CN109047449B - A kind of stamping die buffering formed punch - Google Patents
A kind of stamping die buffering formed punch Download PDFInfo
- Publication number
- CN109047449B CN109047449B CN201811048600.XA CN201811048600A CN109047449B CN 109047449 B CN109047449 B CN 109047449B CN 201811048600 A CN201811048600 A CN 201811048600A CN 109047449 B CN109047449 B CN 109047449B
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- CN
- China
- Prior art keywords
- mounting blocks
- side wall
- formed punch
- sliding block
- cavity
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Classifications
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B21—MECHANICAL METAL-WORKING WITHOUT ESSENTIALLY REMOVING MATERIAL; PUNCHING METAL
- B21D—WORKING OR PROCESSING OF SHEET METAL OR METAL TUBES, RODS OR PROFILES WITHOUT ESSENTIALLY REMOVING MATERIAL; PUNCHING METAL
- B21D28/00—Shaping by press-cutting; Perforating
- B21D28/02—Punching blanks or articles with or without obtaining scrap; Notching
- B21D28/14—Dies
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- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Fixed Capacitors And Capacitor Manufacturing Machines (AREA)
- Presses And Accessory Devices Thereof (AREA)
- Shaping Metal By Deep-Drawing, Or The Like (AREA)
Abstract
The invention discloses a kind of stamping die buffering formed punches, including mounting blocks, installation cavity is equipped in the mounting blocks, and sliding block is slidably connected in installation cavity, the downside side wall of the sliding block is equipped with the formed punch being vertically arranged, and formed punch far from sliding block side through mounting blocks side wall and with its setting that is slidably connected, the upper inside walls of the mounting blocks are equipped with the first cavity being laterally arranged, and first is equipped with upper capacitor board in cavity, the second cavity being laterally arranged is equipped in the sliding block, and second is equipped with the lower capacitor board being parallel to each other with upper capacitor board in cavity, the side side wall of the mounting blocks is equipped with power interface, and power interface is electrically connected by conducting wire and upper capacitor board and lower capacitor board, ER fluid is filled between the upper inside walls and sliding block of the mounting blocks.In the present invention, which can fully buffer formed punch with buffering formed punch, effectively prevent it that larger abrasion occurs, to improve its service life.
Description
Technical field
The present invention relates to technical field of mold more particularly to a kind of stamping die buffering formed punches.
Background technique
Stamping die is that material (metal or nonmetallic) is processed into part (or semi-finished product) in Cold Press Working
A kind of special process equipment, referred to as cold punching die (being commonly called as cold-punching mould).
In practical punching course, the whole pair maximum component of die wear is undoubtedly formed punch, thus can generally select hardness
Higher formed punch carries out stamping press, in punching course repeatedly, since formed punch directly contacts firmly with punching plate, generates suddenly
Great stress can make the degree of wear higher.In addition, for the punching plate of different-thickness, due to blanking pressure size not
Together, so that the degree of wear to formed punch is also not quite similar.And the formed punch after wearing needs to replace immediately, what is otherwise processed rushes
The quality for cutting out part not can guarantee.
For this purpose, it is proposed that a kind of stamping die is solved the above problems with buffering formed punch.
Summary of the invention
The purpose of the present invention is to solve problems of the prior art, and a kind of stamping die buffering proposed
Formed punch.
To achieve the goals above, present invention employs following technical solutions:
A kind of stamping die buffering formed punch, including mounting blocks are equipped with installation cavity in the mounting blocks, and sliding in installation cavity
Dynamic to be connected with sliding block, the downside side wall of the sliding block is equipped with the formed punch being vertically arranged, and formed punch runs through far from the side of sliding block
The side wall of mounting blocks and with its setting that is slidably connected, the upper inside walls of the mounting blocks are equipped with the first cavity being laterally arranged,
And first is equipped with upper capacitor board in cavity, is equipped with the second cavity being laterally arranged in the sliding block, and be equipped in the second cavity with
The side side wall of the lower capacitor board that upper capacitor board is parallel to each other, the mounting blocks is equipped with power interface, and power interface passes through
Conducting wire and upper capacitor board and lower capacitor board are electrically connected, and are become between the upper inside walls and sliding block of the mounting blocks filled with electric current
Liquid, the outside side wall of the formed punch on the outside of mounting blocks are equipped with annular shoulder block, are arranged on the outside side wall of the formed punch
There is a spring, and the both ends of spring offset with the side wall of mounting blocks and annular shoulder block setting respectively.
