CN108972302B - Non-resonant vibration auxiliary polishing device and method - Google Patents
Non-resonant vibration auxiliary polishing device and method Download PDFInfo
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- CN108972302B CN108972302B CN201811171292.XA CN201811171292A CN108972302B CN 108972302 B CN108972302 B CN 108972302B CN 201811171292 A CN201811171292 A CN 201811171292A CN 108972302 B CN108972302 B CN 108972302B
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- 238000005498 polishing Methods 0.000 title claims abstract description 117
- 238000000034 method Methods 0.000 title claims abstract description 19
- 238000006073 displacement reaction Methods 0.000 claims description 72
- 239000000919 ceramic Substances 0.000 claims description 49
- 230000033001 locomotion Effects 0.000 claims description 48
- 230000007246 mechanism Effects 0.000 claims description 46
- 239000004579 marble Substances 0.000 claims description 17
- 238000005520 cutting process Methods 0.000 claims description 11
- 238000005188 flotation Methods 0.000 claims description 9
- 239000003638 chemical reducing agent Substances 0.000 claims description 7
- 238000007517 polishing process Methods 0.000 claims description 6
- 239000002245 particle Substances 0.000 claims description 4
- 230000005540 biological transmission Effects 0.000 claims description 3
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- 238000003754 machining Methods 0.000 abstract description 9
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- 230000003321 amplification Effects 0.000 description 7
- 238000003199 nucleic acid amplification method Methods 0.000 description 7
- 238000010586 diagram Methods 0.000 description 6
- 238000012545 processing Methods 0.000 description 6
- 238000005516 engineering process Methods 0.000 description 5
- 239000000463 material Substances 0.000 description 4
- 238000006703 hydration reaction Methods 0.000 description 3
- 230000003746 surface roughness Effects 0.000 description 3
- 239000013598 vector Substances 0.000 description 3
- 238000011161 development Methods 0.000 description 2
- 230000036571 hydration Effects 0.000 description 2
- 238000010884 ion-beam technique Methods 0.000 description 2
- 230000008569 process Effects 0.000 description 2
- 238000011160 research Methods 0.000 description 2
- 239000000126 substance Substances 0.000 description 2
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- 239000003082 abrasive agent Substances 0.000 description 1
- 239000006061 abrasive grain Substances 0.000 description 1
- 238000004458 analytical method Methods 0.000 description 1
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- 238000003486 chemical etching Methods 0.000 description 1
- 230000007123 defense Effects 0.000 description 1
- 238000013461 design Methods 0.000 description 1
- 229910003460 diamond Inorganic materials 0.000 description 1
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Classifications
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B29/00—Machines or devices for polishing surfaces on work by means of tools made of soft or flexible material with or without the application of solid or liquid polishing agents
- B24B29/02—Machines or devices for polishing surfaces on work by means of tools made of soft or flexible material with or without the application of solid or liquid polishing agents designed for particular workpieces
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B41/00—Component parts such as frames, beds, carriages, headstocks
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B41/00—Component parts such as frames, beds, carriages, headstocks
- B24B41/02—Frames; Beds; Carriages
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B41/00—Component parts such as frames, beds, carriages, headstocks
- B24B41/06—Work supports, e.g. adjustable steadies
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- Grinding And Polishing Of Tertiary Curved Surfaces And Surfaces With Complex Shapes (AREA)
Abstract
The invention relates to a non-resonant vibration auxiliary polishing device and method, and belongs to the field of ultra-precise machining. The polishing tool comprises a polishing tool moving platform, a precise swinging platform, a rotating vibration platform and a Y-axis linear guide rail. The advantages are that: the polishing efficiency is high, the frequency and the amplitude of vibration can be adjusted, the controllability is good, and the applicability is improved; the polishing device can polish hard and brittle ceramic material workpieces with simple curved surface structures, has the advantages of high polishing speed, high polishing precision, good controllability and the like, and improves the practicability of the device.
Description
Technical Field
The invention relates to the field of ultra-precise machining, in particular to a non-resonant vibration auxiliary polishing device and method.
Background
The development of precision and ultra-precision processing technology directly affects the development of a national advanced technology and national defense industry, so that the world is very important, and research and development are carried out with great effort, and meanwhile, the technology confidentiality is implemented, and the key processing technology and equipment export are controlled. The ultra-precise machining technology is developed in the last U.S. of the 20 th century, ultra-precise turning of a diamond cutter, namely single-point diamond turning, is developed and is used for machining a laser nuclear fusion reflector, a spherical part for a manned airship, a large-scale aspheric part and the like, the dimension precision of a workpiece subjected to ultra-precise machining can reach the nano-level by the 80 th century, and the surface roughness of the workpiece can reach the nano-level or the sub-nano-level. In ultra-precision machining, polishing is the last and most important process, and generally, the uneven surface of a workpiece is finely cut by abrasive grains having high hardness, and the purpose of the polishing is to reduce the surface roughness of the workpiece.
