CN109041452A - A kind of solder joint preparation method with specific morphology intermetallic compounds layer - Google Patents
A kind of solder joint preparation method with specific morphology intermetallic compounds layer Download PDFInfo
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- CN109041452A CN109041452A CN201810950922.7A CN201810950922A CN109041452A CN 109041452 A CN109041452 A CN 109041452A CN 201810950922 A CN201810950922 A CN 201810950922A CN 109041452 A CN109041452 A CN 109041452A
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- solder
- convex algorithm
- layer
- solder joint
- reflux
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/3494—Heating methods for reflowing of solder
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- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Abstract
The invention discloses a kind of solder joint preparation methods with specific morphology intermetallic compounds layer, first selection substrate, and using reflow method prepares solder convex algorithm on pad again after planting ball, dispensing or printing on metal pad；It is prepared using the method for plating or sputtering to second metal pad on another substrate, preparation can layer on second metal pad.By on solder convex algorithm and second metal pad can layer be mutually aligned, and contact placement and form assembly.To formed assembly be heated to required temperature carry out solder reflux, after the completion of reflux between the first metal pad and convex algorithm, intermetallic compound can be respectively formed between layer and convex algorithm；In the ratio V/A of the volume V and contact substrate area A of Control Welding Process solder joint, the ratio of Cu in solder matrix in reflux course can be efficiently controlled, controls intermetallic compounds layer pattern well in the industrial production to realize to guarantee the reliability of solder joint.
Description
Technical field
The present invention relates to electronic welding manufacturing technology fields, specifically, being related to changing between one kind has specific morphology metal
Close the solder joint preparation method of nitride layer.
Background technique
In integrated chip technique, the connection of mechanically and electrically signal is often carried out between chip and substrate by solder joint.Because
Solder containing pb has toxic, at present worldwide just replaces with solder containing pb using tin silver copper system as the nonhazardous of representative
Lead-free solder.Tin silver copper series lead-free solder is formed in the molten state between copper base with Cu6Sn5Change between the metal of representative
Close nitride layer.Under different reflux temperature and rate of temperature fall and welding spot size, the pattern of intermetallic compounds layer has larger
Difference.And Related Experimental Study shows that the pattern of intermetallic compounds layer can significantly affect welding spot reliability；And it if can be with
It finds the control selector of control intermetallic compounds layer pattern and is subject to quantitative analysis, can control well in the industrial production
The intermetallic compounds layer pattern of Lead-Free Solder Joint processed is to predict the reliability of solder joint.
Rodlike Cu is had in Lead-Free Solder Joint, in solder layer6Sn5With needle-shaped Ag3Sn is generated, while at boundary layer,
Cu6Sn5Pattern also have scallop shape, multi-panel shape, prism-shaped different morphologies occur.The intermetallic compound butt welding of different-shape
Point reliability influence differs widely, such as prism-shaped Cu6Sn5Although increasing the contact area between solder joint and substrate, also generate
More crack initiation sources, and the Cu of scallop shape6Sn5Although surface area is smaller, surface is smooth to lead to crack initiation source
It is less.
The method of existing control intermetallic compound mainly reduces reflux temperature, reduces needle-shaped Ag3Sn and rodlike
Cu6Sn5Generation, but for tin silver copper system Pb-free coating, required reflux temperature is higher than solder containing pb, so reduce back
The range of stream temperature is restricted.So the shape of bad intermetallic compound can only be reduced to a certain extent by reducing reflux temperature
At the reliability for being formed by solder joint still will receive the influence of bad form intermetallic compound.In addition also have from reducing back
The method of time is flowed to reduce the appearance of bad form intermetallic compound, but is reduced return time and also influenced whether to fan simultaneously
The growth of shellfish shape intermetallic compound.
The problem of for existing control Lead-Free Solder Joint intermetallic compound pattern method, it is comprehensive to need a kind of energy
Polymer morphology changing factor is between considering metal the method that controls intermetallic compound growth pattern.Influence intermetallic compound
Cu precipitating on intermetallic compounds layer of the key link of pattern variation in temperature-fall period in solder matrix.Solder matrix
Interior Cu is fewer, and rate of temperature fall is faster, can substantially reduce the formation of bad form intermetallic compound.But in solder joint reality
Accelerate rate of temperature fall in reflux technique to be limited by equipment itself, so consider that the Cu reduced in solder matrix is more particularly suitable
Control mode.