Preferably, it is symmetrically arranged with the fixed block being laterally arranged on the two sides side wall of the mounting blocks, and is equipped in fixed block
Through the bolt hole of setting.
Preferably, circular array shows multiple guide grooves on the side wall that the mounting blocks are in contact with formed punch, the formed punch
Circular array shows multiple guide pads to match with guide groove on outside side wall.
Preferably, the outside side wall of the sliding block is equipped with annular groove, and O-ring seal is arranged in annular groove.
Preferably, the side side wall of the mounting blocks is equipped with liquid injection port, and cock is threaded in liquid injection port.
Preferably, the upside side wall of the installation cavity is elastic surface.
Compared with prior art, the beneficial effects of the present invention are:
The stamping die passes through the cooperation of sliding block, ER fluid, spring, upper capacitor board and lower capacitor board with buffering formed punch,
When formed punch and punching plate contact, spring contraction, to avoid formed punch that hard contact occurs, by biggish mutation stress, separately
Outside, ER fluid is under the voltage effect that upper capacitor board and lower capacitor board generate, and viscosity changes, and according to stamping press
Size, the mobile distance of slide plate changes, so that the viscosity of ER fluid also changes, so as in due course to formed punch into
Row buffering is adequately protected it, and then can guarantee the quality of blanking part；
By setting guide pad and guide groove, can make in punching course, movement of the formed punch in installation cavity is more
Add stabilization, keeps vertical, will not shift, to avoid breakage punch head.
Detailed description of the invention
Fig. 1 is the structural schematic diagram that a kind of stamping die proposed by the present invention buffers formed punch；
Fig. 2 is the structural schematic diagram in Fig. 1 at A；
Fig. 3 is the schematic diagram of the section structure for the mounting blocks that a kind of stamping die proposed by the present invention buffers formed punch.
In figure: 1 mounting blocks, 2 ER fluids, 3 first cavitys, capacitor board, 5 fixed blocks, 6 bolts hole, 7 installation cavitys, 8 on 4
Guide pad, 9 springs, 10 annular shoulder blocks, 11 formed punches, 12 sliding blocks, 13 second cavitys, 14 lower capacitor boards, 15O type sealing ring, 16 rings
Connected in star, 17 guide grooves.
Specific embodiment
Following will be combined with the drawings in the embodiments of the present invention, and technical solution in the embodiment of the present invention carries out clear, complete
Site preparation description, it is clear that described embodiments are only a part of the embodiments of the present invention, instead of all the embodiments.
In the description of the present invention, it is to be understood that, term " on ", "lower", "front", "rear", "left", "right", "top",
The orientation or positional relationship of the instructions such as "bottom", "inner", "outside" is to be based on the orientation or positional relationship shown in the drawings, merely to just
In description the present invention and simplify description, rather than the device or element of indication or suggestion meaning must have a particular orientation, with
Specific orientation construction and operation, therefore be not considered as limiting the invention.
Referring to Fig.1-3, a kind of stamping die is equipped with installation cavity 7 with formed punch, including mounting blocks 1 is buffered in mounting blocks 1, and
Sliding block 12 is slidably connected in installation cavity 7, the upside side wall of installation cavity 7 is elastic surface, it is ensured that sliding block 12 squeezes electric current and becomes
When liquid 2, deformation occurs for upper side wall, so that sliding block 12 can move up, to change upper capacitor board 4 and lower capacitor board 14
Voltage so that the viscosity of ER fluid 2 changes therewith, the side side wall of mounting blocks 1 is equipped with liquid injection port, and liquid injection port
In be threaded with cock, ER fluid 2 can be replaced in due course, be symmetrically arranged with transverse direction on the two sides side wall of mounting blocks 1
The fixed block 5 of setting, and the bolt hole 6 through setting is equipped in fixed block 5, convenient for securing the device in stamping die
On punch retainer, circular array shows multiple guide grooves 17, the outside of formed punch 11 on the side wall that mounting blocks 1 are in contact with formed punch 11
Circular array shows multiple guide pads 8 to match with guide groove 17 on side wall, and formed punch 11 is avoided to shift in punching course,
To guarantee the stability and verticality of its movement, then guarantee that formed punch 11 will not be broken off, the downside side wall of sliding block 12 is equipped with
The outside side wall of the formed punch 11 being vertically arranged, sliding block 12 is equipped with annular groove 16, and O-shaped sealing is arranged in annular groove 16
Circle 15 prevents the ER fluid 2 filled in installation cavity 7 from flowing out, and formed punch 11 runs through the side of mounting blocks 1 far from the side of sliding block 12
Wall and with its setting that is slidably connected, the upper inside walls of mounting blocks 1 are equipped with the first cavity 3 being laterally arranged, and in the first cavity 3
Equipped with upper capacitor board 4, it is equipped with the second cavity 13 being laterally arranged in sliding block 12, and is equipped with and upper capacitor board 4 in the second cavity 13
The lower capacitor board 14 being parallel to each other, the side side wall of mounting blocks 1 are equipped with power interface, and power interface passes through conducting wire and powers on
Hold plate 4 and lower capacitor board 14 is electrically connected, ER fluid 2 is filled between the upper inside walls and sliding block 12 of mounting blocks 1, is located at
The outside side wall of the formed punch 11 in 1 outside of mounting blocks is equipped with annular shoulder block 10, is arranged with spring on the outside side wall of formed punch 11
9, and the both ends of spring 9 offset with the side wall of mounting blocks 1 and annular shoulder block 10 setting respectively.