At present, the processing modes of ultra-precise polishing of a workpiece mainly comprise ion beam polishing, hydration polishing, chemical mechanical polishing and the like, wherein the ion beam polishing is to spray plasma on the surface of the workpiece so as to remove the surface of the workpiece in a non-contact mode, but the material removal rate is low; the hydration polishing is a polishing method utilizing hydration reaction, but the polishing process is complicated and is unfavorable for mass production; chemical mechanical polishing is a polishing process combining chemical etching and mechanical removal, and is complex and has many influencing factors. In the year of 60 of the 20 th century, japanese Kogyo Gong Daxue proposed a "vibration cutting" method, in which a controllable vibration is added to a cutter to change the machining process into a discontinuous, instantaneous and reciprocating microscopic intermittent cutting process, and the vibration is combined with the machining, and the method is gradually developed as a popular research topic in the machining industry. Vibration cutting has been applied to the fields of superfinishing, micromachining, hard and brittle ceramics, difficult-to-machine materials, and the like. In recent years, a learner has proposed a vibration-assisted polishing technique, which has a large material removal rate, a large cutting amount, a small cutting force during processing, a small surface residual stress, a low surface roughness and a good mechanical property of the surface of a workpiece under the same processing conditions as those of the conventional polishing. The principle of vibration assisted polishing is that free abrasive materials vibrate to process the surface of a workpiece so as to achieve the purpose of polishing, and the polishing device is particularly suitable for processing hard and brittle materials.
Vibration auxiliary polishing is divided into a resonance type and a non-resonance type, the resonance type vibration auxiliary polishing is also called ultrasonic vibration auxiliary polishing, most of vibration auxiliary polishing is of a resonance type at present, the vibration frequency, the vibration amplitude and the motion track of the resonance type vibration auxiliary polishing cannot be adjusted, the controllability is poor, the traditional non-resonance type vibration auxiliary polishing is low in polishing efficiency due to the low natural frequency of a vibration device, and the design of the non-resonance type vibration auxiliary polishing device is still an important research direction.
Disclosure of Invention
The invention provides a non-resonant vibration auxiliary polishing device and a method thereof, which are used for solving the problems of poor controllability, low polishing efficiency and the like of the traditional vibration auxiliary polishing.
The technical scheme adopted by the invention is as follows: the utility model provides a non-resonant vibration auxiliary polishing device, including Z axle linear guide, Y axle linear guide, X axle linear guide, polishing cutter motion platform, accurate oscillating table, rotary vibration platform and marble frame, Y axle linear guide installs on marble frame, X axle linear guide installs on marble frame, Z axle linear guide passes through the screw to be connected with X axle linear guide, polishing cutter motion platform is connected with Z axle linear guide, accurate oscillating table passes through the screw to be connected with Y axle linear guide, rotary vibration platform passes through the screw to be connected with accurate oscillating table.
The polishing tool motion platform of the invention comprises: the polishing tool is driven by the air flotation electric spindle to rotate around the Z axis, the polishing tool is used for polishing a workpiece to be processed, and the balance cylinder is used for balancing the gravity of the Z axis and reducing the load of the air flotation electric spindle.
The precise swinging platform of the invention comprises: the direct current brushless servo motor comprises a direct current brushless servo motor, a speed reducer, a coupler, a bearing, an arc base, an arc movement swinging table, an arc rack and a worm, wherein the arc base is arranged on a Y-axis linear guide rail through a screw, the arc movement swinging table is rigidly connected with the arc rack, the arc movement swinging table and the arc rack are arranged on the arc base, and the direct current brushless servo motor is connected with the worm through the speed reducer and the coupler.
The rotary vibration platform of the present invention comprises: vibration base, vibration generating device, rotatory vibration platform installs on the arc motion pendulum platform, and vibration generating device passes through the screw and is connected with vibration base.
The vibration generating device comprises a vibration device I, a vibration device II, a vibration device III, a working platform and a sensor system, wherein the vibration device I comprises a guide mechanism I, a lever amplifying mechanism I, a piezoelectric ceramic I and a pre-tightening screw I, the vibration device II comprises a guide mechanism II, a lever amplifying mechanism II, a piezoelectric ceramic II and a pre-tightening screw II, the vibration device III comprises a guide mechanism III, a lever amplifying mechanism III, a piezoelectric ceramic III and a pre-tightening screw III, the vibration device I, the vibration device II and the vibration device III are identical in structure, the vibration device I is in a structure that the piezoelectric ceramic I is fixed on the guide mechanism I through the pre-tightening screw I, displacement generated by the piezoelectric ceramic I is transmitted to the lever amplifying mechanism I through the guide mechanism I, a straight beam type hinge in the guide mechanism I is used for restraining the transmission direction of displacement, the lever amplifying mechanism I is used for amplifying the displacement generated by the piezoelectric ceramic I, the sensor system comprises a sensor I, a sensor II and a sensor III, the sensor I comprises a displacement sensor bracket and a motion body I, the sensor II and the sensor II is fixed on the displacement bracket and the motion body I through the sensor bracket, the sensor II and the sensor III is fixed on the displacement bracket and the motion body, and the sensor body is fixed on the displacement bracket through the sensor.
