CN109064623A - Cash inspecting machine for finance - Google Patents
Cash inspecting machine for finance Download PDFInfo
- Publication number
- CN109064623A CN109064623A CN201810857937.9A CN201810857937A CN109064623A CN 109064623 A CN109064623 A CN 109064623A CN 201810857937 A CN201810857937 A CN 201810857937A CN 109064623 A CN109064623 A CN 109064623A
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- China
- Prior art keywords
- cooling mechanism
- cooling
- chilling plate
- semiconductor chilling
- heat
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Classifications
-
- G—PHYSICS
- G07—CHECKING-DEVICES
- G07D—HANDLING OF COINS OR VALUABLE PAPERS, e.g. TESTING, SORTING BY DENOMINATIONS, COUNTING, DISPENSING, CHANGING OR DEPOSITING
- G07D7/00—Testing specially adapted to determine the identity or genuineness of valuable papers or for segregating those which are unacceptable, e.g. banknotes that are alien to a currency
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/2039—Modifications to facilitate cooling, ventilating, or heating characterised by the heat transfer by conduction from the heat generating element to a dissipating body
- H05K7/20509—Multiple-component heat spreaders; Multi-component heat-conducting support plates; Multi-component non-closed heat-conducting structures
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- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Thermal Sciences (AREA)
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
Abstract
The present invention provides a kind of cash inspecting machines for finance, including shell, first motor, the second motor, bank note accepting wheel and driving wheel；It further include the first heat-conducting piece, the second heat-conducting piece, the first cooling mechanism and the second cooling mechanism；First cooling mechanism and the second cooling mechanism include semiconductor chilling plate and cooling fin, the semiconductor chilling plate of first cooling mechanism is installed on the rear wall of shell, the semiconductor chilling plate of second cooling mechanism is installed on the left side wall of the shell, and the huyashi-chuuka (cold chinese-style noodles) of the semiconductor chilling plate of the first cooling mechanism and the second cooling mechanism is respectively positioned in shell, and the hot face of the semiconductor chilling plate of the first cooling mechanism and the second cooling mechanism is respectively positioned on outside shell；The cooling fin of first cooling mechanism is installed on the hot face of the semiconductor chilling plate of the first cooling mechanism.The present invention improves heat dissipation performance, reduces the probability that motor is burned, and improves security level, while improving dust-proof grade.
Description
Technical field
The present invention relates to financial apparatus fields, and in particular to a kind of cash inspecting machine for finance.
Background technique
Cash inspecting machine is a kind of machine identified authenticity of banknotes and check number of banknotes.Since cash circulation is in large scale,
Bank/Finance Department cashier sales counter cash processing work is heavy, and paper money counter has become indispensable equipment.Collection counts and discrimination
, with the development of printing technology, reprography and electronic scanning technique, counterfeit money manufacture level is higher and higher, it is necessary to no
The disconnected discrimination performance for improving paper money counter.According to the difference of banknote motion profile, paper money counter is divided into horizontal and vertical currency counting machine.Discrimination
Means usually have three ways, such as fluorescence identifying, magnetometric analysis, infrared penetrate.Portable bank note validator is divided into Portable table type laser again and tests
Paper money machine and two kinds of palm laser cash inspecting machine portable.
Wherein Horizontal banknote detector is most commonly seen, and money-checking speed is fast, and volume is moderate to be conducive to carry carrying.It is this at present horizontal to test
There are an insufficient places for paper money machine, occur serious heat dissipation problem afterwards for a period of time in continuous work.Horizontal banknote detector is main
Pyrotoxin is two motors, followed by circuit board, but circuit board heating amount is very small, can be ignored.Two motors exist
It running at high speed middle by a large amount of heat of generation, heat is slowly spread out by side wall thermovent, but due to continuous work, largely
Heat concentrate at two motors, since in the way of natural heat dissipation, heat cannot be spread out in time, to be easy to burn out electricity
Machine.
Further, since side wall is provided with thermovent, the dust in environment is easy in cash inspecting machine building up inside or even sundries
It is easy to enter from thermovent.When dust is constantly accumulated, on the one hand influence heat dissipation performance, on the other hand will affect circuit board, cause
Short circuit.
