CN108987312A - Surface encapsulation chip automatic production line and its packaging method - Google Patents
Surface encapsulation chip automatic production line and its packaging method Download PDFInfo
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- CN108987312A CN108987312A CN201810602806.6A CN201810602806A CN108987312A CN 108987312 A CN108987312 A CN 108987312A CN 201810602806 A CN201810602806 A CN 201810602806A CN 108987312 A CN108987312 A CN 108987312A
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- 238000004519 manufacturing process Methods 0.000 title claims abstract description 38
- 238000005538 encapsulation Methods 0.000 title claims abstract description 25
- 238000000034 method Methods 0.000 title claims abstract description 18
- 238000004806 packaging method and process Methods 0.000 title claims abstract description 9
- 230000002950 deficient Effects 0.000 claims abstract description 77
- 230000007723 transport mechanism Effects 0.000 claims abstract description 19
- 238000001514 detection method Methods 0.000 claims abstract description 3
- 230000007246 mechanism Effects 0.000 claims description 28
- 238000012546 transfer Methods 0.000 claims description 8
- 238000004080 punching Methods 0.000 claims description 2
- 230000008676 import Effects 0.000 claims 1
- 239000000047 product Substances 0.000 description 46
- 238000005516 engineering process Methods 0.000 description 6
- 238000005259 measurement Methods 0.000 description 5
- 239000006227 byproduct Substances 0.000 description 3
- 238000007689 inspection Methods 0.000 description 3
- 230000004048 modification Effects 0.000 description 3
- 238000012986 modification Methods 0.000 description 3
- 238000000465 moulding Methods 0.000 description 3
- 230000005540 biological transmission Effects 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 238000009434 installation Methods 0.000 description 2
- 230000008569 process Effects 0.000 description 2
- 230000008859 change Effects 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 238000004904 shortening Methods 0.000 description 1
- 229910000679 solder Inorganic materials 0.000 description 1
- 238000012360 testing method Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67126—Apparatus for sealing, encapsulating, glassing, decapsulating or the like
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Sorting Of Articles (AREA)
Abstract
The invention discloses surface encapsulation chip automatic production line and its packaging methods, the surface encapsulation chip automatic production line, it successively include automatic charging machine, Pressesservo, sorter, transport mechanism and electric logging device, feeding manipulator is set between the automatic charging machine and Pressesservo, splicing manipulator is set between the Pressesservo and sorter, four axis robots are set between the sorter and transport mechanism.Steps are as follows for packaging method: product is sent by the feeding manipulator to the Pressesservo through automatic charging machine, product is mounted by the Pressesservo, then product is taken out by splicing manipulator and is sent to the sorter, the sorter carries out defective products judgement to product and separates non-defective unit and defective products, defective products takes out, non-defective unit is sent by four axis robot to the transport mechanism, and the transport mechanism discharges after sending product to electric logging device progress circuit detection.
Description
Technical field
The present invention relates to semiconductors, and field is made, in particular to a kind of surface encapsulation chip automatic production line and its encapsulation
Method.
Background technique
SMT, i.e. surface installation technique (Surface Mount Technology abbreviation SMT) are by hydrid integrated circuit skill
The circuit assembly technology of new generation that art develops, with the characteristics of using component surface mounting technology and reflow solder technique,
As package technique of new generation in Electronic products manufacturing.The extensive use of SMT promotes the miniaturization of electronic product, more function
Energyization provides condition for mass production, Low Defectivity production.SMT is exactly surface installation technique, is by hydrid integrated circuit
The circuit assembly technology of a new generation that technology develops.
SMT stamp at present, electrical measurement, balance remain as manually operation, and homework precision is low, high labor cost, and quality is hidden
Suffer from big.As the shortening of electronic product life cycle and the unit price of product gradually reduce, it is a kind of for improving the speed of production
Reduce the important means of production cost.
Summary of the invention
The present invention provides a kind of surface encapsulation chip automatic production lines, to solve the above problems.
In order to solve the above-mentioned technical problem, the technical scheme is that
A kind of surface encapsulation chip automatic production line successively includes automatic charging machine, Pressesservo, sorter, transmission
Feeding manipulator, the Pressesservo and sorter is arranged in mechanism and electric logging device between the automatic charging machine and Pressesservo
Between splicing manipulator is set, four axis robots are set between the sorter and transport mechanism.
