CN109087932A - The stripping means and display panel of flexible base board - Google Patents

The stripping means and display panel of flexible base board Download PDF

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Publication number
CN109087932A
CN109087932A CN201810670391.6A CN201810670391A CN109087932A CN 109087932 A CN109087932 A CN 109087932A CN 201810670391 A CN201810670391 A CN 201810670391A CN 109087932 A CN109087932 A CN 109087932A
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CN
China
Prior art keywords
line
glue
adhesion glue
base board
laser
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Pending
Application number
CN201810670391.6A
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Chinese (zh)
Inventor
王超梁
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Wuhan China Star Optoelectronics Semiconductor Display Technology Co Ltd
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Wuhan China Star Optoelectronics Semiconductor Display Technology Co Ltd
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Application filed by Wuhan China Star Optoelectronics Semiconductor Display Technology Co Ltd filed Critical Wuhan China Star Optoelectronics Semiconductor Display Technology Co Ltd
Priority to CN201810670391.6A priority Critical patent/CN109087932A/en
Publication of CN109087932A publication Critical patent/CN109087932A/en
Pending legal-status Critical Current

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    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10KORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/10OLED displays
    • H10K59/12Active-matrix OLED [AMOLED] displays
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/70Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
    • H01L21/77Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate
    • H01L21/78Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate with subsequent division of the substrate into plural individual devices
    • H01L21/7806Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate with subsequent division of the substrate into plural individual devices involving the separation of the active layers from a substrate
    • H01L21/7813Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate with subsequent division of the substrate into plural individual devices involving the separation of the active layers from a substrate leaving a reusable substrate, e.g. epitaxial lift off

Abstract

The invention discloses a kind of stripping means of flexible base board and display panels, by the way that adhesive film layer is equipped with two layers, one includes the first adhesion glue-line of optical cement, and another is the second adhesion glue-line for including optical cement (OCA) with the yellow polyimide (PI) being entrained in optical cement.Utilize the high-absorbility of the second adhesion glue-line and the penetrance characteristic of 308nm laser, in 308nm laser light backboard, 308nm laser energy all is absorbed to form excessive temperature by the second adhesion glue-line, cause the first adhesion glue-line performance failure, be carbonized the second adhesion glue-line simultaneously, so that adhesive film layer is carbonized.Backboard will be made easily to separate with flexible base board after the carbonization of adhesive film layer, and to achieve the purpose that smooth heavy industry, while flexible display panels will not be caused to damage, and then can be reduced defective products scrappage, substantially reduce production cost.

Description

The stripping means and display panel of flexible base board
[technical field]
The present invention relates to display fields, more particularly to the stripping means and display panel of a kind of flexible base board.
[background technique]
With the progress of display technology, flexible AMOLED (active-matrix Organic Light Emitting Diode) shows that screen is increasingly becoming Mainstream.Currently, usually needing in the preparation process of display device (such as AMOLED display device) at panel (Panel) Cover-plate glass (Cover glass) on attach polaroid, display panel could be formed.
Sharpest edges of the OLED display compared with liquid crystal display device (LCD) are that flexibility can be made (Flexible) OLED display, to meet market to the high request of Mobile portable product.
But flexible OLED display ratio and rigid OLED display and LCD yield are lower at present, because flexible OLED processing procedure is relatively complicated, and especially fitting processing procedure is far more than LCD and hardness OLED, and there are a big problems by flexibility OLED It is exactly all different and heavy industry operating efficiency when it is bonded bad is bad in the particles of material (Particle) that is bonded processing procedure.Such as Shown in Fig. 1, polaroid 10 ', flexible OLED display panel 20 ' have been generally comprised in traditional flexible OLED display and has been used Polaroid, the adhesion coating of flexible OLED display panel adhesion together to be constituted.Existing flexibility OLED display panel 20 ' one As production include the rigid liner plate 28 ' (such as: cover-plate glass (Cover glass)) set gradually from the bottom to top, flexible liner plate 22 ', buffer layer 23 ', array layer 24 ', oled layer 25 ' and touch-control sensing layer 26 ', and the table in flexible OLED display panel 20 ' It is reflective to eliminate that face paste closes (Lamination) polaroid (POL) 10 '.Therefore, for existing display panel processing procedure, packet Include the flexible each component parts of OLED display panel 20 ' itself is bonded to each other processing procedure and polaroid and flexibility OLED display surface Both plates are bonded to each other processing procedure ... etc..