The marble frame of the present invention comprises: the marble frame is used for installing and fixing the whole device.
A method of non-resonant vibration assisted polishing comprising the steps of:
the workpiece to be polished is fixed on a working platform of a rotary vibration platform, a Y-axis linear guide rail drives a precise swing platform, the rotary vibration platform and the workpiece to be polished to move to a designated position along the Y direction, a Z-axis linear guide rail and an X-axis linear guide rail drive a polishing tool moving platform to move to a designated position along a ZX plane, and an air floatation motorized spindle in the polishing tool moving platform drives a polishing tool to rotate around the Z axis;
(II) to the piezoceramics I in the rotary vibration platform, the piezoceramics II and the piezoceramics three pass through the same sinusoidal electric signal, and the sinusoidal electric signal can be represented by the formula X=A X X sin (2pi×f×t), wherein X represents a voltage applied to the piezoelectric ceramic, A X Represents the amplitude of the sinusoidal electrical signal, f represents the frequency of the sinusoidal electrical signal, t represents time, by adjusting the amplitude A of the sinusoidal signal X Parameters such as frequency f and the like, and controlling the rotation angle and the vibration frequency of the working platform 60204 around the Z axis;
the polishing tool is used for polishing a curved surface, the polishing tool is used for carrying out ductile removal on the surface of the workpiece to be polished, so that the purpose of polishing is achieved, when the curved surface is required to be polished, a direct-current brushless servo motor in the precise swinging table enables the arc-shaped movement swinging table to move along an arc-shaped base through a vortex rod and an arc-shaped rack on the arc-shaped movement swinging table, and the arc-shaped movement swinging table drives the rotary vibration table and the workpiece to be polished to move, so that the surface of the workpiece to be polished is always in point contact with the polishing tool, and the curved surface is polished;
and fourthly, finishing the polishing process until the polishing of all the processed surfaces is finished.
The invention has the advantages that:
(1) Compared with other vibration platforms, the rotary vibration platform in the device has higher natural frequency, the working frequency of the polishing device is improved by improving the natural frequency, and the flexibility and controllability of the device are improved, so that the device has the advantage of high polishing efficiency compared with the traditional non-resonant vibration auxiliary polishing device;
(2) Compared with the traditional resonant vibration auxiliary polishing, the non-resonant vibration auxiliary polishing method has the advantages that the frequency and the amplitude of vibration of the polishing device are adjustable, the controllability is good, and the applicability is improved;
(3) The device is added with a precise sensor system, can feed back the motion signal of the rotary vibration driving platform on line in real time, and adjusts parameters such as amplitude, frequency and the like of an electric signal fed into the rotary vibration driving platform according to the fed-back signal, so as to timely adjust the working state of the rotary vibration driving platform;
(4) The precise swinging table is added, so that the device can polish hard and brittle ceramic material workpieces with simple curved surface structures, has the advantages of high polishing speed, high polishing precision, good controllability and the like, and improves the practicability of the device.