Preferably, the Pressesservo includes upper die and lower die, the feeding manipulator by product be placed on it is described under
Mould, the upper die and lower die molding, product stay in the upper mold, and the splicing manipulator is taken out product and sent to the sorter.
Preferably, the sorter includes CCD detector, defective products box and non-defective unit box, the splicing manipulator will be produced
Product, which are arranged at the CCD detector, to be detected, and is sent non-defective unit to the non-defective unit box by four axis robot, and defective products is sent
To the defective products box.
Preferably, the sorter further includes non-defective unit box carrying cylinder, non-defective unit quantity is more, the appearance of each non-defective unit box
It measures limited, therefore the non-defective unit box carrying cylinder is set, empty non-defective unit box is sent to four axis robot to the work for placing non-defective unit
Position product to be put.
Preferably, the transport mechanism includes windrow mechanism, feeding mechanism and receiving mechanism, the windrow mechanism is used
Push plate, the receiving mechanism use body feed tank, and product balance is pushed to the feeding mechanism, the feeding mechanism by the push plate
Product is delivered to the body feed tank.
Preferably, the feeding mechanism use conveyer belt, including be arranged in conveyer belt Transfer pipe one end into
Mouthful, the outlet of the other end and the loading surface being arranged on the Transfer pipe, the body feed tank be arranged in the exit.
The present invention also provides the packaging methods of above-mentioned surface encapsulation chip automatic production line, and steps are as follows: product warp
Automatic charging machine is sent by the feeding manipulator to the Pressesservo, and product is mounted by the Pressesservo, then produced
Product are taken out by splicing manipulator and are sent to the sorter, and the sorter carries out defective products judgement to product and separates non-defective unit and not
Non-defective unit, defective products take out, and non-defective unit is sent by four axis robot to the transport mechanism, and the transport mechanism send product to institute
It states after electric logging device carries out circuit detection and discharges.
Preferably, the sorter includes CCD detector, defective products box and non-defective unit box, the splicing manipulator will be produced
Product, which are arranged at the CCD detector, to be detected, and is sent non-defective unit to the non-defective unit box by four axis robot, and defective products is sent
To the defective products box, the non-defective unit box is sent by four axis robot to the transport mechanism.
Preferably, the sorter further includes non-defective unit box carrying cylinder, the non-defective unit box carrying cylinder is by empty non-defective unit
Box send to four axis robot station product to be put for placing non-defective unit.
Compared with prior art, the invention has the following advantages that surface encapsulation chip automatic production line of the present invention,
It successively include automatic charging machine, Pressesservo, sorter, transport mechanism and electric logging device, the automatic charging machine and Pressesservo
Between feeding manipulator is set, splicing manipulator is set between the Pressesservo and sorter, and the sorter and windrow are sent
Four axis robots are set between material mechanism.The surface encapsulation chip automatic production line realizes automatic stamp, balance and electrical measurement,
Whole process manless production, effectively Improving The Quality of Products, reduces cost of labor.It is realized and is rushed by Automated production line device
Type, electrical measurement, inspection automation production, have saved production cost while having improved production efficiency and product quality.
Detailed description of the invention
Fig. 1 is the structural schematic diagram of the surface encapsulation chip automatic production line of a specific embodiment of the invention；
Fig. 2 is the schematic diagram at the A of the surface encapsulation chip automatic production line in Fig. 1 of the present invention；
Fig. 3 is the step flow chart of the method for the surface encapsulation chip of a specific embodiment of the invention.
It is as shown in the figure: 1- automatic charging machine, 11- feeding manipulator, 2- Pressesservo, 21- splicing manipulator, 22- lower die,
3- sorter, 4- transport mechanism.
Specific embodiment
In order to make the foregoing objectives, features and advantages of the present invention clearer and more comprehensible, with reference to the accompanying drawing to the present invention
Specific embodiment be described in detail.It should be noted that attached drawing of the present invention is all made of simplified form and uses non-essence
Quasi- ratio, only for the purpose of facilitating and clarifying the purpose of the embodiments of the invention.
Referring to Figure 1 and Fig. 2, a kind of surface encapsulation chip automatic production line successively includes automatic charging machine 1, servo
Punching machine 2, sorter 3, transport mechanism 4 and electric logging device (not shown).Between the automatic charging machine 1 and Pressesservo 2 in setting
Expect manipulator 11, splicing manipulator 21, the sorter 3 and transport mechanism 4 are set between the Pressesservo 2 and sorter 3
Between four axis robots (not shown) is set.
