CN108981047A - A kind of heat exchanger and its method - Google Patents
A kind of heat exchanger and its method Download PDFInfo
- Publication number
- CN108981047A CN108981047A CN201811138949.2A CN201811138949A CN108981047A CN 108981047 A CN108981047 A CN 108981047A CN 201811138949 A CN201811138949 A CN 201811138949A CN 108981047 A CN108981047 A CN 108981047A
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- Prior art keywords
- heat exchanger
- chilling plate
- semiconductor chilling
- heat
- air
- Prior art date
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- 238000000034 method Methods 0.000 title claims description 9
- 239000004065 semiconductor Substances 0.000 claims abstract description 54
- 238000005192 partition Methods 0.000 claims abstract description 17
- 238000010438 heat treatment Methods 0.000 claims abstract description 10
- 230000007246 mechanism Effects 0.000 claims description 15
- 230000008859 change Effects 0.000 claims description 4
- 238000001816 cooling Methods 0.000 claims description 4
- 238000004891 communication Methods 0.000 claims description 3
- 238000001514 detection method Methods 0.000 claims description 3
- 230000005611 electricity Effects 0.000 claims description 3
- 239000012212 insulator Substances 0.000 claims description 3
- 230000008450 motivation Effects 0.000 claims description 2
- 238000000926 separation method Methods 0.000 claims description 2
- 238000005057 refrigeration Methods 0.000 abstract description 8
- 230000000694 effects Effects 0.000 abstract description 6
- 230000003750 conditioning effect Effects 0.000 abstract description 3
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 9
- 206010037660 Pyrexia Diseases 0.000 description 4
- 238000010586 diagram Methods 0.000 description 3
- 230000006870 function Effects 0.000 description 3
- 238000009825 accumulation Methods 0.000 description 2
- 230000009466 transformation Effects 0.000 description 2
- 238000004378 air conditioning Methods 0.000 description 1
- 238000007605 air drying Methods 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000005540 biological transmission Effects 0.000 description 1
- 238000004140 cleaning Methods 0.000 description 1
- 238000009833 condensation Methods 0.000 description 1
- 230000005494 condensation Effects 0.000 description 1
- 239000004020 conductor Substances 0.000 description 1
- 230000010259 detection of temperature stimulus Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000009467 reduction Effects 0.000 description 1
Classifications
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F24—HEATING; RANGES; VENTILATING
- F24F—AIR-CONDITIONING; AIR-HUMIDIFICATION; VENTILATION; USE OF AIR CURRENTS FOR SCREENING
- F24F5/00—Air-conditioning systems or apparatus not covered by F24F1/00 or F24F3/00, e.g. using solar heat or combined with household units such as an oven or water heater
- F24F5/0003—Exclusively-fluid systems
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F24—HEATING; RANGES; VENTILATING
- F24F—AIR-CONDITIONING; AIR-HUMIDIFICATION; VENTILATION; USE OF AIR CURRENTS FOR SCREENING
- F24F13/00—Details common to, or for air-conditioning, air-humidification, ventilation or use of air currents for screening
- F24F13/30—Arrangement or mounting of heat-exchangers
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F25—REFRIGERATION OR COOLING; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS; MANUFACTURE OR STORAGE OF ICE; LIQUEFACTION SOLIDIFICATION OF GASES
- F25B—REFRIGERATION MACHINES, PLANTS OR SYSTEMS; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS
- F25B21/00—Machines, plants or systems, using electric or magnetic effects
- F25B21/02—Machines, plants or systems, using electric or magnetic effects using Peltier effect; using Nernst-Ettinghausen effect
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F25—REFRIGERATION OR COOLING; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS; MANUFACTURE OR STORAGE OF ICE; LIQUEFACTION SOLIDIFICATION OF GASES
- F25B—REFRIGERATION MACHINES, PLANTS OR SYSTEMS; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS
- F25B39/00—Evaporators; Condensers
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- General Engineering & Computer Science (AREA)
- Chemical & Material Sciences (AREA)
- Combustion & Propulsion (AREA)
- Physics & Mathematics (AREA)
- Thermal Sciences (AREA)
- Life Sciences & Earth Sciences (AREA)
- Sustainable Development (AREA)
- Other Air-Conditioning Systems (AREA)
Abstract
The present invention relates to heat exchanger, including air hose, partition component is provided in air hose, air hose is separated into air inlet area and exhaust zone by partition component；It is provided with semiconductor chilling plate on partition component or partition component is semiconductor chilling plate；It is provided with heat-conductive assembly in air inlet area and exhaust zone, the heat-conductive assembly of the heat-conductive assembly and exhaust zone of entering the wind area is close to respectively or is fixed with the chill surface of semiconductor chilling plate and heating surface；Heat exchanger further includes the power supply for semiconductor chilling plate power supply；In use, being worked by semiconductor chilling plate, the one side of semiconductor chilling plate refrigeration reduces heat-conductive assembly temperature, it enters the wind when the wind that area enters passes through the heat-conductive assembly in it and is cooled, so that the air temperature entered the room reduces, reduce the working time of room conditioning, and then reach energy-efficient effect.
