CN109087878A - Cleaning device is used in a kind of wafer flow production - Google Patents
Cleaning device is used in a kind of wafer flow production Download PDFInfo
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- CN109087878A CN109087878A CN201811060258.5A CN201811060258A CN109087878A CN 109087878 A CN109087878 A CN 109087878A CN 201811060258 A CN201811060258 A CN 201811060258A CN 109087878 A CN109087878 A CN 109087878A
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- 238000004140 cleaning Methods 0.000 title claims abstract description 81
- 238000004519 manufacturing process Methods 0.000 title claims abstract description 44
- 230000001105 regulatory effect Effects 0.000 claims abstract description 40
- 235000009161 Espostoa lanata Nutrition 0.000 claims abstract description 20
- 240000001624 Espostoa lanata Species 0.000 claims abstract description 20
- 238000003825 pressing Methods 0.000 claims abstract description 15
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 claims abstract description 12
- 238000003860 storage Methods 0.000 claims description 14
- 210000004744 fore-foot Anatomy 0.000 claims description 6
- 238000009434 installation Methods 0.000 claims description 6
- 230000000694 effects Effects 0.000 abstract description 6
- 230000008901 benefit Effects 0.000 description 3
- 238000000034 method Methods 0.000 description 3
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 235000003140 Panax quinquefolius Nutrition 0.000 description 1
- 240000005373 Panax quinquefolius Species 0.000 description 1
- 238000011109 contamination Methods 0.000 description 1
- 230000001276 controlling effect Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000005201 scrubbing Methods 0.000 description 1
- 239000007921 spray Substances 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67017—Apparatus for fluid treatment
- H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
- H01L21/6704—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing
- H01L21/67046—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing using mainly scrubbing means, e.g. brushes
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67017—Apparatus for fluid treatment
- H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
- H01L21/6704—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing
- H01L21/67051—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing using mainly spraying means, e.g. nozzles
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2221/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof covered by H01L21/00
- H01L2221/67—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere
- H01L2221/683—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
- Y02P70/50—Manufacturing or production processes characterised by the final manufactured product
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- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Cleaning Or Drying Semiconductors (AREA)
Abstract
The present invention relates to the technical fields of wafer flow production auxiliary equipment, more particularly to a kind of wafer flow production cleaning device, can facilitate and carry out using raising usability to alcohol；It is convenient simultaneously that the foul fallen after cleaning is cleared up, reduce labour degree；And can be fixed without hand by wafer flow, so that cleaning brush and cleaning cotton balls is carried out simultaneously using raising cleaning efficiency enhances using effect；Cotton balls is cleaned including workbench, holder, rack, cleaning brush and multiple groups；It further include Pressing pump, pressing pump output terminal is located at right above rack；It further include holding box and bearing piece, holding box top is provided with containing tank；It further include front supporting member and rear support, rack includes left regulating part, left fixing piece, left rotation shaft, right regulating part, right fixing piece and right rotation shafts, and left rotation shaft and right rotation shafts are inserted into respectively inside left link slot and right link slot.
Description
Technical field
The present invention relates to the technical fields of wafer flow production auxiliary equipment, produce and use more particularly to a kind of wafer flow
Cleaning device.
Background technique
It is well known that wafer flow production is that one kind is used in wafer flow production process with cleaning device, to wafer flow
The ink of on piece contamination is cleaned, so as to the subsequent auxiliary device welded to it, in wafer flow production field
It is widely used；Existing wafer flow production cleaning device include workbench, holder, rack, cleaning brush and
Multiple groups clean cotton balls, and rack is arranged on the first half region of workbench top, and holder is arranged on rear side of workbench top, and puts
It sets and is provided with placed cavity in box, and be contained with alcohol in placed cavity, holder top is provided with pick-and-place mouth, and on picking and placing mouth
It is provided with door, cleaning brush and multiple groups cleaning cotton balls are both placed in workbench top；Existing wafer flow production cleaning dress
Wafer flow need to be only placed on rack when setting use, then pressing wafer flow is fixed on the other hand, the other hand tweezer
Sub-folder lives to clean cotton balls and picks the alcohol in holder, then by cleaning cotton balls and cleaning brush to the ink of wafer flow on piece
It is cleaned；Existing wafer flow production is found in cleaning device use, to avoid alcohol from quickly volatilizing, cleans cotton
Ball is both needed to be opened and closed door back and forth when picking alcohol every time, is more troublesome, usability is limited；And the foul washed down is easily direct
It falls on workbench, causes to be more troublesome when subsequent cleaning, labour degree is higher；And clean when need to have on the other hand to wafer flow into
Row pressing is fixed, and is caused cleaning brush and cleaning cotton balls that can only be used alone, cannot be carried out simultaneously using influencing cleaning efficiency, make
It is limited with effect.