Summary of the invention
For the defects in the prior art, the present invention provides a kind of cash inspecting machine for finance, to improve heat dissipation performance, drop
The probability that low motor is burned improves security level, while improving dust-proof grade.
The present invention provides it is a kind of for finance cash inspecting machine, including shell, first motor, the second motor, bank note accepting wheel and
Driving wheel；The driving wheel and bank note accepting wheel respectively correspond the upper opening and lower openings for being installed on the shell, and described first
Motor and the second motor are mounted in shell, and first motor connect with capstan drive and the second motor and connects paper money
Wheel transmission connection；
It further include the first heat-conducting piece, the second heat-conducting piece, the first cooling mechanism and the second cooling mechanism；The first heat dissipation machine
Structure and the second cooling mechanism include semiconductor chilling plate and cooling fin, and the semiconductor chilling plate of the first cooling mechanism is installed on institute
The rear wall of shell is stated, the semiconductor chilling plate of the second cooling mechanism is installed on the left side wall of the shell, and the first heat dissipation
The huyashi-chuuka (cold chinese-style noodles) of the semiconductor chilling plate of mechanism and the second cooling mechanism is respectively positioned in shell, the first cooling mechanism and the second cooling mechanism
The hot face of semiconductor chilling plate be respectively positioned on outside shell；The cooling fin of first cooling mechanism is installed on the first cooling mechanism
The hot face of semiconductor chilling plate, the cooling fin of second cooling mechanism are installed on the semiconductor chilling plate of the second cooling mechanism
Hot face；
First heat-conducting piece includes the first cylinder body and the first heat carrier, and the first cylinder body is set in described first
The outer surface of motor, for absorbing the heat of first motor sending；First heat carrier is fixedly connected with the first cylinder body, and
And first heat carrier contacted with the huyashi-chuuka (cold chinese-style noodles) of the semiconductor chilling plate of the first cooling mechanism；
Second heat carrier includes the second cylinder body and the second heat carrier, and the second cylinder body is set in described second
The outer surface of motor, for absorbing the heat of the second motor sending；Second heat carrier is fixedly connected with the second cylinder body, and
And second heat carrier contacted with the huyashi-chuuka (cold chinese-style noodles) of the semiconductor chilling plate of the second cooling mechanism.
Preferably, the first cylinder body and the first thermally conductive body by integral forming, and material is copper.The pyroconductivity of copper
Height can substantially increase the heat dissipation performance of first motor quickly by the heat absorption of first motor.
Preferably, the second cylinder body and the second thermally conductive body by integral forming, and material is copper.
Preferably, the semiconductor chilling plate of first cooling mechanism is opposite with first motor.Reduce the first cooling mechanism
Semiconductor chilling plate at a distance from first motor, be conducive to shorten the first heat carrier length, further increase first motor
Heat dissipation performance.
It preferably, further include third cooling mechanism, the third cooling mechanism includes semiconductor chilling plate and cooling fin；The
The semiconductor chilling plate of three cooling mechanisms is installed on the housing right side wall, and the huyashi-chuuka (cold chinese-style noodles) of the semiconductor chilling plate is located at shell
Interior, hot face is located at outside shell；The cooling fin of the third cooling mechanism is closely attached on third cooling mechanism there are two setting respectively
The huyashi-chuuka (cold chinese-style noodles) of semiconductor chilling plate and hot face.
Third cooling mechanism is to assist cooling mechanism, the first cooling mechanism and the second cooling mechanism by first motor and second
Most of heat of motor is taken away, and third cooling mechanism absorbs remaining minor heat in shell, this partial heat mainly comes
From electronic component, further decrease the intracorporal temperature of shell.
Preferably, between the semiconductor chilling plate and its cooling fin of first cooling mechanism, second cooling mechanism
Semiconductor chilling plate and its cooling fin between and the semiconductor chilling plate and its cooling fin of the third cooling mechanism between
It is equipped with heat conductive silica gel.
Heat conductive silica gel has high thermal conductivity, and splendid thermal conductivity, the good exhausted property of electricity is wider to use temperature, well
Stability in use can improve semiconductor chilling plate and the heat transmitting of its cooling fin.In addition, heat conductive silica gel can also in structure technique
Tolerance is made up, and manufacturing tolerance requirement between semiconductor chilling plate and cooling fin is reduced.