It is bonded in processing procedure carrying out flexible OLED display panel 20 ', is also easy to produce foreign matter, bubble or dirty bad, or Each component parts is bonded to each other bad in itself, needs to carry out heavy industry (Rework) to defective products in this case.Such as when need by Rigid liner plate 28 ' separates the case where being bonded again again with flexible liner plate 22 '.
There are many kinds for traditional separate mode, for example, torn rigid liner plate 28 ' from flexible liner plate 22 ' by external force, It is stacked together due to attaching multilayered structure on flexible liner plate 22 ', and flexible liner plate 22 ' is that (hardness is very for a flexible base material It is low), when external force is pullled, be easy torn because of material properties itself it is bad cause breakage, subsequent heavy industry can not be carried out again (Rework) it operates, or generates peeling between flexible liner plate and other layers (such as buffer layer 23 ', array layer 24 ') (Peeling) bad, cause isolated success rate lower, so that subsequent heavy industry (Rework) operation can not be carried out.Furthermore as schemed Shown in 2, in the way of heavy industry (Rework) after knife separates, however, the hardness of knife (Knife) 29 is less than glass (Glass) The hardness of the rigid liner plate 28 ' of material, thus to LCD carry out knife tear separation after heavy industry (Rework) be bonded when, will not have damage The anxiety of glass.If but flexible OLED display using this mode when, since flexible 22 ' hardness of liner plate is very low, be easy to quilt Knife (Knife) 29, which scratches, even to be stabbed thoroughly, and then damage array layer 24 ' and oled layer 25 ', while during tearing just Property liner plate 28 ' and flexible liner plate 22 ' between bonding force be about 500Kg/inch2, much larger than 20 ' institute of flexible OLED display panel The mastication forces 10Kg/inch that can be born2, so will cause flexible 20 ' multilayered structure of OLED display panel during tearing Between mutual removing (Peeling) situation, so that it is whole to damage flexible OLED display panel 20 ', to can not carry out subsequent Heavy industry directly becomes defective products and causes to scrap.Based on the above issues, the success rate not only separated is extremely low, will also generate many not Non-defective unit certainly will be added significantly to the cost of production for making manufacturer.
[summary of the invention]
It is an object of the present invention to provide a kind of stripping means of flexible base board and display panels, provide separation efficiency More preferably, the efficiency of heavy industry (Rework) operation can be improved, to solve prior art problem.
It is another object of the present invention to provide a kind of stripping means of flexible base board and display panels, are not having to substantially Under the premise of changing flexible OLED display technique, flexible OLED display panel can be effectively prevent to generate in separation process and divided It is bad from peeling off, so reduce avoid heavy industry (Rework) from operating during damage to flexible display panels, reduce production Cost.
To achieve the above object, present invention generally provides a kind of stripping means of flexible base board and display panels, will adhere Adhesive film is equipped with two layers, and one includes the first adhesion glue-line of optical cement, it is another be include optical cement (OCA) and being entrained in optics Second adhesion glue-line of the yellow polyimide (PI) in glue.Utilize the high-absorbility and 308nm laser of the second adhesion glue-line Penetrance characteristic, in 308nm laser light backboard, 308nm laser energy all by second adhesion glue-line absorb to be formed it is high Temperature causes the first adhesion glue-line performance failure, while the second adhesion glue-line that is carbonized, thus by adhesive film layer carbon Change.Backboard will be made easily to separate with flexible base board after the carbonization of adhesive film layer, to achieve the purpose that smooth heavy industry, while not Flexible display panels can be caused to damage, and then can be reduced defective products scrappage, substantially reduce production cost.
In order to solve the above technical problems, one technical scheme adopted by the invention is that providing a kind of removing side of flexible base board Method, this method comprises the following steps:
The flexible display panels that step 1, offer mutually fit.
