CN109087937A - A kind of AMOLED panel - Google Patents
A kind of AMOLED panel Download PDFInfo
- Publication number
- CN109087937A CN109087937A CN201811046313.5A CN201811046313A CN109087937A CN 109087937 A CN109087937 A CN 109087937A CN 201811046313 A CN201811046313 A CN 201811046313A CN 109087937 A CN109087937 A CN 109087937A
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- China
- Prior art keywords
- inorganic insulation
- layer
- insulation layer
- column
- interlayer dielectric
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Classifications
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
- H10K59/10—OLED displays
- H10K59/12—Active-matrix OLED [AMOLED] displays
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K50/00—Organic light-emitting devices
- H10K50/80—Constructional details
- H10K50/84—Passivation; Containers; Encapsulations
- H10K50/844—Encapsulations
Abstract
The embodiment of the invention discloses a kind of AMOLED panels, there is fringe region between its cutting line and packaging film boundary, the fringe region successively includes: flexible substrate, buffer layer, the first inorganic insulation layer, the second inorganic insulation layer and the first interlayer dielectric layer from bottom to up；The fringe region of the AMOLED panel has the structure for preventing inoranic membrane crack propagation, comprising: the organic deposition pattern that at least one column are set in first inorganic insulation layer, the second inorganic insulation layer and the first interlayer dielectric layer；At least one column are provided with the metal deposit pattern in first inorganic insulation layer, the second inorganic insulation layer and the first interlayer dielectric layer at least one layer.Implement the embodiment of the present invention, can improve the problems such as causing image quality abnormal because of crack propagation in bending process.
Description
Technical field
The present invention relates to display field, in particular to a kind of AMOLED panel.
Background technique
In AMOLED (Active-matrix organic light emitting diode, active-matrix organic light emission
Diode) panel production in, usually big plate is cut by laser to form the platelet for needing dimensions.On the one hand, by
It can cause naked eyes sightless micro-crack when the inorganic film of face plate edge is in cutting, on the other hand, because lattice is at most edge
Position terminates suddenly and forms a large amount of dangling bonds and defect, and therefore, edge unstable region would generally become the start bit of crackle
It sets.When AMOLED panel is bent in use, it is present in intrinsic stress in inorganic thin film and from film
The extrinsic stress such as the adhesive force to substrate can constantly promote further expanding for micro-crack, bend in ten hundreds of repetitions
Under, when embrittlement occurs with intrinsic brittleness and compared with the inorganic encapsulated film of defect modes, the water in atmosphere will enter with oxygen
It invades.The invasion of water oxygen not only can occur oxidation with luminescent layer organic matter and generate carbonyls, also can be with OLED device
Cathode material in alkali or alkaline earth metal occur electrochemical corrosion, while significantly reducing luminous quantum efficiency,
Also a large amount of stain disadvantages can be formed because luminescent material is rotten, extreme influence device lifetime.
As shown in Figure 1, showing a kind of existing AMOLED panel planar structure schematic diagram；There it can be seen that described
AMOLED panel is successively placed with cutting line area 1 ', face plate edge area 3 ', packaging film marginal zone 2 ', GOA driving circuit and cloth
Line area 4 ' and viewing area 5 '.In panel after repeatedly bending, the crackle of cutting area can be to GOA driving circuit and wiring region 4 '
And viewing area 5 ' extends.Together referring to fig. 2 in sectional view, in the face plate edge area 3 ' of AMOLED panel, from bottom to up according to
It is secondary to be placed with flexible substrate 30 ', buffer layer 31 ', the first inorganic insulation layer 32 ', the second inorganic insulation layer 33 ' and the first interlayer
Dielectric layer 34 '；It is extended to slow down crackle into plate, one of barrier structure 6 ' can be designed in panel cutting line marginal position,
But there is only some shortcomingss for this kind, i.e., be only arranged the barrier structure 6 ' be difficult to prevent different frequency, thousands of times it is curved
The rapid extension of micro-crack brought by rolling over, on the other hand, since 6 ' distance cutting line position of the barrier structure is excessively close, easily because
It crosses and cuts and cause the destruction of the barrier structure 6 ' and thoroughly lose the effect that crackle prevents.
