CN108995322B - 一种无卤抗镀覆铜板 - Google Patents
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Abstract
本发明公开了一种无卤抗镀覆铜板，本发明可以与普通覆铜板组成多层板，可实现孔内选择性镀铜，提升PCB信号传输速率。一种无卤抗镀覆铜板，包括绝缘层以及固定于绝缘层端面的铜箔，所述绝缘层采用无卤抗镀树脂材料制作。所述无卤抗镀树脂材料为无卤抗镀树脂油墨。所述无卤抗镀树脂油墨由以下质量分数的原材料制得：水性丙烯酸树脂60‑80％，氯化聚丙烯类树脂2‑5％，聚氨酯树脂3‑6％，水性色浆3‑10％，去离子水5‑10％，余量为氨水。
Description
技术领域
本发明涉及覆铜板领域，特别是涉及一种无卤抗镀覆铜板。
背景技术
覆铜板又名基材。将补强材料浸以树脂，一面或两面覆以铜箔，经热压而成的一种板状材料，称为覆铜箔层压板(CCL)。它是做PCB(印制电路板)的基本材料，常叫基材。当它用于多层板生产，也叫芯板(CORE)。印刷线路板是由覆铜板经过线路制作后形成，覆铜板由玻璃布以及附着于该玻璃布上的树脂层与导体层热压得到，因此PCB板的主要性能，特别是信号传输性能主要由CCL决定，同时CCL的性能与树脂基体关系很大。
随着电子产品向轻、薄、小、高密度、多功能化发展，元件组装密度和集成度越来越高，传递信号频率越来越高，起传递信号作用的线路层间距越来越小，线宽越来越窄，这对基础电子材料提出了更高的要求，主要为高耐热性、优异的介电性能、高绝缘性、合适的机械性能以及加工性，特别是介电性能。材料的相对介电系数越小，信号的传输速度越快；介电损耗因子越小，信号在传输过程中的损耗功率保持一定时，允许传输的频率就越高，即在信号频率相同下，介电损耗值越小，信号传输过程中失真率就越低。
发明内容
本发明的目的在于克服现有技术的不足，提供一种无卤抗镀覆铜板，本发明可以与普通覆铜板组成多层板，可实现多层板通孔内任意层镀铜，提升PCB信号传输速率。
本发明的目的是这样实现的：
一种无卤抗镀覆铜板，包括绝缘层以及固定于绝缘层端面的铜箔，所述绝缘层采用无卤抗镀树脂材料制作。
优选地，所述无卤抗镀树脂材料为无卤抗镀树脂油墨。
优选地，所述无卤抗镀树脂油墨由以下质量分数的原材料制得：水性丙烯酸树脂60-80％，氯化聚丙烯类树脂2-5％，聚氨酯树脂3-6％，水性色浆3-10％，去离子水5-10％，余量为氨水。
优选地，所述水性丙烯酸树脂由以下质量份的原材料制得：甲基丙烯酸甲脂10-16份，丙烯酸丁脂14-20份，丙烯酸4-8份，丙烯酸羟乙脂1.5-2.5份，双丙酮丙烯酰胺0.5-1份，丙二甲醚醋酸脂38-45份，二甲基甲酰胺14-20份，氧乙烯醚2-4份，聚丙烯酸钠2-6份，偶氮二异丁腈0.5-1份，己二酸二酰肼0.6-0.8份，三乙胺1.2-2.8份，氨水2-5份，蒸馏水40-60份。
优选地，所述无卤抗镀树脂油墨通过丝网印刷的方式丝印到铜箔上。
优选地，通过丝印网版的目数及丝印的次数控制绝缘层厚度。
优选地，所述绝缘层两端面上均设有铜箔，当绝缘层丝印到一张铜箔上后，另一张铜箔热压固定到绝缘层上。
优选地，无卤抗镀覆铜板上设有法向通孔。
优选地，将无卤抗镀覆铜板放置在氢氧化钠溶液中浸泡，褪除无卤抗镀树脂油墨，实现层与层间隔断。
优选地，根据氢氧化钠溶液浓度、浸泡时间决定横向布孔的深度；所述横向布孔的孔径等于无卤抗镀树脂油墨的厚度。
由于采用了上述技术方案，本发明具有如下有益效果：
1.本发明可以作为芯板与普通覆铜板组成多层板，由于绝缘层不能电镀，而普通覆铜板的绝缘层可以电镀，因此可实现孔内选择性镀铜工艺，解决背钻0stub技术，提升PCB信号传输速率。
2.无卤抗镀覆铜板逆转了现有覆铜板，保证原有覆铜板功能基础上，无卤抗镀覆铜板可放置在氢氧化钠溶液中浸泡，褪除无卤抗镀树脂油墨，实现横向布孔。
3.无卤抗镀树脂油墨内部作用力主要包括化学键力(即原子间的作用力)、分子间的作用力、界面静电引力和机械作用力。这些作用于树脂连接料与基材或铜箔之间的作用。针对不同铜箔、PP(粘接片)，选用合适的树脂连接料也就成了关键，一般来讲，对于PE、PP等非极性基材，即使进行电晕表面处理，其表面张力也只能达到38达因左右，应采用树脂结构为非极性的如氯化聚丙烯类树脂连接料；而对于PET、PA等表面极性基材，则可采用聚氨酯类树脂连接料。