Preferably, the cooling fin of first cooling mechanism, the cooling fin of the second cooling mechanism and third cooling mechanism
Cooling fin be equipped with blower.The heat-sinking capability that blower improves cooling fin makes simultaneously in time by heat diffusion into surrounding air
Cooling fin cools down in time.
Preferably, the front side wall of the shell, left side wall and right side wall are equipped with detachable cover board, first heat dissipation
The semiconductor chilling plate of the semiconductor chilling plate of mechanism, the semiconductor chilling plate of the second cooling mechanism and third cooling mechanism
It is embedded in corresponding cover board correspondingly.
Each cover board be it is hermetically sealed, be not provided with heat release hole, the dust efficiently avoided in air enters shell
It is interior, it avoids the dust of long-term accumulated from influencing heat dissipation performance and detonator circuit failure, improves dust-proof grade.In addition, cover board and correspondence
Side wall between can split, facilitate later period maintenance.
It preferably, further include controller, the controller is installed on the outer surface of the rear wall, and controller is defeated
The semiconductor chilling plate with first cooling mechanism, the semiconductor chilling plate of the second cooling mechanism, third radiate outlet respectively
Mechanism semiconductor chilling plate and the electrical connection of all blowers.
Preferably, first heat-conducting piece and the second heat-conducting piece are equipped with temperature sensor, and two temperature sensors
It is electrically connected respectively with the input terminal of the controller.
Controller is PLC controller, which sets both of which.Two temperature sensors are in real time by first motor
For temperature feedback with the second motor to controller, controller judges automatically any mode of starting according to the temperature of feedback.It is a kind of
It is common radiating mode, under the mode, controller makes third cooling mechanism, the first cooling mechanism and the second cooling mechanism not work
Make, this mode applies to the not high situation of frequency of use.Another mode is rapidly radiating mode, under the mode, control
Device works at the same time the first cooling mechanism, the second cooling mechanism and third cooling mechanism, quickly by first motor and the second motor
Heat spreader go out.Both the above mode has controller to judge automatically completion, common radiating mode power saving, rapidly radiating mode
It ensure that heat dissipation performance.
The beneficial effects of the present invention are embodied in:
The heat of first motor and the second motor is quickly transferred to by the present invention using the first heat-conducting piece and the second heat-conducting piece
Corresponding first cooling mechanism and the second cooling mechanism, and the first cooling mechanism and the second cooling mechanism utilize semiconductor chilling plate
Huyashi-chuuka (cold chinese-style noodles) by first motor and the heat absorption of the second motor and be transferred to hot face, really by first motor and the second motor
Heat is quickly transferred to hull outside.Even if this equipment, also can be timely and effectively in the case where prolonged continuous work
By first motor and the heat transfer of the second motor to hull outside, avoids heat and collect at first motor and the second motor
It is damaged to, to substantially increase heat dissipation performance, reduces first motor and probability that the second motor is burned, improve safety etc.
Grade.
Detailed description of the invention
It, below will be to specific in order to illustrate more clearly of the specific embodiment of the invention or technical solution in the prior art
Embodiment or attached drawing needed to be used in the description of the prior art are briefly described.In all the appended drawings, similar element
Or part is generally identified by similar appended drawing reference.In attached drawing, each element or part might not be drawn according to actual ratio.
Fig. 1 is the structural schematic diagram of the present embodiment；
Fig. 2 is the left view of Fig. 1；
Fig. 3 is the right view of Fig. 1；
Fig. 4 is the schematic diagram of internal structure of Fig. 3；
Fig. 5 is the enlarged drawing in Fig. 4 at A；
Fig. 6 is the structural schematic diagram of the first heat-conducting piece in the present embodiment；
Fig. 7 is the right view of Fig. 6；
Fig. 8 is the structural schematic diagram of the second heat-conducting piece in the present embodiment；
Fig. 9 is the left view of Fig. 8；
Figure 10 is the top view of Fig. 8.
