CN109015441B - Manufacturing method of ultra-thin diamond grinding wheel based on quasi-LIGA (laser induced breakdown ionization) process - Google Patents
Manufacturing method of ultra-thin diamond grinding wheel based on quasi-LIGA (laser induced breakdown ionization) process Download PDFInfo
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- CN109015441B CN109015441B CN201811142797.3A CN201811142797A CN109015441B CN 109015441 B CN109015441 B CN 109015441B CN 201811142797 A CN201811142797 A CN 201811142797A CN 109015441 B CN109015441 B CN 109015441B
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- B24—GRINDING; POLISHING
- B24D—TOOLS FOR GRINDING, BUFFING OR SHARPENING
- B24D18/00—Manufacture of grinding tools or other grinding devices, e.g. wheels, not otherwise provided for
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Abstract
The manufacturing method of the ultra-thin diamond grinding wheel based on the quasi-LIGA process comprises the steps of firstly, manufacturing a cathode substrate, coating a photoresist film on the substrate in a spinning mode through glue homogenizing, forming a micropore array film on the photoresist film through a UV photoetching development hardening process, then plating a conductive film on the surface of the micropore array film, forming a masking layer on the micropore array film through the UV photoetching process, and enabling the area, which is not masked by the masking layer, on the micropore array film to be in the shape of a grinding wheel; then, carrying out a composite electroforming process, wherein diamond grinding materials and metal ions in the electroforming solution are uniformly eutectoid at the grinding wheel pattern position of the cathode substrate to obtain a composite electroforming layer; finally, separating the composite electroforming layer from the cathode substrate to obtain a grinding wheel; the invention realizes the integrated molding manufacture of the diamond grinding wheel, two sides of the grinding wheel expose diamond particles, the cutting capability of the two sides is basically uniform and symmetrical, and the diamond grinding wheel can be directly used; the manufactured grinding wheel has small section jump, low cost and high cutting precision and efficiency.
Description
Technical Field
The invention relates to the technical field of manufacturing of diamond grinding wheels, in particular to a manufacturing method of an ultra-thin diamond grinding wheel based on a quasi-LIGA (laser induced breakdown ionization) process.
Background
The quasi-LIGA technique uses a combination of ultraviolet lithography and electroforming, and the process is divided into two main parts: deep UV lithography of thick resist and electroforming of structural materials in patterns. At present, two methods, namely a pressing method and an electroforming method, are mainly used for developing the diamond grinding wheel. The pressing method adopts the powder metallurgy principle, and the thickness is more than 0.08mm, so the method is not suitable for manufacturing the ultra-thin diamond grinding wheel. Conventional electroforming, which deposits a diamond-metal matrix composite coating on a smooth substrate, mechanically releases the grinding wheel from the substrate, and then punches the grinding wheel into a desired size, has many disadvantages. The grinding wheel produced by the method has the following problems: the plating layer close to the substrate is bright, the content of diamond is less, the metal content of the plating layer is high, and naked diamond particles cannot be seen on the surface of the plating layer basically, which does not meet the requirement that two sides of a grinding wheel are required to be naked, so that the cutting capability of the two sides of the grinding wheel is basically uniform and symmetrical; the grinding wheel is easy to damage in the mechanical demoulding process, and the production cost is increased; after the electroplated layer is stripped and separated, the grinding wheel with required specification can be formed only by punching and forming, thus wasting materials and increasing production cost.
In order to solve the problem that the grinding wheel only has single-side exposed diamond particles and the cutting capacities of the two sides of the grinding wheel are not uniform and symmetrical, the U.S. Pat. No. 4, 7527050, 2 provides a method for manufacturing the grinding wheel with a multi-layer diamond coating. In order to realize the integral molding manufacture of the diamond grinding wheel, the united states patent (publication No. 4547998) proposes to cut the substrate into the shape of the grinding wheel of the required specification, but because of the edge effect in the electroforming process, burrs and burrs occur at the edges of the inner and outer circles, if such a composite film is directly used as the grinding wheel, the cut width of the workpiece will be inevitably caused in the using process, the workpiece may be damaged, and even the blade and the workpiece are cracked at an extremely high rotation speed, which causes danger.
Disclosure of Invention
In order to overcome the defects of the prior art, the invention aims to provide a manufacturing method of an ultra-thin diamond grinding wheel based on a quasi-LIGA process, so that the integrated molding manufacturing of the diamond grinding wheel is realized, the two surfaces of the grinding wheel are exposed with diamond particles, the cutting capacities of the two surfaces are basically uniform and symmetrical, and the ultra-thin diamond grinding wheel can be directly used without subsequent processing; the substrate is simple to separate from the substrate, and the substrate can be reused; the manufactured grinding wheel has small section jump, low cost and high cutting precision and efficiency.
