CN109002156B - Novel closed phase-change liquid cooling server system - Google Patents
Novel closed phase-change liquid cooling server system Download PDFInfo
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- CN109002156B CN109002156B CN201811180510.6A CN201811180510A CN109002156B CN 109002156 B CN109002156 B CN 109002156B CN 201811180510 A CN201811180510 A CN 201811180510A CN 109002156 B CN109002156 B CN 109002156B
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- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
- G06F1/16—Constructional details or arrangements
- G06F1/20—Cooling means
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/2029—Modifications to facilitate cooling, ventilating, or heating using a liquid coolant with phase change in electronic enclosures
- H05K7/20318—Condensers
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- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F2200/00—Indexing scheme relating to G06F1/04 - G06F1/32
- G06F2200/20—Indexing scheme relating to G06F1/20
- G06F2200/201—Cooling arrangements using cooling fluid
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- Cooling Or The Like Of Electrical Apparatus (AREA)
Abstract
The invention provides a novel closed phase change type liquid cooling server system.A compressor acquires liquid refrigerant in a refrigerant storage tank; inputting the liquid refrigerant into a liquid refrigerant storage area, so that the liquid refrigerant in the liquid refrigerant storage area cools the immersed server; the output end of the condenser is connected with the input end of the refrigerant storage tank, the condenser converts the gaseous refrigerant into liquid refrigerant, and the liquid refrigerant is input into the refrigerant storage tank for storage. The inner element of the immersion type server generates heat during operation, the heat enables the refrigerant liquid to boil, a large amount of gas is generated along with the boiling, a gaseous refrigerant storage area is reserved above the liquid level, and the gas is discharged to the condenser through the upper part of the sealing space. The gas enters the condenser, and is condensed into liquid refrigerant through the condenser. The liquid refrigerant is input into the refrigerant storage tank for storage, so that the cooling and pressure in the server can be kept constant, and explosion danger is avoided.
Description
Technical Field
The invention relates to the field of server cooling, in particular to a novel closed phase-change liquid cooling server system.
Background
The method for cooling the server generally adopts an air cooling mode to cool the server. In the air cooling mode, an indirect contact cooling mode is adopted, so that the problems of large contact thermal resistance, large heat convection thermal resistance and large total thermal resistance exist in a cooling system with a complex heat transfer process, and the heat exchange efficiency is low; meanwhile, a larger temperature difference between high-temperature and low-temperature heat sources in the heat exchange process is ensured, so that a lower outdoor low-temperature heat source is required to guide the heat exchange process. However, for the data center, the air cooling mode alone is insufficient to meet the requirement of the server with high heat flux on heat dissipation performance.
Another method of server heat dissipation is liquid cooling, i.e., using a working fluid as an intermediate heat transfer medium to transfer heat from a hot zone to a remote location for further cooling. Unlike the indirect cooling of the air cooling mode, the liquid cooling mode directly guides the liquid-phase refrigerant to the heat source, and in addition, the liquid is much larger than the specific heat capacity of air, and the heat dissipation speed is much larger than that of air, so that the cooling efficiency of the liquid cooling mode is much higher than that of the air cooling mode, and compared with the air cooling mode, the heat dissipation efficiency of the heat transmitted per unit volume is improved by 3300 times.
The liquid cooling system has the characteristics of balancing heat of heating components and parts and working with low noise. Because the specific heat capacity of the liquid is large, a large amount of heat can be absorbed and the temperature can not be obviously changed, so that the temperature of the heating element in the liquid cooling system can be well controlled, and the sudden operation can not cause the instantaneous and large change of the internal temperature of the heating element.
In the thermal principle, the evaporative cooling takes heat away by utilizing the vaporization latent heat when the liquid-phase refrigerant boils. Since the liquid has a large latent heat of vaporization, the evaporative cooling has a more remarkable cooling effect, and is therefore applied to a liquid cooling system. In the liquid cooling system, the gas-phase refrigerant gasified by the liquid-phase refrigerant is condensed by a condenser to be changed into a liquid-phase refrigerant again.
In an immersion liquid cooling system, a large amount of gas is generated by boiling a refrigerant and is accumulated in the system. When the gas reaches a certain amount, if the gas is not timely exhausted, the pressure in the sealed space is increased sharply, so that the sealed space has explosion danger.