Drawings
FIG. 1 is a schematic view of the apparatus of the present invention;
FIG. 2 is a diagram of a polishing tool motion stage of the present invention;
FIG. 3 is a diagram of a precision swing table of the present invention;
FIG. 4 is a cross-sectional view of the precision swing table of the present invention;
FIG. 5 is a diagram of a rotary vibration table of the present invention;
FIG. 6 is a diagram of a first vibration device, a second vibration device, a third vibration device and a work platform in the vibration generating device of the present invention;
FIG. 7 is a view of a guide mechanism in a vibration device of the present invention
FIG. 8 is a diagram of a sensor system in the vibration generating device of the present invention;
FIG. 9 is a schematic view of the rotary vibration table of the present invention in operation;
fig. 10 is a view of a marble frame of the present invention;
FIG. 11 is a schematic view of the angular-positional relationship of the rotary vibration table of the present invention;
FIG. 12 is a schematic representation of displacement vectors of a rotary vibration table of the present invention;
reference numerals illustrate: the polishing machine comprises a Z-axis linear guide 1, a Y-axis linear guide 2, an X-axis linear guide 3, a polishing tool motion platform 4, a precise swing platform 5, a rotary vibration platform 6, a marble frame 7, a polished workpiece 8, an air floatation motorized spindle 401, a polishing tool 402, a counterweight balance cylinder 403, a direct current brushless servo motor 501, a speed reducer 502, a coupler 503, a bearing 504, an arc base 505, an arc motion swing platform 506, an arc rack 507, a worm 508, a vibration platform base 601, a vibration generating device 602, a vibration device 60201, a vibration device 60202, a vibration device 60203, a working platform 60204, a guide mechanism one 6020101, a straight beam type hinge 602010101, a lever amplification mechanism one 6020102, a piezoelectric ceramic one 6020103, a pre-tightening screw one 6020104, a guide mechanism two 6020201, a lever amplification mechanism two 6020202, a piezoelectric ceramic two 6020203, a pre-tightening screw one 6020204, a guide mechanism three 6020301, a lever amplification mechanism three 6020302, a piezoelectric ceramic three 6020303, a pre-tightening screw three 6020304, a sensor system 60205, a sensor one-3565, a sensor three sensor 3245, a sensor three bracket one-position sensor support frame one 602050202, a displacement sensor one 602050202 and a displacement body one 602050202, a displacement sensor three support frame one 602050202 and a displacement body one 602050202, a displacement sensor one 602050202 and a displacement support one 602050202, a displacement sensor one 602050202 and a displacement body one.
Detailed Description
As shown in fig. 1, a non-resonant vibration auxiliary polishing device comprises a Z-axis linear guide 1, a Y-axis linear guide 2, an X-axis linear guide 3, a polishing tool moving platform 4, a precision oscillating platform 5, a rotary oscillating platform 6, a marble frame 7 and a workpiece 8 to be polished, wherein the Y-axis linear guide 2 is mounted on the marble frame 7, the X-axis linear guide 3 is mounted on the marble frame 7, the Z-axis linear guide 1 is connected with the X-axis linear guide 3 through screws, the polishing tool moving platform 4 is connected with the Z-axis linear guide 1, the precision oscillating platform 5 is connected with the Y-axis linear guide 2 through screws, the rotary oscillating platform 6 is connected with the precision oscillating platform 5 through screws, the workpiece 8 to be polished is fixed on the rotary oscillating platform 6, and the workpiece 8 to be polished is fixed on a working platform 60204 of the rotary oscillating platform 6.
The Y-axis linear guide rail 2 drives the precise swinging platform 5, the rotary vibration platform 6 and the workpiece 8 to be polished to move to a designated position along the Y direction, the Z-axis linear guide rail 1 and the X-axis linear guide rail 3 drive the polishing tool moving platform 4 to move to the designated position along the ZX plane, the air floating electric spindle 401 in the polishing tool moving platform 4 drives the polishing tool 402 to rotate around the Z axis, the precise swinging platform 5 drives the rotary vibration platform 6 to move along the arc-shaped base 505, the rotary vibration platform 6 drives the workpiece 8 to be processed to rotate around the Z axis within a certain angle range, and in order to ensure the polishing controllability, the device adopts the Z axis, the X axis translation and the rotation around the Z axis of the polishing tool 402, and the Y axis translation, the swinging around the Y axis and the rotation around the Z axis of the rotary vibration platform 6 to have 6 degrees of freedom.
The polishing tool moving platform 4 shown in fig. 2 comprises an air flotation electric spindle 401, a polishing tool 402 and a counterweight balance cylinder 403, wherein the air flotation electric spindle 401 is arranged on a Z-axis linear guide rail 1, the polishing tool 402 is clamped on the air flotation electric spindle 401, the counterweight balance cylinder 403 is arranged on the Z-axis linear guide rail 1, the air flotation electric spindle 401 drives the polishing tool 402 to rotate around the Z axis, the polishing tool 402 is used for polishing a workpiece 8 to be processed, and the counterweight balance cylinder 403 is used for balancing the gravity of the Z axis, so that the load of the air flotation electric spindle 401 is reduced.
The precise swinging platform 5 shown in fig. 3 and 4 comprises a direct current brushless servo motor 501, a speed reducer 502, a coupler 503, a bearing 504, an arc base 505, an arc movement swinging platform 506, an arc rack 507 and a worm 508, wherein the arc base 505 is arranged on a Y-axis linear guide rail 2 through screws, the arc movement swinging platform 506 is rigidly connected with the arc rack 507, the arc movement swinging platform 506 and the arc rack 507 are arranged on the arc base 505, the direct current brushless servo motor 501 is connected with the worm 508 through the speed reducer 502 and the coupler 503 to complete the rotation of the worm 508, the worm 508 drives the arc rack 507 on the arc movement swinging platform 506, and the arc rack 507 drives the arc movement swinging platform 506 to move along the arc base 505.
