CN108988121A - Optical devices and equipment - Google Patents
Optical devices and equipment Download PDFInfo
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- CN108988121A CN108988121A CN201810829128.7A CN201810829128A CN108988121A CN 108988121 A CN108988121 A CN 108988121A CN 201810829128 A CN201810829128 A CN 201810829128A CN 108988121 A CN108988121 A CN 108988121A
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- conductive film
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S5/00—Semiconductor lasers
- H01S5/04—Processes or apparatus for excitation, e.g. pumping, e.g. by electron beams
- H01S5/042—Electrical excitation ; Circuits therefor
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- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06V—IMAGE OR VIDEO RECOGNITION OR UNDERSTANDING
- G06V40/00—Recognition of biometric, human-related or animal-related patterns in image or video data
- G06V40/10—Human or animal bodies, e.g. vehicle occupants or pedestrians; Body parts, e.g. hands
- G06V40/16—Human faces, e.g. facial parts, sketches or expressions
- G06V40/161—Detection; Localisation; Normalisation
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- Engineering & Computer Science (AREA)
- General Physics & Mathematics (AREA)
- General Health & Medical Sciences (AREA)
- Optics & Photonics (AREA)
- Health & Medical Sciences (AREA)
- Electromagnetism (AREA)
- Oral & Maxillofacial Surgery (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Human Computer Interaction (AREA)
- Multimedia (AREA)
- Theoretical Computer Science (AREA)
- Geophysics And Detection Of Objects (AREA)
- Laser Beam Processing (AREA)
Abstract
The disclosure is directed to a kind of Optical devices and equipment.The Optical devices include: surface-emitting laser, impedance detection circuit, controller and go out the optical module in light optical path positioned at surface-emitting laser；Optical module includes bracket and the diffraction optical element DOE positioned at internal stent, pairs of conductive contact is provided on the inner sidewall of bracket, the light output surface of DOE is attached with the conductive film of predetermined material formation, is connected between the edge of conductive film and pairs of conductive contact by conductive materials；Impedance detection circuit is connect with pairs of conductive contact and controller respectively；Controller is also connect with surface-emitting laser, controller be used for the impedance that impedance detection circuit detects not within a preset range when, control surface-emitting laser close.The disclosure is avoided since the position DOE is mobile or the damaged laser for causing surface-emitting laser to emit is not dissipated uniformly, and single-point energy is excessively high to be caused to cause human eye expendable injury, improves safety.
Description
Technical field
This disclosure relates to optical technical field more particularly to a kind of Optical devices and equipment.
Background technique
Currently, more and more equipment support the face identification functions based on surface-emitting laser.
In the related technology, due to laser energy with higher, the laser direct irradiation human eye tool of homogenization is not broken up
It is dangerous.Therefore, surface-emitting laser usually requires to combine diffraction optical element (Diffractive Optical
Elements, DOE) laser of aggregation is broken up after launch as uniform area source.DOE break up after single point laser intensity
It is harmless, but the risk that DOE has position mobile or damaged in equipment use process swashs once DOE is damaged or position is mobile
Light is not dissipated uniformly, and single-point energy is excessively high to cause expendable injury to human eye.
Summary of the invention
To overcome the problems in correlation technique, the disclosure provides a kind of Optical devices and equipment.
According to the first aspect of the embodiments of the present disclosure, a kind of Optical devices are provided, comprising: surface-emitting laser, impedance inspection
Slowdown monitoring circuit, controller and go out the optical module in light optical path positioned at the surface-emitting laser；Wherein,
The optical module includes bracket and the diffraction optical element DOE positioned at the internal stent, the inner sidewall of the bracket
On be provided with pairs of conductive contact, the light output surface of the DOE is attached with the conductive film of predetermined material formation, the conductive film
Edge and the pairs of conductive contact between pass through conductive materials connect；
The impedance detection circuit is connect with the pairs of conductive contact and the controller respectively；
The controller is also connect with the surface-emitting laser, what which was used to detect in the impedance detection circuit
Impedance not within a preset range when, control the surface-emitting laser closing.
In a kind of design in the cards, multipair pairs of conductive contact, the DOE are provided on the inner sidewall of the bracket
Light output surface on be attached with multiple conductive films, the edge of each conductive film and the pairs of conductive contact of corresponding a pair it
Between connected by the conductive materials.
In a kind of design in the cards, clearance for insulation respectively is provided between the conductive film.
In a kind of design in the cards, multiple conductive film is covered with the light output surface of the DOE.