Disclosure of Invention
In order to overcome the defects in the prior art, the invention provides a novel closed phase change type liquid cooling server system, which comprises: the cooling device, the refrigerant storage tank, the compressor and the condenser;
the cooling device is provided with a liquid refrigerant storage area and a gaseous refrigerant storage area; a water immersion server is arranged in the liquid refrigerant storage area;
the input end of the compressor is connected with the liquid output end of the refrigerant storage tank, and the compressor acquires liquid refrigerant in the refrigerant storage tank; the output end of the compressor is connected with a liquid refrigerant storage area of the cooling device through a liquid refrigerant output pipeline, and the liquid refrigerant is input into the liquid refrigerant storage area, so that the liquid refrigerant in the liquid refrigerant storage area cools the immersed server;
the gaseous refrigerant storage area of the cooling device is connected with the input end of the condenser through a gaseous refrigerant pipeline, and the gaseous refrigerant in the gaseous refrigerant storage area is input into the condenser;
the output end of the condenser is connected with the input end of the refrigerant storage tank, the condenser converts the gaseous refrigerant into liquid refrigerant, and the liquid refrigerant is input into the refrigerant storage tank for storage.
Preferably, the liquid refrigerant output pipeline is provided with a first electromagnetic valve, a first booster pump and a first one-way valve;
the first electromagnetic valve, the first booster pump and the first one-way valve are connected in series along the connection direction from the output end of the compressor to the liquid refrigerant storage area of the cooling device;
the gaseous refrigerant pipeline is provided with a second electromagnetic valve, a second pressurizing pump and a second one-way valve;
the second solenoid valve, the second booster pump and the second check valve are connected in series along the connection direction from the gaseous refrigerant storage area of the cooling device to the input end of the condenser.
Preferably, the method further comprises: the single chip microcomputer and the second booster pump driving circuit; a gas phase sensor is arranged in the gaseous refrigerant storage area;
the gas phase sensor senses the gas concentration in the gaseous refrigerant storage area and transmits the sensed gas concentration to the singlechip;
the singlechip receives the sensed gas concentration, and when the sensed gas concentration exceeds a threshold value, the singlechip drives the second booster pump to perform pressurized operation through the second booster pump driving circuit, and gas-phase refrigerants in the gaseous refrigerant storage area are extracted to the condenser to be condensed to form liquid-phase refrigerants.
Preferably, the gas phase sensor comprises: the device comprises a resistor R1, a resistor R2, a sliding resistor R3, a capacitor C1, a gas phase sensing mechanism U1 and an operational amplifier U2;
one pin, two pins and three pins of the gas phase sensing mechanism U1 are respectively connected with a power supply; five pins of the gas phase sensing mechanism U1 are grounded through a resistor R1; the gas phase sensing mechanism U1 is provided with four pins, six pins and a first end of a resistor R2, and two pins of the operational amplifier U2 are connected together; the second end of the resistor R2 is grounded;
the three feet of the operational amplifier U2 are connected with the sliding end of the sliding resistor R3, and the amplification factor is adjusted by adjusting the sliding resistor R3, namely the sensitivity of the gas-phase sensor is adjusted; the resistor R1 and the resistor R2 have the functions of current limiting and interference resistance; five pins of the operational amplifier U2 and the first end of the sliding resistor R3 are respectively connected with a power supply; the second end of the sliding resistor R3 and four pins of the operational amplifier U2 are respectively grounded; the first end of the capacitor C1 is respectively connected with the output end of the gas phase sensor, and the output end of the gas phase sensor is connected with the singlechip (21); the second end of the capacitor C1 is grounded; the capacitor C1 eliminates the high frequency component in the gas phase sensor and filters it.
Preferably, the method further comprises: a first booster pump drive circuit;
a temperature sensor is arranged in the water immersion server; the temperature sensor senses the temperature of a heating element in the water immersion server and transmits the sensed temperature to the singlechip;
the single chip microcomputer is used for controlling the first booster pump to operate through the first booster pump driving circuit when the temperature of any heating element of the receiving immersed server is higher than a threshold value, and enhancing the output of the liquid refrigerant from the refrigerant storage tank to the liquid refrigerant storage area; meanwhile, the singlechip controls the pressurizing operation of the second pressurizing pump through the driving circuit of the second pressurizing pump, and gas-phase refrigerants in the gaseous refrigerant storage area are pumped to the condenser to be condensed into liquid-phase refrigerants.
