CN109037869A - High-temperature adaptability power splitter - Google Patents
High-temperature adaptability power splitter Download PDFInfo
- Publication number
- CN109037869A CN109037869A CN201810760009.0A CN201810760009A CN109037869A CN 109037869 A CN109037869 A CN 109037869A CN 201810760009 A CN201810760009 A CN 201810760009A CN 109037869 A CN109037869 A CN 109037869A
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- Prior art keywords
- bottom board
- ceramic bottom
- power splitter
- inductor
- temperature
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- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01P—WAVEGUIDES; RESONATORS, LINES, OR OTHER DEVICES OF THE WAVEGUIDE TYPE
- H01P1/00—Auxiliary devices
- H01P1/20—Frequency-selective devices, e.g. filters
- H01P1/213—Frequency-selective devices, e.g. filters combining or separating two or more different frequencies
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Abstract
The present invention provides a kind of high-temperature adaptability power splitters, including ceramic bottom board and the casing made by high temperature resistant bakelite, casing is placed on ceramic bottom board, the inductor made using high temperature resistant wire rod, the capacitor and resistor resistant to high temperature that are made of C0G material are installed on ceramic bottom board, high-temperature adaptability power splitter further includes several connecting lines resistant to high temperature, the paster pin at the ceramic bottom board back side is set there are six end pole piece and respectively led to each end pole piece on ceramic bottom board, and inductor, capacitor, resistor and six end pole pieces are electrical connected by several connecting lines.By the present invention in that, to carry out good insulation, guaranteeing high safety with ceramic bottom board and high temperature resistant bakelite casing；Using C0G material capacitor, there is inductor resistant to high temperature, resistor and connecting line, thereby may be ensured that each device has good Acclimation temperature performance, and then make the power splitter that there is biggish operating temperature range, improve thermal adaptability.
Description
Technical field
The invention belongs to power splitter fields, are to be related to a kind of high-temperature adaptability power splitter more specifically.
Background technique
Power splitter is a kind of common electronic device, power splitter full name power divider, be it is a kind of will input signal all the way
Energy is divided into the device of two-way or the equal or unequal energy of multiple-channel output.It should ensure that one between the output port of one power splitter
Fixed isolation.It is the important technological parameters power loss (including insertion loss, distribution loss and reflection loss) of power splitter, each
The voltage standing wave ratio of port, isolation, amplitude balance, phase balance, power capacity and frequency band between power distribution port
Width etc..Power splitter is usually according to circuit diagram, and by resistor, inductance and capacitor simple layout and welding is made on circuit boards
At.The operating temperature range of current general power splitter is -10 DEG C -40 DEG C or -30 DEG C -50 DEG C；It is required that higher power splitter
Operating temperature range is mostly -30 DEG C -85 DEG C or -45 DEG C -80 DEG C；Even if meeting military operating temperature range is also only -55 DEG C -85
℃.However for some special rugged environments, or use, in military domain, the operating temperature of current power splitter is then difficult to reach
It is required that.
Summary of the invention
The purpose of the present invention is to provide a kind of high-temperature adaptability power splitters, to solve function existing in the prior art point
The lesser problem of operating temperature range adaptability of device.
To achieve the above object, the technical solution adopted by the present invention is that: providing a kind of includes ceramic bottom board and by high temperature resistant
The casing of bakelite production, the casing are placed on the ceramic bottom board, are equipped on the ceramic bottom board using high temperature resistant wire rod
The inductor of production, the capacitor and resistor resistant to high temperature made of C0G material, the high-temperature adaptability power splitter is also
Including several connecting lines resistant to high temperature, is set on the ceramic bottom board there are six end pole piece and respectively lead to each end pole piece
The paster pin at the ceramic bottom board back side, several connecting lines by the inductor, the capacitor, the resistor and
Six end pole pieces are electrical connected.
Further, the resistor is the film resistor being directly molded in the ceramic bottom board.
Further, the high temperature resistant wire rod is the twisted wire for determining line capacitance amount, and the inductor further includes iron
Oxysome magnetic core, the twisted wire are wound in the ferrite magnetic in the heart.
Further, the exit of the inductor is fixed on the ceramic bottom board using electronic spot-welding.
Further, each end pole piece printing takes shape on the ceramic bottom board.
Further, each end pole piece is taken shape on the ceramic bottom board using palladium-silver conductor material.
Further, the capacitor welding is on the ceramic bottom board.