The rotary vibration table 6 as shown in fig. 5, 6, 7, 8 and 9 includes a vibration base 601, and a vibration generating device 602, the rotary vibration table 6 is mounted on the arc-shaped movement table 506, and the vibration generating device 602 is connected to the vibration base 601 by screws.
The vibration generating device 602 comprises a first vibration device 60201, a second vibration device 60202, a third vibration device 60203, a working platform 60204 and a sensor system 60205, wherein the first vibration device 60201 comprises a first guide mechanism 6020101, a first lever amplifying mechanism 6020102, a first piezoelectric ceramic 6020103 and a first pre-tightening screw 6020104, the second vibration device 60202 comprises a second guide mechanism 6020201, a second lever amplifying mechanism 6020202, a second piezoelectric ceramic 6020203 and a second pre-tightening screw 6020204, the third vibration device 60203 comprises a third guide mechanism 6020301, a third lever amplifying mechanism 6020302, a third piezoelectric ceramic 6020302 and a third pre-tightening screw 6020302, the first vibration device 60201, the second vibration device 60202 and the third vibration device 6020302 are identical in structure, taking the first vibration device 60201 as an example, the first piezoelectric ceramic 6020302 is fixed on the first guide mechanism 6020302 through the first pre-tightening screw 6020302, the displacement generated by the first piezoelectric ceramic 6020302 is transmitted to the first lever amplifying mechanism 6020302 through the guide mechanism 6020302, the straight beam type hinge 6020302 in the first guide mechanism 6020302 is used for restraining the transmission direction of displacement, the first lever amplifying mechanism 6020302 is used for amplifying the displacement generated by the first piezoelectric ceramic 6020302, the second piezoelectric ceramic 6020302 and the third piezoelectric ceramic 6020302 are supplied with alternating current signals with the same phase, so that the first piezoelectric ceramic 6020302, the second piezoelectric ceramic 6020302 and the third piezoelectric ceramic 6020302 generate displacement, the displacement is transmitted to the working platform 60204 and then is vectorially synthesized into rotary displacement around the Z axis, the rotary displacement enables the working platform 60204 to swing around the Z axis within a certain angle range, the sensor system 60205 comprises a first sensor 6020302, a second sensor 6020302 and a third sensor 6020302, the first sensor 6020302 comprises a first displacement sensor 6020302, a first displacement sensor bracket 6020302 and a first moving body 6020302, the second sensor 6020302 comprises a second displacement sensor 6020302, a second displacement sensor bracket 6020302 and a second moving body 6020302, and the third sensor 6020302 comprises a third displacement sensor 6020302, the first sensor bracket 602050302 and the third moving body 602050303 have the same structure, the first sensor 6020501, the second sensor 6020502 and the third sensor 6020503 are exemplified by the first sensor 6020501, the first displacement sensor bracket 602050102 is fixed on the vibration device 60201 by a screw, the first moving body 602050103 is fixed on the working platform 60204 by a screw, the first displacement sensor 602050101 is fixed in the first displacement sensor bracket 602050102, and the sensor system 60205 is used for feeding back the motion signal of the rotary vibration driving platform 6 on line in real time, and adjusting the amplitude, frequency and other parameters of the electric signal fed into the rotary vibration platform 6 according to the fed back signal, so as to timely adjust the working state of the rotary vibration platform 6.
As shown in fig. 10, the marble frame 7 includes a base 701, a cross beam 702, a first support 703 and a second support 704, the first support 703 and the second support 704 are rigidly connected to the base 701, the cross beam 702 is rigidly connected to the first support 703 and the second support 704, and the marble frame 7 is used for mounting and fixing the whole device.