Preferably, the temperature sensor includes: resistor R11, resistor R12, resistor R13, resistor R14, resistor R15, capacitor C3, capacitor C4, diode D1, temperature sensing device U3 and op-amp U4;
the first end of the resistor R11 and the first end of the resistor R12 are respectively connected with a power supply; the second end of the resistor R11, the first end of the temperature sensing device U3, the first end of the capacitor C4, the first end of the operational amplifier U4 and the first end of the resistor R14 are connected together; the second end of the temperature sensing device U3 and the second end of the capacitor C3 are grounded; the second end of the resistor R12, the first end of the resistor R13 and two pins of the operational amplifier U4 are connected together; the second end of the resistor R13 is grounded; the three pins of the operational amplifier U4 are connected with a power supply, and the four pins of the operational amplifier U4 are grounded; five pins of the operational amplifier U4 are connected with the first end of the resistor R15; the second end of the resistor R15, the second end of the resistor R14, the second end of the capacitor C4, the output end of the temperature sensor and the cathode of the diode D1 are connected together; the anode of the diode D1 is grounded;
the temperature sensing device U3 adopts a thermistor type sensor, the temperature sensing devices U3 are respectively arranged on heating elements in the immersion type server, and when the temperature of any heating element is sensed to exceed a threshold value by the singlechip, the first booster pump is driven to operate by the first booster pump driving circuit, so that the output of liquid refrigerant from the refrigerant storage tank to the liquid refrigerant storage area is enhanced;
the resistance value of the temperature sensing device U3 is reduced along with the temperature rise, and a voltage is applied to two ends of the temperature sensing device U3, so that the current values of the passages at two ends of the temperature sensing device U3 along with the temperature are different;
the temperature sensing device U3 outputs a resistance signal, and the resistance signal is converted into a voltage signal by the resistor R11, the resistor R12, the resistor R13, the resistor R14, the resistor R15, the capacitor C3, the capacitor C4 and the diode D1, and amplified and filtered by the operational amplifier U4, so that the signal reaches the range which can be acquired by the singlechip;
the operational amplifier U4 adopts an LM393;
the relationship between temperature value and voltage is:
temperature value=0.412×ad-61.
Preferably, the singlechip is further used for controlling the first booster pump to restore normal power operation through the first booster pump driving circuit after a preset duration when the temperature of the heating element in the received immersed server is lower than a threshold value; meanwhile, the singlechip controls the second booster pump to resume normal power operation through the second booster pump driving circuit;
the inside heating element of the soaking type server includes: motherboard, processor, hard disk and memory.
Preferably, the condenser is made of red copper material, the condenser is provided with fins, and the fins are made of aluminum-magnesium alloy material; the condenser adopts a fan heat exchange mode or adopts cooling water for heat exchange.
Preferably, the side part of the liquid refrigerant storage area is provided with a cable outlet hole, and the cable of the immersed server is led out of the cooling device through the cable outlet hole; the wall of the cable outlet hole is provided with a sealing device; the side of the cooling device is provided with a transparent glass surface.
From the above technical scheme, the invention has the following advantages:
in the invention, the internal elements of the immersion server generate heat when in operation, the heat causes the refrigerant liquid to boil, a large amount of gas is generated along with the boiling, a gaseous refrigerant storage area is reserved above the liquid level, and the gas is discharged to the condenser through the upper part of the sealed space. The gas enters the condenser, and is condensed into liquid refrigerant through the condenser. The liquid refrigerant is input into the refrigerant storage tank for storage, so that the cooling and pressure in the server can be kept constant, and explosion danger is avoided.
Drawings
In order to more clearly illustrate the technical solutions of the present invention, the drawings that are needed in the description will be briefly introduced below, it being obvious that the drawings in the following description are only some embodiments of the present invention, and that other drawings can be obtained according to these drawings without inventive effort for a person skilled in the art.
FIG. 1 is a schematic diagram of a novel closed phase change type liquid cooling server system;
FIG. 2 is a schematic diagram of an embodiment of a novel closed phase change liquid cooled server system;
FIG. 3 is a circuit diagram of a gas phase sensor;
fig. 4 is a circuit diagram of a temperature sensor.
