CN108962769A - Device attaching method, device packaging method and device processing equipment - Google Patents
Device attaching method, device packaging method and device processing equipment Download PDFInfo
- Publication number
- CN108962769A CN108962769A CN201810710361.3A CN201810710361A CN108962769A CN 108962769 A CN108962769 A CN 108962769A CN 201810710361 A CN201810710361 A CN 201810710361A CN 108962769 A CN108962769 A CN 108962769A
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- sheet body
- bonding
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- attaching method
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- 238000000034 method Methods 0.000 title claims abstract description 63
- 238000004806 packaging method and process Methods 0.000 title claims abstract description 19
- 239000008188 pellet Substances 0.000 claims abstract description 19
- 239000003292 glue Substances 0.000 claims description 29
- 235000012431 wafers Nutrition 0.000 claims description 14
- 239000011521 glass Substances 0.000 claims description 6
- 229910052710 silicon Inorganic materials 0.000 claims description 3
- 239000010703 silicon Substances 0.000 claims description 3
- 238000000926 separation method Methods 0.000 claims description 2
- 238000004026 adhesive bonding Methods 0.000 claims 2
- 239000000463 material Substances 0.000 description 5
- 238000004519 manufacturing process Methods 0.000 description 4
- 230000008901 benefit Effects 0.000 description 3
- 238000005538 encapsulation Methods 0.000 description 3
- 230000007246 mechanism Effects 0.000 description 3
- 239000000203 mixture Substances 0.000 description 3
- 238000005411 Van der Waals force Methods 0.000 description 2
- 230000008859 change Effects 0.000 description 2
- 238000005520 cutting process Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000000149 penetrating effect Effects 0.000 description 2
- 238000002360 preparation method Methods 0.000 description 2
- 238000003825 pressing Methods 0.000 description 2
- 230000015572 biosynthetic process Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 235000013399 edible fruits Nutrition 0.000 description 1
- 238000000465 moulding Methods 0.000 description 1
- 230000008520 organization Effects 0.000 description 1
- 230000035515 penetration Effects 0.000 description 1
- 230000008569 process Effects 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
- H01L21/56—Encapsulations, e.g. encapsulation layers, coatings
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L24/02—Bonding areas ; Manufacturing methods related thereto
- H01L24/03—Manufacturing methods
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
Abstract
The invention discloses a kind of device attaching method, device packaging method and device processing equipments to be bonded at least two devices on first sheet body wherein the device attaching method includes: to provide the first sheet body；By the surface bond of the second pellet surface and at least two device；First sheet body and second sheet body are separated, and each device is bonded with the reservation of one of first sheet body, second sheet body.It by means of the invention it is possible to mount the device on the first sheet body to the second sheet body, and is not in the situation that micro devices are scattered without taking out and moving from the first sheet body by device；It is accurately positioned position to be pasted corresponding to the micro devices taken out without by equipment, the contraposition offset during attachment is avoided, has saved attachment cost.
Description
Technical field
The present invention relates to surface mount process technical fields, and in particular to device attaching method, device packaging method and device
Part processing equipment.
Background technique
Device attachment refer to the micro devices being originally arranged on wafer are shifted and are fixed at existing sheet body or
On packaging body, continue to encapsulate or carry out other processing in order to subsequent.
Existing device attaching method often coats bonding glue in pellet surface to be pasted, takes out from wafer small
Device to be pasted is moved to and is pasted onto pellet surface to be pasted.
However, above-mentioned device attaching method needs to shift the micro devices on wafer, need after mobile by setting
It is standby to be accurately positioned position to be pasted corresponding to the micro devices taken out, be easy to appear contraposition offset, cause mounting device at
This is higher.
Summary of the invention
In view of this, the embodiment of the invention provides the processing of a kind of device attaching method, device packaging method and device to set
It is standby, with solve the problems, such as existing device attaching method be easy to appear contraposition offset cause to mount it is at high cost.