Summary of the invention
Technical problem to be solved by the present invention lies in provide a kind of AMOLED panel, being provided with prevents inoranic membrane
The structure of crack propagation is improved in bending process by integrating different patterned structures in AMOLED panel fringe region
It is the problems such as causing image quality abnormal because of crack propagation, final to realize the normal display dynamically bent under targeted number.
In order to solve the above-mentioned technical problem, the one side of the embodiment of the present invention provides a kind of AMOLED panel, cuts at it
There is fringe region, the fringe region successively includes: flexible substrate, buffering from bottom to up between secant and packaging film boundary
Layer, the first inorganic insulation layer, the second inorganic insulation layer and the first interlayer dielectric layer；It is characterized in that, in the fringe region
In be provided with one and prevent the structure of inoranic membrane crack propagation, the structure includes:
At least one column are set to organic in first inorganic insulation layer, the second inorganic insulation layer and the first interlayer dielectric layer
Object deposited picture；
It is at least one layer of that at least one column are provided with first inorganic insulation layer, the second inorganic insulation layer and the first interlayer dielectric layer
In metal deposit pattern.
Wherein, the organic deposition pattern is close to the cutting line side, and the metal deposit pattern is close to the envelope
Fill film side.
Wherein, the second interlayer dielectric layer, second interlayer are further provided on the organic deposition pattern
Dielectric layer covers all organic deposition patterns.
Wherein, each column organic matter deposited picture is parallel with the cutting line comprising multiple perforations described the
The deposition hole of one inorganic insulation layer, the second inorganic insulation layer and the first interlayer dielectric layer has in the deposition hole
Machine object；
Each column metal deposit pattern is parallel with the cutting line comprising multiple to be deposited on first inorganic insulation
Metal film block in one of layer, the second inorganic insulation layer and the first interlayer dielectric layer layer.
Wherein, in adjacent two column organic matter deposited picture, the deposition hole is staggered in the longitudinal direction；In adjacent two column
In metal deposit pattern, the metal film block is staggered in the longitudinal direction.
Wherein, each column organic matter deposited picture is parallel with the cutting line comprising one article of perforation described the
The dislodger of one inorganic insulation layer, the second inorganic insulation layer and the first interlayer dielectric layer has in the dislodger
Machine object；
Each column metal deposit pattern is parallel with the cutting line comprising one is deposited on first inorganic insulation
Metal film strips in one of layer, the second inorganic insulation layer and the first interlayer dielectric layer layer.
Wherein, each column organic matter deposited picture is identical as each column metal deposit pattern length.
Wherein, it is further provided between the cutting line and outermost organic deposition pattern through the buffering
The barrier structure of layer, the first inorganic insulation layer, the second inorganic insulation layer and the first interlayer dielectric layer.
Wherein, the metal deposit pattern uses metal molybdenum material.
The implementation of the embodiments of the present invention has the following beneficial effects:
AMOLED panel provided in an embodiment of the present invention is wherein being provided with the structure for preventing inoranic membrane crack propagation, specifically,
By the fringe region between the cutting line of AMOLED panel and packaging film boundary, an at least column organic deposition figure is set
Case, and an at least column metal deposit pattern；Formed different scale, metal of different shapes and organic matter graphically, diversification
Structure；Since existing fringe region does not have a metal routing and figure, thus this in the present invention increase newly structure design be not take up it is other
Route and pattern space can prevent crack propagation to diversification on the basis of AMOLED panel existing structure designs, and can be suitable
Benefit stops micro-crack except encapsulating film, realizes that the dynamic of targeted number is bent without there is phenomena such as image quality is abnormal.
Detailed description of the invention
In order to more clearly explain the embodiment of the invention or the technical proposal in the existing technology, to embodiment or will show below
There is attached drawing needed in technical description to be briefly described, it should be apparent that, the accompanying drawings in the following description is only this
Some embodiments of invention for those of ordinary skill in the art without creative efforts, can be with
Other attached drawings are obtained according to these attached drawings.
Fig. 1 is a kind of existing AMOLED panel planar structure schematic diagram；
Fig. 2 be in Fig. 1 A '-A ' to partial cutaway view；
Fig. 3 is a kind of partial structural diagram of AMOLED panel one embodiment provided by the invention；
Fig. 4 is the partial structural diagram of another embodiment in a kind of AMOLED panel provided by the invention；
Fig. 5 is a kind of partial structural diagram of another embodiment of AMOLED panel provided by the invention.