Detailed Description
The present invention provides a novel closed phase change type liquid cooling server system, as shown in fig. 1 to 4, comprising: a cooling device 5, a refrigerant storage tank 9, a compressor 8, and a condenser 1;
the cooling device 5 is provided with a liquid refrigerant storage area 3 and a gaseous refrigerant storage area 4; a soaking server 2 is arranged in the liquid refrigerant storage area 3; the input end of the compressor 8 is connected with the liquid output end of the refrigerant storage tank 9, and the compressor 8 acquires liquid refrigerant in the refrigerant storage tank 9; the output end of the compressor 8 is connected with the liquid refrigerant storage area 3 of the cooling device 5 through a liquid refrigerant output pipeline 17, and the liquid refrigerant is input into the liquid refrigerant storage area 3, so that the liquid refrigerant in the liquid refrigerant storage area 3 cools the immersed server 2; the gaseous refrigerant storage area 4 of the cooling device 5 is connected with the input end of the condenser 1 through a gaseous refrigerant pipeline 18, and the gaseous refrigerant of the gaseous refrigerant storage area 4 is input into the condenser 1; the output end of the condenser 1 is connected with the input end of the refrigerant storage tank 9, the condenser 1 converts the gaseous refrigerant into liquid refrigerant, and the liquid refrigerant is input into the refrigerant storage tank 9 for storage. The cooling device 5 is of a closed structure.
In order to make the objects, features and advantages of the present invention more comprehensible, embodiments accompanied with specific embodiments and figures are described in detail below, wherein the embodiments are described only in part but not in all embodiments. All other embodiments, based on the embodiments in this patent, which would be within the purview of one of ordinary skill in the art without the particular effort to make the invention are intended to be within the scope of the patent protection.
In the embodiment provided by the invention, a first electromagnetic valve 11, a first booster pump 12 and a first one-way valve 13 are arranged on a liquid refrigerant output pipeline 17; the first solenoid valve 11, the first booster pump 12 and the first check valve 13 are connected in series along the connection direction from the output end of the compressor 8 to the liquid refrigerant storage area 3 of the cooling device 5;
the gaseous refrigerant pipeline 18 is provided with a second electromagnetic valve 14, a second booster pump 15 and a second one-way valve 16; the second solenoid valve 14, the second booster pump 15 and the second check valve 16 are connected in series along the connection direction of the gaseous refrigerant storage area 4 of the cooling device 5 to the input end of the condenser 1.
The system further comprises: a singlechip 21, a first booster pump driving circuit 22, a second booster pump driving circuit 23, a compressor control circuit 26, a first solenoid valve control circuit 24, and a second solenoid valve control circuit 25; the singlechip 21 is connected with the compressor through a compressor control circuit 26 and controls the operation of the compressor; the singlechip 21 controls the on-off of the first electromagnetic valve 11 through the first electromagnetic valve control circuit 24; the singlechip 21 controls the on-off of the second electromagnetic valve 14 through the second electromagnetic valve control circuit 25.
When the server is started, the singlechip 21 controls the compressor to operate, the condenser to operate, the first electromagnetic valve 11 is opened, and the first booster pump 12 operates, and if the coolant flow is enough for the server to dissipate heat, the first booster pump 12 can be temporarily not started. The second solenoid valve 14 is opened to form a circulation cooling.
A gas phase sensor 27 is arranged in the gaseous refrigerant storage area 4; the gas phase sensor 27 senses the gas concentration in the gaseous refrigerant storage area 4 and transmits the sensed gas concentration to the singlechip 21;
the singlechip 21 receives the sensed gas concentration, and when the sensed gas concentration exceeds a threshold value, the singlechip 21 drives the second booster pump 15 to perform pressurized operation through the second booster pump driving circuit 23, and the gas-phase refrigerant in the gaseous refrigerant storage area 4 is pumped to the condenser 1 to be condensed to form a liquid-phase refrigerant.
If implemented in hardware, the present invention relates to an apparatus, e.g., as a processor or an integrated circuit device, such as an integrated circuit chip or chip set. Alternatively or additionally, if implemented in software or firmware, the techniques may implement a data storage medium readable at least in part by a computer comprising instructions that, when executed, cause a processor to perform one or more of the methods described above. For example, a computer-readable data storage medium may store instructions such as those executed by a processor.