In a preferred embodiment, the flexible display panels include setting gradually from the bottom to top: backboard, adhesive film Layer, flexible base board.Flexible base board includes flexible liner plate, buffer layer, array layer, OLED layers and touch-control sensing layer;Herein only Not limit to for example, can also include other component parts, such as polarization elements.
Specifically, the adhesive film layer includes setting gradually from the bottom to top: the first adhesion glue-line and the second adhesion glue-line, It is by adhesive film layer (including the second adhesion glue-line and first adhesion glue-line) that flexible base board is viscous set on backboard upper surface.
Step 2 makes its carbonization to adhesive film layer progress laser irradiation, while destroying the first adhesion glue-line and the second adhesion The glue material performance of glue-line.
Specifically, the material of the first adhesion glue-line includes optical cement.
Specifically, the material of the second adhesion glue-line includes that optical cement (OCA) and the yellow polyamides being entrained in optical cement are sub- Amine (PI) formation, yellow polyimide (PI) have the efficiency of splendid absorption laser high temperature.
Specifically, for the optical cement for failing under the irradiation of laser, the yellow polyimide (PI) is absorption portion Divide for absorbing laser.
It should be noted that adhesive film layer lose the optical cement of the first and second adhesion glue-line can Vanishing viscosity, yellow polyimide (PI) failure, causes flexible base board to be thereon no longer bonded with the upper surface of backboard.
Step 3 removes backboard from flexible base board.
It should be noted that due to after the completion of step 2 flexible base board be no longer bonded (because of adhesive film with the upper surface of backboard Layer is carbonized), therefore in step 3, backboard can be removed from flexible base board, only be left soft with the external force of very little Property substrate.So far, namely the separation of backboard 21 Yu flexible base board 30 is completed.
The step 1, in another preferred embodiment, the flexible display panels include setting gradually from the bottom to top: back Plate, glue, flexible base board.The glue, comprising:
First adhesion glue-line, including adhesive portion;And
Second adhesion glue-line, set on the upper surface of the first adhesion glue-line, the second adhesion glue-line includes paste section Divide and absorb part, the absorption part is for absorbing laser, and the adhesive portion under the irradiation of laser for failing.
Specifically, the absorption part of the second adhesion glue-line is entrained in adhesive portion.
Preferably, the adhesive portion of the second adhesion glue-line includes optical cement (OCA), absorbs the polyimides that part is yellow (PI)。
Preferably, the material of backboard is PET material.
Preferably, the material of flexible substrate is polyimides.
Preferably, array layer is made of tft array or other arrays.
Preferably, laser is 308nm laser.
The step 2 specifically: the material of the second adhesion glue-line is by yellow optical cement (OCA) and be entrained in optical cement Polyimides (PI) formation, since absorptivity of the yellow PI (polyimides) to the laser (for 308nm laser) is higher, reaches To 99.6% or more efficiency;And 308nm laser reaches 90% or so characteristic to the penetrance of backboard and the first adhesion glue-line. Therefore, when 308nm laser irradiation backboard and adhesive film layer, in 308nm laser light backboard, extreme portions laser energy It is all absorbed by the structure of the second adhesion glue-line, therefore will cause extreme temperatures at the second adhesion structural adhesive layer, this is high Temperature will cause the most of glue material performance failure of the first and second adhesion glue-line (i.e. optics glue material), while laser will also be carbonized the Two adhesion structural adhesive layers occur that the first adhesion glue-line and the second adhesion glue-line all also that is, destroying the performance of two layers of glue material simultaneously After carbonization, further make the backboard for being adhered to the first adhesion glue-line be easy to be adhered to the flexible liner plate of the second adhesion glue-line into Row detached job to achieve the purpose that subsequent smooth heavy industry (Rework), while will not cause to damage to flexible base board.
The step 2 specifically: from a side of backboard and adhesive film layer surface to opposite another side to backboard And adhesive film layer carries out the irradiation of 308nm laser beam, so that adhesive film layer be made to be carbonized.