First aspect present invention provides a kind of device attaching method, comprising: the first sheet body is provided, on first sheet body
It is bonded at least two devices；By the surface bond of the second pellet surface and at least two device；By first sheet body
It is separated with second sheet body, and each device is bonded with the reservation of one of first sheet body, second sheet body.
Optionally, first sheet body and/or second sheet body are glass or silicon.
Optionally, described to separate first sheet body and second sheet body, and each device and described first
It includes: by first laser from first sheet body side direction that one of body, described second sheet body, which retain the step of bonding,
The device irradiation is to remove being bonded between the device and first sheet body；And/or by second laser from described
Two sheet body sides are irradiated towards the device to remove being bonded between the device and second sheet body.
Optionally, the one side of the device is bonded by the first bonding glue with first sheet body, and another side passes through second
Bonding glue is bonded with second sheet body；It is up to the first temperature that temperature is removed in the bonding of the first bonding glue, and described second
The minimum second temperature of temperature is removed in the bonding for being bonded glue, and first temperature is lower than the second temperature；It is described by described
One sheet body and second sheet body separation, and each device and one of first sheet body, second sheet body retain
The step of bonding includes: to be exposed to the bonding body of first sheet body, second sheet body and the device to be less than or equal to
The environment of first temperature is to remove the described first bonding for being bonded glue；By first sheet body, second sheet body and institute
The bonding body for stating device is exposed to the environment more than or equal to the second temperature to remove the bonding of the second bonding glue.
Optionally, the step of the first sheet body of the offer includes: by the first slide surface and device wafers surface bond；It cuts
The device wafers are cut or etched, independent device is obtained.
Second aspect of the present invention provides a kind of device packaging method, comprising: first aspect or first aspect are any one
Device attaching method described in kind optional embodiment；X encapsulated layer, the X encapsulated layer are made in the X pellet surface
It is in contact at least partly surface of the device；Wherein, " X " includes " first " and/or " second ".
Optionally, described to make X encapsulated layer in the X pellet surface, the X encapsulated layer and the device are extremely
After the step of small part surface is in contact, further includes: remove the X sheet body.
Optionally, the surface of the device towards the X sheet body is provided with pad；The dismounting X sheet body
After step further include: make soldered ball on the surface of the X encapsulated layer.
Optionally, the X encapsulated layer covers the surface of the device；The X plastic packaging layer surface is carried out thinned.
Third aspect present invention provides a kind of device processing equipment, any one for executing first aspect and first aspect
Method described in kind optional embodiment.
Fourth aspect present invention provides a kind of device processing equipment, any one for executing second aspect and second aspect
Method described in kind optional embodiment.
Device attaching method, device packaging method provided by the embodiment of the present invention and device processing equipment, the first sheet body
Bonding body is formed with two surface bonds of device respectively with the second sheet body, then separates the first sheet body and the second sheet body, and
And each device is bonded with the reservation of one of the first sheet body, the second sheet body, the sheet body after foring two attachments.Pass through the party
Method can mount the device on the first sheet body to the second sheet body, and without taking out and moving from the first sheet body by device,
It is not in the situation that micro devices are scattered；It is to be pasted corresponding to the micro devices taken out without being accurately positioned by equipment
Position avoids the contraposition offset during attachment, has saved attachment cost.
Detailed description of the invention
The features and advantages of the present invention will be more clearly understood by referring to the accompanying drawings, and attached drawing is schematically without that should manage
Solution is carries out any restrictions to the present invention, in the accompanying drawings:
Fig. 1 shows a kind of flow chart of device attaching method according to an embodiment of the present invention；
Fig. 2A -2F shows a kind of step schematic diagram of device attaching method according to an embodiment of the present invention；
Fig. 3 shows the flow chart of another device attaching method according to an embodiment of the present invention；
Fig. 4 shows the flow chart of another device attaching method according to an embodiment of the present invention；
Fig. 5 shows a kind of flow chart of device packaging method according to an embodiment of the present invention.