In order to adapt to the submerged server provided by the invention, the submerged server is effectively cooled, and the gas-phase sensor 27 which is based on the structural form of the gaseous refrigerant storage area defined by the invention and the structural form related to the gaseous refrigerant storage area can be realized, and the gas-phase sensor 27 in other forms, namely, the unconventional gas-phase sensor 27, can be distinguished.
The gas phase sensor 27 includes: the device comprises a resistor R1, a resistor R2, a sliding resistor R3, a capacitor C1, a gas phase sensing mechanism U1 and an operational amplifier U2; one pin, two pins and three pins of the gas phase sensing mechanism U1 are respectively connected with a power supply; five pins of the gas phase sensing mechanism U1 are grounded through a resistor R1; the gas phase sensing mechanism U1 is provided with four pins, six pins and a first end of a resistor R2, and two pins of the operational amplifier U2 are connected together; the second end of the resistor R2 is grounded; the three feet of the operational amplifier U2 are connected with the sliding end of the sliding resistor R3, and the amplification factor is adjusted by adjusting the sliding resistor R3, namely the sensitivity of the gas-phase sensor 27 is adjusted; the resistor R1 and the resistor R2 have the functions of current limiting and interference resistance; five pins of the operational amplifier U2 and the first end of the sliding resistor R3 are respectively connected with a power supply; the second end of the sliding resistor R3 and four pins of the operational amplifier U2 are respectively grounded; the first end of the capacitor C1 is respectively connected with the output end of the gas phase sensor 27 by one pin of the operational amplifier U2, and the output end of the gas phase sensor 27 is connected with the singlechip 212121; the second end of the capacitor C1 is grounded; the capacitor C1 eliminates the high frequency component in the gas phase sensor 27 and filters it. The singlechip 2121 may be of a type commonly used in the art, and the specific type is not limited herein.
The techniques described herein may be implemented in hardware, software, firmware, or any combination thereof. The various features described are modules, units, or components that may be implemented together in an integrated logic device or separately as discrete but interoperable logic devices or other hardware devices. In some cases, various features of the electronic circuit may be implemented as one or more integrated circuit devices, such as an integrated circuit chip or chipset.
In the embodiment provided by the invention, a temperature sensor is arranged inside the immersion server 2; the temperature sensor senses the temperature of a heating element in the water immersion server 2 and transmits the sensed temperature to the singlechip 21; the singlechip 21 is used for controlling the operation of the first booster pump 12 through the first booster pump driving circuit 22 when the temperature of any heating element of the receiving immersion server 2 is higher than a threshold value, so that the liquid refrigerant is enhanced to be output from the refrigerant storage tank 9 to the liquid refrigerant storage area 3; meanwhile, the singlechip 21 controls the second booster pump 15 to perform pressurized operation through the second booster pump driving circuit 23, and gas-phase refrigerants in the gaseous refrigerant storage area 4 are pumped to the condenser 1 to be condensed to form liquid-phase refrigerants.
In order to adapt to the submerged server 2 provided by the invention, the submerged server is effectively cooled, and the temperature sensors based on the system structural form defined by the invention, the cooling device structural form and the structural form related to the cooling device structural form can be realized, and the temperature sensors in other forms, namely, unconventional temperature sensors, are distinguished.