The stripping means of the flexible base board, this method further comprise: step 4, to the carbonization on flexible liner plate after Adhesive film layer cleaned.Specifically, isopropanol solvent or other solvents can be used, easily the adhesion after dissolution carbonization Adhesive film cleans up the adhesive film layer after the carbonization on flexible liner plate to reach.
In order to solve the above technical problems, another technical solution used in the present invention is to provide a kind of display panel, this is aobvious Show that panel can be made using any of the above item the method.In a preferred embodiment, display panel includes:
Flexible base board has luminous front;
Adhesive film layer, being irradiated with a laser according to the above method makes its carbonization, while destroying the first adhesion glue-line and second The glue material performance of adhesion glue-line, gets rid of after losing efficiency;
Backboard can be separated from flexible base board;
Specifically, in above-mentioned display panel, the adhesive film layer includes setting gradually from the bottom to top:
First adhesion glue-line, including general optical adhesive layer, cover in the upper surface of backboard;And
Second adhesion glue-line, including by optical cement (OCA) and yellow polyimide (PI) shape being entrained in optical cement At yellow polyimide (PI) has the function of splendid absorption high temperature.Second adhesion glue-line is covered in the first adhesion glue-line The adhesion of flexible liner plate is set to backboard by adhesive film layer (including the second adhesion glue-line and first adhesion glue-line) by upper surface Upper surface.
In a preferred embodiment, above-mentioned flexible display panels, the flexible base board includes setting gradually from the bottom to top: Flexible liner plate, buffer layer, array layer, oled layer and touch-control sensing layer.It herein by way of example only, can also include other Component parts does not limit to.
Above-mentioned technical proposal have the following advantages that or the utility model has the advantages that
The present invention provides the stripping means and display panel of a kind of flexible base board, can be based on existing flexibility OLED display surface On the basis of plate, by the way that one second adhesion glue-line is arranged again on general optical adhesive layer (the first adhesion glue-line such as of the invention), And be bonded between backboard and flexible base board, so that flexible base board is attached on backboard, can not only be not required to significantly alter Original integrally-built preparation method, and pollution damage is also not easily susceptible in continuing subsequent heavy industry operating process;In addition, It carries out in above-mentioned separation heavy industry operation processing procedure, 308nm is carried out to the adhesive film layer fitted on backboard to flexible base board Laser irradiation makes its carbonization lose adhesive performance, and backboard is easily removed from flexible base board, later can also be to flexibility Adhesive film layer after carbonization on substrate is cleaned, and tearing separation without using biggish external force or knife completely can be completed back The detached job of plate and flexible base board, success rate is high, also can effectively prevent flexible base board itself or flexible base board in separation process In cause flexible base board itself damaged because being torn by external force between each layer structure or flexible base board in produce between each layer structure Raw peeling is bad, causes isolated success rate extremely low, thus the problems such as subsequent heavy industry (Rework) operation can not be carried out, effectively That improves separation heavy industry operation uses range and efficiency, and then can be reduced defective products scrappage, substantially reduces production cost.
[Detailed description of the invention]
In order to more clearly explain the embodiment of the invention or the technical proposal in the existing technology, below to required in embodiment Attached drawing to be used is briefly described.The accompanying drawings in the following description is only section Example of the invention, general for this field For logical technical staff, without creative efforts, other attached drawings can also be obtained according to these attached drawings.
Fig. 1 is the structural schematic diagram of traditional display panel;
Fig. 2 is schematic diagram of traditional display panel in such a way that knife separates heavy industry (Rework);
Fig. 3 is the flow chart of one embodiment of stripping means of flexible base board of the present invention;
Fig. 4-5 makes its carbonization to adhesive film layer progress laser irradiation to be of the invention, carries out to backboard and flexible base board Separate the schematic diagram of the step 2 of the stripping means of heavy industry;
Fig. 6 is the schematic diagram after the step 3 of the stripping means of flexible base board of the present invention as flexible base board.
[specific embodiment]
The schema in attached drawing is please referred to, wherein identical component symbol represents identical component.Following Structure Figure and reality The explanation for applying mode be based on illustrated by the specific embodiment of the invention.It should be appreciated that the specific embodiments described herein It is only used to explain the present invention, is not construed as the limitation present invention other specific embodiments not detailed herein.