A method of non-resonant vibration assisted polishing comprising the steps of:
firstly, a workpiece 8 to be polished is fixed on a working platform 60204 of a rotary vibration platform 6, a Y-axis linear guide rail 2 drives a precise swinging platform 5, the rotary vibration platform 6 and the workpiece 8 to be polished to move to a designated position along the Y direction, a Z-axis linear guide rail 1 and an X-axis linear guide rail 3 drive a polishing tool moving platform 4 to move to a designated position along a ZX plane, and an air floatation motorized spindle 401 in the polishing tool moving platform 4 drives a polishing tool 402 to rotate around the Z axis;
(II) the same sinusoidal electric signal is supplied to the piezoelectric ceramic one 6020103, the piezoelectric ceramic two 6020203 and the piezoelectric ceramic three 6020303 in the rotary vibration platform 6, and the sinusoidal electric signal can be represented by the formula X=A X X sin (2pi×f×t), wherein X represents a voltage applied to the piezoelectric ceramic, A X Represents the amplitude of the sinusoidal electrical signal, f represents the frequency of the sinusoidal electrical signal, t represents time, by adjusting the amplitude A of the sinusoidal signal X Parameters such as frequency f and the like, and controlling the rotation angle and the vibration frequency of the working platform 60204 around the Z axis;
the working platform 60204 drives the workpiece 8 to be polished to rotate around the Z axis within a certain angle range, abrasive particles are uniformly distributed on the workpiece 8 to be polished, the rotation and the rotation of the polishing tool 402 around the Z axis form relative motion, the relative motion increases the relative motion speed between the polishing tool 402 and the workpiece 8 to be polished, the depth of the abrasive particles cutting into the ductile zone of the surface of the workpiece 8 to be polished increases, the polishing tool 402 performs ductile removal on the surface of the workpiece 8 to be polished before the cutting depth reaches the critical cutting depth, so that the purpose of polishing is achieved, when the curved surface is required to be polished, the direct current brushless servo motor 501 in the precise swinging table 5 enables the arc-shaped motion swinging table 506 to move along the arc-shaped base 505 through the vortex rod 508 and the arc-shaped rack 507 on the arc-shaped motion swinging table 506, and the arc-shaped motion swinging table 506 drives the rotary vibration table 6 and the workpiece 8 to be polished to move, so that the surface of the workpiece 8 to be polished is always in point contact with the polishing tool 402, and the purpose of polishing the curved surface is achieved;
and fourthly, finishing the polishing process until the polishing of all the processed surfaces is finished.
The principles and effects of the present invention are further illustrated by an analysis of vibration generating device 602.
As shown in the displacement vector diagram of the rotary vibration platform in fig. 11, c1, c2 and c3 are displacement input points of the vibration generating device, L1, L2 and L3 are input displacements, S1, S2 and S3 are amplified input displacements, piezoelectric ceramic one 6020103 applies input forces F1, F2 and F3 at displacement input point c1, force F1 makes input point c1 generate displacement L1, lever displacement amplifying mechanism one 6020102 amplifies displacement L1, amplified displacement is S1, piezoelectric ceramic two 6020203 applies input force F2 at displacement input point c2, force F2 makes input point c2 generate displacement L2, lever displacement amplifying mechanism two 6020202 amplifies displacement L2, amplified displacement is S2, piezoelectric ceramic three 6020303 applies input force F3 at displacement input point c3, force F3 makes input point c3 generate displacement L3, lever displacement amplifying mechanism three 6020302 amplifies displacement L3, amplified displacement is S3, S1, S2 and S3 work vector is 60204.
In the traditional polishing process, residual height is generated between adjacent polishing tracks of the processed surface of a workpiece, the residual height can seriously reduce the polishing surface shape precision, the vibration generating device 6 can drive the processed workpiece 8 to generate micro-scale rotary vibration, the residual height is improved, the polishing surface shape precision is improved, in order to ensure the accuracy, the effectiveness and the controllability of the surface shape precision, the rotation angle and the vibration frequency of the rotary vibration of the working platform 60204 are strictly controlled, the rotation angle of the vibration of the working platform 60204 around the Z axis is precisely controlled by establishing an angle-position model of the vibration generating device 602, and the working frequency of the vibration of the working platform 60204 around the Z axis is identical with the frequency of a sinusoidal electric signal fed in piezoelectric ceramics, so that a theoretical model of the vibration frequency of the vibration of the working platform 60204 around the Z axis is not required to be established.
Modeling the angular position of vibration generating device 602
As shown in fig. 12, a working platform 60204 with an equilateral triangle shape is shown, a fixed coordinate system O is established at the center of the working platform 60204, the O point is a displacement output point of the working platform, and the coordinates are (0, 0), and because the sinusoidal electric signals fed into the piezoelectric ceramics one 6020103, two 6020203 and three 6020303 are identical in an ideal state, the output forces generated by the piezoelectric ceramics one 6020103, two 6020203 and three 6020303 are identical, and the motion states of the vibration device one 60201, the vibration device two 60202 and the vibration device three 60203 are identical, the model is simplified, and only a function model between the sinusoidal electric signals fed into the piezoelectric ceramics one 6020103 and the rotation angle θ of the working platform 60204 around the O point is established.
c1 is a displacement input point of the vibration device I60201, L1 is an input displacement of the vibration device I60201, g1 is a displacement input point of the working platform 60204, S1 is an input displacement amplified by the lever amplifying mechanism I6020102, R is a rotation radius of the working platform 60204, alpha is an included angle formed by a line segment O-g1 and an X-axis negative half axis, and alpha=pi/6, and theta is a rotation angle of the working platform 60204 around the O point.
Establishing a function model between a sinusoidal electric signal fed into the piezoelectric ceramic A6020103 and an output force generated by the piezoelectric ceramic A6020103;
the output force generated by piezoelectric ceramic one 6020103 can be expressed by the following formula:
F1＝n×X (1)
where F1 represents the output force generated by piezoelectric ceramic one 6020103, n represents the piezoelectric constant, and X represents the voltage across piezoelectric ceramic one 6020103.
