setting
In on the microscope base, the lens barrel is set in the lens barrel.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710471827.4A CN109104550A (en) | 2017-06-20 | 2017-06-20 | Camera module and its photosensory assembly |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710471827.4A CN109104550A (en) | 2017-06-20 | 2017-06-20 | Camera module and its photosensory assembly |
Publications (1)
| Publication Number | Publication Date |
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| CN109104550A true CN109104550A (en) | 2018-12-28 |
Family
ID=64796044
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| Application Number | Title | Priority Date | Filing Date |
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| CN201710471827.4A Withdrawn CN109104550A (en) | 2017-06-20 | 2017-06-20 | Camera module and its photosensory assembly |
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| Country | Link |
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| CN (1) | CN109104550A (en) |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| CN109905584A (en) * | 2019-03-28 | 2019-06-18 | 昆山丘钛微电子科技有限公司 | Camera module and terminal |
| WO2020220815A1 (en) * | 2019-04-30 | 2020-11-05 | 宁波舜宇光电信息有限公司 | Camera module and photosensitive assembly thereof, and electronic device and preparation method |
| US12010412B2 (en) | 2019-04-30 | 2024-06-11 | Ningbo Sunny Opotech Co., Ltd. | Camera module and photosensitive assembly thereof, electronic device, and manufacturing method |
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| US12010412B2 (en) | 2019-04-30 | 2024-06-11 | Ningbo Sunny Opotech Co., Ltd. | Camera module and photosensitive assembly thereof, electronic device, and manufacturing method |
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