Fig. 3 is the flow chart of one embodiment of stripping means of flexible base board of the present invention;Fig. 4-5 is of the invention to adhesion glue Film layer, which carries out laser irradiation, makes its carbonization, separate with flexible base board the signal of the step 2 of the stripping means of heavy industry to backboard Figure.
Referring to Fig. 3, the stripping means of flexible base board of the present invention, this method includes following step in a preferred embodiment It is rapid:
Step 1, please refer to Fig. 4, the flexible display panels 20 that each layer mutually fits are provided.
In a preferred embodiment, the flexible display panels 20 include setting gradually from the bottom to top: backboard 21, adhesion Adhesive film 27, flexible base board 30.Flexible base board 30 includes flexible liner plate 301, buffer layer 302, array layer 303, oled layer 304 and touch-control sensing layer 305;It herein by way of example only, can also include other component parts, such as polarization elements, not Limitation.
Specifically, the adhesive film layer 27 includes setting gradually from the bottom to top: the first adhesion glue-line 271 and second viscous Glue-line 272,21 upper surface of backboard is set to for flexible base board 30 is viscous by adhesive film layer 27.
Step 2 carries out laser irradiation to adhesive film layer 27 and makes its carbonization, while destroying the first adhesion glue-line 271 and the The glue material performance of two adhesion glue-lines 272.
Specifically, the material of the first adhesion glue-line 271 includes optical cement.
Specifically, the material of the second adhesion glue-line 272 includes optical cement (OCA) and the yellow polyamides that is entrained in optical cement Imines (PI) formation, yellow polyimide (PI) have the efficiency of splendid absorption laser high temperature.
Specifically, for the optical cement for failing under the irradiation of laser, the yellow polyimide (PI) is absorption portion Divide for absorbing laser.
It should be noted that adhesive film layer 27 after laser irradiation is carbonized, makes the first and second adhesion glue-line 271,272 Optical cement can lose viscosity, yellow polyimide (PI) failure, cause the upper surface of flexible base board 30 thereon and backboard 21 not It is bonded again.
Step 3 removes backboard 21 from flexible base board 30.
It should be noted that due to after the completion of step 2 flexible base board 30 be no longer bonded (because adhering with the upper surface of backboard 21 Adhesive film 27 is carbonized), therefore in step 3, backboard 21 can be shelled from flexible base board 30 with the external force of very little From only leaving flexible base board 30.So far, namely the separation of backboard 21 Yu flexible base board 30 is completed.
In another preferred embodiment, the flexible display panels of the step 1 include setting gradually from the bottom to top: back Plate 21, glue 27 ', flexible base board 30.The glue 27 ', comprising:
First adhesion glue-line, including adhesive portion;And
Second adhesion glue-line, set on the upper surface of the first adhesion glue-line, the second adhesion glue-line includes paste section Divide and absorb part, the absorption part is for absorbing laser, and the adhesive portion under the irradiation of laser for failing.
Specifically, the absorption part of the second adhesion glue-line is entrained in adhesive portion.
Specifically, the adhesive portion of the second adhesion glue-line includes optical cement (OCA), absorbs the polyimides that part is yellow (PI)。
Preferably, the material of backboard 21 is PET material.
Preferably, the material of flexible substrate 301 is polyimides.
Preferably, array layer 303 is made of tft array or other arrays.
Preferably, laser is 308nm laser.
Specifically, fig. 4 to fig. 6, the step 2 are please referred to specifically: the material of the second adhesion glue-line 272 includes optical cement (OCA) it is formed with the yellow polyimide (PI) being entrained in optical cement, since yellow PI (polyimides) is to the laser The absorptivity of (for 308nm laser) is higher, reaches 99.6% or more efficiency;And 308nm laser is to backboard and the first adhesion glue The penetrance of layer reaches 90% or so characteristic.Therefore, when 308nm laser irradiation backboard and adhesive film layer, swash in 308nm When light penetrates backboard, extreme portions laser energy is all absorbed by the structure of the second adhesion glue-line, therefore will cause second Extreme temperatures at adhesion structural adhesive layer, the excessive temperature will cause the most of glue of the first and second adhesion glue-line (i.e. optics glue material) Material performance failure, while carbonization the second adhesion structural adhesive layer also also that is, destroying the performance of two layers of glue material is simultaneously made the by laser After one adhesion glue-line and the second adhesion glue-line are all carbonized, the backboard for further making to be adhered to the first adhesion glue-line be easy to and The flexible liner plate for being adhered to the second adhesion glue-line carries out detached job, thus achieve the purpose that subsequent smooth heavy industry (Rework), Simultaneously flexible base board 30 will not be caused to damage.