In a kind of design in the cards, the multipair pairs of conductive contact is symmetrical.
In a kind of design in the cards, the edge which connect with the conductive contact extends to the DOE's
Edge.
In a kind of design in the cards, the impedance which is also used to detect in the impedance detection circuit exists
When in preset range, controls the surface-emitting laser and continue working.
In a kind of design in the cards, pass through conduction between the edge of the conductive film and the pairs of conductive contact
Substance welds bonding connection.
In a kind of design in the cards, which is the contact formed by conducting foam.
In a kind of design in the cards, which is tin indium oxide ITO.
In a kind of design in the cards, which is light transmission and frangible material.
In a kind of design in the cards, which is vertical cavity surface emitting laser VCSEL.
According to the second aspect of an embodiment of the present disclosure, a kind of equipment is provided, which includes Optical devices；The Optical devices
Include: surface-emitting laser, impedance detection circuit, controller and goes out optics group in light optical path positioned at the surface-emitting laser
Part；Wherein,
The optical module includes bracket and the diffraction optical element DOE positioned at the internal stent, the inner sidewall of the bracket
On be provided with pairs of conductive contact, the light output surface of the DOE is attached with the conductive film of predetermined material formation, the conductive film
Edge and the pairs of conductive contact between pass through conductive materials connect；
The impedance detection circuit is connect with the pairs of conductive contact and the controller respectively；
The controller is also connect with the surface-emitting laser, what which was used to detect in the impedance detection circuit
Impedance not within a preset range when, control the surface-emitting laser closing.
In a kind of design in the cards, multipair pairs of conductive contact, the DOE are provided on the inner sidewall of the bracket
Light output surface on be attached with multiple conductive films, the edge of each conductive film and the pairs of conductive contact of corresponding a pair it
Between connected by the conductive materials.
In a kind of design in the cards, clearance for insulation respectively is provided between the conductive film.
In a kind of design in the cards, multiple conductive film is covered with the light output surface of the DOE.
In a kind of design in the cards, the multipair pairs of conductive contact is symmetrical.
In a kind of design in the cards, the edge which connect with the conductive contact extends to the DOE's
Edge.
In a kind of design in the cards, the impedance which is also used to detect in the impedance detection circuit exists
When in preset range, controls the surface-emitting laser and continue working.
In a kind of design in the cards, pass through conduction between the edge of the conductive film and the pairs of conductive contact
Substance welds bonding connection.
In a kind of design in the cards, which is the contact formed by conducting foam.
In a kind of design in the cards, which is tin indium oxide ITO.
In a kind of design in the cards, which is light transmission and frangible material.
In a kind of design in the cards, which is vertical cavity surface emitting laser VCSEL.
The technical scheme provided by this disclosed embodiment can include the following benefits: be provided on the inner sidewall of bracket
Pairs of conductive contact, the light output surface of the DOE be attached with predetermined material formation conductive film, the edge of the conductive film with
It being connected between the pairs of conductive contact by conductive materials, impedance detection circuit is connect with the pairs of conductive contact respectively,
For detecting the impedance between conductive film and conductive contact, controller connects with impedance detection circuit and surface-emitting laser respectively
Connect, the impedance for being detected in impedance detection circuit not within a preset range when, control the surface-emitting laser closing, by
When the position DOE is mobile or damaged, the variation of impedance between conductive contact and conductive film can be caused, in conductive contact and conductive thin
Between film impedance not within a preset range when, control surface-emitting laser closing, can be to avoid since the position DOE is mobile or damaged
The laser for causing surface-emitting laser to emit is not dissipated uniformly, and single-point energy is excessively high to be caused to cause human eye expendable wound
Harmful problem, improves safety.
It should be understood that above general description and following detailed description be only it is exemplary and explanatory, not
The disclosure can be limited.
Detailed description of the invention
The drawings herein are incorporated into the specification and forms part of this specification, and shows and meets implementation of the invention
Example, and be used to explain the principle of the present invention together with specification.
Fig. 1 is a kind of block diagram one of Optical devices shown according to an exemplary embodiment；
Fig. 2 is a kind of block diagram two of Optical devices shown according to an exemplary embodiment；
Fig. 3 is a kind of block diagram of the Optical devices shown according to another exemplary embodiment；
Fig. 4 is a kind of block diagram of the Optical devices shown according to a further exemplary embodiment；
Fig. 5 is a kind of block diagram of the Optical devices shown according to a further exemplary embodiment；
Fig. 6 is a kind of block diagram of the Optical devices shown according to a further exemplary embodiment；
Fig. 7 is a kind of block diagram of the Optical devices shown according to a further exemplary embodiment；
Fig. 8 is the block diagram of equipment 800 shown according to an exemplary embodiment.