Specific embodiment
Following will be combined with the drawings in the embodiments of the present invention, and technical solution in the embodiment of the present invention carries out clear and complete
Ground description, it is clear that described embodiment is only a part of the embodiments of the present invention, instead of all the embodiments.It is based on
Embodiment in the present invention, those of ordinary skill in the art without making creative work it is obtained it is all its
Its embodiment, shall fall within the protection scope of the present invention.
Here, it should also be noted that, in order to avoid having obscured the present invention because of unnecessary details, in the accompanying drawings only
Show with closely related structure and/or processing step according to the solution of the present invention, and be omitted little with relationship of the present invention
Other details.
As shown in figure 3, being one, structure for preventing inoranic membrane crack propagation in a kind of AMOLED panel provided by the invention
The structural schematic diagram of embodiment, middle and upper part point show its plan view, under partially illustrate the A-A of upper figure to sectional view；?
In the present embodiment, the AMOLED panel has fringe region 3, AMOLED between 2 boundary of its cutting line 1 and packaging film
The fringe region 3 of panel successively includes: flexible substrate 30, buffer layer 31, the first inorganic insulation layer 32, second from bottom to up
Inorganic insulation layer 33 and the first interlayer dielectric layer 34；Wherein, being provided in the fringe region 3 prevents inoranic membrane crackle from expanding
The structure of exhibition, the structure for preventing inoranic membrane crack propagation include:
At least one column are set in first inorganic insulation layer 32, the second inorganic insulation layer 33 and the first interlayer dielectric layer 34
Organic deposition pattern 4, can be realized simultaneously flexible bending prevents with crackle；
At least one column be provided with first inorganic insulation layer 32, the second inorganic insulation layer 33 and the first interlayer dielectric layer 34 to
Metal deposit pattern 5 in one layer few.
Specifically, the organic deposition pattern 4 is close to 1 side of cutting line, and the metal deposit pattern 5 is close to institute
2 side of packaging film is stated, in the present embodiment, the packaging film 2 is provided with interstitial area 6 in the metal deposit pattern 5；
The interstitial area 6 is set, can be come into contact in a large area to avoid the organic matter filled in packaging film 2 and organic deposition pattern 4；
Simultaneously as being further provided with metal deposit pattern 5 between packaging film 2 and organic deposition pattern 4, can further prevent
Only above-mentioned phenomenon occurs.
Wherein, the second interlayer dielectric layer 7, the second layer are further provided on the 4 of the organic deposition pattern
Between dielectric layer 7 cover all organic deposition patterns 4.
Wherein, it is further provided between the cutting line 1 and outermost organic deposition pattern 4 through described slow
The barrier structure 8 of layer 31, the first inorganic insulation layer 32, the second inorganic insulation layer 33 and the first interlayer dielectric layer 34 is rushed, with resistance
Most marginal crackle is kept off to spread into plate.
Specifically, in the embodiment show in figure 3, two column organic matter deposited pictures 4 are shown, it is to be understood that this
Number is only for example.Wherein, each column organic matter deposited picture 4 is parallel with the cutting line 1 comprising multiple perforations
The deposition hole 40 of first inorganic insulation layer 32, the second inorganic insulation layer 33 and the first interlayer dielectric layer 34, described heavy
Product is filled with organic matter in hole；
In the embodiment show in figure 3, two column metal deposit patterns 5 are shown, it is to be understood that this number is only for example.
Wherein, each column metal deposit pattern 5 is parallel with the cutting line 1 comprising multiple to be deposited on described first inorganic
Metal film block 50 in one of insulating layer 32, the second inorganic insulation layer 33 and the first interlayer dielectric layer 34 layer.For example, in Fig. 3
In, the column metal deposit pattern 5 to keep left is deposited in the second inorganic insulation layer 33, and the column metal deposit pattern 5 kept right is heavy
Product is in the first interlayer dielectric layer 34.In one embodiment, the metal deposit pattern 5 uses metal molybdenum (Mo) material, can
With understanding, the metal material of other similar performance can also be used.