Summary of the invention
In order to solve the above technical problems, the present invention provide one kind can facilitate to alcohol carry out use, improve usability；Simultaneously
It is convenient that the foul fallen after cleaning is cleared up, reduce labour degree；And can be fixed without hand by wafer flow, make clear
Scrubbing and clean cotton balls can carry out simultaneously using raising cleaning efficiency enhances the wafer flow production cleaning dress of using effect
It sets.
A kind of wafer flow production cleaning device of the invention, including workbench, holder, rack, cleaning brush and
Multiple groups clean cotton balls, and rack is arranged on the first half region of workbench top, and holder is arranged on rear side of workbench top, and puts
It sets and is provided with placed cavity in box, and be contained with alcohol in placed cavity, holder top is provided with pick-and-place mouth；It further include pressing
Pump, the Pressing pump setting press pump output terminal and are located at right above rack on picking and placing mouth, and Pressing pump input terminal, which is located at, to be put
It sets intracavitary；It further include holding box and bearing piece, the bearing piece is arranged on workbench top, and holding box bottom end is provided with slot, and institute
It states bearing piece top to be inserted into inside slot, holding box top is provided with containing tank；It further include front supporting member and rear support, it is described
Rack includes left regulating part, left fixing piece, left rotation shaft, right regulating part, right fixing piece and right rotation shafts, left regulating part and the right side
Regulating part is separately positioned in workbench top left region and right areas, and left regulating part and right regulating part are located at Sheng
It puts at left and right sides of box, the left rotation shaft and right rotation shafts are separately positioned on left regulating part and right regulating part, and left fixing piece is left
Left link slot and right link slot, and the left rotation shaft and right rotation shafts are respectively arranged in the middle part of end middle part and right fixing piece right end
Be inserted into inside left link slot and right link slot respectively, on the outside of left fixing piece left end and right fixing piece right end outside respectively with left tune
Part and the contact of right regulating part are saved, the front supporting member and rear support are separately positioned on workbench top first half region and later half area
On domain.
A kind of wafer flow production cleaning device of the invention, the front supporting member includes two groups of preceding thread pipes, two groups
Preceding thread bar, ball bearing and front end panel before two groups are provided with preceding peace in the left front region in workbench top and right forefoot area
Tankage, before ball bearing is separately positioned on two groups before two groups in mounting groove, two groups of preceding thread tube bottom end is inserted into two respectively
Before group inside ball bearing, two groups of preceding thread bar bottom ends are inserted into respectively and are screwed on inside two groups of preceding thread tube top ends, before described
Support plate is located above holding box, and connect respectively with two groups of preceding thread bar tops at left and right sides of front end panel bottom end.
A kind of wafer flow production cleaning device of the invention, the rear support includes two groups of rear thread pipes, two groups
Rear thread bar, ball bearing and rear bearing sheet after two groups are pacified after being provided on the left back region in workbench top and right rear region
Tankage, after ball bearing is separately positioned on two groups after two groups in mounting groove, two groups of rear thread tube bottom end is inserted into two respectively
After group inside ball bearing, two groups of rear thread bar bottom ends are inserted into respectively and are screwed on inside two groups of rear thread tube top ends, after described
Support plate is located above holding box, and connect respectively with two groups of rear thread bar tops at left and right sides of rear bearing sheet bottom end.
A kind of wafer flow production cleaning device of the invention, the left regulating part include left-hand thread pipe, left-hand thread bar,
Left ball bearing and left bearing piece, left mounting groove is provided in the left area of workbench top, and left ball bearing is arranged in left installation
In slot, left-hand thread tube bottom end is inserted into the pearl Bearing inner that rolls left, and left-hand thread bar bottom end is inserted into and is screwed on left-hand thread tube top
End is internal, and on left-hand thread bar top, left rotation shaft is arranged in left bearing piece right end for the left bearing piece setting.