Specific embodiment
In order to keep the purpose of the present invention, advantage, preparation method clearer, below in conjunction with attached drawing to implementation of the invention
Example is described in detail, and examples of the embodiments are shown in the accompanying drawings, wherein in attached drawing part-structure directly given it is excellent
The structural material of choosing, it is clear that described embodiments are some of the embodiments of the present invention, instead of all the embodiments.It needs
Illustrate, the embodiment being described with reference to the drawings is exemplary, and the structural material shown in embodiment is also exemplary, only
It is used to explain the present invention, and is not construed as limiting the claims, the attached drawing of each embodiment of the present invention is merely to signal
Purpose, therefore be not necessarily to scale.Based on the embodiments of the present invention, those skilled in the art are not making wound
Every other embodiment obtained under the premise of the property made labour, shall fall within the protection scope of the present invention.
Embodiment one
Fig. 1 shows a kind of flow chart of device attaching method according to an embodiment of the present invention, can be used for Mount Device,
Such as other any devices that pasting chip, lens or the device attaching method can be applicable in.As shown in Figure 1, this method packet
Include following steps:
S101: the first sheet body is provided, is bonded at least two devices on the first sheet body.
S102: by the surface bond of the second pellet surface and at least two devices.
Since the first surface of device is bonded with the first sheet body, the first table will be removed by referring in step S102 on device
Other surfaces (such as the second surface being oppositely arranged with first surface) except face are bonded with the second pellet surface.
As shown in Figure 2 C, after step S102, the first sheet body 10, the second sheet body 30 are respectively and on the first sheet body 10
Device 20 is bonded, and forms the three-decker of the first sheet body 10, device 20, the second sheet body 30.
S103: the first sheet body and the second sheet body are separated, and one of each device and the first sheet body, the second sheet body
Retain bonding.
Bonding body shown in Fig. 2 C is after executing step S103, sheet body after forming two attachments, respectively such as Fig. 2 E and figure
Shown in 2F.
Above-mentioned device attaching method, the first sheet body and the second sheet body are bonded with the formation of two surface bonds of device respectively
Then body separates the first sheet body and the second sheet body, and one of each device and the first sheet body, the second sheet body retain key
It closes, the sheet body after foring two attachments.In this way, the device on the first sheet body can be mounted to the second sheet body, and
It is not in the situation that micro devices are scattered and without taking out and moving from the first sheet body by device；Without passing through equipment
It is accurately positioned position to be pasted corresponding to the micro devices taken out, the contraposition offset during attachment is avoided, has saved patch
Dress up this.
Embodiment two
Fig. 3 shows the flow chart of another device attaching method according to an embodiment of the present invention, can be used for mounter
Part, such as other any devices that pasting chip, lens or the device attaching method can be applicable in.As shown in figure 3, the party
Method includes the following steps:
S201: by the first slide surface and device wafers surface bond.
As shown in Figure 2 A, by 20 surface bond of the first slide glass 10 and device wafers, the mode of bonding, which can be, passes through pressing
So that the first slide glass 10 and device wafers 20 are bonded by Van der Waals force；It can also be carried out as shown in Figure 2 B by bonding glue-line A
Bonding.
S202: cutting or etched features wafer obtain independent device.As shown in Figure 2 B.
Above-mentioned steps S201 and S202 in fact provide it is a kind of prepare in embodiment one " surface bond has at least two
First sheet body 10 " of device 20.It should be added that " surface bond has the of at least two devices for preparation in the application
The mode of one sheet body " is not limited to this.For example, device can also be mounted by other means to the surface of the first sheet body 10.
S203: by the surface bond of the second pellet surface and at least two devices.
Please refer to step S201, the mode that the second pellet surface is bonded with the surface of at least two device can be with
It is by pressing so that the secondth sheet body 30 and device wafers 20 are bonded by Van der Waals force；Key can also be passed through as shown in Figure 2 B
Glue-line A is closed to be bonded.