Further, the high-temperature adaptability power splitter further includes covering the inductor and the covering inductance
The exit of device and the epoxy resin of the ceramic bottom board junction protect structure.
Further, the high-temperature adaptability power splitter further includes being filled between the casing and the ceramic bottom board
The inductor, the capacitor, the resistor, the connecting line, the ceramic bottom board and the casing to be solidified into
One whole epoxy resin interstitital texture.
Further, the inductor is two, and the capacitor and two inductors are long along the ceramic bottom board
Degree direction is successively spaced setting, and the capacitor and two inductors are right in the middle part of the ceramic bottom board width direction
The position answered.
The beneficial effect of high-temperature adaptability power splitter provided by the invention is: compared with prior art, the present invention is logical
It crosses and guarantees high safety using ceramic bottom board and high temperature resistant bakelite casing to carry out good insulation；Use C0G material capacitor
Device has inductor resistant to high temperature, resistor and connecting line, thereby may be ensured that each device has good thermal adaptability
Can, and then make the power splitter that there is biggish operating temperature range, improve thermal adaptability.
Detailed description of the invention
It to describe the technical solutions in the embodiments of the present invention more clearly, below will be to embodiment or description of the prior art
Needed in attached drawing be briefly described, it should be apparent that, the accompanying drawings in the following description is only of the invention some
Embodiment for those of ordinary skill in the art without any creative labor, can also be according to these
Attached drawing obtains other attached drawings.
Fig. 1 is the schematic diagram of internal structure of high-temperature adaptability power splitter provided in an embodiment of the present invention；
Fig. 2 is the structural schematic diagram of high-temperature adaptability power splitter provided in an embodiment of the present invention.
Wherein, each attached drawing main mark in figure:
11- ceramic bottom board；The end 12- pole piece；13- resistor；14- capacitor；15- inductor；16- connecting line；17- draws
Foot；18- casing；181- ribs.
Specific embodiment
In order to which technical problems, technical solutions and advantages to be solved are more clearly understood, tie below
Accompanying drawings and embodiments are closed, the present invention will be described in further detail.It should be appreciated that specific embodiment described herein is only
To explain the present invention, it is not intended to limit the present invention.
It should be noted that it can be directly another when element is referred to as " being fixed on " or " being set to " another element
On one element or indirectly on another element.When an element is known as " being connected to " another element, it can
To be directly to another element or be indirectly connected on another element.
In addition, term " first ", " second " are used for descriptive purposes only and cannot be understood as indicating or suggesting relative importance
Or implicitly indicate the quantity of indicated technical characteristic.Define " first " as a result, the feature of " second " can be expressed or
Implicitly include one or more of the features.In the description of the present invention, the meaning of " plurality " is two or more,
Unless otherwise specifically defined.
In the description of the present invention, it is to be understood that, term " center ", " length ", " width ", " thickness ", "upper",
The orientation or position of the instructions such as "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outside"
Relationship is to be based on the orientation or positional relationship shown in the drawings, and is merely for convenience of description of the present invention and simplification of the description, without referring to
Show or imply that signified device or element must have a particular orientation, be constructed and operated in a specific orientation, therefore cannot manage
Solution is limitation of the present invention.
In the description of the present invention, it should be noted that unless otherwise clearly defined and limited, term " installation ", " phase
Even ", " connection " shall be understood in a broad sense, for example, it may be being fixedly connected, may be a detachable connection, or be integrally connected；It can
To be mechanical connection, it is also possible to be electrically connected；It can be directly connected, can also can be indirectly connected through an intermediary
The interaction relationship of connection or two elements inside two elements.It for the ordinary skill in the art, can be with
The concrete meaning of above-mentioned term in the present invention is understood as the case may be.
The specific names that the present invention uses are explained as follows:
The capacitor of C0G material production refers in particular to the 1 class ceramic capacitor made using Unite States Standard.
High temperature resistant bakelite refers in particular to can be with high temperature resistant up to 160 DEG C of bakelite.
Resistor resistant to high temperature refers in particular to can be with high temperature resistant up to 200 DEG C or more of resistance.
Connecting line resistant to high temperature refers in particular to reach with high temperature resistant 180 DEG C of wire rod.
The production of high temperature resistant wire rod refers in particular to reach with high temperature resistant 180 DEG C of wire rod.