Specific embodiment
Example embodiments are described in detail here, and the example is illustrated in the accompanying drawings.Following description is related to
When attached drawing, unless otherwise indicated, the same numbers in different drawings indicate the same or similar elements.Following exemplary embodiment
Described in embodiment do not represent all embodiments consistented with the present invention.On the contrary, they be only with it is such as appended
The example of device and method being described in detail in claims, some aspects of the invention are consistent.
Fig. 1 is a kind of block diagram one of Optical devices shown according to an exemplary embodiment, and Fig. 2 is according to an exemplary reality
Apply a kind of block diagram two of the Optical devices exemplified.As depicted in figs. 1 and 2, the Optical devices of the present embodiment may include: face hair
It penetrates laser (not shown), impedance detection circuit 11, controller 12 and goes out the light in light optical path positioned at the surface-emitting laser
Learn component；Wherein, which includes bracket 13 and the DOE 14 inside the bracket 13, the inner sidewall of the bracket 13
On be provided with pairs of conductive contact 131, the light output surface of the DOE 14 is attached with the conductive film 141 of predetermined material formation,
It is connected between the edge of the conductive film 141 and the pairs of conductive contact 131 by conductive materials；The impedance detection circuit 11
It is connect respectively with the pairs of conductive contact 131 and the controller 12；The controller 12 is also connect with the surface-emitting laser,
The controller 12 be used for the obtained impedance of the impedance detection circuit 11 detection not within a preset range when, control the surface launching and swash
Light device is closed.
Wherein, when impedance detection circuit 11 detect obtained impedance not within a preset range when, can indicate that the position DOE is moved
It is dynamic or damaged；When impedance detection circuit 11 detects obtained impedance within a preset range, can indicate the position DOE do not move and
It is not damaged.I.e., it is possible to the impedance between conductive film 141 and conductive contact 131 be detected by impedance detection circuit 11, to detect
The position of DOE is mobile and damaged.Optionally, preset range can be determined by experiment.
Specifically, the conductive contact 131 of conductive film 141 and bracket 13 that the light output surface of DOE 14 adheres to is based on conduction
After substance connection, the impedance between conductive film 141 and conductive contact 131 can detecte by impedance detection circuit 11.If
DOE14 does not have position mobile or breakage, then the impedance that impedance detection circuit 11 detects is maintained at a certain range (that is, default
Range) within, at this time it is considered that DOE 14 is normal, i.e. DOE 14 is mobile or damaged without position.Once 14 position DOE is moved
Dynamic or damaged, the impedance between conductive film 141 and conductive contact 131 is affected, and causes conductive film 141 and conductive contact
The great variety of 131 impedances, impedance detection circuit 11 detects impedance great change at this time, and controller 12 can control surface launching and swash
Light device is closed, so that surface-emitting laser no longer emits laser.
It, can be with the relative position of conductive contact 131 and conductive film it should be noted that when 14 position DOE is mobile
It changes, so as to cause the variation of impedance between conductive contact 131 and conductive film 141.When DOE 14 is damaged, can cause
The damage (for example, fracture) of conductive film 141, and then cause the variation of 141 conductive characteristic of conductive film, so as to cause conduction touching
The variation of impedance between point 131 and conductive film 141.Specifically, the position of DOE 14 is mobile or damaged, conductive touching can be caused
The increase of impedance between point 131 and conductive film 141.
Optionally, which is specifically as follows vertical cavity surface emitting laser (Vertical Cavity
SurfaceEmitting Laser, VCSEL).
Optionally, impedance detection circuit 11 can be any circuit for being able to detect impedance.Specifically, impedance detection circuit
11 can form the circuit of closed loop with pairs of conductive contact 131, for detecting between conductive film 141 and conductive contact 131
Impedance.
Wherein, controller 12 can be used for controlling surface-emitting laser closing.It should be noted that being controlled for controller 12
The concrete mode that emitting laser processed is closed, the disclosure are not construed as limiting.Optionally, can output control signal by way of,
Surface-emitting laser is controlled to close.For example, control signal can be for example the control letter of control cutting surface-emitting laser power supply
Number.