S204: it is irradiated by first laser from the first sheet body side towards device to remove between device and the first sheet body
Bonding.
As shown in Figure 2 D, can be irradiated from the side of the first sheet body 10 towards device 20, with remove independent device 20 with
Bonding between first sheet body 10.For example, when, by being bonded glue A bonding, working as first laser between device 20 and the first sheet body 10
When penetrating the first sheet body 10 and acting on bonding glue A, bonding glue A loses viscous viscosity or decomposes.
S205: it is irradiated by second laser from the second sheet body side towards device to remove between device and the second sheet body
Bonding.
As shown in Figure 2 D, can be irradiated from the side of the second sheet body 30 towards device 20, with remove independent device 20 with
Bonding between second sheet body 30.For example, when, by being bonded glue B bonding, working as second laser between device 20 and the second sheet body 20
When penetrating the second sheet body 30 and acting on bonding glue B, bonding glue B loses viscous viscosity or decomposes.
It should be added that one in above-mentioned steps S204 and S205 can also be only included in the same embodiment
Person, step S204 and S205 are not required to be present in the same embodiment.For example, removing device 20 and first by step S204
Bonding body, can be by being exposed in predetermined temperature environment to remove device 20 and the second sheet body 30 by the bonding between sheet body 10
Between bonding.
As a kind of optional embodiment of the present embodiment, any one of the first sheet body 10, second sheet body 20 can be
Glass or silicon, in order to act on the bonded layer between sheet body and device after laser penetration sheet body.
Above-mentioned steps S204 and S205 is practical to provide a kind of mode for realizing the step S103 in embodiment one.
Above-mentioned device attaching method is not in the situation that micro devices are scattered, and can be avoided attachment during
Attachment cost is saved in contraposition offset.Specifically please refer to embodiment one.
Embodiment three
Fig. 4 shows the flow chart of another device attaching method according to an embodiment of the present invention, can be used for mounter
Part, such as other any devices that pasting chip, lens or the device attaching method can be applicable in.As shown in figure 4, the party
Method includes the following steps:
S301: by the first slide surface and device wafers surface bond.Refer to step S201.
S302: cutting or etched features wafer obtain independent device.Refer to step S202.
S303: by the surface bond of the second pellet surface and at least two devices.Refer to step S203.
The following steps S304 and S305 provide another mode for realizing the step S103 in embodiment one.It is following
In step S304 and S305, the one side of device is bonded by the first bonding glue with the first sheet body, and another side passes through the second bonding glue
It is bonded with the second sheet body.It is up to the first temperature T1 that temperature is removed in the bonding of first bonding glue, and the bonding of the second bonding glue is removed
The minimum second temperature T2 of temperature, wherein T1 < T2.
S304: the bonding body of first sheet body, second sheet body and the device is exposed to less than or equal to
One temperature environment is to remove the described first bonding for being bonded glue.
By the step, being bonded between device and the first sheet body can be removed, and will not destroy device and second
Bonding between body.
S305: the bonding of first sheet body, second sheet body and the device is mentioned and is exposed to second temperature environment
To remove the bonding of the second bonding glue.
By the step, being bonded between device and the second sheet body can be removed, and will not destroy device and first
Bonding between body.
Certainly, above-mentioned steps S304 and S305 before execution, need first to coat bonding glue, and device and the first sheet body
Between first bonding glue-line include two kinds of bonding glue, it includes two kinds of keys that second between device and the second sheet body, which is bonded glue-line also,
Glue is closed, and device is coated with the first bonding glue on one side, another side is coated with the second bonding glue.
Above-mentioned device attaching method is not in the situation that micro devices are scattered, and can be avoided attachment during
Attachment cost is saved in contraposition offset.Specifically please refer to embodiment one.