In attached drawing, 1- shell, 2- first motor, the second motor of 3-, 4- bank note accepting wheel, 5- driving wheel, 6- upper opening, under 7-
Portion's opening, 8- money retaining plate, 9- cover board, 10- deep gouge, 11- screw hole, the first heat-conducting piece of 12-, the second heat-conducting piece of 13-, 14- first
Cooling mechanism, the second cooling mechanism of 15-, 16- third cooling mechanism, 17- semiconductor chilling plate, 18- cooling fin, the circle of 19- first
Cylinder, the first heat carrier of 20-, 21- the second cylinder body, the second heat carrier of 22-, 23- heat conductive silica gel, 24- thermal-insulated frame, 25- control
Device, 26- display, 27- blower, 28- temperature sensor
Specific embodiment
It is described in detail below in conjunction with embodiment of the attached drawing to technical solution of the present invention.Following embodiment is only used for
Clearly illustrate technical solution of the present invention, therefore be only used as example, and cannot be used as a limitation and limit protection model of the invention
It encloses.
It should be noted that unless otherwise indicated, technical term or scientific term used in this application should be this hair
The ordinary meaning that bright one of ordinary skill in the art are understood.
As shown in Figure 1, present embodiments providing a kind of cash inspecting machine for finance, including shell 1, first motor 2, second
Motor 3, bank note accepting wheel 4 and driving wheel 5；The driving wheel 5 and bank note accepting wheel 4 respectively correspond the upper opening 6 for being installed on the shell 1
With lower openings 7, the first motor 2 and the second motor 3 are mounted in shell 1, and first motor 2 and driving wheel 5 pass
Dynamic connection and the second motor 3 are sequentially connected with bank note accepting wheel 4.Wherein, it is additionally provided with money retaining plate 8 at lower openings 7, is set on shell
There is display 26.
As shown in Figures 2 and 3, in order to avoid the dust in environment is easy also to be easy in 1 building up inside of shell or even sundries
The problem of entering from thermovent, front side wall, left side wall and the right side wall of shell 1 are equipped with detachable cover board 9 in the present embodiment,
Cover board 9 is connected with corresponding side wall by screw, and front side wall, left side wall and right side wall are equipped with and sink in cover board 9 is corresponding
Slot 10 and screw hole 11.Each cover board 9 be it is hermetically sealed, be not provided with heat release hole, efficiently avoid dust in air into
Enter into shell 1, avoids the dust of long-term accumulated from influencing heat dissipation performance and detonator circuit failure, improve dust-proof grade.
As shown in Fig. 4 to Figure 10, due to shell 1 be it is hermetically sealed, in order to solve the first motor 2 and second inside shell 1
3 heat dissipation performance of motor is poor, causes to be easy to appear the phenomenon that burning motor, the present embodiment further includes that the first heat-conducting piece 12, second is thermally conductive
Part 13, the first cooling mechanism 14 and the second cooling mechanism 15, first cooling mechanism 14 and the second cooling mechanism 15 include
Semiconductor chilling plate 17 and cooling fin 18, the semiconductor chilling plate 17 of the first cooling mechanism 14 are installed on the rear side of the shell 1
Wall, the semiconductor chilling plate 17 of the second cooling mechanism 15 are installed on the left side wall of the shell 1, and 14 He of the first cooling mechanism
The huyashi-chuuka (cold chinese-style noodles) of the semiconductor chilling plate 17 of second cooling mechanism 15 is respectively positioned in shell 1, the first cooling mechanism 14 and the second heat dissipation machine
The hot face of the semiconductor chilling plate 17 of structure 15 is respectively positioned on outside shell 1；The cooling fin 18 of first cooling mechanism 14 is installed on
The cooling fin 18 in the hot face of the semiconductor chilling plate 17 of one cooling mechanism 14, second cooling mechanism 15 is installed on the second heat dissipation
The hot face of the semiconductor chilling plate 17 of mechanism 15.First heat-conducting piece 12 includes the first cylinder body 19 and the first heat carrier 20,
The first cylinder body 19 is set in the outer surface of the first motor 2, for absorbing the heat of the sending of first motor 2；It is described
First heat carrier 20 is fixedly connected with the first cylinder body 19, and the semiconductor system of the first heat carrier 20 and the first cooling mechanism 14
Cold 17 huyashi-chuuka (cold chinese-style noodles) contact.Second heat carrier 22 includes the second cylinder body 21 and the second heat carrier 22, described the second cylinder
Body 21 is set in the outer surface of second motor 3, for absorbing the heat of the second motor 3 sending；Second heat carrier 22
It is fixedly connected with the second cylinder body 21, and the huyashi-chuuka (cold chinese-style noodles) of the semiconductor chilling plate 17 of the second heat carrier 22 and the second cooling mechanism 15
Contact.