Further alternative, impedance detection circuit 11 can be also used for judging whether the impedance that its detection obtains is being preset
In range；Alternatively, controller 12, can be also used for judging that whether impedance detection circuit 11 detects obtained impedance in preset range
It is interior；Alternatively, decision circuitry can also be connected between impedance detection circuit 11 and control circuit 12, for judging impedance detection electricity
Whether within a preset range to detect obtained impedance in road 11.
Optionally, in order to enable the conductive characteristic of conductive film can sensitively react the breakage of DOE, and will not be to light
Intensity affects greatly, and default substance can be light transmission and frangible material.Specifically, default substance can be big for conductivity
In default conductivity, and mechanical stress is greater than or equal to the material of default stress.Wherein, presetting conductivity and default stress can be with
It is determined according to experiment.Default substance for example can be tin indium oxide (Indium tin oxide, ITO).
It should be noted that forming the concrete mode of conductive film 141 for the light output surface of DOE 14, the disclosure is not made
It limits.It optionally, can be the light output surface that default substance is attached to DOE 14 by way of vapor deposition, to form conductive mill
At 141.
Optionally, it is preferably connected between the edge of conductive film 141 and conductive contact 131 to realize, conductive contact
It is specifically as follows the contact formed by the conductive materials with certain retractility.Further alternative, conductive contact can serve as reasons
The contact that conducting foam is formed.It should be noted that for the shapes and sizes of conductive contact 131, the disclosure is not construed as limiting.Example
Such as, conductive contact 131 can be rectangle.
It should be noted that for realizing what the edge of conductive film 141 was connect with conductive contact 131 by conductive materials
Concrete technology, the disclosure are not construed as limiting.For example, passing through between the edge of the conductive film 141 and the pairs of conductive contact 131
Conductive materials weld (bonding) connection.Here, conductive materials for example can be anisotropy conductiving glue (Anisotropic
Conductive Films, ACF).
Optionally, it is connect with conductive contact 131 by default substance for the ease of the edge of conductive film 141, such as Fig. 1 institute
Show, the edge which connect with conductive contact 131 can extend to the edge of DOE 14.
Optionally, when impedance detection circuit 11 detects obtained impedance within a preset range, controller 12 can not be made
Any operation；Alternatively, controller 12, it is also used to the control when impedance detection circuit 11 detects obtained impedance within a preset range
Surface-emitting laser processed continues working, so that emitting laser can continue transmitting laser, is convenient for recognition of face.
It should be noted that being located at lower right in Fig. 1 with conductive film 141, and conductive film 141 is not covered with DOE14's
For light output surface, optionally, conductive film 141 can also be located at the other positions of 14 light output surface of DOE.Optionally, in order to
The detection sensitivity mobile and damaged for 14 position DOE is improved, conductive film 141 can be covered with the light output surface of DOE 14.
In Fig. 1 by taking the shape of conductive module 141 is square as an example, optionally, conductive film may be other shapes, such as rectangular
Shape, diamond shape etc., the disclosure is not construed as limiting this.
Optical devices provided in this embodiment, pairs of conductive contact is provided on the inner sidewall of bracket, and the DOE's goes out light
Surface is attached with the conductive film of predetermined material formation, by leading between the edge of the conductive film and the pairs of conductive contact
Isoelectric substance connection, impedance detection circuit is connect with the pairs of conductive contact respectively, for detecting conductive film and conductive contact
Between impedance, controller is connect with impedance detection circuit and surface-emitting laser respectively, for detecting in impedance detection circuit
The impedance arrived not within a preset range when, control surface-emitting laser closing, due to the position DOE is mobile or it is damaged when, can draw
Rise between conductive contact and conductive film impedance variation, between conductive contact and conductive film impedance not within a preset range when,
Surface-emitting laser closing is controlled, it can be to avoid since the position DOE is mobile or breakage leads to swashing for surface-emitting laser transmitting
Light is not dissipated uniformly, and single-point energy is excessively high to lead to the problem of causing expendable injury to human eye, improves safety.
Optionally, 14 position DOE is moved and damaged detection sensitivity, the inner sidewall of the bracket 13 in order to improve
On be provided with multipair pairs of conductive contact 131, be attached with multiple conductive films 141 on the light output surface of the DOE 14, each
It is connected between the edge of conductive film 141 conductive contact 131 pairs of with corresponding a pair by the conductive materials.Optionally,
The shape of multiple conductive films 141 can it is identical, part is identical or entirely different, the disclosure is not construed as limiting this.