Example IV
Fig. 5 shows a kind of flow chart of device packaging method according to an embodiment of the present invention, can be used for packaging,
Such as other any devices that encapsulation chip, lens or the device packaging method can be applicable in.As shown in figure 5, this method packet
Include following steps:
S401: the first sheet body is provided, is bonded at least two devices on the first sheet body.
S402: by the surface bond of the second pellet surface and at least two devices.
S403: the first sheet body and the second sheet body are separated, and one of each device and the first sheet body, the second sheet body
Retain bonding.
S404: the first encapsulated layer is made in the first pellet surface, the first encapsulated layer connects at least partly surface of device
Touching.
S405: the second encapsulated layer is made in the second pellet surface, the second encapsulated layer connects at least partly surface of device
Touching.
It should be added that encapsulated layer can be made into the first pellet surface, or only in the second pellet surface
Make encapsulated layer.Encapsulated layer is referred to as molding layer, can be formed with plastic packaging glue, and specific production method is the usual of this field
Technological means, details are not described herein by the application.
Above-mentioned device attaching method is not in the situation that micro devices are scattered, and can be avoided attachment during
Attachment cost is saved in contraposition offset.Specifically please refer to embodiment one.
As a kind of optional embodiment of the present embodiment, after step S404, the first sheet body can also be removed；In step
After rapid S405, the second sheet body can also be removed.
Still optionally further, the surface of device towards X sheet body is provided with pad.It can be with after removing the first sheet body
Soldered ball is made on the surface of the first encapsulated layer, can also make and weld on the surface of the second encapsulated layer after removing the second sheet body
Ball.It can be directly in encapsulation layer surface production soldered ball；Alternatively, when encapsulated layer covering device surface, it can be first to encapsulated layer
Surface carries out thinned, exposes after the pad of device again in encapsulation layer surface production soldered ball.
Optionally, many other operations can also be performed based on encapsulated layer, such as setting wiring layer etc., the application is herein not
It enumerates again.
Embodiment five
The embodiment of the present invention provides a kind of device processing equipment, for executing any embodiment institute in embodiment one to four
The method stated.
It should be added that the first sheet body, the second sheet body in the application refer to the object of slab organization, such as can
To be chip, slide glass.
Although being described in detail about example embodiment and its advantage, those skilled in the art can not departed from
Various change, replacement are carried out to these embodiments in the case where spirit of the invention and protection scope defined in the appended claims
And modification, such modifications and variations are each fallen within be defined by the appended claims within the scope of.For other examples, ability
The those of ordinary skill in domain should be readily appreciated that the order of processing step can become while keeping in the scope of the present invention
Change.
In addition, application range of the invention is not limited to the technique, mechanism, system of specific embodiment described in specification
It makes, material composition, means, method and step.From the disclosure, will be easy as those skilled in the art
Ground understands, for current technique that is existing or will developing later, mechanism, manufacture, material composition, means, method or
Step, wherein they execute the function that the corresponding embodiment described with the present invention is substantially the same or the knot that acquisition is substantially the same
Fruit can apply them according to the present invention.Therefore, appended claims of the present invention are intended to these techniques, mechanism, system
It makes, material composition, means, method or step are included in its protection scope.
Claims (10)
1. a kind of device attaching method characterized by comprising
First sheet body is provided, is bonded at least two devices on first sheet body；
By the surface bond of the second pellet surface and at least two device；
First sheet body and second sheet body are separated, and each device and first sheet body, second sheet body
One of retain bonding.
2. device attaching method according to claim 1, which is characterized in that first sheet body and/or second described
Body is glass or silicon.
3. device attaching method according to claim 1 or 2, which is characterized in that described by first sheet body and described
The separation of second sheet body, and the step of each device is bonded with the reservation of one of first sheet body, second sheet body is wrapped
It includes:
It is irradiated by first laser from first sheet body side towards the device to remove the device and described first
Bonding between body；And/or
It is irradiated by second laser from second sheet body side towards the device to remove the device and described second
Bonding between body.