Invention a kind of wafer flow production use cleaning device, the left fixing piece include left link block, upper left connecting plate,
Lower-left connecting plate, the first threaded rod, the first rotating block and the first fixed plate, the left link block left end outside and left bearing piece right end
Outer side contacts, upper left connecting plate and lower-left connecting plate are separately positioned on left link block top and bottom end, the upper left connecting plate
On be provided with first through hole, and internal thread structure is provided on first through hole inner sidewall, and first threaded rod bottom end is worn
It crosses and is screwed in first through hole, first fixed plate is located at below the connecting plate of upper left, and the first fixed plate top and first
The connection of threaded rod bottom end, first rotating block are arranged in the first threaded rod tip.
A kind of wafer flow production cleaning device of the invention, the right regulating part include right-hand thread pipe, right-hand thread bar,
Right ball bearing and right bearing piece, right mounting groove is provided on the right half area of workbench top, and right ball bearing is arranged in right installation
In slot, right-hand thread tube bottom end is inserted into inside right ball bearing, and right-hand thread bar bottom end is inserted into and is screwed on right-hand thread tube top
End is internal, and on right-hand thread bar top, right rotation shafts are arranged in right bearing piece right end for the right bearing piece setting.
A kind of wafer flow production cleaning device of the invention, the right fixing piece include right link block, upper right connection
Plate, bottom right connecting plate, the second threaded rod, the second rotating block and the second fixed plate, the right link block right end outside and right bearing piece
Side contacts outside left end, upper right connecting plate and bottom right connecting plate are separately positioned on right link block top and bottom end, and the upper right connects
It is provided with the second through-hole on fishplate bar, and is provided with internal thread structure in the second inner side wall of through hole, second threaded rod bottom end
It passes through and is screwed on the second through-hole, second fixed plate is located at below upper right connecting plate, and the second fixed plate top and the
The connection of two threaded rod bottom ends, second rotating block are arranged in the second threaded rod tip.
A kind of wafer flow production cleaning device of the invention, further includes that two group of first antiskid plate and two group second are anti-skidding
Plate, two group of first antiskid plate are separately positioned on lower-left connecting plate top and bottom right connecting plate top, and two group second anti-skidding
Plate is separately positioned on the first fixed plate bottom end and the second fixed plate bottom end.
A kind of wafer flow production cleaning device of the invention further includes two group of first stop collar, two group of second limit
Ring and two groups of third stop collars, are provided with first annular groove on the overseas side wall of two groups of preceding threads pipe bottom half, and two groups
First stop collar is set in two groups of first annular grooves, and two group of first stop collar Basolateral respectively with bench top
It holds left front region to connect with right forefoot area, it is recessed that the second annular is provided on the overseas side wall of two groups of rear threads pipe bottom half
Slot, two group of second stop collar are set in two groups of second annular grooves, and two group of second stop collar Basolateral respectively with
The left back region in workbench top is connected with right rear region, is respectively provided on the left-hand thread pipe and the overseas side wall of right-hand thread pipe bottom half
There is third annular groove, two groups of third stop collars are set on two groups of third annular grooves, and two groups of third stop collar bottoms
End outside is connect with workbench top left area and right half area respectively.
A kind of wafer flow production cleaning device of the invention, further includes storage box and knob, the workbench front end
Placing groove is provided on upper half area, storage box is placed in placing groove, and the storage box top is provided with accommodating groove, cleaning brush
It is both placed in accommodating groove with multiple groups cleaning cotton balls, the knob setting shakes hands to be located in placing groove in storage box front end.
Compared with prior art the invention has the benefit that it can make it by the wine in holder by pushing Pressing pump
Essence is extracted out and is sprayed by its output end, so that convenient carry out alcohol to use raising usability；Holding box pair can be passed through simultaneously
The foul fallen after cleaning is collected, and by removing holding box from workbench, so that convenient clear up it, is dropped
Low labour degree；And wafer flow can be fixed by left fixing piece and right fixing piece, wafer flow is pressed without hand
Be fixed, enable cleaning brush and cleaning cotton balls carry out simultaneously using, improve cleaning efficiency, at the same by control left regulating part and
Right regulating part is adjusted left fixing piece and right fixing piece position, so as to the position according to demand to wafer flow after fixed
It is adjusted, enhances using effect.