The temperature sensor 28 includes: resistor R11, resistor R12, resistor R13, resistor R14, resistor R15, capacitor C3, capacitor C4, diode D1, temperature sensing device U3 and op-amp U4;
the first end of the resistor R11 and the first end of the resistor R12 are respectively connected with a power supply; the second end of the resistor R11, the first end of the temperature sensing device U3, the first end of the capacitor C4, the first end of the operational amplifier U4 and the first end of the resistor R14 are connected together; the second end of the temperature sensing device U3 and the second end of the capacitor C3 are grounded; the second end of the resistor R12, the first end of the resistor R13 and two pins of the operational amplifier U4 are connected together; the second end of the resistor R13 is grounded; the three pins of the operational amplifier U4 are connected with a power supply, and the four pins of the operational amplifier U4 are grounded; five pins of the operational amplifier U4 are connected with the first end of the resistor R15; the second end of the resistor R15, the second end of the resistor R14, the second end of the capacitor C4, the output end of the temperature sensor 28 and the cathode of the diode D1 are connected together; the anode of the diode D1 is grounded;
the temperature sensing device U3 adopts a thermistor type sensor, the temperature sensing devices U3 are respectively arranged on heating elements in the immersion server 2, when the singlechip 21 senses that the temperature of any heating element exceeds a threshold value, the first booster pump 12 is driven to operate by the first booster pump driving circuit 22, and the liquid refrigerant is enhanced to be output from the refrigerant storage tank 9 to the liquid refrigerant storage area 3;
the resistance value of the temperature sensing device U3 is reduced along with the temperature rise, and a voltage is applied to two ends of the temperature sensing device U3, so that the current values of the passages at two ends of the temperature sensing device U3 along with the temperature are different;
the temperature sensing device U3 outputs a resistance signal, and the resistance signal is converted into a voltage signal by the resistor R11, the resistor R12, the resistor R13, the resistor R14, the resistor R15, the capacitor C3, the capacitor C4 and the diode D1, and amplified and filtered by the operational amplifier U4, so that the signal reaches the range which can be acquired by the singlechip 21;
the operational amplifier U4 adopts an LM393;
the relationship between temperature value and voltage is:
temperature value=0.412×ad-61.
The specific value-taking modes are shown in the following table:
| temperature (DEG C) | 20 | 40 | 60 | 70 | 80 |
| Voltage v | 0.5 | 1.5 | 2.5 | 3.5 | 4.5 |
| AD value | 197 | 245 | 294 | 318 | 342 |
Accurate temperature induction and conversion into voltage values are realized through mutual matching of temperature, voltage and AD values, so that the singlechip 21 automatically controls the system, and the operation stability of the immersed server is ensured.
The terms "first," "second," "third," "fourth" and the like in the description and in the claims and in the above drawings, if any, are used for distinguishing between similar objects and not necessarily for describing a particular sequential or chronological order. It is to be understood that the data so used may be interchanged where appropriate such that the embodiments of the invention described herein may be implemented in sequences other than those illustrated or otherwise described herein. Furthermore, the terms "comprise" and "have," as well as any variations thereof, are intended to cover a non-exclusive inclusion.
In the embodiment provided by the invention, the singlechip 21 is further used for controlling the first booster pump 12 to resume normal power operation through the first booster pump driving circuit 22 after a preset time period when the temperature of the heating element in the received immersed server 2 is lower than a threshold value; meanwhile, the singlechip 21 controls the second booster pump 15 to restore normal power operation through the second booster pump driving circuit 23; the heating element inside the immersion server 2 includes: motherboard, processor, hard disk and memory.
In the embodiment provided by the invention, the condenser 1 is made of red copper material, the condenser 1 is provided with fins, and the fins are made of aluminum-magnesium alloy material; the condenser 1 adopts a fan heat exchange mode or adopts cooling water heat exchange.
The side part of the liquid refrigerant storage area 3 is provided with a cable outlet hole, and the cable of the immersed server 2 is led out of the cooling device 5 through the cable outlet hole; the wall of the cable outlet hole is provided with a sealing device 19; the side of the cooling device 5 is provided with a transparent glass surface, which is convenient for personnel to observe the internal condition of the cooling device.
The previous description of the disclosed embodiments is provided to enable any person skilled in the art to make or use the present invention. Various modifications to these embodiments will be readily apparent to those skilled in the art, and the generic principles defined herein may be applied to other embodiments without departing from the spirit or scope of the invention. Thus, the present invention is not intended to be limited to the embodiments shown herein but is to be accorded the widest scope consistent with the principles and novel features disclosed herein.