Alternatively, the edge of each conductive film 141 can lead between corresponding multipair pairs of conductive contact 131
Cross conductive materials connection.Here, between the edge of each conductive film 141 and corresponding multipair pairs of conductive contact 131
It is connected by the conductive materials, can be further improved sensitivity, but cost is more, designs more complicated.
It should be noted that when being provided with multipair pairs of conductive contact 131, impedance detection circuit 11 can with it is each pair of
Pairs of conductive contact 131 forms independent closed loop circuit, for detecting between each pair of conductive contact 131 and conductive film 141
Impedance.
It is further alternative, in order to avoid due to influencing each other between different conductive films, and cause impedance detection electric
It detects obtained impedance and fails to reflect that the position DOE is mobile or damaged or erroneous detection measures that the position DOE is mobile or damaged to ask in road 11
It inscribes, clearance for insulation can be set between each conductive film 141.
Optionally, 14 position DOE is moved and damaged detection sensitivity, multiple conduction in order to further increase
Film 141 is covered with the light output surface of the DOE 14.
Optionally, the multipair pairs of conductive contact is symmetrical.
On the basis of the above embodiments, it is square with the shape of conductive film, the inner sidewall of bracket is provided with 8 and leads
Electric contact, the light output surface of DOE are attached with 4 conductive films, and 4 conductive films are covered with the light output surface of DOE, and conductive film
Edge extend to for the edge of DOE.As shown in figure 3,8 conductive contacts are respectively a, b, c, d, e, f, g and h, wherein a
It can be a pair of conductive contact with b, be connect with the edge of conductive film A by conductive materials；C and d can touch for a pair of conductive
Point is connect with the edge of conductive film B by conductive materials；E and f can be a pair of conductive contact, the edge with conductive film C
It is connected by conductive materials；G and h can be a pair of conductive contact, be connect with the edge of conductive film D by conductive materials.
It is connect respectively with pairs of conductive contact a and b it should be noted that only showing impedance detection circuit in Fig. 3, it can be with
Understand, in specific implementation, impedance detection circuit needs to lead with each pair of pairs of in 4 pairs of pairs of conductive contacts respectively
Electric contact connection, for detecting the impedance between each pair of conductive contact and conductive film.
As shown in figure 3, clearance for insulation 142 can be set between each conductive film 141.
On the basis of the above embodiments, using the shape of conductive film as rectangle, the inner sidewall of bracket is provided with 4 and leads
Electric contact, the light output surface of DOE are attached with 2 conductive films, and 2 conductive films are covered with the light output surface of DOE, and conductive film
Edge extend to for the edge of DOE.As shown in figure 4,4 conductive contacts are respectively a, b, c and d, wherein a and b can be
A pair of conductive contact is connect with the edge of conductive film A by conductive materials；C and d can be a pair of conductive contact, with conduction
The edge of film B is connected by conductive materials.
It is connect respectively with pairs of conductive contact a and b it should be noted that only showing impedance detection circuit in Fig. 4, it can be with
Understand, in specific implementation, impedance detection circuit needs to lead with each pair of pairs of in 2 pairs of pairs of conductive contacts respectively
Electric contact connection, for detecting the impedance between each pair of conductive contact and conductive film.
As shown in figure 4, clearance for insulation 142 can be set between each conductive film 141.
On the basis of the above embodiments, using the shape of conductive film as rectangle, the inner sidewall of bracket is provided with 6 and leads
Electric contact, the light output surface of DOE are attached with 3 conductive films, and 3 conductive films are covered with the light output surface of DOE, and conductive film
Edge extend to for the edge of DOE.As shown in figure 5,6 conductive contacts are respectively a, b, c, d, e and f, wherein a and b can
Think a pair of conductive contact, is connect with the edge of conductive film A by conductive materials；C and d can be a pair of conductive contact, with
The edge of conductive film B is connected by conductive materials；E and f can be a pair of conductive contact, pass through with the edge of conductive film C
Conductive materials connection.
It is connect respectively with pairs of conductive contact a and b it should be noted that only showing impedance detection circuit in Fig. 5, it can be with
Understand, in specific implementation, impedance detection circuit needs to lead with each pair of pairs of in 3 pairs of pairs of conductive contacts respectively
Electric contact connection, for detecting the impedance between each pair of conductive contact and conductive film.
As shown in figure 5, clearance for insulation 142 can be set between each conductive film 141.