Specifically, Fig. 4 and Fig. 5, the step 2 are please referred to specifically: from the one of 27 surface of backboard 21 and adhesive film layer Side to opposite another side carries out the irradiation of 308nm laser beam to backboard and adhesive film layer, to make adhesive film layer carbon Change.
The stripping means of above-mentioned flexible base board, this method further comprise: step 4, to the carbonization on flexible liner plate after Adhesive film layer cleaned.Specifically, isopropanol solvent or other solvents can be used, easily the adhesion after dissolution carbonization Adhesive film cleans up the adhesive film layer after the carbonization on flexible base board to reach, and removes flexible base to improve The quality of plate.
In order to solve the above technical problems, another technical solution used in the present invention is to provide a kind of display panel, this is aobvious Show that panel can be made using any of the above item the method.In a preferred embodiment, display panel includes:
Flexible base board has luminous front;
Adhesive film layer, being irradiated with a laser according to the above method makes its carbonization, while destroying the first adhesion glue-line and second It adheres the glue material performance of glue-line, loses after efficiency and be removed;
Backboard can be separated from flexible base board.
Specifically, in above-mentioned display panel, the adhesive film layer includes setting gradually from the bottom to top:
First adhesion glue-line, including general optical adhesive layer, cover in the upper surface of backboard;And
Second adhesion glue-line, including by optical cement (OCA) and yellow polyimide (PI) shape being entrained in optical cement At yellow polyimide (PI) has the function of splendid absorption high temperature.Second adhesion glue-line is covered in the first adhesion glue-line The adhesion of flexible liner plate is set to backboard by adhesive film layer (including the second adhesion glue-line and first adhesion glue-line) by upper surface Upper surface.
In a preferred embodiment, above-mentioned flexible display panels, the flexible base board includes setting gradually from the bottom to top: Flexible liner plate, buffer layer, array layer, oled layer and touch-control sensing layer.It herein by way of example only, can also include other Component parts does not limit to.
The present invention provides the stripping means and display panel of a kind of flexible base board, in the above-described embodiment, using existing On the basis of flexible display panel structure, by being arranged again on general optical adhesive layer (the first adhesion glue-line such as of the invention) One second adhesion glue-line, and be bonded between backboard and flexible base board, so that flexible base board is attached on backboard, not only may not be used Original integrally-built preparation method need to be significantly alterred, and is also not easily susceptible to pollute in continuing subsequent heavy industry operating process Damage;In addition, in carrying out above-mentioned separation heavy industry operation processing procedure, to flexible base board to fit in the adhesive film on backboard Layer, which carries out 308nm laser irradiation, to be made it be carbonized and loses adhesive performance, and backboard is easily removed from flexible base board, The adhesive film layer after the carbonization on flexible base board can be cleaned, be torn completely without using biggish external force or knife later Except the detached job of backboard and flexible base board can be completed in separation, success rate is high, also can effectively prevent flexible base in separation process Cause flexible base board itself damaged or flexible base board because being torn by external force between plate itself or each layer structure of flexible base board Each layer structure between generate peel off it is bad, cause isolated success rate extremely low, so that subsequent heavy industry (Rework) can not be carried out The problems such as operation, effective raising separation heavy industry operation uses range and efficiency, and then can be reduced defective products scrappage, significantly Reduce production cost.
In conclusion although the present invention has been disclosed above in the preferred embodiment, but the above is only the implementation of the present invention Mode is not intended to limit the scope of the invention, those skilled in the art, do not depart from spirit of the invention and In range, can make it is various change and retouch, it is all using equivalent structure made by description of the invention and accompanying drawing content or to wait Process transformation is imitated, being applied directly or indirectly in other relevant technical fields, similarly includes in patent protection of the invention In range.