Description
Technical field
The present invention relates to technical field of heat exchange, more specifically to a kind of heat exchanger and its method.
Background technique
In air cleaning facility, existing air inlet air outlet device can only mostly realize simple air inlet/outlet, open indoors
In the case where having air conditioner refrigerating, the higher wind of temperature that the external world enters can bring biggish load to air-conditioning, so that air conditioner refrigerating
Working time is elongated, and power consumption increases.
Summary of the invention
The technical problem to be solved in the present invention is that in view of the above drawbacks of the prior art, providing a kind of heat exchanger
A kind of heat change method is additionally provided.
The technical solution adopted by the present invention to solve the technical problems is:
Construct a kind of heat exchanger, wherein including air hose, partition component, the partition component are provided in the air hose
The air hose is separated into air inlet area and exhaust zone；Semiconductor chilling plate or the separation group are provided on the partition component
Part is semiconductor chilling plate；Heat-conductive assembly is provided in the air inlet area and the exhaust zone, the described of air inlet area is led
Hot component and the heat-conductive assembly of the exhaust zone be close to respectively with the chill surface of the semiconductor chilling plate and heating surface or
It is fixed；The heat exchanger further includes the power supply for semiconductor chilling plate power supply.
Heat exchanger of the present invention, wherein the heat exchanger further includes the drive for driving the air hose axially to rotate
Motivation structure, and the controller of the control driving mechanism.
Heat exchanger of the present invention, wherein the power supply is semiconductor chilling plate power supply by brush.
Heat exchanger of the present invention, wherein the heat exchanger further include detect by it is described air inlet area after into
First temperature sensor of the temperature of inlet air, and detect the second temperature sensor of the temperature of the discharge wind of the exhaust zone；The
One temperature sensor and second temperature sensor are connect with the controller communication；The controller receives first temperature
Sensor and the second temperature sensor data control the driving mechanism when data difference reaches preset threshold and drive
The air hose axially rotates 180 degree.
Heat exchanger of the present invention, wherein the heat exchanger further includes the electricity for changing the brush current direction
Stream controller.
Heat exchanger of the present invention, wherein the air hose is in circular ring shape；The positive and negative of the semiconductor chilling plate is electrically connected
Interface is respectively positioned on one end-face, and is symmetrical arranged along the axle center of the air hose.
Heat exchanger of the present invention, wherein the partition component includes the semiconductor chilling plate and is located at described
The thermal insulator at semiconductor chilling plate both ends.
Heat exchanger of the present invention, wherein the heat-conductive assembly includes being close to or consolidating with the semiconductor chilling plate
The first fixed thermally conductive sheet, and the second thermally conductive sheet of one or more being fixedly connected with first thermally conductive sheet；Described second is thermally conductive
When piece is provided with multiple, there is gap between adjacent second thermally conductive sheet.
Heat exchanger of the present invention, wherein the air hose outer surface is provided with outer gear ring；The driving mechanism includes
With the outer gear ring meshed gears, and the motor of the driving gear.
