CN108987459B - A kind of power device - Google Patents
A kind of power device Download PDFInfo
- Publication number
- CN108987459B CN108987459B CN201810823511.1A CN201810823511A CN108987459B CN 108987459 B CN108987459 B CN 108987459B CN 201810823511 A CN201810823511 A CN 201810823511A CN 108987459 B CN108987459 B CN 108987459B
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- China
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- region
- ring
- injection region
- injection
- potential dividing
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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- 238000002347 injection Methods 0.000 claims abstract description 100
- 239000007924 injection Substances 0.000 claims abstract description 100
- 238000007514 turning Methods 0.000 claims abstract description 36
- 230000002093 peripheral effect Effects 0.000 claims abstract description 5
- 150000002500 ions Chemical class 0.000 claims description 13
- -1 boron ion Chemical class 0.000 claims description 4
- 229910052796 boron Inorganic materials 0.000 claims description 2
- 238000002513 implantation Methods 0.000 claims description 2
- 230000005684 electric field Effects 0.000 description 13
- 230000015556 catabolic process Effects 0.000 description 10
- 230000001413 cellular effect Effects 0.000 description 5
- 230000004048 modification Effects 0.000 description 5
- 238000012986 modification Methods 0.000 description 5
- 239000002699 waste material Substances 0.000 description 5
- 239000000463 material Substances 0.000 description 3
- 238000000034 method Methods 0.000 description 3
- 239000004065 semiconductor Substances 0.000 description 3
- 125000004122 cyclic group Chemical group 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 238000000407 epitaxy Methods 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 229920002120 photoresistant polymer Polymers 0.000 description 2
- 239000000243 solution Substances 0.000 description 2
- GYHNNYVSQQEPJS-UHFFFAOYSA-N Gallium Chemical compound [Ga] GYHNNYVSQQEPJS-UHFFFAOYSA-N 0.000 description 1
- 229910052787 antimony Inorganic materials 0.000 description 1
- WATWJIUSRGPENY-UHFFFAOYSA-N antimony atom Chemical compound [Sb] WATWJIUSRGPENY-UHFFFAOYSA-N 0.000 description 1
- 229910052785 arsenic Inorganic materials 0.000 description 1
- RQNWIZPPADIBDY-UHFFFAOYSA-N arsenic atom Chemical compound [As] RQNWIZPPADIBDY-UHFFFAOYSA-N 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 238000010276 construction Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 229910052733 gallium Inorganic materials 0.000 description 1
- 229910052738 indium Inorganic materials 0.000 description 1
- APFVFJFRJDLVQX-UHFFFAOYSA-N indium atom Chemical compound [In] APFVFJFRJDLVQX-UHFFFAOYSA-N 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
- 238000005468 ion implantation Methods 0.000 description 1
- 230000002035 prolonged effect Effects 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L29/00—Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
- H01L29/02—Semiconductor bodies ; Multistep manufacturing processes therefor
- H01L29/06—Semiconductor bodies ; Multistep manufacturing processes therefor characterised by their shape; characterised by the shapes, relative sizes, or dispositions of the semiconductor regions ; characterised by the concentration or distribution of impurities within semiconductor regions
- H01L29/0603—Semiconductor bodies ; Multistep manufacturing processes therefor characterised by their shape; characterised by the shapes, relative sizes, or dispositions of the semiconductor regions ; characterised by the concentration or distribution of impurities within semiconductor regions characterised by particular constructional design considerations, e.g. for preventing surface leakage, for controlling electric field concentration or for internal isolations regions
- H01L29/0607—Semiconductor bodies ; Multistep manufacturing processes therefor characterised by their shape; characterised by the shapes, relative sizes, or dispositions of the semiconductor regions ; characterised by the concentration or distribution of impurities within semiconductor regions characterised by particular constructional design considerations, e.g. for preventing surface leakage, for controlling electric field concentration or for internal isolations regions for preventing surface leakage or controlling electric field concentration
- H01L29/0611—Semiconductor bodies ; Multistep manufacturing processes therefor characterised by their shape; characterised by the shapes, relative sizes, or dispositions of the semiconductor regions ; characterised by the concentration or distribution of impurities within semiconductor regions characterised by particular constructional design considerations, e.g. for preventing surface leakage, for controlling electric field concentration or for internal isolations regions for preventing surface leakage or controlling electric field concentration for increasing or controlling the breakdown voltage of reverse biased devices