Summary of the invention
In order to avoid the shortcomings of the prior art, the present invention proposes a kind of with specific morphology intermetallic compounds layer
Solder joint preparation method.The solder joint preparation method Control Welding Process solder joint volume V and contact substrate area A ratio V/A,
The ratio of Cu in solder matrix in reflux course can be efficiently controlled, thus realize in the industrial production well control metal between
Compound layer pattern is to guarantee the reliability of solder joint.
The technical solution adopted by the present invention to solve the technical problems is:
A kind of solder joint preparation method with specific morphology intermetallic compounds layer, it is characterised in that the following steps are included:
Step 1. select first substrate, on metal pad using plant ball, dispensing or printing after again reflow method in pad
On prepare solder convex algorithm, in which:
Metal pad is one of Cu, Ni, Ag or Au；
The solder for preparing convex algorithm is one of pure Sn or Sn-Ag, Sn-Cu, Au-Sn alloy；
The volume and bonding area ratio of convex algorithm are setting value；
Step 2. selects the second substrate, prepares at least second metal using the method for plating or sputtering in the second substrate
Pad, preparation can layer on second metal pad；
Step 3. by solder convex algorithm and second metal pad can layer be mutually aligned, and contact placement and form group
It is fit；
Step 4. is heated to required temperature progress solder reflux to assembly is formed in step 3, first after the completion of reflux
Between metal pad and convex algorithm, intermetallic compound can be respectively formed between layer and convex algorithm；
Wherein: the volume and bonding area ratio of convex algorithm are defined as V/A, and V is convex algorithm, and A is convex algorithm and the first gold medal
Belong to the contact area of pad；
Solder reflux required temperature and time are chosen according to solder varieties；When the selected solder for preparing convex algorithm is
When Sn3.0Ag0.5Cu lead-free solder, reflux temperature is selected as 245 DEG C；
V/A size is selected according to solder varieties and welding temperature, for Sn3.0Ag0.5Cu lead-free solder, 245
At DEG C under the conditions of Reflow Soldering 5min, when less than 100 μm, then solder joint intermetallic compound is scallop shape to V/A；
V/A size is selected according to solder varieties and welding temperature, for Sn3.0Ag0.5Cu lead-free solder, 245
At DEG C under the conditions of Reflow Soldering 5min, when then solder joint intermetallic compound is multi-panel shape to V/A between 150 μm -300 μm；
V/A size is selected according to solder varieties and welding temperature, for Sn3.0Ag0.5Cu lead-free solder, 245
At DEG C under the conditions of Reflow Soldering 5min, when then solder joint intermetallic compound is prism-shaped to V/A between 500 μm -1000 μm.
Beneficial effect
A kind of solder joint preparation method with specific morphology intermetallic compounds layer proposed by the present invention, first selection base
Plate, using reflow method prepares solder convex algorithm on pad again after planting ball, dispensing or printing on metal pad；In another base
It is prepared using the method for plating or sputtering to second metal pad on plate, preparation can layer on second metal pad.It will
On solder convex algorithm and second metal pad can layer be mutually aligned, and contact placement and form assembly.It is combined to being formed
Body be heated to required temperature carry out solder reflux, after the completion of reflux between the first metal pad and convex algorithm, can layer with it is convex
Intermetallic compound is respectively formed between solder joint；Control Welding Process solder joint volume V and contact substrate area A ratio V/A,
The ratio of Cu in solder matrix in reflux course can be efficiently controlled, thus realize in the industrial production well control metal between
Compound layer pattern is to guarantee the reliability of solder joint.
Detailed description of the invention
With reference to the accompanying drawing with embodiment to a kind of solder joint system with specific morphology intermetallic compounds layer of the present invention
Preparation Method is described in further detail.
Fig. 1 is copper base/specific morphology intermetallic compounds layer/solder layer structure soldering point schematic diagram of preparation.
Fig. 2 be in the present invention V/A be 36 μ m in size solder joints intermetallic compounds layer shape appearance figure.
Fig. 3 be in the present invention V/A be 166 μ m in size solder joints intermetallic compounds layer shape appearance figure.