A kind of heat change method, using above-mentioned heat exchanger, its implementation is as follows: described in certain interval of time detection
The temperature of area's outlet air and exhaust zone discharge wind is entered the wind, driving mechanism drives air hose when temperature gap reaches preset threshold
Rotate 180 degree；The positive and negative anodes of the positive and negative interface of semiconductor chilling plate and brush are reversely connected after rotation, the refrigeration of semiconductor chilling plate
Face and the exchange of heating face, the air inlet area of air hose and exhaust zone exchange.
The beneficial effects of the present invention are: in use, worked by semiconductor chilling plate, the one of semiconductor chilling plate refrigeration
Heat-conductive assembly temperature in the reduction air inlet area of face, the wind that air inlet area enters is cooled when passing through the heat-conductive assembly in it, and then makes
The air temperature that must be entered the room reduces, and reduces the working time of room conditioning, and then reach energy-efficient effect.
Detailed description of the invention
In order to more clearly explain the embodiment of the invention or the technical proposal in the existing technology, below in conjunction with attached drawing and reality
Applying example, the invention will be further described, and the accompanying drawings in the following description is only section Example of the invention, for this field
For those of ordinary skill, without creative efforts, it can also be obtained according to these attached drawings other accompanying drawings:
Fig. 1 is the heat exchanger air duct structure schematic diagram of present pre-ferred embodiments；
Fig. 2 is the heat converter structure schematic diagram of present pre-ferred embodiments；
Fig. 3 is the heat-exchanger principle block diagram of present pre-ferred embodiments.
Specific embodiment
In order to keep the purposes, technical schemes and advantages of the embodiment of the present invention clearer, implement below in conjunction with the present invention
Technical solution in example carries out clear, complete description, it is clear that and described embodiment is section Example of the invention, and
It is not all of embodiment.Based on the embodiment of the present invention, those of ordinary skill in the art are not before making the creative labor
Every other embodiment obtained is put, protection scope of the present invention is belonged to.
The heat exchanger of present pre-ferred embodiments is as shown in Figure 1, simultaneously refering to Fig. 2 and Fig. 3, including air hose 1, air hose 1
It is inside provided with partition component 2, air hose 1 is separated into air inlet area 10 and exhaust zone 11 by partition component 2；It is provided on partition component 2
Semiconductor chilling plate 20 or partition component are semiconductor chilling plate；Heat-conductive assembly is provided in air inlet area 10 and exhaust zone 11
3, enter the wind area 10 heat-conductive assembly 3 and exhaust zone 11 heat-conductive assembly 3 respectively with the chill surface of semiconductor chilling plate 20 and fever
It is close to or fixes in face；Heat exchanger further includes the power supply powered for semiconductor chilling plate 20；In use, passing through semiconductor chilling plate
20 work, the one side that semiconductor chilling plate 20 freezes reduce the heat-conductive assembly temperature in air inlet area, the wind warp that air inlet area 10 enters
It is cooled when crossing the heat-conductive assembly 3 in it, so that the air temperature entered the room reduces, when reducing the work of room conditioning
Between, and then reach energy-efficient effect.
As shown in Figure 1, Figure 2 and Figure 3, heat exchanger further includes the driving mechanism 4 for driving air hose 1 axially to rotate, and control
The controller 6 of driving mechanism 4；Power supply is the power supply of semiconductor chilling plate 20 by brush 5；
At summer, the air of outdoor higher levels of humidity and temperature is corresponding thermally conductive by the refrigeration one side of semiconductor chilling plate 20
When component 3, the aqueous vapor having in air can be condensed on heat-conductive assembly 3, reach the function to the air dewetting entered the room；Half
Conductor cooling piece 20 rotates air hose 1 after a period of work, by driving mechanism 4 come 180 degree, at this time semiconductor chilling plate 20
The positive and negative anodes of positive and negative interface and brush 5 are reversely connected, so that original air inlet area and exhaust zone are interchangeable, with condensed water
Heat-conductive assembly 3 is now in the side of air draft, the indoor wind of discharge condensed water is carried out it is air-dried, it is original without condensed water
Condensate water accumulation on heat-conductive assembly 3 after a period of time, overturns 180 degree again, and such repeated work goes down, and realizes both to entrance
Air is cooled down, while also to the effect to dehumidify into air；
In winter, outside air humidity and temperature are lower, and brush 5 is rotated 180 degree or changes the electric current side of brush 5
To so that original air inlet area corresponds to the fever one side of semiconductor chilling plate, exhaust zone corresponds to the refrigeration one of semiconductor chilling plate
Face is heated to air is entered the room, while steam is condensed in the cold on heat-conductive assembly 3 in the gas of indoor discharge, is worked one section
The air of 180 degree rotating air-duct 1 after time, entrance is entering while air-drying the moisture on heat-conductive assembly 3, so that enter
Air humidity increases, and while reaching to indoor heating, humidifies into air, reduces indoor humidity amplitude of variation, subtract
The load of humidification apparatus in Shaoshi.