The output force generated by the piezoelectric ceramic one 6020103 is equal to the input force received by the vibration device one 60201
Establishing a function model of the input force received by the vibration device I60201 and the input displacement of the vibration device I60201;
the input displacement of vibration device one 60201 can be expressed by the following formula:
L1＝F1÷k (2)
where L1 represents the input displacement of the first vibration device and k represents the input stiffness of the first vibration device.
Establishing a function model between the input displacement of the first vibration device and the rotation angle theta of the working platform around the O point;
when the working platform 60204 is at the initial position, the position coordinate O of the g1 point in the fixed coordinate system O g1 Is described as:
wherein g1 X Represents the position coordinate of the g1 point along the X axis, g1 Y Represents the position coordinate of the g1 point along the Y axis, g1 Z Representing the position coordinates of the g1 point along the Z axis.
When the working platform 60204 is at the working position, the g1 point moves to the g1 'point, and the position coordinate O of the g1' point in the fixed coordinate system O g1' Is described as:
wherein g1' X Represents the position coordinate of the g1 'point along the X axis, g1' Y Represents the position coordinate of the g1 'point along the Y axis, g1' Z Representing the position coordinates of the point g1' along the Z axis.
The working platform 60204g1 moves to the linear displacement Y1 of the g1' along the Y axis by the pushing of the formula (3) and the formula (4):
Y1＝g1' Y -g1 Y ＝R×sin(π/6)-R×sin(π/6-θ) (5)
since the amplified input displacement S1 is equal to the linear displacement Y1 along the Y axis from the movement of the working platform 60204g1 point to the movement of the g1' point:
S1＝Y1＝R×sin(π/6)-R×sin(π/6-θ) (6)
further, since the displacement amplification ratio of the lever amplification mechanism one 6020102 is Rma, the amplified input displacement S1:
S1＝L1×Rma＝L1×A (7)
as can be deduced from equations (6) and (7), the functional relationship between the input displacement L1 of the vibration device one 60201 and the rotation angle θ of the work platform 60204 is:
L1×A＝R×sin(π/6)-R×sin(π/6-θ) (8)
(8) After finishing, the product is obtained:
θ＝π/6-arcsin(1/2-L1/R×A) (9)
rma=a, and Rma is the displacement amplification ratio of the lever amplification mechanism one 6020102.
Claims (4)
1. The polishing method is characterized in that the polishing device comprises a Z-axis linear guide rail, a Y-axis linear guide rail, an X-axis linear guide rail, a polishing tool motion platform, a precise swing platform, a rotary vibration platform and a marble frame, wherein the Y-axis linear guide rail is arranged on the marble frame, the X-axis linear guide rail is arranged on the marble frame, the Z-axis linear guide rail is connected with the X-axis linear guide rail through a screw, the polishing tool motion platform is connected with the Z-axis linear guide rail, the precise swing platform is connected with the Y-axis linear guide rail through a screw, and the rotary vibration platform is connected with the precise swing platform through a screw; the rotary vibration table includes: the rotary vibration platform is arranged on the arc-shaped motion swing table, and the vibration generating device is connected with the vibration base through screws; the vibration generating device comprises a vibration device I, a vibration device II, a vibration device III, a working platform and a sensor system, wherein the vibration device I comprises a guide mechanism I, a lever amplifying mechanism I, a piezoelectric ceramic I and a pre-tightening screw I, the vibration device II comprises a guide mechanism II, a lever amplifying mechanism II, a piezoelectric ceramic II and a pre-tightening screw II, the vibration device III comprises a guide mechanism III, a lever amplifying mechanism III, a piezoelectric ceramic III and a pre-tightening screw III, the vibration device I, the vibration device II and the vibration device III are identical in structure, the vibration device I is in a structure that the piezoelectric ceramic I is fixed on the guide mechanism I through the pre-tightening screw I, displacement generated by the piezoelectric ceramic I is transmitted to the lever amplifying mechanism I through the guide mechanism I, a straight beam type hinge in the guide mechanism I is used for restraining the transmission direction of the displacement, the lever amplifying mechanism I is used for amplifying the displacement generated by the piezoelectric ceramic I, the sensor system comprises a sensor I, a sensor II and a sensor III, a sensor I comprises a displacement sensor bracket and a motion body I, the sensor II comprises a sensor II, the sensor and a sensor II and a sensor III, the sensor II comprises the sensor and a sensor III is fixed on the displacement bracket and the sensor I, and the sensor III is fixed on the sensor bracket through the displacement sensor; the polishing method comprises the following steps: the workpiece to be polished is fixed on a working platform of a rotary vibration platform, a Y-axis linear guide rail drives a precise swing