On the basis of the above embodiments, using the shape of conductive film as triangle, the inner sidewall of bracket is provided with 4 and leads
Electric contact, the light output surface of DOE are attached with 2 conductive films, and 2 conductive films are covered with the light output surface of DOE, and conductive film
Edge extend to for the edge of DOE.As shown in fig. 6,4 conductive contacts are respectively a, b, c and d, wherein a and b can be
A pair of conductive contact is connect with the edge of conductive film A by conductive materials；C and d can be a pair of conductive contact, with conduction
The edge of film B is connected by conductive materials.
It is connect respectively with pairs of conductive contact a and b it should be noted that only showing impedance detection circuit in Fig. 6, it can be with
Understand, in specific implementation, impedance detection circuit needs to lead with each pair of pairs of in 2 pairs of pairs of conductive contacts respectively
Electric contact connection, for detecting the impedance between each pair of conductive contact and conductive film.
As shown in fig. 6, clearance for insulation 142 can be set between each conductive film 141.
On the basis of the above embodiments, using the shape of conductive film as triangle, the inner sidewall of bracket is provided with 8 and leads
Electric contact, the light output surface of DOE are attached with 4 conductive films, and 4 conductive films are covered with the light output surface of DOE, and conductive film
Edge extend to for the edge of DOE.As shown in fig. 7,8 conductive contacts are respectively a, b, c, d, e, f, g and h, wherein a
It can be a pair of conductive contact with b, be connect with the edge of conductive film A by conductive materials；C and d can touch for a pair of conductive
Point is connect with the edge of conductive film B by conductive materials；E and f can be a pair of conductive contact, the edge with conductive film C
It is connected by conductive materials；G and h can be a pair of conductive contact, be connect with the edge of conductive film D by conductive materials.
It is connect respectively with pairs of conductive contact a and b it should be noted that only showing impedance detection circuit in Fig. 7, it can be with
Understand, in specific implementation, impedance detection circuit needs to lead with each pair of pairs of in 4 pairs of pairs of conductive contacts respectively
Electric contact connection, for detecting the impedance between each pair of conductive contact and conductive film.
As shown in fig. 7, clearance for insulation 142 can be set between each conductive film 141.
Fig. 8 is the block diagram of equipment 800 shown according to an exemplary embodiment.For example, equipment 800 can be mobile electricity
Words, computer, digital broadcast equipment, messaging devices, game console, tablet device, Medical Devices, body-building equipment are a
Personal digital assistant etc..
Referring to Fig. 8, equipment 800 may include following one or more components: processing component 802, memory 804, power supply
Component 806, multimedia component 808, audio component 810, the interface 812 of input/output (I/O), sensor module 814, and
Communication component 816.
Processing component 802 usually control equipment 800 integrated operation, such as with display, telephone call, data communication, phase
Machine operation and record operate associated operation.Processing component 802 may include that one or more processors 820 refer to execute
It enables, to perform all or part of the steps of the methods described above.In addition, processing component 802 may include one or more modules, just
Interaction between processing component 802 and other assemblies.For example, processing component 802 may include multi-media module, it is more to facilitate
Interaction between media component 808 and processing component 802.
Memory 804 is configured as storing various types of data to support the operation in equipment 800.These data are shown
Example includes the instruction of any application or method for operating in equipment 800, contact data, and telephone book data disappears
Breath, picture, video etc..Memory 804 can be by any kind of volatibility or non-volatile memory device or their group
It closes and realizes, such as static random access memory (SRAM), electrically erasable programmable read-only memory (EEPROM) is erasable to compile
Journey read-only memory (EPROM), programmable read only memory (PROM), read-only memory (ROM), magnetic memory, flash
Device, disk or CD.
Power supply module 806 provides electric power for the various assemblies of equipment 800.Power supply module 806 may include power management system
System, one or more power supplys and other with for equipment 800 generate, manage, and distribute the associated component of electric power.
Multimedia component 808 includes the screen of one output interface of offer between the equipment 800 and user.Some
In embodiment, screen may include liquid crystal display (LCD) and touch panel (TP).If screen includes touch panel, screen
It may be implemented as touch screen, to receive input signal from the user.Touch panel includes one or more touch sensors
To sense the gesture on touch, slide, and touch panel.The touch sensor can not only sense the side of touch or sliding action
Boundary, but also detect duration and pressure relevant to the touch or slide.In some embodiments, multimedia component
808 include a front camera and/or rear camera.When equipment 800 is in operation mode, such as screening-mode or video screen module
When formula, front camera and/or rear camera can receive external multi-medium data.Each front camera and postposition are taken the photograph
As head can be a fixed optical lens system or have focusing and optical zoom capabilities.