Detailed description of the invention
Fig. 1 is structural schematic diagram of the invention；
Fig. 2 is the right view of Fig. 1；
Fig. 3 is the portion the A partial enlarged view of Fig. 1；
Fig. 4 is the portion the B partial enlarged view of Fig. 1；
It is attached marked in the figure: 1, workbench；2, holder；3, cleaning brush；4, cotton balls is cleaned；5, holding box；6, bearing piece；7, rear support
Part；8, left regulating part；9, left rotation shaft；10, right fixing piece；11, preceding thread bar；12, preceding ball bearing；13, front end panel；
14, rear thread pipe；15, rear bearing sheet；16, left-hand thread pipe；17, left ball bearing；18, upper left connecting plate；19, lower-left connects
Plate；20, the first rotating block；21, the first fixed plate；22, right-hand thread bar；23, right bearing piece；24, right link block；25, the second screw thread
Bar；26, the first antiskid plate；27, the second antiskid plate；28, the first stop collar；29, storage box；30, Pressing pump.
Specific embodiment
With reference to the accompanying drawings and examples, specific embodiments of the present invention will be described in further detail.Implement below
Example is not intended to limit the scope of the invention for illustrating the present invention.
As shown in Figures 1 to 4, a kind of wafer flow of the invention production cleaning device, including workbench 1, holder
2, rack, cleaning brush 3 and multiple groups clean cotton balls 4, and rack is arranged on the first half region of workbench top, and holder setting exists
On rear side of workbench top, and placed cavity is provided in holder, and alcohol is contained in placed cavity, holder top is provided with
Pick and place mouth；It further include Pressing pump 30, Pressing pump setting presses pump output terminal and be located at right above rack, presses on picking and placing mouth
Press pump input terminal is located in the placement cavity；It further include holding box 5 and bearing piece 6, bearing piece is arranged on workbench top, and holding box bottom end is set
It is equipped with slot, and bearing piece top is inserted into inside slot, holding box top is provided with containing tank；It further include front supporting member and rear branch
Support member 7, rack include left regulating part 8, left fixing piece, left rotation shaft 9, right regulating part, right fixing piece 10 and right rotation shafts, a left side
Regulating part and right regulating part are separately positioned in workbench top left region and right areas, and left regulating part and right regulating part
It is located at left and right sides of holding box, left rotation shaft and right rotation shafts are separately positioned on left regulating part and right regulating part, Zuo Gu
Determine to be respectively arranged with left link slot and right link slot in the middle part of part left end and in the middle part of right fixing piece right end, and left rotation shaft and right-hand rotation are dynamic
Axis is inserted into respectively inside left link slot and right link slot, on the outside of left fixing piece left end and right fixing piece right end outside respectively with a left side
Regulating part and the contact of right regulating part, front supporting member and rear support are separately positioned on workbench top first half region and later half region
On；It can make it extract the alcohol in holder out and pass through its output end to spray by pushing Pressing pump, thus convenient to wine
The enforcement that progresses greatly is used, and usability is improved；The foul fallen after cleaning can be collected by holding box simultaneously, and by that will hold
Box is removed from workbench, so that convenient clear up it, reduces labour degree；And left fixing piece and right fixing piece can be passed through
Wafer flow is fixed, is fixed without hand by wafer flow, cleaning brush and cleaning cotton balls is enable to carry out simultaneously
It uses, improves cleaning efficiency, while carrying out to left fixing piece and right fixing piece position by controlling left regulating part and right regulating part
Adjustment enhances using effect so as to be adjusted according to demand to position of the wafer flow after fixed.
A kind of wafer flow production cleaning device of the invention, front supporting member include spiral shell before two groups of preceding thread pipes, two groups
Ball bearing 12 and front end panel 13 before 11, two groups of rasp bar, before being provided on the left front region in workbench top and right forefoot area
Mounting groove, before ball bearing is separately positioned on two groups before two groups in mounting groove, two groups of preceding thread tube bottom ends are inserted into two groups respectively
Inside preceding ball bearing, two groups of preceding thread bar bottom ends are inserted into respectively and are screwed on inside two groups of preceding thread tube top ends, front end panel
It is connect respectively with two groups of preceding thread bar tops above holding box, and at left and right sides of front end panel bottom end；It can pass through screw thread
Structure makes two groups of preceding thread bars by two groups of preceding thread control of rotation simultaneously and front end panel is driven to move up and down, so as to root
Front supporting member height is adjusted according to demand, improves adaptability.