Meanwhile in order to achieve the effect that preferably to prevent crack propagation, in adjacent two column organic matter deposited picture 4, institute
Deposition hole is stated to be staggered in the longitudinal direction；In adjacent two column metal deposit pattern 5, the metal film block is staggeredly set in the longitudinal direction
It sets.So that heavy at least provided with organic deposition pattern 4 or metal in the longitudinal each section of the fringe region 3 of AMOLED panel
Product pattern 5, due to the organic deposition pattern 4 or the barrier effect of metal deposit pattern 5, so as to prevent inorganic film
Crackle extended into plate.
Shown in Fig. 4, be prevented in a kind of AMOLED panel provided by the invention inoranic membrane crack propagation structure it is another
The structural schematic diagram of a embodiment；Its middle and upper part point shows its plan view, under partially illustrate the B-B direction sectional view of upper figure；
It is understood that the difference of embodiment shown in Fig. 4 and embodiment shown in Fig. 3 is, in the fig. 4 embodiment,
Eliminate the interstitial area 6 being arranged between the metal deposit pattern 5 and the packaging film 2.
Shown in Fig. 5, be prevented in a kind of AMOLED panel provided by the invention inoranic membrane crack propagation structure it is another
The structural schematic diagram of a embodiment；Its middle and upper part point shows its plan view, under partially illustrate the C-C of upper figure to sectional view；
It is understood that the main distinction of embodiment shown in embodiment shown in Fig. 5 and Fig. 3 is organic deposition pattern
4 and metal deposit pattern 5 setting different from.In the present embodiment, multiple row organic deposition pattern 4 and gold are again provided with
Belong to deposited picture 5.Wherein, each column organic matter deposited picture 4 is parallel with the cutting line comprising a perforation institute
State the dislodger 41 of the first inorganic insulation layer 32, the second inorganic insulation layer 33 and the first interlayer dielectric layer 34, the dislodger
41 be strip, and organic matter is filled in the dislodger 41；
Each column metal deposit pattern 5 is parallel with the cutting line 1 comprising one is deposited on first inorganic insulation
Metal film strips 51 in layer one of the 32, second inorganic insulation layer 33 and the first interlayer dielectric layer 34 layer.
Wherein, each column organic matter deposited picture 4 is identical as each column metal deposit 5 length of pattern.
It is understood that the more details of the present embodiment, are referred to the aforementioned description to Fig. 3, herein without superfluous
It states.
It is understood that being often stress concentration region around deposition hole, not according to from the point of view of the case where stress distribution
When disconnected bending, it is possible to the generation of micro-crack can be caused；Therefore, in the present embodiment, the deposition hole by organic matter filling adjusts
To deposit channel-shaped, the risk of this problem generation can be effectively reduced.Even if when micro-crack is in deposition slot structure, the present embodiment
Strip metal film strips figure can play further stop micro-crack extensions path, delay crack propagation velocity, with reality
Encapsulated layer is intact under the bending number of existing predeterminated target.
It is understood that a kind of AMOLED panel of the present invention, in the cutting line 1 and packaging film of AMOLED panel
Any embodiment is arranged just like Fig. 3 into Fig. 5 in fringe region 3 between 2 prevents in AMOLED panel inoranic membrane crackle to expand
The structure of exhibition, specific structure is referring to the aforementioned explanation to Fig. 3 to Fig. 5, herein without repeating.
The implementation of the embodiments of the present invention has the following beneficial effects:
AMOLED panel provided in an embodiment of the present invention has the structure for preventing inoranic membrane crack propagation, by AMOLED
An at least column organic matter deposited picture is arranged in fringe region between the cutting line and packaging film boundary of panel, and at least
One column metal deposit pattern；Formed different scale, metal of different shapes and organic matter graphically, diversification structure；Due to existing
Some fringe regions do not have metal routing and figure, therefore this in the present invention increases structure design newly and be not take up other routes and figure sky
Between, crack propagation can be prevented to diversification on the basis of AMOLED panel existing structure designs, and can smoothly stop micro-crack
Except encapsulating film, realize that the dynamic of targeted number is bent without there is phenomena such as image quality is abnormal.