Fig. 4 be in the present invention V/A be 585 μ m in size solder joints intermetallic compounds layer shape appearance figure.
In figure
1. 2. copper base of solder, 3. scallop shape intermetallic compound, 4. multi-panel shape intermetallic compound, 5. prism-shaped gold
Compound between category
Specific embodiment
The present embodiment is a kind of solder joint preparation method with specific morphology intermetallic compounds layer.The solder joint preparation method
In the ratio V/A of the volume V and contact substrate area A of Control Welding Process solder joint, solder in reflux course can be efficiently controlled
The ratio of Cu in matrix realizes the purpose of control intermetallic compound pattern.
Refering to fig. 1~Fig. 4, using the solder joint preparation method with specific morphology intermetallic compounds layer to certain material into
Row preparation, specific steps are as follows:
First step determines material and selects first substrate, flows back again using plant ball, dispensing on metal pad or after printing
Method prepares solder convex algorithm on pad, in which: one of metal pad Cu, Ni, Ag or Au；Prepare convex algorithm
Solder is one of pure Sn or Sn-Ag, Sn-Cu, Au-Sn alloy；The volume and bonding area ratio of convex algorithm are setting value.
Second step selects the second substrate, prepares at least second gold using the method for plating or sputtering in the second substrate
Belong to pad, preparation can layer on second metal pad.
Third step by solder convex algorithm and second metal pad can layer be mutually aligned, and contact placement formed
Assembly.
4th step carries out solder reflux to forming assembly in third step and be heated to required temperature, the after the completion of reflux
Between one metal pad and convex algorithm, intermetallic compound can be respectively formed between layer and convex algorithm；Wherein: the volume of convex algorithm
It is defined as V/A with bonding area ratio, V is convex algorithm, and A is the contact area of convex algorithm and the first metal pad；Solder reflux
Required temperature and time are chosen according to solder varieties；When the selected solder for preparing convex algorithm is Sn3.0Ag0.5Cu lead-free solder
When, reflux temperature is selected as 245 DEG C.
V/A size is selected according to solder varieties and welding temperature, for Sn3.0Ag0.5Cu lead-free solder, 245
At DEG C under the conditions of Reflow Soldering 5min, when less than 100 μm, then solder joint intermetallic compound is scallop shape to V/A；
V/A size is selected according to solder varieties and welding temperature, for Sn3.0Ag0.5Cu lead-free solder, 245
At DEG C under the conditions of Reflow Soldering 5min, when then solder joint intermetallic compound is multi-panel shape to V/A between 150 μm -300 μm；
V/A size is selected according to solder varieties and welding temperature, for Sn3.0Ag0.5Cu lead-free solder, 245
At DEG C under the conditions of Reflow Soldering 5min, when then solder joint intermetallic compound is prism-shaped to V/A between 500 μm -1000 μm.
The present embodiment apply with specific morphology intermetallic compounds layer solder joint preparation method prepared " copper base/
Specific morphology intermetallic compounds layer/solder layer " structure soldering point: one piece of copper base is taken first, cleans copper base with absolute alcohol
Surface smears scaling powder in copper-based plate surface, certain thickness Sn3.0Ag0.5Cu thin slice is taken to be placed in copper-based plate surface, will be copper-based
The related Sn3.0Ag0.5Cu solder thin slice of plate is put into reflow machine, and setting reflux temperature curve is that 245 DEG C of reflux 5min are welded
It connects.
The V/A that solder joint is controlled according to solder thickness, when V/A less than 100 μm then solder joint intermetallic compound be scallop shape,
When then solder joint intermetallic compound is multi-panel shape to V/A between 150 μm -300 μm, when V/A is between 500 μm -1000 μm
Then solder joint intermetallic compound is prism-shaped；Control Welding Process solder joint volume V and contact substrate area A ratio V/A,
The ratio of Cu in solder matrix in reflux course can be efficiently controlled, thus realize in the industrial production well control metal between
Compound layer pattern is to guarantee the reliability of solder joint.