A kind of wafer flow production cleaning device of the invention, rear support is including after two groups 14, two groups of rear thread pipe
Threaded rod, ball bearing and rear bearing sheet 15 after two groups are pacified after being provided on the left back region in workbench top and right rear region
Tankage, after ball bearing is separately positioned on two groups after two groups in mounting groove, after two groups of rear thread tube bottom ends are inserted into two groups respectively
Inside ball bearing, two groups of rear thread bar bottom ends are inserted into respectively and are screwed on inside two groups of rear thread tube top ends, rear bearing sheet position
It is connect respectively with two groups of rear thread bar tops above holding box, and at left and right sides of rear bearing sheet bottom end；It can pass through screw thread knot
Structure makes two groups of rear thread bars by two groups of rear thread control of rotation simultaneously and rear bearing sheet is driven to move up and down, so as to basis
Demand is adjusted rear support height, improves adaptability.
A kind of wafer flow production cleaning device of the invention, left regulating part includes left-hand thread pipe 16, left-hand thread bar, a left side
Ball bearing 17 and left bearing piece, left mounting groove is provided in the left area of workbench top, and left ball bearing is arranged in left installation
In slot, left-hand thread tube bottom end is inserted into the pearl Bearing inner that rolls left, and left-hand thread bar bottom end is inserted into and is screwed in left-hand thread tube top end
Portion, on left-hand thread bar top, left rotation shaft is arranged in left bearing piece right end for left bearing piece setting；It can pass through rotation by helicitic texture
The screwed pipe that turns left control left-hand thread bar drives left fixing piece to move up and down, to carry out according to demand to left fixing piece height
Adjustment improves adaptability.
A kind of wafer flow production cleaning device of invention, left fixing piece include left link block, upper left connecting plate 18, a left side
Lower connecting plate 19, the first threaded rod, the first rotating block 20 and the first fixed plate 21, left link block left end outside and left bearing piece right end
Outer side contacts, upper left connecting plate and lower-left connecting plate are separately positioned on left link block top and bottom end, are set on the connecting plate of upper left
It is equipped with first through hole, and is provided with internal thread structure on first through hole inner sidewall, and the first threaded rod bottom end passes through and spiral shell dress
In first through hole, the first fixed plate is located at below the connecting plate of upper left, and the first fixed plate top and the first threaded rod bottom end connect
It connects, the first rotating block is arranged in the first threaded rod tip；It can be by being inserted into upper left connecting plate and a left side for wafer flow left end
It between lower connecting plate, then rotates the first rotating block and the first threaded rod is driven to move down, thus by the first fixed plate to crystalline substance
Circular jet piece left end is fixed.
A kind of wafer flow production cleaning device of the invention, right regulating part include right-hand thread pipe, right-hand thread bar 22, the right side
Ball bearing and right bearing piece 23, right mounting groove is provided on the right half area of workbench top, and right ball bearing is arranged in right installation
In slot, right-hand thread tube bottom end is inserted into inside right ball bearing, and right-hand thread bar bottom end is inserted into and is screwed in right-hand thread tube top end
Portion, on right-hand thread bar top, right rotation shafts are arranged in right bearing piece right end for right bearing piece setting；It can pass through rotation by helicitic texture
The screwed pipe that turns right control right-hand thread bar drives right fixing piece to move up and down, to carry out according to demand to right fixing piece height
Adjustment improves adaptability.
A kind of wafer flow production cleaning device of the invention, right fixing piece include right link block 24, upper right connecting plate,
Bottom right connecting plate, the second threaded rod 25, the second rotating block and the second fixed plate, on the outside of right link block right end and outside right bearing piece left end
Side contacts, upper right connecting plate and bottom right connecting plate are separately positioned on right link block top and bottom end, are arranged on upper right connecting plate
There is the second through-hole, and be provided with internal thread structure in the second inner side wall of through hole, the second threaded rod bottom end passes through and is screwed on
On two through-holes, the second fixed plate is located at below upper right connecting plate, and the second fixed plate top is connect with the second threaded rod bottom end, the
Two rotating blocks are arranged in the second threaded rod tip；It can be connected by the way that wafer flow right end is inserted into upper right connecting plate with bottom right
Between plate, then rotates the second rotating block and the second threaded rod is driven to move down, by the second fixed plate to wafer flow right end
It is fixed.
A kind of wafer flow production cleaning device of the invention further includes that two group of first antiskid plate 26 and two group second are anti-
Slide plate 27, two group of first antiskid plate are separately positioned on lower-left connecting plate top and bottom right connecting plate top, and two group second anti-skidding
Plate is separately positioned on the first fixed plate bottom end and the second fixed plate bottom end；It can increase frictional force, enhance to wafer flow
Fixed effect.