It should be noted that, in this document, relational terms such as first and second and the like are used merely to a reality
Body or operation are distinguished with another entity or operation, are deposited without necessarily requiring or implying between these entities or operation
In any actual relationship or order or sequence.Moreover, the terms "include", "comprise" or its any other variant are intended to
Non-exclusive inclusion, so that the process, method, article or equipment including a series of elements is not only wanted including those
Element, but also including other elements that are not explicitly listed, or further include for this process, method, article or equipment
Intrinsic element.In the absence of more restrictions, the element limited by sentence "including a ...", it is not excluded that
There is also other identical elements in process, method, article or equipment including the element.
The above is only the specific embodiment of the application, it is noted that for the ordinary skill people of the art
For member, under the premise of not departing from the application principle, several improvements and modifications can also be made, these improvements and modifications are also answered
It is considered as the protection scope of the application.
Claims (9)
1. a kind of AMOLED panel, there is fringe region between its cutting line and packaging film boundary, the fringe region from
Under it is supreme successively include: flexible substrate, buffer layer, the first inorganic insulation layer, the second inorganic insulation layer and the first inter-level dielectric
Layer；It is characterized in that, being provided with the structure for preventing inoranic membrane crack propagation in the fringe region, the structure includes:
At least one column are set to organic in first inorganic insulation layer, the second inorganic insulation layer and the first interlayer dielectric layer
Object deposited picture；
It is at least one layer of that at least one column are provided with first inorganic insulation layer, the second inorganic insulation layer and the first interlayer dielectric layer
In metal deposit pattern.
2. AMOLED panel as described in claim 1, which is characterized in that the organic deposition pattern is close to the cutting line
Side, the metal deposit pattern is close to the packaging film side.
3. AMOLED panel as claimed in claim 2, which is characterized in that further set on the organic deposition pattern
It is equipped with the second interlayer dielectric layer, second interlayer dielectric layer covers all organic deposition patterns.
4. preventing AMOLED panel as claimed in claim 3, which is characterized in that each column organic matter deposited picture with
The cutting line is parallel comprising multiple first inorganic insulation layer, the second inorganic insulation layer and the first interlayers of penetrating through are situated between
The deposition hole of matter layer is filled with organic matter in the deposition hole；
Each column metal deposit pattern is parallel with the cutting line comprising multiple to be deposited on first inorganic insulation
Metal film block in one of layer, the second inorganic insulation layer and the first interlayer dielectric layer layer.
5. AMOLED panel as claimed in claim 4, which is characterized in that described in adjacent two column organic matter deposited picture
Deposition hole is staggered in the longitudinal direction；In adjacent two column metal deposit pattern, the metal film block is staggered in the longitudinal direction.
6. AMOLED panel as claimed in claim 3, which is characterized in that each column organic matter deposited picture with it is described
Cutting line is parallel comprising a perforation first inorganic insulation layer, the second inorganic insulation layer and the first interlayer dielectric layer
Dislodger, in the dislodger be filled with organic matter；
Each column metal deposit pattern is parallel with the cutting line comprising one is deposited on first inorganic insulation
Metal film strips in one of layer, the second inorganic insulation layer and the first interlayer dielectric layer layer.
7. AMOLED panel as claimed in claim 6, which is characterized in that each column organic matter deposited picture and each column
Metal deposit pattern length is identical.
8. AMOLED panel as described in any one of claim 1 to 7, which is characterized in that the cutting line with it is outermost
Be further provided between organic deposition pattern through the buffer layer, the first inorganic insulation layer, the second inorganic insulation layer with
And first interlayer dielectric layer barrier structure.
9. in AMOLED panel as claimed in claim 8, which is characterized in that the metal deposit pattern uses metal molybdenum materials
Material.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201811046313.5A CN109087937A (en) | 2018-09-07 | 2018-09-07 | A kind of AMOLED panel |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201811046313.5A CN109087937A (en) | 2018-09-07 | 2018-09-07 | A kind of AMOLED panel |
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| Publication Number | Publication Date |
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| CN109087937A true CN109087937A (en) | 2018-12-25 |
Family
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| Application Number | Title | Priority Date | Filing Date |
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| CN201811046313.5A Pending CN109087937A (en) | 2018-09-07 | 2018-09-07 | A kind of AMOLED panel |
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