4. device attaching method according to claim 1, which is characterized in that the one side of the device passes through the first bonding glue
It is bonded with first sheet body, another side is bonded by the second bonding glue with second sheet body；The key of the first bonding glue
Closing and removing temperature is up to the first temperature, the bonding dismounting minimum second temperature of temperature of the second bonding glue, and described first
Temperature is lower than the second temperature；
It is described to separate first sheet body and second sheet body, and each device and first sheet body, described second
One of sheet body retain bonding the step of include:
The bonding body of first sheet body, second sheet body and the device is exposed to less than or equal to first temperature
Environment with remove it is described first bonding glue bonding；
The bonding body of first sheet body, second sheet body and the device is exposed to more than or equal to the second temperature
Environment with remove it is described second bonding glue bonding.
5. device attaching method according to claim 1, which is characterized in that the step of the first sheet body of the offer includes:
By the first slide surface and device wafers surface bond；
The device wafers are cut or etched, independent device is obtained.
6. a kind of device packaging method characterized by comprising
Device attaching method described in any one of claim 1 to 5；
X encapsulated layer is made in the X pellet surface, the X encapsulated layer connects at least partly surface of the device
Touching；
Wherein, " X " includes " first " and/or " second ".
7. device packaging method according to claim 6, which is characterized in that described to make X in the X pellet surface
After the step of encapsulated layer, the X encapsulated layer is in contact at least partly surface of the device, further includes: described in dismounting
X sheet body.
8. device packaging method according to claim 7, which is characterized in that table of the device towards the X sheet body
Face is provided with pad；
After the step of dismounting X sheet body further include: make soldered ball on the surface of the X encapsulated layer.
9. device packaging method according to claim 7, which is characterized in that the X encapsulated layer covers the device
Surface；
The X plastic packaging layer surface is carried out thinned.
10. a kind of device processing equipment, which is characterized in that require 1 to 9 described in any item methods for perform claim.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810710361.3A CN108962769A (en) | 2018-07-02 | 2018-07-02 | Device attaching method, device packaging method and device processing equipment |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810710361.3A CN108962769A (en) | 2018-07-02 | 2018-07-02 | Device attaching method, device packaging method and device processing equipment |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN108962769A true CN108962769A (en) | 2018-12-07 |
Family
ID=64484803
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201810710361.3A Withdrawn CN108962769A (en) | 2018-07-02 | 2018-07-02 | Device attaching method, device packaging method and device processing equipment |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN108962769A (en) |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105723528A (en) * | 2015-11-04 | 2016-06-29 | 歌尔声学股份有限公司 | Mini LED transferring method, manufacturing method, device and electric device |
| WO2017107097A1 (en) * | 2015-12-23 | 2017-06-29 | Goertek.Inc | Micro-led transfer method and manufacturing method |
| US20180096877A1 (en) * | 2016-09-30 | 2018-04-05 | International Business Machines Corporation | Multi-chip package assembly |
| WO2018096455A1 (en) * | 2016-11-25 | 2018-05-31 | Vuereal Inc. | Integration of micro-devices into system substrate |
-
2018
- 2018-07-02 CN CN201810710361.3A patent/CN108962769A/en not_active Withdrawn
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105723528A (en) * | 2015-11-04 | 2016-06-29 | 歌尔声学股份有限公司 | Mini LED transferring method, manufacturing method, device and electric device |
| WO2017107097A1 (en) * | 2015-12-23 | 2017-06-29 | Goertek.Inc | Micro-led transfer method and manufacturing method |
| US20180096877A1 (en) * | 2016-09-30 | 2018-04-05 | International Business Machines Corporation | Multi-chip package assembly |
| WO2018096455A1 (en) * | 2016-11-25 | 2018-05-31 | Vuereal Inc. | Integration of micro-devices into system substrate |
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| WW01 | Invention patent application withdrawn after publication |
Application publication date: 20181207 |
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| WW01 | Invention patent application withdrawn after publication |