Also referring to Fig. 1 and Fig. 2, now high-temperature adaptability power splitter provided by the invention is illustrated.The height
Thermal adaptability power splitter, including ceramic bottom board 11, casing 18, inductor 15, capacitor 14, resistor 13 and several connecting lines
16；Inductor 15, capacitor 14 and resistor 13 are mounted on ceramic bottom board 11, and casing 18 covers on ceramic bottom board 11, are used to
Protect the devices such as inductor 15, capacitor 14, resistor 13；End pole piece 12 and six patches draw there are six setting on ceramic bottom board 11
Six end pole pieces 12 are led to 11 back side of ceramic bottom board respectively by foot 17, six paster pins 17, to facilitate the high-temperature to adapt to
The use of property power splitter.Several connecting lines 16 are by inductor 15, capacitor 14, resistor 13 and the electrical phases of six end pole pieces 12
Even.
Inductor 15 is made using high temperature resistant wire rod, so that inductor 15 can have performance resistant to high temperature, can have
Biggish operating temperature range.Capacitor 14 uses C0G material, and ceramic bottom board 11 is burnt by 600 DEG C~800 DEG C of high temperature
It ties, sintered compact product structure, heat resistance is excellent.Use resistor 13 resistant to high temperature and connection resistant to high temperature
Line can have biggish operating temperature range.So as to so that the high-temperature adaptability power splitter has biggish work temperature
Range is spent, thermal adaptability is improved, reaches (- 55 DEG C~125 DEG C) of higher military power splitter operating temperature range requirements.
High-temperature adaptability power splitter provided by the invention, compared with prior art, by the present invention in that using ceramic bottom board
11 and high temperature resistant bakelite casing 18 to carry out good insulation guarantee high safety；Using C0G material capacitor 14, have resistance to
Inductor 15, resistor 13 and the connecting line 16 of high temperature thereby may be ensured that each device has good Acclimation temperature performance, into
And make the power splitter that there is biggish operating temperature range, improve thermal adaptability.
Further, Fig. 1 and Fig. 2 are please referred to, one kind as high-temperature adaptability power splitter provided by the invention is specific
Embodiment, the high temperature resistant wire rod of production inductor 15 are twisted wire (not shown), and inductor 15 further includes that (figure is not for ferrite core
Show), twisted wire is wound in ferrite magnetic in the heart.Using ferrite core, i.e., the magnetic core made using ferrite can be low in guarantee
Under the material of loss, also there is preferable temperature coefficient, can work under higher and lower operating temperature.And twisted wire is used,
It to be conveniently used for determining line capacitance amount, and then can determine the capacitance of inductor 15, reduce device inside parameter error, from
And insertion loss can be reduced, obtain preferably phase balance and high-isolation.
Further, Fig. 1 and Fig. 2 are please referred to, one kind as high-temperature adaptability power splitter provided by the invention is specific
The exit of embodiment, inductor 15 is fixed on ceramic bottom board 11 using electronic spot-welding, then can reduce the electricity of pad
Capacity, it can reduce the capacitance between 15 exit of inductor and ceramic bottom board 11, reduce the influence to inductor 15, in turn
Theoretical design requirements can preferably be reached, thus reach low insertion loss, excellent phase balance, the requirement of high-isolation.
The present invention is wrapped in formation inductor 15 on FERRITE CORE using twisted wire, can be dropped by using ferrite core
Low-loss, and can be convenient the capacitance between determining line using twisted wire, so as to good increase and determining inductor 15
Capacitance, and the exit of inductor 15 is welded on ceramic bottom board 11 using electronic spot-welding, it is possible to reduce inductor 15
Line capacitance amount between ceramic bottom board 11, so as to preferably determine the capacitance that uses, reduce element internal error with
And the influence in assembling manufacturing process to device, preferably reach theoretical design requirements, thus reach low insertion loss, excellent phase
The degree of balance, the requirement of high-isolation.
Further, capacitor 14 is the capacitor made of C0G material, can preferably guarantee the essence of capacitor 14
Degree, reduces the loss of capacitor 14, and can bear better operating temperature range.
Further, Fig. 1 and Fig. 2 are please referred to, one kind as high-temperature adaptability power splitter provided by the invention is specific
Embodiment, the twisted wire around inductor 15 can be enamel covered wire.