Audio component 810 is configured as output and/or input audio signal.For example, audio component 810 includes a Mike
Wind (MIC), when equipment 800 is in operation mode, when such as call mode, recording mode, and voice recognition mode, microphone is matched
It is set to reception external audio signal.The received audio signal can be further stored in memory 804 or via communication set
Part 816 is sent.In some embodiments, audio component 810 further includes a loudspeaker, is used for output audio signal.
I/O interface 812 provides interface between processing component 802 and peripheral interface module, and above-mentioned peripheral interface module can
To be keyboard, click wheel, button etc..These buttons may include, but are not limited to: home button, volume button, start button and lock
Determine button.
Sensor module 814 includes one or more sensors, and the state for providing various aspects for equipment 800 is commented
Estimate.For example, sensor module 814 can detecte the state that opens/closes of equipment 800, the relative positioning of component, such as the group
Part is the display and keypad of equipment 800, and sensor module 814 can be with 800 1 components of detection device 800 or equipment
Position change, the existence or non-existence that user contacts with equipment 800, the temperature in 800 orientation of equipment or acceleration/deceleration and equipment 800
Degree variation.Sensor module 814 may include proximity sensor, be configured to detect without any physical contact attached
The presence of nearly object.Sensor module 814 can also include optical sensor, such as CMOS or ccd image sensor, for being imaged
It is used in.In some embodiments, the sensor module 814 can also include acceleration transducer, gyro sensor,
Magnetic Sensor, pressure sensor or temperature sensor.
Communication component 816 is configured to facilitate the communication of wired or wireless way between equipment 800 and other equipment.Equipment
800 can access the wireless network based on communication standard, such as WiFi, 2G or 3G or their combination.In an exemplary implementation
In example, communication component 816 receives broadcast singal or broadcast related information from external broadcasting management system via broadcast channel.
In one exemplary embodiment, which further includes near-field communication (NFC) module, to promote short range communication.Example
Such as, NFC module can be based on radio frequency identification (RFID) technology, Infrared Data Association (IrDA) technology, ultra wide band (UWB) technology,
Bluetooth (BT) technology and other technologies are realized.
In the exemplary embodiment, equipment 800 can be believed by one or more application specific integrated circuit (ASIC), number
Number processor (DSP), digital signal processing appts (DSPD), programmable logic device (PLD), field programmable gate array
(FPGA), controller, microcontroller, microprocessor or other electronic components are realized.
In the exemplary embodiment, a kind of non-transitorycomputer readable storage medium including instruction, example are additionally provided
It such as include the memory 804 of instruction.For example, the non-transitorycomputer readable storage medium can be ROM, random access memory
Device (RAM), CD-ROM, tape, floppy disk and optical data storage devices etc..
Wherein, equipment 800 may include Optical devices.The Optical devices, comprising:
The Optical devices include: surface-emitting laser, impedance detection circuit, controller and are located at the surface-emitting laser
Optical module in light optical path out；Wherein,
The optical module includes bracket and the diffraction optical element DOE positioned at the internal stent, the inner sidewall of the bracket
On be provided with pairs of conductive contact, the light output surface of the DOE is attached with the conductive film of predetermined material formation, the conductive film
Edge and the pairs of conductive contact between pass through conductive materials connect；
The impedance detection circuit is connect with the pairs of conductive contact and the controller respectively；
The controller is also connect with the surface-emitting laser, what which was used to detect in the impedance detection circuit
Impedance not within a preset range when, control the surface-emitting laser closing.
In a kind of design in the cards, multipair pairs of conductive contact, the DOE are provided on the inner sidewall of the bracket
Light output surface on be attached with multiple conductive films, the edge of each conductive film and the pairs of conductive contact of corresponding a pair it
Between connected by the conductive materials.
In a kind of design in the cards, clearance for insulation respectively is provided between the conductive film.
In a kind of design in the cards, multiple conductive film is covered with the light output surface of the DOE.
In a kind of design in the cards, the multipair pairs of conductive contact is symmetrical.
In a kind of design in the cards, the edge which connect with the conductive contact extends to the DOE's
Edge.
In a kind of design in the cards, the impedance which is also used to detect in the impedance detection circuit exists
When in preset range, controls the surface-emitting laser and continue working.
In a kind of design in the cards, pass through conduction between the edge of the conductive film and the pairs of conductive contact
Substance welds bonding connection.
In a kind of design in the cards, which is the contact formed by conducting foam.