- H01L29/0615—Semiconductor bodies ; Multistep manufacturing processes therefor characterised by their shape; characterised by the shapes, relative sizes, or dispositions of the semiconductor regions ; characterised by the concentration or distribution of impurities within semiconductor regions characterised by particular constructional design considerations, e.g. for preventing surface leakage, for controlling electric field concentration or for internal isolations regions for preventing surface leakage or controlling electric field concentration for increasing or controlling the breakdown voltage of reverse biased devices by the doping profile or the shape or the arrangement of the PN junction, or with supplementary regions, e.g. junction termination extension [JTE]
- H01L29/063—Reduced surface field [RESURF] pn-junction structures
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Physics & Mathematics (AREA)
- Ceramic Engineering (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Thyristors (AREA)
Abstract
Description
Claims (10)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201810823511.1A CN108987459B (en) | 2018-07-25 | 2018-07-25 | A kind of power device |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201810823511.1A CN108987459B (en) | 2018-07-25 | 2018-07-25 | A kind of power device |
Publications (2)
Publication Number | Publication Date |
---|---|
CN108987459A CN108987459A (en) | 2018-12-11 |
CN108987459B true CN108987459B (en) | 2019-08-30 |
Family
ID=64550413
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN201810823511.1A Active CN108987459B (en) | 2018-07-25 | 2018-07-25 | A kind of power device |
Country Status (1)
Country | Link |
---|---|
CN (1) | CN108987459B (en) |
Families Citing this family (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN110911475A (en) * | 2019-10-30 | 2020-03-24 | 深圳深爱半导体股份有限公司 | Transistor terminal structure and manufacturing method thereof |
CN115440796B (en) * | 2022-10-24 | 2023-08-15 | 上海功成半导体科技有限公司 | Territory structure for protecting super junction device terminal |
Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN102569357A (en) * | 2010-12-28 | 2012-07-11 | 瑞萨电子株式会社 | Semiconductor device |
Family Cites Families (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP5999748B2 (en) * | 2011-08-12 | 2016-09-28 | ルネサスエレクトロニクス株式会社 | Power MOSFET, IGBT and power diode |
CN102694027B (en) * | 2012-01-13 | 2015-08-19 | 西安龙腾新能源科技发展有限公司 | The non-equilibrium junction termination structures of superjunction devices |
CN202839620U (en) * | 2012-02-29 | 2013-03-27 | 比亚迪股份有限公司 | Super junction metal oxide semiconductor field effect transistor (MOSFET) component |
CN104332489A (en) * | 2014-10-23 | 2015-02-04 | 吉林华微电子股份有限公司 | Terminal with surface super-structure and of semiconductor device |
-
2018
- 2018-07-25 CN CN201810823511.1A patent/CN108987459B/en active Active
Patent Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN102569357A (en) * | 2010-12-28 | 2012-07-11 | 瑞萨电子株式会社 | Semiconductor device |
Also Published As
Publication number | Publication date |
---|---|
CN108987459A (en) | 2018-12-11 |
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TR01 | Transfer of patent right |
Effective date of registration: 20201203 Address after: No.12, Kangping Road, Hede Town, Sheyang County, Yancheng City, Jiangsu Province Patentee after: Gu Yaoyao Address before: 518000 No. 67 Taiqian Road, Tangwei Community, Gongming Office, Guangming New District, Shenzhen City, Guangdong Province Patentee before: Wang Yonggui Patentee before: Yang Lintao Patentee before: Qiu Yiping |
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TR01 | Transfer of patent right | ||
TR01 | Transfer of patent right | ||
TR01 | Transfer of patent right |
Effective date of registration: 20211224 Address after: 224300 plot 2, north of Northwest Ring Road, Airport Road, Pioneer Park, Hede Town, Sheyang County, Yancheng City, Jiangsu Province Patentee after: Jiangsu Xinfei Electronic Technology Co.,Ltd. Address before: No.12, Kangping Road, Hede Town, Sheyang County, Yancheng City, Jiangsu Province Patentee before: Gu Yaoyao |
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TR01 | Transfer of patent right | ||
TR01 | Transfer of patent right |
Effective date of registration: 20221229 Address after: 276100 North of Tanma Road, Tancheng County, Linyi City, Shandong Province (Tancheng New Area) Patentee after: Tancheng County New Area Construction Development Co.,Ltd. Address before: 224300 plot 2, north of Northwest Ring Road, Airport Road, Pioneer Park, Hede Town, Sheyang County, Yancheng City, Jiangsu Province Patentee before: Jiangsu Xinfei Electronic Technology Co.,Ltd. |
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TR01 | Transfer of patent right | ||
TR01 | Transfer of patent right |
Effective date of registration: 20240514 Address after: 518000, A1303, Jieshun Technology Center, No. 5 Guansheng Second Road, Luhu Community, Guanhu Street, Longhua District, Shenzhen City, Guangdong Province Patentee after: Shenzhen Zhongtao Technology Co.,Ltd. Country or region after: China Address before: 276100 North of Tanma Road, Tancheng County, Linyi City, Shandong Province (Tancheng New Area) Patentee before: Tancheng County New Area Construction Development Co.,Ltd. Country or region before: China |