Further, Fig. 1 and Fig. 2 are please referred to, one kind as high-temperature adaptability power splitter provided by the invention is specific
Embodiment, resistor 13 can be the film resistor being directly molded in ceramic bottom board 11, use film resistor, it is ensured that
Higher precision, in addition, directly take shape in film resistor in ceramic bottom board 11, it can be preferably by film resistor and ceramic bottom
Plate 11 is integrally fixed, to improve anti-vibration, shock resistance.Meanwhile film resistor being taken shape in ceramic bottom board 11 and may be used also
Preferably to radiate, guarantee the stability used.Preferentially, the accurate thin-film electro fabulous using temperature characterisitic of resistor 13
Resistance.
Further, Fig. 1 and Fig. 2 are please referred to, one kind as high-temperature adaptability power splitter provided by the invention is specific
Embodiment, it is each that the printing of pole piece 12 is held to take shape on ceramic bottom board 11, so as to enhance each end pole piece 12 and ceramic bottom board 11
Bonding strength, facilitate heat dissipation, improve anti-vibration, shock resistance, guarantee the stability used.
Further, Fig. 1 and Fig. 2 are please referred to, one kind as high-temperature adaptability power splitter provided by the invention is specific
Embodiment, it is each that pole piece 12 is held to take shape on ceramic bottom board 11 using palladium-silver conductor material, it is made using palladium-silver conductor material each
Pole piece 12 is held, welding performance can be improved, so as to improve the intensity of welding, reduces capacitance caused by welding, into one
Step reduces influence when production, reduces loss, is preferably suitble to theoretical design requirements.
Further, Fig. 1 and Fig. 2 are please referred to, one kind as high-temperature adaptability power splitter provided by the invention is specific
Embodiment, capacitor 14 are welded on ceramic bottom board 11, preferably to fix capacitor 14, increase the strong of capacitor 14
Degree improves anti-vibration, shock resistance, guarantees the stability used.
Further, Fig. 1 and Fig. 2 are please referred to, one kind as high-temperature adaptability power splitter provided by the invention is specific
Embodiment, the high-temperature adaptability power splitter further include the exit and pottery for covering inductor 15 and covering inductor 15
The epoxy resin of 11 junction of porcelain bottom plate protects structure (not shown).Inductor 15 is covered by using epoxy resin and is covered
The exit of lid inductor 15 and 11 junction of ceramic bottom board, and it is formed by curing epoxy resin protection structure, it can preferably protect
Exit and 11 junction of ceramic bottom board for protecting inductor 15 and inductor 15, reduce external action, while improving antivibration
Dynamic, shock resistance, guarantees the stability used.Further, epoxy resin protection structure filling enters in inductor 15, with more
Good carries out shaping inductor 15.Preferably improve anti-vibration, shock resistance.Further, epoxy resin protection knot
In the minds of the ferrite magnetic that structure is packed into, and it is packed between adjacent two circles twisted wire and twisted wire and the gap of ferrite magnetic in the heart
In, preferably inductor 15 to be formed, and then inductor 15 preferably is protected, and reduce external action, improves anti-vibration, resists
Impact property.Epoxy resin protection structure is formed it is possible to further use high adhesiveness epoxy resin to make, with more stably
Fixed and protection inductor 15.
Further, Fig. 1 and Fig. 2 are please referred to, one kind as high-temperature adaptability power splitter provided by the invention is specific
Embodiment, the high-temperature adaptability power splitter further include covering 11 inner surface of ceramic bottom board, each end pole piece 12, each connecting line
16, capacitor 14, inductor 15 and resistor 13 and epoxy resin overlay structure that each connecting line 16 is positioned (figure is not
Show).In the present invention, the inner surface of ceramic bottom board 11 refers in particular to the one side opposite with 11 back side of ceramic bottom board, and ceramic bottom board 11
Inner surface is the one side on ceramic bottom board 11 close to casing 18.Epoxy resin overlay structure can be used epoxy resin cure at
Type, by by epoxy resin be coated in 11 inner surface of ceramic bottom board, and cover each end pole piece 12, each connecting line 16, capacitor 14,
Inductor 15 and resistor 13, and it is formed by curing epoxy resin overlay structure, these devices can be wrapped up and are integrally fixed,
And these devices are fixed on ceramic bottom board 11, preferably to be protected, and improve anti-vibration, shock resistance；Simultaneously
Epoxy resin overlay structure can also carry out shaping connecting line 16, to fix connecting line 16, reduce connecting line 16 to each device
The influence of part, and in vibration, it remain stationary connecting line 16 with each device, to enhance anti-vibration, shock resistance.Into one
Step ground, can be used high adhesiveness epoxy resin and makes to form epoxy resin overlay structure, with more stably fixed each with protection
Device.