A kind of wafer flow production cleaning device of the invention, further includes 28, two group second of two group of first stop collar limit
Position ring and two groups of third stop collars, is provided with first annular groove on two groups of overseas side walls of preceding thread pipe bottom half, and two groups the
One stop collar is set in two groups of first annular grooves, and two group of first stop collar Basolateral respectively with workbench top
Left front region is connected with right forefoot area, is provided with second annular groove on two groups of overseas side walls of rear thread pipe bottom half, and two groups
Second stop collar is set in two groups of second annular grooves, and two group of second stop collar Basolateral respectively with bench top
Left back region is held to connect with right rear region, it is recessed to be provided with third annular on left-hand thread pipe and the overseas side wall of right-hand thread pipe bottom half
Slot, two groups of third stop collars are set on two groups of third annular grooves, and two groups of third stop collar Basolaterals respectively with
Workbench top left area is connected with right half area；It can enhance preceding thread pipe, rear thread pipe, left-hand thread pipe and right-hand thread pipe
Stability between workbench.
A kind of wafer flow production cleaning device of the invention further includes storage box 29 and is shaken hands, on workbench front end
Placing groove is provided on half region, storage box is placed in placing groove, and storage box top is provided with accommodating groove, cleaning brush and multiple groups
Cleaning cotton balls is both placed in accommodating groove, and knob setting shakes hands to be located in placing groove in storage box front end；It can facilitate to clear
It scrubs and carries out storage placement with multiple groups cleaning cotton balls, improve usability.
A kind of wafer flow production cleaning device of the invention, when in use inserts wafer flow left and right ends respectively
Enter between upper left connecting plate and lower-left connecting plate and upper right connecting plate and bottom right connecting plate, then rotating the first rotating block band
Dynamic first threaded rod moves down, and is fixed by the first fixed plate to wafer flow left end, then rotates second turn
Motion block drives the second threaded rod to move down, and is fixed by the second fixed plate to wafer flow right end, simultaneously later
Rotation left-hand thread pipe and right-hand thread manage left-hand thread bar and right-hand thread bar processed and a wafer flow left side are driven to move up and down, so as to root
The left height of wafer flow is adjusted according to demand, Pressing pump is pushed after adjusting makes it that alcohol in holder is extracted out and be led to
It crosses its output end and is ejected into wafer flow on piece, then the ink of wafer flow on piece is cleaned by cleaning cotton balls and cleaning brush
?；In the above process rotatable wafer flow make left rotation shaft and right rotation shafts respectively in left link slot and right link slot into
Row rotation, overturn or be adjusted its angle to wafer flow, and spiral shell before two groups can be rotated simultaneously after the adjustment
Line pipe and two groups of rear threads control, two groups of preceding thread bars of system and two groups of rear thread bars drive respectively front end panel and rear bearing sheet into
Row moves up and down, and contacts front end panel and rear bearing sheet with wafer flow bottom end front and rear sides respectively, thus to wafer flow
It is supported fixation；The foul fallen after cleaning can be collected by holding box in cleaning process, and by by holding box
It is removed from workbench, so that convenient clear up it, reduces labour degree.
A kind of wafer flow production cleaning device of the invention, mounting means, connection type or set-up mode are
Common mechanical mode is implemented as long as can reach the equal of its advantages；And the model of above-mentioned each component is unlimited, only
The equal of its advantages can be reached by, which, is implemented.
The above is only a preferred embodiment of the present invention, it is noted that for the ordinary skill people of the art
For member, without departing from the technical principles of the invention, several improvements and modifications, these improvements and modifications can also be made
Also it should be regarded as protection scope of the present invention.
Claims (10)
1. a kind of wafer flow production cleaning device, including workbench (1), holder (2), rack, cleaning brush (3) and more
Group cleaning cotton balls (4), rack are arranged on the first half region of workbench top, and holder is arranged on rear side of workbench top, and
It is provided with placed cavity in holder, and is contained with alcohol in placed cavity, holder top is provided with pick-and-place mouth；Its feature exists
In further including Pressing pump (30), Pressing pump setting presses pump output terminal and be located at right above rack on picking and placing mouth, presses
It is located in the placement cavity to pump input terminal；It further include holding box (5) and bearing piece (6), bearing piece is arranged in workbench top, holding box bottom end
It is provided with slot, and bearing piece top is inserted into inside slot, holding box top is provided with containing tank；It further include front supporting member with after
Supporting element (7), rack include left regulating part (8), left fixing piece, left rotation shaft (9), right regulating part, right fixing piece (10) and
Right rotation shafts, left regulating part and right regulating part are separately positioned in workbench top left region and right areas, and left adjusting
Part and right regulating part are located at left and right sides of holding box, and left rotation shaft and right rotation shafts are separately positioned on left regulating part and right tune
It saves on part, left link slot and right link slot is respectively arranged in the middle part of left fixing piece left end and in the middle part of right fixing piece right end, and turn left
Moving axis and right rotation shafts are inserted into respectively inside left link slot and right link slot, left fixing piece left end outside and right fixing piece right end
Outside is contacted with left regulating part and right regulating part respectively, and front supporting member and rear support are separately positioned on workbench top first half area
On domain and later half region.