The Pressesservo 2 includes upper die and lower die 22, and product is placed in the lower die 22 by the feeding manipulator,
The upper die and lower die 22 molding attachment, product stays in the upper mold after the completion, the splicing manipulator 21 take out product send to
The sorter 3.
The sorter 3 includes CCD detector, defective products box and non-defective unit box, and product is arranged the splicing manipulator 21
Detect judgement at the CCD detector, and sent non-defective unit to the non-defective unit box by four axis robot, by defective products send to
The defective products box.The sorter 3 further includes non-defective unit box carrying cylinder, and non-defective unit quantity is more, the capacity of each non-defective unit box
Limited, non-defective unit box needs to constantly change, therefore the non-defective unit box carrying cylinder is arranged, and empty non-defective unit box is sent to the four axis machine
The station product to be put of tool hand placement non-defective unit.
The transport mechanism 4 includes windrow mechanism, feeding mechanism and receiving mechanism, and the windrow mechanism uses push plate, institute
Receiving mechanism is stated using body feed tank, product balance is pushed to the feeding mechanism by the push plate, and the feeding mechanism is by product
It is delivered to the body feed tank.The feeding mechanism use conveyer belt, including be arranged in conveyer belt Transfer pipe one end into
Mouthful, the outlet of the other end and the loading surface being arranged on the Transfer pipe, the body feed tank be arranged in the exit.
Fig. 3 is referred to, the packaging method of the surface encapsulation chip automatic production line, steps are as follows:
Product is sent by the feeding manipulator 11 to the Pressesservo 2 through automatic charging machine 1, passes through Pressesservo 2
The molding dress patch of upper die and lower die 22, then, product is taken out by splicing manipulator 21 and is sent to the sorter 3, the CCD inspection
It surveys instrument to judge product defective products, separates non-defective unit and defective products, defective products is sent to defective products box and removed by four axis robot
The surface encapsulation chip automatic production line out, non-defective unit send in non-defective unit box and by four axis robot and send to the transmission
Mechanism 4, the rushing board mechanism are sent to body feed tank by product balance, by the conveyer belt, and product is by described in the body feed tank
Electric logging device discharges after carrying out circuit test.
The surface encapsulation chip automatic production line realizes automatic stamp, balance and electrical measurement, whole process manless production,
Effectively Improving The Quality of Products reduces cost of labor.Stamp, electrical measurement, inspection automation are realized by Automated production line device
Production, has saved production cost while having improved production efficiency and product quality.
Those skilled in the art can carry out various modification and variations without departing from spirit and model of the invention to invention
It encloses.In this way, if these modifications and changes of the present invention is within the scope of the claims of the present invention and its equivalent technology, then
The invention is also intended to include including these modification and variations.
Claims (9)
1. a kind of surface encapsulation chip automatic production line, which is characterized in that successively include automatic charging machine, Pressesservo, divide
Pick machine, transport mechanism and electric logging device；Feeding manipulator, the Pressesservo are set between the automatic charging machine and Pressesservo
Splicing manipulator is set between sorter, four axis robots are set between the sorter and transport mechanism.
2. surface encapsulation chip automatic production line according to claim 1, which is characterized in that the Pressesservo includes
Upper die and lower die, the feeding manipulator place product in the lower die, and the upper die and lower die mold, and product stays on described
Mould, the splicing manipulator are taken out product and are sent to the sorter.
3. surface encapsulation chip automatic production line according to claim 1, which is characterized in that the sorter includes
CCD detector, defective products box and non-defective unit box, product is arranged at the CCD detector splicing manipulator detects, and by
Four axis robot send non-defective unit to the non-defective unit box, and defective products is sent to the defective products box.
4. surface encapsulation chip automatic production line according to claim 3, which is characterized in that the sorter further includes
Vacant non-defective unit box is sent to four axis robot work for placing non-defective unit by non-defective unit box carrying cylinder, the non-defective unit box carrying cylinder
Position product to be put.
5. surface encapsulation chip automatic production line according to claim 1, which is characterized in that the transport mechanism includes
Windrow mechanism, feeding mechanism and receiving mechanism, the windrow mechanism use push plate, and the receiving mechanism uses body feed tank, described
Product balance is pushed to the feeding mechanism by push plate, and product is delivered to the body feed tank by the feeding mechanism.