The heat of first motor 2 and the second motor 3 is quickly transferred to using the first heat-conducting piece 12 and the second heat-conducting piece 13
Corresponding first cooling mechanism 14 and the second cooling mechanism 15, and the first cooling mechanism 14 and the second cooling mechanism 15 are utilized and are partly led
The huyashi-chuuka (cold chinese-style noodles) of body cooling piece 17 is by first motor 2 and the heat absorption of the second motor 3 and is transferred to hot face, really by first motor
2 and second the heat of motor 3 be quickly transferred to outside shell 1.Even if this equipment in the case where prolonged continuous work,
Also heat can outside first motor 2 and the heat transfer to shell 1 of the second motor 3, will timely and effectively be avoided in the first electricity
Collect at machine 2 and the second motor 3 and be damaged to, to substantially increase heat dissipation performance, reduces first motor 2 and the second motor 3
The probability being burned improves security level.
Further improve heat dissipation performance, the first cylinder body 19 in the present embodiment and 20 one of the first heat carrier at
Type, and material is copper.The second cylinder body 21 and the second heat carrier 22 are integrally formed, and material is copper.Copper
Pyroconductivity is high, can substantially increase heat dissipation performance quickly by the heat absorption of first motor 2 and the second motor 3.In addition,
The semiconductor chilling plate 17 and first motor 2 of first cooling mechanism 14 are opposite.Reduce the semiconductor of the first cooling mechanism 14
Cooling piece 17 is conducive to the length for shortening the first heat carrier 20, further increases first motor 2 at a distance from first motor 2
Heat dissipation performance.
Since the power of semiconductor chilling plate 17 is larger, in order to save electric energy, guaranteeing first motor 2 and the second motor 3
Under the premise of normal work, the present embodiment further includes third cooling mechanism 16, and the third cooling mechanism 16 includes semiconductor system
Cold 17 and cooling fin 18；The semiconductor chilling plate 17 of third cooling mechanism 16 is installed on 1 right side wall of shell, and should be partly
The huyashi-chuuka (cold chinese-style noodles) of conductor cooling piece 17 is located in shell 1, and hot face is located at outside shell 1；The cooling fin 18 of the third cooling mechanism 16
There are two if, be closely attached on respectively the semiconductor chilling plate 17 of third cooling mechanism 16 huyashi-chuuka (cold chinese-style noodles) and hot face.Third cooling mechanism 16
To assist cooling mechanism, the first cooling mechanism 14 and the second cooling mechanism 15 by most of heat of first motor 2 and the second motor 3
Amount is taken away, and third cooling mechanism 16 absorbs remaining minor heat in shell 1, this partial heat mainly from electronic component,
Further decrease the temperature in shell 1.
As shown in figure 5, further, the semiconductor chilling plate 17 of first cooling mechanism 14 and its cooling fin 18 it
Between, between the semiconductor chilling plate 17 and its cooling fin 18 of second cooling mechanism 15 and the third cooling mechanism 16
Semiconductor chilling plate 17 and its cooling fin 18 between be equipped with heat conductive silica gel 23.Heat conductive silica gel 23 has high thermal conductivity, splendid
Thermal conductivity, the good exhausted property of electricity, wider to use temperature, good stability in use can improve 17 He of semiconductor chilling plate
The heat transmitting of its cooling fin 18.In addition, heat conductive silica gel 23 can also make up manufacturing tolerance in structure, semiconductor chilling plate is reduced
Manufacturing tolerance requirement between 17 and cooling fin 18.The cooling fin 18 of first cooling mechanism 14, the second cooling mechanism 15 dissipate
The cooling fin 18 of backing 18 and third cooling mechanism 16 is all provided with there are two blower 27.The heat dissipation of the raising cooling fin 18 of blower 27
Ability in time by heat diffusion into surrounding air, while keeping cooling fin 18 cooling in time.
The semiconductor refrigerating of the semiconductor chilling plate 17 of the first cooling mechanism 14 in the present embodiment, the second cooling mechanism 15
The semiconductor chilling plate 17 of piece 17 and third cooling mechanism 16 is embedded in corresponding cover board 9 correspondingly.Semiconductor system
Thermal-insulated frame 24 is additionally provided between cold 17 and cover board 9, avoid shell 1 it is inside and outside between heat transmitting it is excessive and influence heat dissipation
Performance.