In order to achieve the purpose, the invention adopts the technical scheme that:
the manufacturing method of the ultra-thin diamond grinding wheel based on the quasi-LIGA process comprises the following steps:
1) manufacturing a cathode substrate: firstly, spin-coating a photoresist film on a substrate through spin-coating, forming a micropore array film on the photoresist film through a UV photoetching development hardening process, and then plating a conductive film on the surface of the micropore array film; finally, forming a masking layer on the micropore array film through a UV photoetching process, wherein the area, which is not masked by the masking layer, on the micropore array film is in the shape of a grinding wheel piece with the required specification;
2) the composite electroforming process comprises the following steps: putting the cathode substrate manufactured in the step 1) as a cathode, a nickel plate as an anode into the sulfamic acid nickel-diamond composite electroforming solution, connecting the cathode substrate with a negative electrode of a direct-current power supply, connecting the nickel plate with a positive electrode of the direct-current power supply, and switching on the power supply, so that diamond grinding materials and metal ions in the electroforming solution are uniformly eutectoid at the position of a grinding wheel pattern of the cathode substrate which is not masked by a masking layer, a composite electroforming layer is obtained, and the thickness of the composite electroforming layer can be controlled by controlling the electroforming time;
3) separating the composite electroformed layer from the cathode substrate: and cleaning and drying the cathode substrate electroformed with the composite electroformed layer, corroding the photoresist by using a corresponding photoresist corrosive liquid, and automatically separating the composite electroformed layer from the cathode substrate after the photoresist is corroded, thereby directly obtaining the grinding wheel with the required size specification.
The thickness of the photoresist film in the step 1) is 5-10 um.
The diameter of the micropores of the micropore array film 9 in the step 1) is equivalent to the diameter of diamond particles, the depth of the micropores is 2-3 um, and the center distance of the micropores is 1.5 times of the diameter of the micropores.
The thickness of the conductive film in the step 1) is 20-100 nm.
The thickness of the masking layer in the step 1) is 50-100 um.
The invention has the beneficial effects that:
the grinding wheel manufactured by the invention overcomes the defects that the traditional manufacturing method only has single-side exposed diamond particles, the cutting capacities of two sides are uneven and symmetrical, edge burrs are easy to generate, and the manufacturing process is complex; the substrate can be directly used without subsequent processing, is simple to separate from the substrate, and can be repeatedly used, so that the manufacturing process is simplified, the production efficiency can be improved, and the manufacturing cost is reduced.
Drawings
FIG. 1 is a schematic structural diagram of a cathode substrate according to the present invention.
FIG. 2 is a schematic view of a microwell array of the present invention.
FIG. 3 is a schematic view of the composite electroforming process of the present invention.
Fig. 4 is a cross-sectional view of a diamond cut-off wheel manufactured by the method of the present invention.
Detailed Description
The invention is described in detail below with reference to the figures and examples.
The manufacturing method of the ultra-thin diamond grinding wheel based on the quasi-LIGA process comprises the following steps:
1) manufacturing a cathode substrate: referring to fig. 1 and 2, a substrate 3 is made of a flat and smooth material such as a silicon wafer or a glass wafer polished on one side; spin-coating photoresist on a substrate 3 by using a spin coater to form a photoresist film 7 with the thickness of 5-10 um, and preparing a micropore array film 9 on the surface of the photoresist film 7 by using a UV (ultraviolet) lithography development hardening process, wherein the diameter of each micropore is equivalent to the diameter of diamond particles, the depth of each micropore is 2-3 um, and the center distance of each micropore is 1.5 times of the diameter of each micropore; depositing a conductive film with a thickness of 20-100 nm on the surface of the micropore array film 9 by adopting a sputtering or evaporation method; forming a masking layer 8 with the thickness of 50-100 um on the micropore array thin film 9 through a UV photoetching, developing and hardening process, wherein the area on the micropore array thin film 9 which is not masked by the masking layer 8 is in the shape of a grinding wheel sheet with required specification;
2) the composite electroforming process comprises the following steps: referring to fig. 3, in an electroforming tank 1, a nickel plate 5 is used as an anode, a cathode substrate is used as a cathode, two electrode plates are put into a nickel sulfamate-diamond composite electroforming solution 4 and are fixed by a fixing rod 2, meanwhile, the cathode substrate is connected with a cathode of a direct current power supply 6, and the nickel plate 5 is connected with an anode of the direct current power supply 6; after the power is switched on, the diamond in the electroforming solution 4 is uniformly eutectoid with metal ions in a suspension state in the area of the micropore array film 9 which is not masked by the photoresist 8, diamond particles enter micropores of the micropore array film 9 of the photoresist film 7 on the cathode substrate to obtain a composite electroforming layer with metal and diamond abrasive materials uniformly mixed, and the cathode substrate is taken out of the electroforming solution 4 when the thickness of the composite electroforming layer reaches 50-100 um; the thickness of the composite electroformed layer can be controlled by controlling the electroforming time;
3) separating the composite electroformed layer from the cathode substrate: after the cathode substrate electroformed with the composite electroformed layer is cleaned and dried, the photoresist is corroded by using a corresponding photoresist corrosion solution, and after the photoresist is corroded, the composite electroformed layer is automatically separated from the cathode substrate, so that a grinding wheel product 10 with two exposed diamond particles is directly obtained, as shown in fig. 4.