In a kind of design in the cards, which is tin indium oxide ITO.
In a kind of design in the cards, which is light transmission and frangible material.
In a kind of design in the cards, which is vertical cavity surface emitting laser VCSEL.
Those skilled in the art after considering the specification and implementing the invention disclosed here, will readily occur to of the invention its
Its embodiment.This application is intended to cover any variations, uses, or adaptations of the invention, these modifications, purposes or
Person's adaptive change follows general principle of the invention and including the undocumented common knowledge in the art of the disclosure
Or conventional techniques.The description and examples are only to be considered as illustrative, and true scope and spirit of the invention are wanted by right
Book is asked to point out.
It should be understood that the present invention is not limited to the precise structure already described above and shown in the accompanying drawings, and
And various modifications and changes may be made without departing from the scope thereof.The scope of the present invention is only limited by appended claims
System.
Claims (13)
1. a kind of Optical devices characterized by comprising surface-emitting laser, impedance detection circuit, controller and be located at institute
State the optical module that surface-emitting laser goes out in light optical path；Wherein,
The optical module includes bracket and the diffraction optical element DOE positioned at the internal stent, the inside of the bracket
Pairs of conductive contact is provided on wall, the light output surface of the DOE is attached with the conductive film of predetermined material formation, described to lead
It is connected between the edge of conductive film and the pairs of conductive contact by conductive materials；
The impedance detection circuit is connect with the pairs of conductive contact and the controller respectively；
The controller is also connect with the surface-emitting laser, and the controller in the impedance detection circuit for detecting
The impedance arrived not within a preset range when, control the surface-emitting laser and close.
2. Optical devices according to claim 1, which is characterized in that be provided on the inner sidewall of the bracket multipair pairs of
Conductive contact, be attached with multiple conductive films, the edge of each conductive film and corresponding one on the light output surface of the DOE
It is connected between pairs of conductive contact by the conductive materials.
3. Optical devices according to claim 2, which is characterized in that be provided between insulation between each conductive film
Gap.
4. Optical devices according to claim 2, which is characterized in that the multiple conductive film is covered with going out for the DOE
Optical surface.
5. Optical devices according to claim 2, which is characterized in that the multipair pairs of conductive contact is symmetrical.
6. Optical devices according to claim 1, which is characterized in that the conductive film is connect with the conductive contact
Edge extends to the edge of the DOE.
7. Optical devices according to any one of claims 1 to 6, which is characterized in that the controller is also used to described
The impedance that impedance detection circuit detects within a preset range when, control the surface-emitting laser and continue working.
8. Optical devices according to any one of claims 1 to 6, which is characterized in that the edge of the conductive film and institute
It states and welds bonding connection by conductive materials between pairs of conductive contact.
9. Optical devices according to any one of claims 1 to 6, which is characterized in that the conductive contact is to be steeped by conduction
The contact that cotton is formed.
10. Optical devices according to any one of claims 1 to 6, which is characterized in that the default substance is tin indium oxide
ITO。
11. Optical devices according to any one of claims 1 to 6, which is characterized in that the predetermined material be light transmission and easily
Broken material.
12. Optical devices according to any one of claims 1 to 6, which is characterized in that the surface-emitting laser is vertical
Cavity surface emitting lasers VCSEL.
13. a kind of equipment, which is characterized in that the equipment includes such as the described in any item Optical devices of claim 1-12.
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810829128.7A CN108988121B (en) | 2018-07-25 | 2018-07-25 | Optical device and apparatus |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810829128.7A CN108988121B (en) | 2018-07-25 | 2018-07-25 | Optical device and apparatus |
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| CN108988121A true CN108988121A (en) | 2018-12-11 |
| CN108988121B CN108988121B (en) | 2020-01-07 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN201810829128.7A Active CN108988121B (en) | 2018-07-25 | 2018-07-25 | Optical device and apparatus |
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| WO2020192384A1 (en) * | 2019-03-26 | 2020-10-01 | Shenzhen GOODIX Technology Co., Ltd. | Multizone illumination for optical face identification |
| CN112242641A (en) * | 2020-12-18 | 2021-01-19 | 深圳市汇顶科技股份有限公司 | Laser emission module and electronic equipment |
| CN113866678A (en) * | 2020-06-30 | 2021-12-31 | 北京小米移动软件有限公司 | Detection jig, detection method, terminal and storage medium |
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| Publication number | Publication date |
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| CN108988121B (en) | 2020-01-07 |
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