Claims (10)

1. a kind of glue characterized by comprising
First adhesion glue-line, including adhesive portion;And
Second adhesion glue-line, set on it is described first adhesion glue-line upper surface, it is described second adhesion glue-line include adhesive portion and Part is absorbed, the absorption part is for absorbing laser, and the adhesive portion under the irradiation of laser for failing.
2. glue according to claim 1, which is characterized in that the absorption part is entrained in the adhesive portion.
3. glue according to claim 1, which is characterized in that the adhesive portion includes optical cement (OCA), the suction Receiving portions are the polyimides (PI) of yellow.
4. a kind of adhesive film layer characterized by comprising
First adhesion glue-line, including optical adhesive layer;And
Second adhesion glue-line, including optical cement (OCA) and the yellow polyimide (PI) being entrained in optical cement, described second is viscous Glue-line be set to it is described first adhesion glue-line upper surface.
5. adhesive film layer according to claim 4, which is characterized in that the optical cement under the irradiation of laser for losing Effect, the yellow polyimide (PI) are to absorb part for absorbing laser.
6. a kind of stripping means of flexible base board, which comprises the steps of:
There is provided flexible display panels includes: backboard, adhesive film layer, flexible base board;The adhesive film layer includes from the bottom to top Setting: the first adhesion glue-line and the second adhesion glue-line, it is by the adhesive film layer that the flexible base board is viscous set on the back On plate;
Carrying out laser irradiation to the adhesive film layer makes its carbonization, while destroying the first adhesion glue-line and described second viscous The performance of glue-line;And
The backboard is removed from the flexible base board.
7. the stripping means of flexible base board according to claim 6, which is characterized in that the first adhesion glue-line includes light Learn glue;The yellow polyimide (PI) that the second adhesion glue-line includes optical cement (OCA) and is entrained in optical cement, the light Glue is learned for failing under the irradiation of laser, the yellow polyimide (PI) is to absorb part for absorbing laser;It is described to swash Light is 308nm laser.
8. the stripping means of flexible base board according to claim 7, which is characterized in that swash to the adhesive film layer Light irradiation make its carbonization specifically: when the 308nm laser irradiation and penetrate the backboard when, extreme portions laser energy all by The second adhesion glue-line is absorbed, and excessive temperature at the second adhesion glue-line is made, and causes the first adhesion glue-line performance Failure, while the second adhesion glue-line that is carbonized.
9. the stripping means of flexible base board according to claim 8, which is characterized in that swash to the adhesive film layer Light irradiation makes its carbonization specifically: since high-absorbility of the yellow polyimide to the 308nm laser reaches 99.6% More than;The 308nm laser reaches 90% or so to the penetrance of the backboard and the first adhesion glue-line;Utilize 308nm The absorptivity and penetrance characteristic of laser, when through backboard, 308nm laser energy is all inhaled by the adhesive film layer It receives, and then the adhesive film layer that is carbonized.
10. a kind of display panel, including the flexible base board according to method removing as claim in any one of claims 6-9.
CN201810670391.6A 2018-06-26 2018-06-26 The stripping means and display panel of flexible base board Pending CN109087932A (en)

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CN109801562A (en) * 2019-02-27 2019-05-24 武汉华星光电半导体显示技术有限公司 Display base plate, display panel and preparation method thereof
CN112216214A (en) * 2020-10-23 2021-01-12 昆山工研院新型平板显示技术中心有限公司 Display panel manufacturing method
WO2021056689A1 (en) * 2019-09-27 2021-04-01 武汉华星光电半导体显示技术有限公司 Display apparatus and preparation method therefor
CN113035057A (en) * 2020-12-29 2021-06-25 奕瑞影像科技(太仓)有限公司 Flexible screen assembly and method of disassembling same
CN113471256A (en) * 2021-06-16 2021-10-01 武汉华星光电技术有限公司 Display panel and preparation method thereof
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Application publication date: 20181225