The present embodiment further includes controller 25, and the controller 25 is installed on the outer surface of the rear wall, and controls
The output end of device 25 semiconductor chilling plate 17 with first cooling mechanism 14 respectively, the semiconductor system of the second cooling mechanism 15
Cold 17,16 semiconductor chilling plate 17 of third cooling mechanism and all blowers 27 are electrically connected.First heat-conducting piece, 12 He
Second heat-conducting piece 13 is equipped with temperature sensor 28, and two temperature sensors 28 input terminal with the controller 25 respectively
Electrical connection.Controller 25 is PLC controller 25, which sets both of which.Two temperature sensors 28 in real time will
Where the temperature feedback of first motor 2 and the second motor 3 judges automatically starting according to the temperature of feedback to controller 25, controller 25
One mode.One is common radiating mode, under the mode, controller 25 makes third cooling mechanism 16, the first cooling mechanism 14
It does not work with the second cooling mechanism 15, this mode applies to the not high situation of frequency of use.Another mode is rapidly
Radiating mode, under the mode, controller 25 makes the first cooling mechanism 14, the second cooling mechanism 15 and third cooling mechanism 16 simultaneously
Work, quickly goes out the heat spreader of first motor 2 and the second motor 3.Both the above mode has controller 25 to judge automatically
It completes, common radiating mode power saving, rapidly radiating mode ensure that heat dissipation performance.
Finally, it should be noted that the above embodiments are only used to illustrate the technical solution of the present invention., rather than its limitations；To the greatest extent
Pipe present invention has been described in detail with reference to the aforementioned embodiments, those skilled in the art should understand that: its according to
So be possible to modify the technical solutions described in the foregoing embodiments, or to some or all of the technical features into
Row equivalent replacement；And these are modified or replaceed, various embodiments of the present invention technology that it does not separate the essence of the corresponding technical solution
The range of scheme should all cover within the scope of the claims and the description of the invention.
Claims (10)
1. a kind of cash inspecting machine for finance, including shell, first motor, the second motor, bank note accepting wheel and driving wheel；The active
Wheel and bank note accepting wheel respectively correspond the upper opening and lower openings for being installed on the shell, and the first motor and the second motor are equal
It is installed in shell, and first motor is connect with capstan drive and the second motor is sequentially connected with bank note accepting wheel；
It is characterized by also including the first heat-conducting piece, the second heat-conducting piece, the first cooling mechanism and the second cooling mechanisms；Described
One cooling mechanism and the second cooling mechanism include semiconductor chilling plate and cooling fin, the semiconductor chilling plate of the first cooling mechanism
It is installed on the rear wall of the shell, the semiconductor chilling plate of the second cooling mechanism is installed on the left side wall of the shell, and
The huyashi-chuuka (cold chinese-style noodles) of the semiconductor chilling plate of first cooling mechanism and the second cooling mechanism is respectively positioned in shell, the first cooling mechanism and second
The hot face of the semiconductor chilling plate of cooling mechanism is respectively positioned on outside shell；The cooling fin of first cooling mechanism is installed on first and dissipates
The cooling fin in the hot face of the semiconductor chilling plate of heat engine structure, second cooling mechanism is installed on the semiconductor of the second cooling mechanism
The hot face of cooling piece；
First heat-conducting piece includes the first cylinder body and the first heat carrier, and the first cylinder body is set in the first motor
Outer surface, for absorb first motor sending heat；First heat carrier is fixedly connected with the first cylinder body, and the
One heat carrier is contacted with the huyashi-chuuka (cold chinese-style noodles) of the semiconductor chilling plate of the first cooling mechanism；
Second heat carrier includes the second cylinder body and the second heat carrier, and the second cylinder body is set in second motor
Outer surface, for absorb the second motor sending heat；Second heat carrier is fixedly connected with the second cylinder body, and the
Two heat carriers are contacted with the huyashi-chuuka (cold chinese-style noodles) of the semiconductor chilling plate of the second cooling mechanism.
2. the cash inspecting machine according to claim 1 for finance, it is characterised in that: the first cylinder body and first thermally conductive
Body by integral forming, and material is copper.