As shown in Figures 2 and 3, heat exchanger further includes the first temperature for detecting the temperature into wind after entering the wind area
Sensor 7, and detect the second temperature sensor 8 of the temperature of the discharge wind of exhaust zone；First temperature sensor 7 and second temperature
Sensor 8 with 6 communication connection of controller；Controller 6 receives the first temperature sensor 7 and 8 data of second temperature sensor,
Driving mechanism 4 is controlled when data difference reaches preset threshold drives air hose axially rotation 180 degree；
Convenient for by the detection of temperature gap, more accurately to be controlled the frequency of overturning；Temperature gap is bigger, then
Condensed water rate of set when outside air enters on heat-conductive assembly can be faster, then overturn adjusting frequency be also required to it is higher.
As depicted in figs. 1 and 2, heat exchanger further includes the current controller for changing 5 current direction of brush；Pass through electric current control
Device processed to carry out brush 5 transformation of current polarity, i.e. progress positive and negative anodes are exchanged so that the chill surface of semiconductor chilling plate and
The exchange of heating face, air inlet area enter hotter wind at this time, realize to indoor heating wind function.
As depicted in figs. 1 and 2, air hose 1 is in circular ring shape；The positive and negative interface that is electrically connected of semiconductor chilling plate 20 is respectively positioned on one end
End face, and be symmetrical arranged along the axle center of air hose 1；It is easy to implement when being overturn to air hose 1 and electricity is carried out to semiconductor chilling plate 20
Flow polar transformation.
As depicted in figs. 1 and 2, partition component 2 is including semiconductor chilling plate 20 and positioned at 20 both ends of semiconductor chilling plate
Thermal insulator 21；Convenient for assembly, and ensure the air-tightness between air inlet area 10 and exhaust zone 11.
As depicted in figs. 1 and 2, heat-conductive assembly 3 includes the first thermally conductive sheet 30 be close to or fixed with semiconductor chilling plate 20,
The second thermally conductive sheet of one or more 31 being fixedly connected with the first thermally conductive sheet 30；When second thermally conductive sheet 31 is provided with multiple, phase
There is gap between adjacent second thermally conductive sheet 31；Good heat conduction effect.
As depicted in figs. 1 and 2,1 outer surface of air hose is provided with outer gear ring 12；Driving mechanism 4 includes engaging with outer gear ring 12
Gear 40, and driving gear 40 motor 41；Structure is simple, and transmission stability is good；
Preferably, motor 41 selects stepper motor.