2. a kind of wafer flow production cleaning device as described in claim 1, which is characterized in that the front supporting member includes
Two groups of preceding thread pipes, two groups of preceding thread bars (11), ball bearing (12) and front end panel (13), workbench top are left front before two groups
Preceding mounting groove, before ball bearing is separately positioned on two groups before two groups in mounting groove, two groups are provided on region and right forefoot area
Before preceding thread tube bottom end is inserted into two groups respectively inside ball bearing, two groups of preceding thread bar bottom ends are inserted into respectively and are screwed on two groups
Inside preceding thread tube top end, front end panel is located above holding box, and at left and right sides of front end panel bottom end respectively with two groups before spiral shell
The connection of rasp bar top.
3. a kind of wafer flow production cleaning device as claimed in claim 2, which is characterized in that the rear support includes
Two groups of rear thread pipes (14), two groups of rear thread bars, ball bearing and rear bearing sheet (15) after two groups, the left back region in workbench top
With rear mounting groove is provided in right rear region, after ball bearing is separately positioned on two groups after two groups in mounting groove, spiral shell after two groups
After line tube bottom end is inserted into two groups respectively inside ball bearing, spiral shell after two groups of rear thread bar bottom ends are inserted into respectively and are screwed on two groups
Inside line tube top end, rear bearing sheet is located above holding box, and at left and right sides of rear bearing sheet bottom end respectively with two groups of rear thread bars
Top connection.
4. a kind of wafer flow production cleaning device as claimed in claim 3, which is characterized in that the left regulating part includes
Left-hand thread pipe (16), left-hand thread bar, left ball bearing (17) and left bearing piece are provided with left installation in the left area of workbench top
Slot, left ball bearing are arranged in left mounting groove, and left-hand thread tube bottom end is inserted into the pearl Bearing inner that rolls left, and left-hand thread bar bottom end is inserted
Enter and be screwed on inside left-hand thread tube top end, on left-hand thread bar top, left rotation shaft is arranged in left bearing piece right end for left bearing piece setting.
5. a kind of wafer flow production cleaning device as claimed in claim 4, which is characterized in that the left fixing piece includes
Left link block, upper left connecting plate (18), lower-left connecting plate (19), the first threaded rod, the first rotating block (20) and the first fixed plate
(21), with the outer side contacts of left bearing piece right end on the outside of left link block left end, upper left connecting plate and lower-left connecting plate are separately positioned on a left side
On link block top and bottom end, first through hole is provided on the connecting plate of upper left, and interior spiral shell is provided on first through hole inner sidewall
Line structure, and the first threaded rod bottom end passes through and is screwed in first through hole, the first fixed plate is located at below the connecting plate of upper left, and
First fixed plate top is connect with the first threaded rod bottom end, and the first rotating block is arranged in the first threaded rod tip.
6. a kind of wafer flow production cleaning device as claimed in claim 5, which is characterized in that the right regulating part includes
Right-hand thread pipe, right-hand thread bar (22), right ball bearing and right bearing piece (23), workbench top are provided with right installation on right half area
Slot, right ball bearing are arranged in right mounting groove, and right-hand thread tube bottom end is inserted into inside right ball bearing, and right-hand thread bar bottom end is inserted
Enter and be screwed on inside right-hand thread tube top end, on right-hand thread bar top, right rotation shafts are arranged in right bearing piece right end for right bearing piece setting.
7. a kind of wafer flow production cleaning device as claimed in claim 6, which is characterized in that the right fixing piece includes
Right link block (24), upper right connecting plate, bottom right connecting plate, the second threaded rod (25), the second rotating block and the second fixed plate, right company
It connects with side contacts outside right bearing piece left end on the outside of block right end, upper right connecting plate and bottom right connecting plate are separately positioned on right link block top
On bottom end, the second through-hole is provided on upper right connecting plate, and internal thread structure is provided in the second inner side wall of through hole, second
Threaded rod bottom end passes through and is screwed on the second through-hole, and the second fixed plate is located at below upper right connecting plate, and the second fixed plate top
End is connect with the second threaded rod bottom end, and the second rotating block is arranged in the second threaded rod tip.