Claims (5)
1. A novel closed phase change type liquid cooling server system, comprising: the cooling device (5), the refrigerant storage tank (9), the compressor (8), the first booster pump driving circuit, the singlechip, the second booster pump driving circuit and the condenser (1);
the cooling device (5) is provided with a liquid refrigerant storage area (3) and a gas refrigerant storage area (4); a water immersion server (2) is arranged in the liquid refrigerant storage area (3);
the input end of the compressor (8) is connected with the liquid output end of the refrigerant storage tank (9), and the compressor (8) acquires liquid refrigerant in the refrigerant storage tank (9); the output end of the compressor (8) is connected with a liquid refrigerant storage area (3) of the cooling device (5) through a liquid refrigerant output pipeline (17), and the liquid refrigerant is input into the liquid refrigerant storage area (3) to cool the immersed server (2) by the liquid refrigerant in the liquid refrigerant storage area (3);
the gaseous refrigerant storage area (4) of the cooling device (5) is connected with the input end of the condenser (1) through a gaseous refrigerant pipeline (18), and the gaseous refrigerant of the gaseous refrigerant storage area (4) is input into the condenser (1);
the output end of the condenser (1) is connected with the input end of the refrigerant storage tank (9), the condenser (1) converts the gaseous refrigerant into liquid refrigerant, and the liquid refrigerant is input into the refrigerant storage tank (9) for storage;
a first electromagnetic valve (11), a first booster pump (12) and a first one-way valve (13) are arranged on the liquid refrigerant output pipeline (17);
the first electromagnetic valve (11), the first booster pump (12) and the first one-way valve (13) are connected in series along the connection direction from the output end of the compressor (8) to the liquid refrigerant storage area (3) of the cooling device (5);
a second electromagnetic valve (14), a second booster pump (15) and a second one-way valve (16) are arranged on the gaseous refrigerant pipeline (18);
the second electromagnetic valve (14), the second booster pump (15) and the second one-way valve (16) are connected in series along the connection direction from the gaseous refrigerant storage area (4) of the cooling device (5) to the input end of the condenser (1);
a gas phase sensor is arranged in the gaseous refrigerant storage area (4);
the gas phase sensor senses the gas concentration in the gaseous refrigerant storage area (4) and transmits the sensed gas concentration to the singlechip;
the singlechip receives the sensed gas concentration, and when the sensed gas concentration exceeds a threshold value, the singlechip drives a second booster pump (15) to perform pressurized operation through a second booster pump driving circuit, and gas-phase refrigerant in the gaseous refrigerant storage area (4) is pumped to the condenser (1) to be condensed to form liquid-phase refrigerant;
a temperature sensor is arranged in the water immersion server (2); the temperature sensor senses the temperature of a heating element in the water immersion server (2) and transmits the sensed temperature to the singlechip;
the singlechip is used for controlling the operation of the first booster pump (12) through the first booster pump driving circuit when the temperature of any heating element of the receiving water immersion type server (2) is higher than a threshold value, so that the liquid refrigerant is enhanced to be output from the refrigerant storage tank (9) to the liquid refrigerant storage area (3); meanwhile, the singlechip controls the pressurizing operation of a second pressurizing pump (15) through a second pressurizing pump driving circuit, and gas-phase refrigerants in the gaseous refrigerant storage area (4) are pumped to the condenser (1) to be condensed into liquid-phase refrigerants;
the gas phase sensor includes: the device comprises a resistor R1, a resistor R2, a sliding resistor R3, a capacitor C1, a gas phase sensing mechanism U1 and an operational amplifier U2;
one pin, two pins and three pins of the gas phase sensing mechanism U1 are respectively connected with a power supply; five pins of the gas phase sensing mechanism U1 are grounded through a resistor R1; the gas phase sensing mechanism U1 is provided with four pins, six pins and a first end of a resistor R2, and two pins of the operational amplifier U2 are connected together; the second end of the resistor R2 is grounded;
the three feet of the operational amplifier U2 are connected with the sliding end of the sliding resistor R3, and the amplification factor is adjusted by adjusting the sliding resistor R3, namely the sensitivity of the gas-phase sensor is adjusted; the resistor R1 and the resistor R2 have the functions of current limiting and interference resistance; five pins of the operational amplifier U2 and the first end of the sliding resistor R3 are respectively connected with a power supply; the second end of the sliding resistor R3 and four pins of the operational amplifier U2 are respectively grounded; the first end of the capacitor C1 is respectively connected with the output end of the gas phase sensor, and the output end of the gas phase sensor is connected with the singlechip (21); the second end of the capacitor C1 is grounded; the capacitor C1 eliminates the high frequency component in the gas phase sensor and filters it.