A kind of heat change method, using above-mentioned heat exchanger, as shown in Figure 1-3, its implementation is as follows: one section of interval
The temperature of time detection air inlet area's outlet air and exhaust zone discharge wind, when temperature gap reaches preset threshold, driving mechanism is driven
Air hose rotates 180 degree；The positive and negative anodes of the positive and negative interface of semiconductor chilling plate and brush are reversely connected after rotation, semiconductor chilling plate
Chill surface and the exchange of heating face, the air inlet area of air hose and exhaust zone exchange；
When summer, semiconductor chilling plate refrigeration one side is corresponding with air inlet area, and the air of outdoor higher temperature is led through more than half
When the refrigeration corresponding heat-conductive assembly 3 of one side of body cooling piece 20, the aqueous vapor having in air can be condensed on heat-conductive assembly 3, be reached
Function to the air dewetting entered the room；Semiconductor chilling plate 20 after a period of work, by driving mechanism 4 come 180 degree
Air hose 1 is rotated, the positive and negative anodes of the positive and negative interface and brush 5 of semiconductor chilling plate 20 are reversely connected at this time, so that original air inlet
Area and exhaust zone are interchangeable, and the heat-conductive assembly 3 with condensed water is now in the side of air draft, and the indoor wind of discharge is to condensation
Water carries out condensate water accumulation on air-dried, the original heat-conductive assembly 3 without condensed water, after a period of time, overturns 180 again
Degree, such repeated work go down, and realize and both cool down into air, while also to the effect to dehumidify into air；
When winter, semiconductor chilling plate fever one side is corresponding with air inlet area, and outside air humidity and temperature are lower, will be electric
5 rotation 180 degree of brush or the current direction for changing brush 5, so that original air inlet area corresponds to the fever one side of semiconductor chilling plate,
Exhaust zone corresponds to the refrigeration one side of semiconductor chilling plate, heats to air is entered the room, while steam in the gas of indoor discharge
It is condensed on heat-conductive assembly 3 to the cold, after a period of work 180 degree rotating air-duct 1, the air of entrance is entering air-dried simultaneously lead
Moisture on hot component 3 so that enter air humidity increase, while reaching to indoor heating, to enter air into
Row humidification, reduces indoor humidity amplitude of variation, reduces the load of indoor humidification apparatus.
It should be understood that for those of ordinary skills, it can be modified or changed according to the above description,
And all these modifications and variations should all belong to the protection domain of appended claims of the present invention.
Claims (10)
1. a kind of heat exchanger, which is characterized in that including air hose, partition component, the partition component are provided in the air hose
The air hose is separated into air inlet area and exhaust zone；Semiconductor chilling plate or the separation group are provided on the partition component
Part is semiconductor chilling plate；Heat-conductive assembly is provided in the air inlet area and the exhaust zone, the described of air inlet area is led
Hot component and the heat-conductive assembly of the exhaust zone be close to respectively with the chill surface of the semiconductor chilling plate and heating surface or
It is fixed；The heat exchanger further includes the power supply for semiconductor chilling plate power supply.
2. heat exchanger according to claim 1, which is characterized in that the heat exchanger further includes driving the air hose axis
To the driving mechanism of rotation, and the controller of the control driving mechanism.
3. heat exchanger according to claim 2, which is characterized in that the power supply is the semiconductor refrigerating by brush
Piece power supply.
4. heat exchanger according to claim 3, which is characterized in that the heat exchanger further include detection by it is described into
First temperature sensor of the temperature into wind behind wind area, and detect the second temperature of the temperature of the discharge wind of the exhaust zone
Sensor；First temperature sensor and second temperature sensor are connect with the controller communication；The controller receives institute
The first temperature sensor and the second temperature sensor data are stated, the drive is controlled when data difference reaches preset threshold
Motivation structure drives the air hose axially rotation 180 degree.
5. heat exchanger according to claim 3, which is characterized in that the heat exchanger further includes changing the brush electricity
Flow the current controller in direction.
6. heat exchanger according to claim 3, which is characterized in that the air hose is in circular ring shape；The semiconductor refrigerating
The positive and negative interface that is electrically connected of piece is respectively positioned on one end-face, and is symmetrical arranged along the axle center of the air hose.
7. -6 any heat exchanger according to claim 1, which is characterized in that the partition component includes the semiconductor
Cooling piece and thermal insulator positioned at the semiconductor chilling plate both ends.
8. -6 any heat exchanger according to claim 1, which is characterized in that the heat-conductive assembly includes partly leading with described
Body cooling piece is close to or the first fixed thermally conductive sheet, and the one or more second being fixedly connected with first thermally conductive sheet is thermally conductive
Piece；When second thermally conductive sheet is provided with multiple, there is gap between adjacent second thermally conductive sheet.
9. -6 any heat exchanger according to claim 1, which is characterized in that the air hose outer surface is provided with external tooth
Circle；The driving mechanism includes and the outer gear ring meshed gears, and the motor of the driving gear.