platform, the rotary vibration platform and the workpiece to be polished to move to a designated position along the Y direction, a Z-axis linear guide rail and an X-axis linear guide rail drive a polishing tool moving platform to move to a designated position along a ZX plane, and an air floatation motorized spindle in the polishing tool moving platform drives a polishing tool to rotate around the Z axis; secondly, leading the same sinusoidal electric signals into the piezoelectric ceramics I in the rotary vibration platform, wherein the piezoelectric ceramics II and the piezoelectric ceramics III can be represented by the formula X= A X ×sin (2pi×f×t), wherein X represents the voltage fed into the piezoelectric ceramics, A X represents the amplitude of the sinusoidal electric signals, f represents the frequency of the sinusoidal electric signals, t represents the time, and the rotation angle and the vibration frequency of the vibration of the working platform around the Z axis are controlled by adjusting parameters such as the amplitude A X, the frequency f and the like of the sinusoidal electric signals; thirdly, the work platform drives the workpiece to be polished to rotate around a Z axis within a certain angle range, abrasive particles are uniformly distributed on the workpiece to be polished, and the vibration generating device drives the workpiece to be processed to generate micro-scale rotary vibration, so that the residual height is improved; the rotation and the rotation of the polishing tool around the Z axis form relative movement, the relative movement increases the relative movement speed between the polishing tool and the workpiece to be polished, so that the depth of the abrasive particles cutting into the ductile zone of the surface of the workpiece to be polished is increased, the polishing tool performs ductile removal on the surface of the workpiece to be polished before the cutting depth reaches the critical cutting depth, thereby achieving the purpose of polishing, when the curved surface is required to be polished, the direct current brushless servo motor in the precise swinging table enables the arc-shaped movement swinging table to move along the arc-shaped base through the vortex rod and the arc-shaped rack on the arc-shaped movement swinging table, and the arc-shaped movement swinging table drives the rotary vibration platform and the workpiece to be polished to move, so that the surface of the workpiece to be polished is always in point contact with the polishing tool, and the curved surface is polished; and fourthly, finishing the polishing process until the polishing of all the processed surfaces is finished.
2. The polishing method using a non-resonant vibration-assisted polishing apparatus as recited in claim 1, wherein: the polishing tool motion platform comprises: the polishing tool is driven by the air flotation electric spindle to rotate around the Z axis, the polishing tool is used for polishing a workpiece to be processed, and the balance cylinder is used for balancing the gravity of the Z axis and reducing the load of the air flotation electric spindle.
3. The polishing method using a non-resonant vibration-assisted polishing apparatus as recited in claim 1, wherein: the precision swing stage includes: the direct current brushless servo motor comprises a direct current brushless servo motor, a speed reducer, a coupler, a bearing, an arc base, an arc movement swinging table, an arc rack and a worm, wherein the arc base is arranged on a Y-axis linear guide rail through a screw, the arc movement swinging table is rigidly connected with the arc rack, the arc movement swinging table and the arc rack are arranged on the arc base, and the direct current brushless servo motor is connected with the worm through the speed reducer and the coupler.
4. The polishing method using a non-resonant vibration-assisted polishing apparatus as recited in claim 1, wherein: the marble frame includes: the marble frame is used for installing and fixing the whole device.
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| CN110394738B (en) * | 2019-07-29 | 2022-03-15 | 哈尔滨理工大学 | Special grinding tool suitable for grinding ceramic material revolving body part and manufacturing process thereof |
| CN112476065B (en) * | 2019-09-11 | 2023-05-12 | 长春工业大学 | Non-resonant vibration auxiliary magnetorheological polishing device and method for processing optical element |
| CN110667232A (en) * | 2019-09-18 | 2020-01-10 | 固高科技(深圳)有限公司 | Electric carving needle assembly and electric carving needle system |
| CN111761359B (en) * | 2020-08-07 | 2022-06-07 | 山东理工大学 | Indexable three-degree-of-freedom high-bandwidth vibration auxiliary cutting device |
| CN113218307A (en) * | 2021-04-29 | 2021-08-06 | 无锡地心科技有限公司 | High-precision optical fiber six-axis positioning platform |
| CN113523435B (en) * | 2021-06-11 | 2023-08-29 | 苏州超徕精工科技有限公司 | Hard and brittle complex structure spindle-free multipole servo polishing device and polishing method |
| CN113770848A (en) * | 2021-09-28 | 2021-12-10 | 芜湖赢诺液压科技有限公司 | Inner hole polishing equipment |
| CN114393513A (en) * | 2022-01-24 | 2022-04-26 | 天津大学 | Central liquid supply semiconductor material surface processing device and use method thereof |
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