2. The novel closed phase-change liquid-cooled server system according to claim 1, wherein,
the temperature sensor includes: resistor R11, resistor R12, resistor R13, resistor R14, resistor R15, capacitor C3, capacitor C4, diode D1, temperature sensing device U3 and op-amp U4;
the first end of the resistor R11 and the first end of the resistor R12 are respectively connected with a power supply; the second end of the resistor R11, the first end of the temperature sensing device U3, the first end of the capacitor C4, the first end of the operational amplifier U4 and the first end of the resistor R14 are connected together; the second end of the temperature sensing device U3 and the second end of the capacitor C3 are grounded; the second end of the resistor R12, the first end of the resistor R13 and two pins of the operational amplifier U4 are connected together; the second end of the resistor R13 is grounded; the three pins of the operational amplifier U4 are connected with a power supply, and the four pins of the operational amplifier U4 are grounded; five pins of the operational amplifier U4 are connected with the first end of the resistor R15; the second end of the resistor R15, the second end of the resistor R14, the second end of the capacitor C4, the output end of the temperature sensor and the cathode of the diode D1 are connected together; the anode of the diode D1 is grounded;
the temperature sensing device U3 adopts a thermistor type sensor, the temperature sensing device U3 is respectively arranged on heating elements in the immersion server (2), when the temperature of any heating element is sensed to exceed a threshold value by the singlechip, the first booster pump (12) is driven to operate by the first booster pump driving circuit, and the liquid refrigerant is enhanced to be output from the refrigerant storage tank (9) to the liquid refrigerant storage area (3);
the resistance value of the temperature sensing device U3 is reduced along with the temperature rise, and a voltage is applied to two ends of the temperature sensing device U3, so that the current values of the passages at two ends of the temperature sensing device U3 along with the temperature are different;
the temperature sensing device U3 outputs a resistance signal, and the resistance signal is converted into a voltage signal by the resistor R11, the resistor R12, the resistor R13, the resistor R14, the resistor R15, the capacitor C3, the capacitor C4 and the diode D1, and amplified and filtered by the operational amplifier U4, so that the signal reaches the range which can be acquired by the singlechip;
the operational amplifier U4 adopts an LM393;
the relationship between temperature value and voltage is:
temperature value=0.412×ad-61.
3. The novel closed phase-change liquid-cooled server system according to claim 1, wherein,
the singlechip is also used for controlling the first booster pump (12) to resume normal power operation through the first booster pump driving circuit after a preset duration when the temperature of the heating element in the received immersed server (2) is lower than a threshold value; meanwhile, the singlechip controls the second booster pump (15) to resume normal power operation through the second booster pump driving circuit;
the heating element inside the immersion server (2) comprises: motherboard, processor, hard disk and memory.
4. The novel closed phase-change liquid-cooled server system according to claim 1, wherein,
the condenser (1) is made of red copper material, the condenser (1) is provided with fins, and the fins are made of aluminum magnesium alloy material; the condenser (1) adopts a fan heat exchange mode or adopts cooling water for heat exchange.
5. The novel closed phase-change liquid-cooled server system according to claim 1, wherein,
the side part of the liquid refrigerant storage area (3) is provided with a cable outlet hole, and a cable of the immersed server (2) is led out of the cooling device (5) through the cable outlet hole; the wall of the cable outlet hole is provided with a sealing device (19);
a transparent glass surface is arranged on the side of the cooling device (5).
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| CN111511161B (en) * | 2019-01-31 | 2023-05-26 | 西门子(深圳)磁共振有限公司 | Cooling system of magnetic resonance equipment and magnetic resonance equipment |
| CN110632996A (en) * | 2019-09-12 | 2019-12-31 | 苏州浪潮智能科技有限公司 | Liquid cooling equipment, liquid cooling method and liquid cooling system |
| CN111352489B (en) * | 2020-02-29 | 2021-05-25 | 苏州浪潮智能科技有限公司 | Flowing boiling immersion type liquid cooling device |
| CN111478158A (en) * | 2020-05-19 | 2020-07-31 | 曙光节能技术（北京）股份有限公司 | Immersion phase change liquid cooling system of laser |
| CN114599216A (en) * | 2022-05-10 | 2022-06-07 | 京清数电(北京)技术有限公司 | Phase-change cooling energy-storage converter |
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