10. a kind of heat change method, using any heat exchanger of claim 1-9, which is characterized in that implementation method is such as
Under: certain interval of time detects the temperature of air inlet area's outlet air and exhaust zone discharge wind, reaches pre- in temperature gap
If driving mechanism drives air hose to rotate 180 degree when threshold values；After rotation the positive and negative anodes of the positive and negative interface of semiconductor chilling plate and brush into
Row reversal connection, the chill surface of semiconductor chilling plate and the exchange of heating face, the air inlet area of air hose and exhaust zone exchange.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201811138949.2A CN108981047B (en) | 2018-09-28 | 2018-09-28 | Heat exchanger and method thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201811138949.2A CN108981047B (en) | 2018-09-28 | 2018-09-28 | Heat exchanger and method thereof |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN108981047A true CN108981047A (en) | 2018-12-11 |
| CN108981047B CN108981047B (en) | 2024-04-30 |
Family
ID=64544086
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201811138949.2A Active CN108981047B (en) | 2018-09-28 | 2018-09-28 | Heat exchanger and method thereof |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN108981047B (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109539412A (en) * | 2019-01-17 | 2019-03-29 | 深圳奇滨电子有限公司 | Heat exchange assembly and method |
| CN112856628A (en) * | 2021-01-06 | 2021-05-28 | 宁波方太厨具有限公司 | Disinfection cabinet |
| CN113864921A (en) * | 2021-09-25 | 2021-12-31 | 太原理工大学 | Household fresh air conditioning device based on semiconductor refrigeration |
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| KR20050030747A (en) * | 2003-09-26 | 2005-03-31 | 한국기계연구원 | Air cleaning and ventilation heat recovery system |
| CN2743741Y (en) * | 2003-07-25 | 2005-11-30 | 曾勇华 | Energy-saving ventilation air interchanger set |
| EP2660525A2 (en) * | 2012-03-27 | 2013-11-06 | Öko-Haustechnik in VENTer GmbH | Ventilation device |
| CN108224639A (en) * | 2018-01-26 | 2018-06-29 | 浙江理工大学 | A kind of new air heat-exchange device based on solar energy power generating semiconductor refrigerating |
| CN208998235U (en) * | 2018-09-28 | 2019-06-18 | 北京赫为科技有限公司 | A kind of heat exchanger |
-
2018
- 2018-09-28 CN CN201811138949.2A patent/CN108981047B/en active Active
Patent Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH112421A (en) * | 1997-06-11 | 1999-01-06 | Zexel Corp | Heat-exchanging ventilator |
| CN2743741Y (en) * | 2003-07-25 | 2005-11-30 | 曾勇华 | Energy-saving ventilation air interchanger set |
| KR20050030747A (en) * | 2003-09-26 | 2005-03-31 | 한국기계연구원 | Air cleaning and ventilation heat recovery system |
| EP2660525A2 (en) * | 2012-03-27 | 2013-11-06 | Öko-Haustechnik in VENTer GmbH | Ventilation device |
| CN108224639A (en) * | 2018-01-26 | 2018-06-29 | 浙江理工大学 | A kind of new air heat-exchange device based on solar energy power generating semiconductor refrigerating |
| CN208998235U (en) * | 2018-09-28 | 2019-06-18 | 北京赫为科技有限公司 | A kind of heat exchanger |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109539412A (en) * | 2019-01-17 | 2019-03-29 | 深圳奇滨电子有限公司 | Heat exchange assembly and method |
| CN112856628A (en) * | 2021-01-06 | 2021-05-28 | 宁波方太厨具有限公司 | Disinfection cabinet |
| CN113864921A (en) * | 2021-09-25 | 2021-12-31 | 太原理工大学 | Household fresh air conditioning device based on semiconductor refrigeration |
| CN113864921B (en) * | 2021-09-25 | 2023-03-07 | 太原理工大学 | Household fresh air conditioning device based on semiconductor refrigeration |
Also Published As
| Publication number | Publication date |
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| CN108981047B (en) | 2024-04-30 |
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Effective date of registration: 20240313 Address after: 241000 No. 110 Huajin South Road, Wuhu High tech Industrial Development Zone, Yijiang District, Wuhu City, Anhui Province Applicant after: Hewei Technology Co.,Ltd. Country or region after: China Address before: Room 606, 6th Floor, Building 1, No.10 Jiachuang Road, Tongzhou District, Beijing, 100000 Applicant before: BEIJING HEALTHWILL TECHNOLOGY CO.,LTD. Country or region before: China |
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