CN109003916A - 一种集成电路板抓取用机械手*** - Google Patents
一种集成电路板抓取用机械手*** Download PDFInfo
- Publication number
- CN109003916A CN109003916A CN201810723329.9A CN201810723329A CN109003916A CN 109003916 A CN109003916 A CN 109003916A CN 201810723329 A CN201810723329 A CN 201810723329A CN 109003916 A CN109003916 A CN 109003916A
- Authority
- CN
- China
- Prior art keywords
- spray printing
- manipulator
- integrated circuit
- defect ware
- printing
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000007639 printing Methods 0.000 claims abstract description 99
- 239000007921 spray Substances 0.000 claims abstract description 81
- 230000007547 defect Effects 0.000 claims abstract description 41
- 238000001514 detection method Methods 0.000 claims abstract description 12
- 238000005476 soldering Methods 0.000 claims description 35
- 238000000034 method Methods 0.000 claims description 13
- 238000007650 screen-printing Methods 0.000 claims description 9
- 230000007704 transition Effects 0.000 claims description 6
- 230000008569 process Effects 0.000 claims description 5
- 238000009826 distribution Methods 0.000 claims description 3
- 238000007789 sealing Methods 0.000 claims description 3
- 238000001914 filtration Methods 0.000 claims description 2
- 208000002925 dental caries Diseases 0.000 claims 1
- 238000004519 manufacturing process Methods 0.000 description 5
- 238000010586 diagram Methods 0.000 description 4
- 238000005516 engineering process Methods 0.000 description 4
- 239000000203 mixture Substances 0.000 description 2
- 238000010521 absorption reaction Methods 0.000 description 1
- 238000004140 cleaning Methods 0.000 description 1
- 239000002131 composite material Substances 0.000 description 1
- 230000004069 differentiation Effects 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 230000003287 optical effect Effects 0.000 description 1
- 238000002360 preparation method Methods 0.000 description 1
- 230000000750 progressive effect Effects 0.000 description 1
- 238000012797 qualification Methods 0.000 description 1
- 230000008439 repair process Effects 0.000 description 1
- 239000002904 solvent Substances 0.000 description 1
- 238000003860 storage Methods 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
- 239000002699 waste material Substances 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67242—Apparatus for monitoring, sorting or marking
- H01L21/67271—Sorting devices
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67242—Apparatus for monitoring, sorting or marking
- H01L21/67282—Marking devices
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/6838—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping with gripping and holding devices using a vacuum; Bernoulli devices
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Abstract
Description
Claims (1)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201810723329.9A CN109003916B (zh) | 2018-07-04 | 2018-07-04 | 一种集成电路板抓取用机械手*** |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201810723329.9A CN109003916B (zh) | 2018-07-04 | 2018-07-04 | 一种集成电路板抓取用机械手*** |
Publications (2)
Publication Number | Publication Date |
---|---|
CN109003916A true CN109003916A (zh) | 2018-12-14 |
CN109003916B CN109003916B (zh) | 2020-08-28 |
Family
ID=64598553
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN201810723329.9A Active CN109003916B (zh) | 2018-07-04 | 2018-07-04 | 一种集成电路板抓取用机械手*** |
Country Status (1)
Country | Link |
---|---|
CN (1) | CN109003916B (zh) |
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN110176413A (zh) * | 2019-04-15 | 2019-08-27 | 南宁聚信众信息技术咨询有限公司 | 一种用于芯片分拣的安全可靠的高效型机械设备 |
CN110794286A (zh) * | 2019-10-30 | 2020-02-14 | 孙传保 | 一种便于取放集成电路板的电路测试装置 |
CN111113527A (zh) * | 2020-01-11 | 2020-05-08 | 上海越联橡塑制品有限公司 | 一种汽车密封条切段自动化生产线 |
CN115165925A (zh) * | 2022-08-05 | 2022-10-11 | 深圳市华研天创检测设备有限公司 | 具有标记功能的pcb板检测装置、标记方法、设备及介质 |
Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH0667311A (ja) * | 1992-08-19 | 1994-03-11 | Dainippon Printing Co Ltd | 真空密着焼付装置 |
JP2000196223A (ja) * | 1998-12-25 | 2000-07-14 | Mitsui High Tec Inc | 基板の検査装置および検査方法 |
CN104669793A (zh) * | 2014-05-16 | 2015-06-03 | 奇美材料科技股份有限公司 | 偏光板喷印制造设备 |
CN107777350A (zh) * | 2016-08-29 | 2018-03-09 | 江苏扬泰电子有限公司 | 一种柔性板吸盘装置 |
-
2018
- 2018-07-04 CN CN201810723329.9A patent/CN109003916B/zh active Active
Patent Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH0667311A (ja) * | 1992-08-19 | 1994-03-11 | Dainippon Printing Co Ltd | 真空密着焼付装置 |
JP2000196223A (ja) * | 1998-12-25 | 2000-07-14 | Mitsui High Tec Inc | 基板の検査装置および検査方法 |
CN104669793A (zh) * | 2014-05-16 | 2015-06-03 | 奇美材料科技股份有限公司 | 偏光板喷印制造设备 |
CN107777350A (zh) * | 2016-08-29 | 2018-03-09 | 江苏扬泰电子有限公司 | 一种柔性板吸盘装置 |
Cited By (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN110176413A (zh) * | 2019-04-15 | 2019-08-27 | 南宁聚信众信息技术咨询有限公司 | 一种用于芯片分拣的安全可靠的高效型机械设备 |
CN110794286A (zh) * | 2019-10-30 | 2020-02-14 | 孙传保 | 一种便于取放集成电路板的电路测试装置 |
CN110794286B (zh) * | 2019-10-30 | 2021-09-10 | 北京国基科航第三代半导体检测技术有限公司 | 一种便于取放集成电路板的电路测试装置 |
CN111113527A (zh) * | 2020-01-11 | 2020-05-08 | 上海越联橡塑制品有限公司 | 一种汽车密封条切段自动化生产线 |
CN115165925A (zh) * | 2022-08-05 | 2022-10-11 | 深圳市华研天创检测设备有限公司 | 具有标记功能的pcb板检测装置、标记方法、设备及介质 |
Also Published As
Publication number | Publication date |
---|---|
CN109003916B (zh) | 2020-08-28 |
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Legal Events
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PB01 | Publication | ||
PB01 | Publication | ||
SE01 | Entry into force of request for substantive examination | ||
SE01 | Entry into force of request for substantive examination | ||
CB02 | Change of applicant information |
Address after: 230011 Room 201, 3 Blocks, Longgang South Village, Quanjiao Road, Yaohai District, Hefei City, Anhui Province Applicant after: Xiao Yongsheng Address before: 230000 Room 306, Shushan New Village, Changjiang West Road, Shushan District, Hefei City, Anhui Province Applicant before: Xiao Yongsheng |
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CB02 | Change of applicant information | ||
TA01 | Transfer of patent application right |
Effective date of registration: 20200806 Address after: 230001 6th floor, building 3, Renhe science and Technology Park, Zhenxing Road, Shushan District, Hefei City, Anhui Province Applicant after: ANHUI XIUWU INDUSTRIAL TECHNOLOGY Co.,Ltd. Address before: Room 201, building 3, Longgang South Village, Quanjiao Road, Yaohai District, Hefei City, Anhui Province Applicant before: Xiao Yongsheng |
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TA01 | Transfer of patent application right | ||
GR01 | Patent grant | ||
GR01 | Patent grant |