Still further, epoxy resin overlay structure can wrap epoxy resin protection structure, epoxy resin is covered
Lid structure and epoxy resin protection structure form overall structure, and each device installed on ceramic bottom board 11 is preferably made to form one
A overall structure enhances anti-vibration, shock resistance.
Further, in processing and fabricating, after having made inductor 15, asphalt mixtures modified by epoxy resin can be filled on inductor 15
Rouge with solidifying and setting inductor 15, then inductor 15 is welded on ceramic bottom board 11, and re-coating epoxy resin cure forms ring
Oxygen resin protects structure.And it is installed on ceramic bottom board 11 when each device, and after being electrical connected with connecting line 16, refill ring
Oxygen resin is formed by curing epoxy resin overlay structure, thus in each step of assembling processing, good each device of protection,
Influence when reducing assembly operation to device reduces loss, guarantees excellent phase balance and high-isolation.
Further, Fig. 1 and Fig. 2 are please referred to, one kind as high-temperature adaptability power splitter provided by the invention is specific
Embodiment, the high-temperature adaptability power splitter further include be filled between casing 18 and ceramic bottom board 11 with by inductor 15,
Capacitor 14, resistor 13, connecting line 16, ceramic bottom board 11 and casing 18 solidify integral epoxy resin interstitital texture
(not shown).It, can be by ceramic bottom board to be formed by curing epoxy resin interstitital texture by filling epoxy resin into casing 18
Each device solidification between 11 and casing 18 is integral, preferably protects each device, while improving anti-vibration, shock resistance.
Further, in the process of processing and manufacturing, after can first making epoxy resin overlay structure on ceramic bottom board 11,
Then casing 18 is covered, production epoxy resin interstitital texture is refilled, to can preferably protect each device in an assembling process
Part, influence when reducing assembly operation to device, reduces loss, guarantees excellent phase balance and high-isolation.
Further, Fig. 1 and Fig. 2 are please referred to, one kind as high-temperature adaptability power splitter provided by the invention is specific
Embodiment, casing are high temperature resistant bakelite shell.Using bakelite shell, good insulating effect can be played, and can be born more
High temperature range.
Further, Fig. 1 and Fig. 2 are please referred to, one kind as high-temperature adaptability power splitter provided by the invention is specific
Embodiment, inductor 15 are two, and capacitor 14 and two inductors 15 are successively spaced along 11 length direction of ceramic bottom board and set
It sets, and capacitor 14 and two inductors 15 are set to corresponding position in the middle part of 11 width direction of ceramic bottom board.The structure can incite somebody to action
Device setting is in symmetrical structure on ceramic bottom board 11, preferably realizes that low insertion loss, excellent phase balance, high-isolation are wanted
It asks.
Further, Fig. 1 and Fig. 2 are please referred to, one kind as high-temperature adaptability power splitter provided by the invention is specific
Embodiment, it is each to hold pole piece 12 in rectangle, and the size of each end pole piece 12 is identical, that is, facilitates production, while can reduce again each
Exit capacitor difference, thus preferably realize low insertion loss, excellent phase balance, the requirement of high-isolation.
Further, Fig. 1 and Fig. 2 are please referred to, one kind as high-temperature adaptability power splitter provided by the invention is specific
Embodiment, six end pole pieces 12 are symmetrically set in the two sides of 11 length direction of ceramic bottom board.
Further, Fig. 1 and Fig. 2 are please referred to, one kind as high-temperature adaptability power splitter provided by the invention is specific
Embodiment, 18 buckle closure of casing is on ceramic bottom board 11, and the two sides of 18 width direction of casing are in the junction of ceramic bottom board 11
Equipped with ribs 181.The structure more casing 18 can be preferably fixed on ceramic bottom board 11, increase bonding strength, and improving should
The anti-vibration of high-temperature adaptability power splitter, shock resistance.
The foregoing is merely illustrative of the preferred embodiments of the present invention, is not intended to limit the invention, all in essence of the invention
Made any modifications, equivalent replacements, and improvements etc., should all be included in the protection scope of the present invention within mind and principle.