6. surface encapsulation chip automatic production line according to claim 5, which is characterized in that the feeding mechanism uses
Including Transfer pipe, import that described Transfer pipe one end is arranged in, going out for the Transfer pipe other end is arranged in conveyer belt
Mouth and the loading surface being arranged on the Transfer pipe, the body feed tank are arranged in the exit.
7. a kind of packaging method of the surface encapsulation chip automatic production line as described in claim 1~6 is any, feature exist
In steps are as follows: product is sent by the feeding manipulator to the Pressesservo through automatic charging machine, product pass through described in watch
Punching machine attachment is taken, then taken out by splicing manipulator and is sent to the sorter, the sorter carries out defective products to product and sentences
Disconnected to separate non-defective unit and defective products, defective products takes out, and non-defective unit is sent by four axis robot to the transport mechanism, the conveyer
Product after structure send product to electric logging device progress circuit detection.
8. packaging method according to claim 7, which is characterized in that the sorter includes CCD detector, defective products box
With non-defective unit box, product is placed at the CCD detector and detects by the splicing manipulator, and will be good by four axis robot
Product are sent to the non-defective unit box, defective products are sent to the defective products box, the non-defective unit box is sent by four axis robot to described
Transport mechanism.
9. packaging method according to claim 8, which is characterized in that the sorter further includes non-defective unit box carrying cylinder,
Vacant non-defective unit box is sent to four axis robot station product to be put for placing non-defective unit by the non-defective unit box carrying cylinder.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810602806.6A CN108987312A (en) | 2018-06-12 | 2018-06-12 | Surface encapsulation chip automatic production line and its packaging method |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810602806.6A CN108987312A (en) | 2018-06-12 | 2018-06-12 | Surface encapsulation chip automatic production line and its packaging method |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN108987312A true CN108987312A (en) | 2018-12-11 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201810602806.6A Pending CN108987312A (en) | 2018-06-12 | 2018-06-12 | Surface encapsulation chip automatic production line and its packaging method |
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| Country | Link |
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Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH05316400A (en) * | 1992-05-08 | 1993-11-26 | Sony Corp | Alignment method for optical axis for image pickup element |
| JP2006140350A (en) * | 2004-11-12 | 2006-06-01 | Dainippon Screen Mfg Co Ltd | Substrate processing apparatus and teaching method |
| CN105346988A (en) * | 2015-11-23 | 2016-02-24 | 东莞王氏港建机械有限公司 | Automatic board clapping and pre-aligning machine |
| CN205853421U (en) * | 2016-08-11 | 2017-01-04 | 江苏力德尔电子信息技术有限公司 | A kind of FPC automatic punching machine |
| CN107665869A (en) * | 2017-09-22 | 2018-02-06 | 上海航天测控通信研究所 | A kind of gull aerofoil profile packaging body lead automates tinning device and its wards off tin method |
| CN208622679U (en) * | 2018-06-12 | 2019-03-19 | 欣兴同泰科技（昆山）有限公司 | Surface encapsulation chip automatic production line |
-
2018
- 2018-06-12 CN CN201810602806.6A patent/CN108987312A/en active Pending
Patent Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH05316400A (en) * | 1992-05-08 | 1993-11-26 | Sony Corp | Alignment method for optical axis for image pickup element |
| JP2006140350A (en) * | 2004-11-12 | 2006-06-01 | Dainippon Screen Mfg Co Ltd | Substrate processing apparatus and teaching method |
| CN105346988A (en) * | 2015-11-23 | 2016-02-24 | 东莞王氏港建机械有限公司 | Automatic board clapping and pre-aligning machine |
| CN205853421U (en) * | 2016-08-11 | 2017-01-04 | 江苏力德尔电子信息技术有限公司 | A kind of FPC automatic punching machine |
| CN107665869A (en) * | 2017-09-22 | 2018-02-06 | 上海航天测控通信研究所 | A kind of gull aerofoil profile packaging body lead automates tinning device and its wards off tin method |
| CN208622679U (en) * | 2018-06-12 | 2019-03-19 | 欣兴同泰科技（昆山）有限公司 | Surface encapsulation chip automatic production line |
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Application publication date: 20181211 |