In the present invention, stamping die buffering formed punch is secured it within by the bolt hole 6 in bolt-through fixed block 5
On the punch retainer of mold, in addition, on the side wall of guide post fixing sleeve be equipped with travel switch utilize pressure in punching course
Power machine drives upper mold to push, and formed punch 11 is contacted with punching plate first, so that spring 9 is shunk, so that formed punch 11 moves up one
After segment distance, the guide sleeve in mold touches travel switch, then power supply is connected, thus upper capacitor board 4 and lower capacitor board 14 it
Between form voltage, ER fluid 2 is due to Wen Saige phenomenon, under the action of voltage, so that the liquid viscosity of ER fluid 2 increases
Greatly, to offset after formed punch 11 rises a small distance with ER fluid 2, since the upper side wall of installation cavity 7 is elastic surface,
Then sliding block 12 pushes ER fluid 2 and makes installation cavity 7 that flexible deformation occur, and then is combined with spring 9 and ER fluid 2
Buffer function can contact firmly with punching plate to avoid formed punch 11, cause its degree of wear larger, improve its service life；
In addition, for the punching plate of different-thickness, set stamping press is different, in punching course, formed punch 11 with
After being punched plate contact, due to the contraction of spring 9, avoid formed punch 11 by unexpected stress, as sliding block 12 squeezes electric current
During becoming liquid 2, sliding block 12 is with the difference of stamping press, and the distance moved up is also not quite similar, due to upper capacitor board 4
Capacitor keeps certain between lower capacitor board 14, and when stamping press is larger, the distance moved up is larger, then voltage increases, from
And the viscosity of ER fluid 2 increases, so as to carry out the adjust automatically of viscosity according to the size of different stamping presses in due course, in turn
Formed punch 11 can adequately be buffered, avoid it by biggish abrasion.
The foregoing is only a preferred embodiment of the present invention, but scope of protection of the present invention is not limited thereto,
Anyone skilled in the art in the technical scope disclosed by the present invention, according to the technique and scheme of the present invention and its
Inventive concept is subject to equivalent substitution or change, should be covered by the protection scope of the present invention.
Claims (1)
1. a kind of stamping die buffering formed punch, including mounting blocks (1), which is characterized in that be equipped with installation in the mounting blocks (1)
Chamber (7), and sliding block (12) are slidably connected in installation cavity (7), the downside side wall of the sliding block (12), which is equipped with, to be vertically arranged
Formed punch (11), and formed punch (11) far from sliding block (12) side through mounting blocks (1) side wall and with its setting that is slidably connected, institute
The upper inside walls for stating mounting blocks (1) are equipped with the first cavity (3) being laterally arranged, and upper capacitor board is equipped in the first cavity (3)
(4), it is equipped with the second cavity (13) being laterally arranged in the sliding block (12), and is equipped with and upper capacitor board in the second cavity (13)
(4) the lower capacitor board (14) being parallel to each other, the side side wall of the mounting blocks (1) is equipped with power interface, and power interface is logical
It crosses conducting wire and upper capacitor board (4) and lower capacitor board (14) is electrically connected, the upper inside walls of the mounting blocks (1) and sliding block (12)
Between be filled with ER fluid (2), the outside side wall for being located at the formed punch (11) on the outside of mounting blocks (1) is equipped with annular shoulder block
(10), be arranged with spring (9) on the outside side wall of the formed punch (11), and the both ends of spring (9) respectively with mounting blocks (1) and ring
The side wall of shape shoulder block (10) offsets setting；
It is symmetrically arranged with the fixed block (5) being laterally arranged on the two sides side wall of the mounting blocks (1), and is equipped with and passes through in fixed block (5)
Wear the bolt hole (6) set；
Circular array shows multiple guide grooves (17), the formed punch on the side wall that the mounting blocks (1) are in contact with formed punch (11)
(11) circular array shows multiple guide pads (8) to match with guide groove (17) on outside side wall；
The outside side wall of the sliding block (12) is equipped with annular groove (16), and is arranged with O-ring seal in annular groove (16)
(15)；
The side side wall of the mounting blocks (1) is equipped with liquid injection port, and cock is threaded in liquid injection port；
The upside side wall of the installation cavity (7) is elastic surface.