Claims (10)
1. high-temperature adaptability power splitter, it is characterised in that: described including ceramic bottom board and the casing made by high temperature resistant bakelite
Casing is placed on the ceramic bottom board, the inductor made using high temperature resistant wire rod is equipped on the ceramic bottom board, using C0G
The capacitor and resistor resistant to high temperature of material production, the high-temperature adaptability power splitter further includes several connections resistant to high temperature
Line sets there are six end pole piece and respectively leads to each end pole piece the patch at the ceramic bottom board back side on the ceramic bottom board
Piece pin, several connecting lines are by the inductor, the capacitor, the resistor and six end pole piece electrical property phases
Even.
2. high-temperature adaptability power splitter as described in claim 1, it is characterised in that: the resistor is is directly molded on
State the film resistor in ceramic bottom board.
3. high-temperature adaptability power splitter as described in claim 1, it is characterised in that: the high temperature resistant wire rod is for determining
The twisted wire of line capacitance amount, the inductor further include ferrite core, and the twisted wire is wound in the ferrite magnetic in the heart.
4. high-temperature adaptability power splitter as described in claim 1, it is characterised in that: the exit of the inductor is using electricity
Sub- spot welding is fixed on the ceramic bottom board.
5. high-temperature adaptability power splitter according to any one of claims 1-4, it is characterised in that: each end pole piece printing
It takes shape on the ceramic bottom board.
6. high-temperature adaptability power splitter as claimed in claim 5, it is characterised in that: each end pole piece uses palladium-silver conductor
Material takes shape on the ceramic bottom board.
7. high-temperature adaptability power splitter according to any one of claims 1-4, it is characterised in that: the capacitor welding in
On the ceramic bottom board.
8. high-temperature adaptability power splitter according to any one of claims 1-4, it is characterised in that: the high-temperature adaptability
Power splitter further includes the exit for covering the inductor and the covering inductor and the ring of the ceramic bottom board junction
Oxygen resin protects structure.
9. high-temperature adaptability power splitter according to any one of claims 1-4, it is characterised in that: the high-temperature adaptability
Power splitter further includes being filled between the casing and the ceramic bottom board with by the inductor, the capacitor, the electricity
Resistance device, the connecting line, the ceramic bottom board and the casing solidify integral epoxy resin interstitital texture.
10. high-temperature adaptability power splitter according to any one of claims 1-4, it is characterised in that: the inductor is two
A, the capacitor and two inductors are successively spaced setting, and the capacitor along the ceramic bottom board length direction
And two inductors are set to corresponding position in the middle part of the ceramic bottom board width direction.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810760009.0A CN109037869A (en) | 2018-07-11 | 2018-07-11 | High-temperature adaptability power splitter |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810760009.0A CN109037869A (en) | 2018-07-11 | 2018-07-11 | High-temperature adaptability power splitter |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN109037869A true CN109037869A (en) | 2018-12-18 |
Family
ID=64641137
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201810760009.0A Pending CN109037869A (en) | 2018-07-11 | 2018-07-11 | High-temperature adaptability power splitter |
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| Country | Link |
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Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20030155991A1 (en) * | 2002-02-19 | 2003-08-21 | Daxiong Ji | Miniature 180 degree power splitter |
| US20050146395A1 (en) * | 2004-01-02 | 2005-07-07 | Lu Chen | Three way power splitter |
| CN2819618Y (en) * | 2006-03-15 | 2006-09-20 | 毛定德 | Non-inductive adjusting DC power-supply module of ceramic base plate |
| CN107040233A (en) * | 2017-05-12 | 2017-08-11 | 深圳振华富电子有限公司 | Electronic equipment and its power splitter |
| CN208806344U (en) * | 2018-07-11 | 2019-04-30 | 深圳振华富电子有限公司 | High-temperature adaptability power splitter |
-
2018
- 2018-07-11 CN CN201810760009.0A patent/CN109037869A/en active Pending
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20030155991A1 (en) * | 2002-02-19 | 2003-08-21 | Daxiong Ji | Miniature 180 degree power splitter |
| US20050146395A1 (en) * | 2004-01-02 | 2005-07-07 | Lu Chen | Three way power splitter |
| CN2819618Y (en) * | 2006-03-15 | 2006-09-20 | 毛定德 | Non-inductive adjusting DC power-supply module of ceramic base plate |
| CN107040233A (en) * | 2017-05-12 | 2017-08-11 | 深圳振华富电子有限公司 | Electronic equipment and its power splitter |
| CN208806344U (en) * | 2018-07-11 | 2019-04-30 | 深圳振华富电子有限公司 | High-temperature adaptability power splitter |
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