Claims (1)
1. a kind of solder joint preparation method with specific morphology intermetallic compounds layer, it is characterised in that the following steps are included:
Step 1. selects first substrate, using reflow method is made on pad again after planting ball, dispensing or printing on metal pad
Standby solder convex algorithm, in which:
Metal pad is one of Cu, Ni, Ag or Au；
The solder for preparing convex algorithm is one of pure Sn or Sn-Ag, Sn-Cu, Au-Sn alloy；
The volume and bonding area ratio of convex algorithm are setting value；
Step 2. selects the second substrate, prepares at least second metal welding using the method for plating or sputtering in the second substrate
Disk, preparation can layer on second metal pad；
Step 3. by solder convex algorithm and second metal pad can layer be mutually aligned, and contact placement formed combination
Body；
Step 4. is heated to required temperature progress solder reflux to assembly is formed in step 3, in the first metal after the completion of reflux
Between pad and convex algorithm, intermetallic compound can be respectively formed between layer and convex algorithm；
Wherein: the volume and bonding area ratio of convex algorithm are defined as V/A, and V is convex algorithm, and A is convex algorithm and the first metal welding
The contact area of disk；
Solder reflux required temperature and time are chosen according to solder varieties；When the selected solder for preparing convex algorithm is
When Sn3.0Ag0.5Cu lead-free solder, reflux temperature is selected as 245 DEG C；
V/A size is selected according to solder varieties and welding temperature, for Sn3.0Ag0.5Cu lead-free solder, at 245 DEG C
Under the conditions of Reflow Soldering 5min, when less than 100 μm, then solder joint intermetallic compound is scallop shape to V/A；
V/A size is selected according to solder varieties and welding temperature, for Sn3.0Ag0.5Cu lead-free solder, at 245 DEG C
Under the conditions of Reflow Soldering 5min, when then solder joint intermetallic compound is multi-panel shape to V/A between 150 μm -300 μm；
V/A size is selected according to solder varieties and welding temperature, for Sn3.0Ag0.5Cu lead-free solder, at 245 DEG C
Under the conditions of Reflow Soldering 5min, when then solder joint intermetallic compound is prism-shaped to V/A between 500 μm -1000 μm.
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| Application Number | Priority Date | Filing Date | Title |
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| CN201810950922.7A CN109041452A (en) | 2018-08-21 | 2018-08-21 | A kind of solder joint preparation method with specific morphology intermetallic compounds layer |
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| CN201810950922.7A CN109041452A (en) | 2018-08-21 | 2018-08-21 | A kind of solder joint preparation method with specific morphology intermetallic compounds layer |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112045329A (en) * | 2020-09-07 | 2020-12-08 | 中国电子科技集团公司第二十四研究所 | Flip-chip bonding process method for ball mounting on metal substrate |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101454114A (en) * | 2006-05-24 | 2009-06-10 | 松下电器产业株式会社 | Bonding material, electronic component, bonding structure and electronic device |
| US20110248398A1 (en) * | 2010-04-07 | 2011-10-13 | Maxim Integrated Products, Inc. | Wafer-level chip-scale package device having bump assemblies configured to mitigate failures due to stress |
| CN105122442A (en) * | 2013-03-28 | 2015-12-02 | 日东电工株式会社 | Compound semiconductor device, method for manufacturing same, and resin-sealed semiconductor device |
-
2018
- 2018-08-21 CN CN201810950922.7A patent/CN109041452A/en active Pending
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101454114A (en) * | 2006-05-24 | 2009-06-10 | 松下电器产业株式会社 | Bonding material, electronic component, bonding structure and electronic device |
| US20110248398A1 (en) * | 2010-04-07 | 2011-10-13 | Maxim Integrated Products, Inc. | Wafer-level chip-scale package device having bump assemblies configured to mitigate failures due to stress |
| CN105122442A (en) * | 2013-03-28 | 2015-12-02 | 日东电工株式会社 | Compound semiconductor device, method for manufacturing same, and resin-sealed semiconductor device |
Non-Patent Citations (1)
| Title |
|---|
| 高伟娜等: "Sn-3.0Ag-0.5Cu", 《电子与封装》 * |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112045329A (en) * | 2020-09-07 | 2020-12-08 | 中国电子科技集团公司第二十四研究所 | Flip-chip bonding process method for ball mounting on metal substrate |
| CN112045329B (en) * | 2020-09-07 | 2022-03-11 | 中国电子科技集团公司第二十四研究所 | Flip-chip bonding process method for ball mounting on metal substrate |
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Application publication date: 20181218 |