8. a kind of wafer flow production cleaning device as claimed in claim 7, which is characterized in that further include two group first anti-
Slide plate (26) and two group of second antiskid plate (27), two group of first antiskid plate are separately positioned on lower-left connecting plate top and connect with bottom right
On plate top, two group of second antiskid plate is separately positioned on the first fixed plate bottom end and the second fixed plate bottom end.
9. a kind of wafer flow production cleaning device as claimed in claim 8, which is characterized in that described further includes two groups the
One stop collar (28), two group of second stop collar and two groups of third stop collars are all provided on two groups of overseas side walls of preceding thread pipe bottom half
It is equipped with first annular groove, two group of first stop collar is set in two groups of first annular grooves, and two group of first stop collar
Basolateral is connect with the left front region in workbench top and right forefoot area respectively, on two groups of overseas side walls of rear thread pipe bottom half
It is provided with second annular groove, two group of second stop collar is set in two groups of second annular grooves, and two group of second limit
Ring Basolateral is connect with the left back region in workbench top and right rear region respectively, and left-hand thread pipe and right-hand thread pipe bottom half are overseas
Third annular groove is provided on side wall, two groups of third stop collars are set on two groups of third annular grooves, and two groups
Third stop collar Basolateral is connect with workbench top left area and right half area respectively.
10. a kind of wafer flow production cleaning device as claimed in claim 9, which is characterized in that described further includes storage
Box (29) and knob, workbench front end are provided with placing groove on upper half area, and storage box is placed in placing groove, storage box top
It is provided with accommodating groove, cleaning brush and multiple groups cleaning cotton balls are both placed in accommodating groove, and knob setting is shaken hands in storage box front end
In placing groove.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201811060258.5A CN109087878B (en) | 2018-09-12 | 2018-09-12 | Cleaning device for wafer production |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201811060258.5A CN109087878B (en) | 2018-09-12 | 2018-09-12 | Cleaning device for wafer production |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN109087878A true CN109087878A (en) | 2018-12-25 |
| CN109087878B CN109087878B (en) | 2024-03-12 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201811060258.5A Active CN109087878B (en) | 2018-09-12 | 2018-09-12 | Cleaning device for wafer production |
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| Country | Link |
|---|---|
| CN (1) | CN109087878B (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112453003A (en) * | 2020-11-03 | 2021-03-09 | 四川美术学院 | Semiconductor wafer clamping equipment |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH1050654A (en) * | 1996-08-01 | 1998-02-20 | Nec Corp | Wafer-treating apparatus |
| CN101459124A (en) * | 2007-12-13 | 2009-06-17 | 中芯国际集成电路制造(上海)有限公司 | Chemical mechanical grinding method and wafer cleaning method |
| CN107694798A (en) * | 2017-10-26 | 2018-02-16 | 江苏康杰机械股份有限公司 | A kind of workpiece preservative spray equipment |
| CN108109946A (en) * | 2018-01-16 | 2018-06-01 | 昆山成功环保科技有限公司 | A kind of etching apparatus |
-
2018
- 2018-09-12 CN CN201811060258.5A patent/CN109087878B/en active Active
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH1050654A (en) * | 1996-08-01 | 1998-02-20 | Nec Corp | Wafer-treating apparatus |
| CN101459124A (en) * | 2007-12-13 | 2009-06-17 | 中芯国际集成电路制造(上海)有限公司 | Chemical mechanical grinding method and wafer cleaning method |
| CN107694798A (en) * | 2017-10-26 | 2018-02-16 | 江苏康杰机械股份有限公司 | A kind of workpiece preservative spray equipment |
| CN108109946A (en) * | 2018-01-16 | 2018-06-01 | 昆山成功环保科技有限公司 | A kind of etching apparatus |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112453003A (en) * | 2020-11-03 | 2021-03-09 | 四川美术学院 | Semiconductor wafer clamping equipment |
| CN112453003B (en) * | 2020-11-03 | 2022-02-15 | 四川美术学院 | Semiconductor wafer clamping equipment |
Also Published As
| Publication number | Publication date |
|---|---|
| CN109087878B (en) | 2024-03-12 |
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