The formulation of the electroforming solution 4 in the step 2) is as follows:
100-600g/l of nickel sulfamate;
1-3ml/L of additive N-500W;
30-60g/L of boric acid;
5-15g/L of nickel chloride.
The parameters of the electroforming process in the step 2) are as follows:
temperature: 45-55 ℃;
PH：3.3-5；
current density: 0.5-2A/dm 2;
the diamond density is 5-20 g/l.
The beneficial effect of this embodiment does:
the cutting capability of two surfaces of the grinding wheel manufactured by the embodiment is basically uniform and symmetrical, no edge burr is generated, and the cutting precision and efficiency are improved; the substrate can be directly used without subsequent processing, is simple to separate from the substrate, and can be repeatedly used, so that the manufacturing process is simplified, the production efficiency can be improved, and the manufacturing cost is reduced.
Claims (4)
1. The manufacturing method of the ultra-thin diamond grinding wheel based on the quasi-LIGA process is characterized by comprising the following steps of:
1) manufacturing a cathode substrate: the substrate (3) is a silicon wafer or glass sheet material with a polished single surface; firstly, spin-coating a photoresist film (7) on a substrate (3) through spin coating, forming a micropore array film (9) on the photoresist film (7) through a UV photoetching development hardening process, and then plating a conductive film on the surface of the micropore array film (9); finally, forming a masking layer (8) on the micropore array film (9) with the conductive film through a UV photoetching process, wherein the area, which is not masked by the masking layer (8), on the micropore array film (9) with the conductive film is in the shape of a grinding wheel piece with required specification;
2) the composite electroforming process comprises the following steps: taking a nickel plate (5) as an anode in an electroforming tank (1), taking a cathode substrate manufactured in the step 1) as a cathode, taking the nickel plate (5) as the anode, putting the nickel plate into nickel sulfamate-diamond composite electroforming solution (4), connecting the cathode substrate with the negative pole of a direct current power supply (6), connecting the nickel plate with the positive pole of the direct current power supply (6), and switching on the power supply, so that diamond grinding materials and metal ions in the electroforming solution (4) are uniformly eutectoid in an area which is not masked by a masking layer (8) on a micropore array film (9) with a conductive film, diamond particles enter micropores of the micropore array film (9) on the cathode substrate, a composite electroforming layer with uniformly mixed metal and diamond grinding materials is obtained, and the thickness of the composite electroforming layer can be controlled by controlling the electroforming time;
3) separating the composite electroformed layer from the cathode substrate: cleaning and drying the cathode substrate electroformed with the composite electroformed layer, corroding the photoresist by using a corresponding photoresist corrosive liquid, and automatically separating the composite electroformed layer from the cathode substrate after the photoresist is corroded, thereby directly obtaining a two-sided bare diamond particle grinding wheel (10) with the required size specification;
the thickness of the photoresist film in the step 1) is 5-10 um;
the diameter of the micropores of the micropore array film (9) in the step 1) is equivalent to the diameter of the diamond particles, the depth of the micropores is 2-3 um, and the center distance of the micropores is 1.5 times of the diameter of the micropores.
2. The manufacturing method of the ultra-thin diamond grinding wheel based on the quasi-LIGA process, which is claimed in claim 1, is characterized in that: the thickness of the conductive film in the step 1) is 20-100 nm.
3. The manufacturing method of the ultra-thin diamond grinding wheel based on the quasi-LIGA process, which is claimed in claim 1, is characterized in that: the thickness of the masking layer in the step 1) is 50-100 um.
4. The manufacturing method of the ultra-thin diamond grinding wheel based on the quasi-LIGA process, which is claimed in claim 1, is characterized in that: the formula and electroforming process of the electroforming solution (4) in the step 2) are as follows:
1) formulation of electroforming solution
100-600g/l of nickel sulfamate;
1-3ml/L of additive N-500W;
30-60g/L of boric acid;
5-15g/L of nickel chloride;
2) electroforming process parameters
Temperature: 45-55 ℃;
PH：3.3-5；
current density: 0.5-2A/dm2(ii) a The diamond density is: 5-20 g/l.
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| CN201811142797.3A CN109015441B (en) | 2018-09-28 | 2018-09-28 | Manufacturing method of ultra-thin diamond grinding wheel based on quasi-LIGA (laser induced breakdown ionization) process |
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| CN109015441B true CN109015441B (en) | 2020-08-14 |
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| TW503161B (en) * | 2000-01-19 | 2002-09-21 | Mitsubishi Materials Corportio | Apparatus and method for making electro-depositted grinding stone |
| US7073496B2 (en) * | 2003-03-26 | 2006-07-11 | Saint-Gobain Abrasives, Inc. | High precision multi-grit slicing blade |
| CN1609284A (en) * | 2003-10-24 | 2005-04-27 | 上海核工业第八研究所 | Method for producing thin diamond cutting sheet |
| CN1857990B (en) * | 2006-05-18 | 2010-05-12 | 西安交通大学 | Method for making complicate three dimension microstructure or micro device at low cost |
| CN101474778B (en) * | 2009-01-20 | 2010-09-08 | 常州华中集团有限责任公司 | Technique for producing ultrathin diamond cutting slice of Ni-based anchoring agent |
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