Priority Applications (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201911003986.7A CN110605328B (en) | 2018-09-10 | 2018-09-10 | Buffer punch for stamping die and stamping method |
| CN201811048600.XA CN109047449B (en) | 2018-09-10 | 2018-09-10 | A kind of stamping die buffering formed punch |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201811048600.XA CN109047449B (en) | 2018-09-10 | 2018-09-10 | A kind of stamping die buffering formed punch |
Related Child Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201911003986.7A Division CN110605328B (en) | 2018-09-10 | 2018-09-10 | Buffer punch for stamping die and stamping method |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN109047449A CN109047449A (en) | 2018-12-21 |
| CN109047449B true CN109047449B (en) | 2019-12-03 |
Family
ID=64760070
Family Applications (2)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201911003986.7A Active CN110605328B (en) | 2018-09-10 | 2018-09-10 | Buffer punch for stamping die and stamping method |
| CN201811048600.XA Active CN109047449B (en) | 2018-09-10 | 2018-09-10 | A kind of stamping die buffering formed punch |
Family Applications Before (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201911003986.7A Active CN110605328B (en) | 2018-09-10 | 2018-09-10 | Buffer punch for stamping die and stamping method |
Country Status (1)
| Country | Link |
|---|---|
| CN (2) | CN110605328B (en) |
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| CN109773587A (en) * | 2019-01-31 | 2019-05-21 | 泉州装备制造研究所 | A kind of power control precise machining equipment |
| CN111531147A (en) * | 2020-05-16 | 2020-08-14 | 肖航 | Temperature control and self-telescopic rear cavity ejection device for die-casting die |
| CN111645267B (en) * | 2020-06-02 | 2021-08-31 | 太仓信诚精密模具有限公司 | Injection mold with spherical workpiece without penetrating through special-shaped hole |
| CN111872231A (en) * | 2020-07-20 | 2020-11-03 | 安徽省巢湖市共力链条有限公司 | Buffer punch for stamping die |
| CN112296240A (en) * | 2020-10-12 | 2021-02-02 | 湖州浪佩智能科技有限公司 | Fixing method of hollow spherical workpiece for riveting press |
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| CN113618569B (en) * | 2021-10-13 | 2021-12-07 | 南通泾达船用轴瓦有限公司 | Bearing bush grinding device |
| CN114260373B (en) * | 2022-01-06 | 2022-10-25 | 靖江市联友模具制造有限公司 | Die buffering device for machining stamping die |
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| US4026192A (en) * | 1971-11-12 | 1977-05-31 | Atlas Copco Aktiebolag | Motor driven by a pressurized fluid medium for operating an impacting tool in a linear direction |
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| EP0659547A1 (en) * | 1992-09-02 | 1995-06-28 | Kabushiki Kaisha Komatsu Seisakusho | Breakthrough buffer for presses and control method therefor |
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Also Published As
| Publication number | Publication date |
|---|---|
| CN110605328B (en) | 2020-11-13 |
| CN109047449A (en) | 2018-12-21 |
| CN110605328A (en) | 2019-12-24 |
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Effective date of registration: 20191030 Address after: 231323 Hangzhou Port Economic Development Zone, Lu'an, Anhui, Shucheng Applicant after: Anhui Yingli Electronic Technology Co., Ltd. Address before: 200050 No. 1882, Changning District, Shanghai, West Yan'an Road Applicant before: Geng Pan |
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