3. the cash inspecting machine according to claim 1 for finance, it is characterised in that: the second cylinder body and second thermally conductive
Body by integral forming, and material is copper.
4. the cash inspecting machine according to claim 1 for finance, it is characterised in that: the semiconductor of first cooling mechanism
Cooling piece is opposite with first motor.
5. described in any item cash inspecting machines for finance according to claims 1 to 4, it is characterised in that: further include that third dissipates
Heat engine structure, the third cooling mechanism includes semiconductor chilling plate and cooling fin；The semiconductor chilling plate of third cooling mechanism is pacified
Loaded on the housing right side wall, and the huyashi-chuuka (cold chinese-style noodles) of the semiconductor chilling plate is located in shell, and hot face is located at outside shell；Described
There are two the cooling fin of three cooling mechanisms is set, be closely attached on respectively the semiconductor chilling plate of third cooling mechanism huyashi-chuuka (cold chinese-style noodles) and hot face.
6. the cash inspecting machine according to claim 5 for finance, it is characterised in that: the semiconductor of first cooling mechanism
Between cooling piece and its cooling fin, between the semiconductor chilling plate and its cooling fin of second cooling mechanism and described
Heat conductive silica gel is equipped between the semiconductor chilling plate of three cooling mechanisms and its cooling fin.
7. the cash inspecting machine according to claim 5 for finance, it is characterised in that: the heat dissipation of first cooling mechanism
The cooling fin of piece, the cooling fin of the second cooling mechanism and third cooling mechanism is equipped with blower.
8. the cash inspecting machine according to claim 5 for finance, it is characterised in that: front side wall, the left side wall of the shell
Detachable cover board is equipped with right side wall, and the semiconductor chilling plate of first cooling mechanism, the second cooling mechanism are partly led
The semiconductor chilling plate of body cooling piece and third cooling mechanism is embedded in corresponding cover board correspondingly.
9. the cash inspecting machine according to claim 7 for finance, it is characterised in that: it further include controller, the controller
It is installed on the outer surface of the rear wall, and the output end of the controller semiconductor refrigerating with first cooling mechanism respectively
Piece, the semiconductor chilling plate of the second cooling mechanism, third cooling mechanism semiconductor chilling plate and the electrical connection of all blowers.
10. the cash inspecting machine according to claim 9 for finance, it is characterised in that: first heat-conducting piece and second is led
Warmware is equipped with temperature sensor, and two temperature sensors are electrically connected with the input terminal of the controller respectively.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810857937.9A CN109064623A (en) | 2018-07-31 | 2018-07-31 | Cash inspecting machine for finance |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810857937.9A CN109064623A (en) | 2018-07-31 | 2018-07-31 | Cash inspecting machine for finance |
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| Publication Number | Publication Date |
|---|---|
| CN109064623A true CN109064623A (en) | 2018-12-21 |
Family
ID=64831940
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201810857937.9A Pending CN109064623A (en) | 2018-07-31 | 2018-07-31 | Cash inspecting machine for finance |
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| CN (1) | CN109064623A (en) |
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| CN107609629A (en) * | 2017-09-06 | 2018-01-19 | 无锡南理工科技发展有限公司 | The currency counting and detecting machine of portable quick heat radiating |
| KR101834751B1 (en) * | 2016-06-30 | 2018-03-06 | 주식회사 에이텍에이피 | Media recognizing apparatus and financial device |
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2018
- 2018-07-31 CN CN201810857937.9A patent/CN109064623A/en active Pending
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102102868A (en) * | 2010-11-18 | 2011-06-22 | 常州星宇车灯股份有限公司 | Large-power light emitting diode (LED) active radiating device for car lamp |
| CN104456211A (en) * | 2014-12-05 | 2015-03-25 | 东莞市闻誉实业有限公司 | LED lamp with refrigerating piece |
| CN105844785A (en) * | 2016-03-26 | 2016-08-10 | 无锡南理工科技发展有限公司 | Use method of multifunctional continuous-operation bill counting and checking machine |
| KR101834751B1 (en) * | 2016-06-30 | 2018-03-06 | 주식회사 에이텍에이피 | Media recognizing apparatus and financial device |
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Application publication date: 20181221 |
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| RJ01 | Rejection of invention patent application after publication |