所述油墨连接料体系通过添加少量专门用于PP、PE的附着力促进剂，或用氯化聚丙烯类树脂少量与聚氨酯树脂拼用作为水性丙烯酸树脂的添加剂，可以解决在非极性基材上的附着力问题(抗镀或非极性作用)，已经能够做到一种树脂连接料通用性的问题，同时解决了以氯化聚丙烯树脂为连接料容易出现的甲苯溶剂残留超标的问题，在提倡绿色环保的21世纪，这点突破显得尤为重要。
附图说明
图1为本发明的结构示意图；
图2为本发明的制备流程图。
附图标记
附图中，1为无卤抗镀树脂油墨，2为铜箔。
具体实施方式
参见图1，一种无卤抗镀覆铜板，包括绝缘层以及固定于绝缘层端面的铜箔，所述绝缘层采用无卤抗镀树脂材料制作。所述无卤抗镀树脂材料为无卤抗镀树脂油墨。所述无卤抗镀树脂油墨由以下质量分数的原材料制得：水性丙烯酸树脂60-80％，氯化聚丙烯类树脂2-5％，聚氨酯树脂3-6％，水性色浆3-10％，去离子水5-10％，余量为氨水。所述水性丙烯酸树脂由以下质量份的原材料制得：甲基丙烯酸甲脂10-16份，丙烯酸丁脂14-20份，丙烯酸4-8份，丙烯酸羟乙脂1.5-2.5份，双丙酮丙烯酰胺0.5-1份，丙二甲醚醋酸脂38-45份，二甲基甲酰胺14-20份，氧乙烯醚2-4份，聚丙烯酸钠2-6份，偶氮二异丁腈0.5-1份，己二酸二酰肼0.6-0.8份，三乙胺1.2-2.8份，氨水2-5份，蒸馏水40-60份。
参见图2，所述无卤抗镀树脂油墨通过丝网印刷的方式丝印到铜箔上。通过丝印网版的目数及丝印的次数控制绝缘层厚度。所述绝缘层两端面上均设有铜箔，当绝缘层丝印到一张铜箔上后，另一张铜箔热压固定到绝缘层上。无卤抗镀覆铜板上设有法向通孔，可以作为芯板与普通覆铜板组成多层板，由于法向通孔的绝缘层不能电镀，而普通覆铜板的法向通孔绝缘层可以电镀，因此可实现孔内选择性镀铜工艺，解决背钻0stub技术，提升PCB信号传输速率。
将无卤抗镀覆铜板放置在氢氧化钠溶液中浸泡，褪除无卤抗镀树脂油墨，实现横向布孔。根据氢氧化钠溶液浓度、浸泡时间决定横向布孔的深度；所述横向布孔的孔径等于无卤抗镀树脂油墨的厚度。
最后说明的是，以上优选实施例仅用以说明本发明的技术方案而非限制，尽管通过上述优选实施例已经对本发明进行了详细的描述，但本领域技术人员应当理解，可以在形式上和细节上对其作出各种各样的改变，而不偏离本发明权利要求书所限定的范围。
Claims (6)
1.一种无卤抗镀覆铜板，包括绝缘层以及固定于绝缘层端面的铜箔，其特征在于，所述绝缘层采用无卤抗镀树脂材料制作；
所述无卤抗镀树脂材料为无卤抗镀树脂油墨；
将无卤抗镀覆铜板放置在氢氧化钠溶液中浸泡，褪除无卤抗镀树脂油墨，实现层与层间隔断；
根据氢氧化钠溶液浓度、浸泡时间决定横向布孔的深度；所述横向布孔的孔径等于无卤抗镀树脂油墨的厚度；
所述绝缘层两端面上均设有铜箔，无卤抗镀覆铜板上设有法向通孔，作为芯板与普通覆铜板组成多层板，由于法向通孔的绝缘层不能电镀，而普通覆铜板的法向通孔绝缘层能够电镀，因此实现孔内选择性镀铜工艺。
2.根据权利要求1所述的一种无卤抗镀覆铜板，其特征在于，所述无卤抗镀树脂油墨由以下质量分数的原材料制得：水性丙烯酸树脂60-80%，氯化聚丙烯类树脂2-5%，聚氨酯树脂3-6%，水性色浆3-10%，去离子水5-10%，余量为氨水。
3.根据权利要求2所述的一种无卤抗镀覆铜板，其特征在于，所述水性丙烯酸树脂由以下质量份的原材料制得：甲基丙烯酸甲脂10-16份，丙烯酸丁脂14-20份，丙烯酸4-8份，丙烯酸羟乙脂1.5-2.5份，双丙酮丙烯酰胺0.5-1份，丙二甲醚醋酸脂38-45份，二甲基甲酰胺14-20份，氧乙烯醚2-4份，聚丙烯酸钠2-6份，偶氮二异丁腈0.5-1份，己二酸二酰肼0.6-0.8份，三乙胺1.2-2.8份，氨水2-5份，蒸馏水40-60份。
4.根据权利要求1所述的一种无卤抗镀覆铜板，其特征在于，所述无卤抗镀树脂油墨通过丝网印刷的方式丝印到铜箔上。
5.根据权利要求4所述的一种无卤抗镀覆铜板，其特征在于，通过丝印网版的目数及丝印的次数控制绝缘层厚度。
6.根据权利要求4所述的一种无卤抗镀覆铜板，其特征在于，所述绝缘层两端面上均设有铜箔，当绝缘层丝印到一张铜箔上后，另一张铜箔热压固定到绝缘层上。
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