CN108942638B

CN108942638B - Grinding device

Info

Publication number: CN108942638B
Application number: CN201810930041.9A
Authority: CN
Inventors: 杨俊铖; 蒋阳波; 高林; 王光毅
Original assignee: Yangtze Memory Technologies Co Ltd
Current assignee: Yangtze Memory Technologies Co Ltd
Priority date: 2018-08-15
Filing date: 2018-08-15
Publication date: 2020-11-13
Anticipated expiration: 2038-08-15
Also published as: CN108942638A

Abstract

The application discloses grinder includes: a grinding platform; the grinding pad is positioned on the grinding platform; the grinding fluid output structure is positioned above the grinding pad and used for outputting the initial grinding fluid and placing the initial grinding fluid on the grinding pad; and the grinding head is positioned above the grinding pad and used for fixing a product to be ground and enabling the product to be ground to be in contact with the grinding pad, wherein the grinding liquid output structure comprises a blocking part, the blocking part is in contact with the grinding pad, when the grinding platform drives the grinding pad to rotate, the initial grinding liquid is in contact with the product to be ground, and the blocking part is used for preventing the used grinding liquid from being mixed with the initial grinding liquid. The invention solves the problem of reduced grinding rate caused by dilution of the concentration of the initial grinding fluid by the used grinding fluid, and achieves the technical effect of preventing the used grinding fluid from being mixed with the initial grinding fluid.

Description

Grinding device

Technical Field

The invention relates to the technical field of semiconductors, in particular to a grinding device.

Background

With the rapid development of the semiconductor industry, the size of electronic devices is gradually reduced, thereby requiring the surface flatness of wafers to reach the nanometer level. Conventional planarization techniques can only achieve local planarization, but when the minimum feature size reaches below 0.25 μm, global planarization is necessary.

In the prior art, a Chemical Mechanical Polishing (CMP) technique can achieve global planarization.

However, in the polishing apparatus for chemical mechanical polishing, after the slurry (slurry) on the polishing Pad (Pad) that has reacted with the wafer surface is removed from the polishing Pad by the Pad conditioner, the remaining reacted slurry still remains on the polishing Pad, and this portion of the slurry is mixed with the initial slurry that has not reacted with the wafer surface by the rotation of the polishing Pad, thereby diluting the concentration of the initial slurry and causing a problem of a decrease in the polishing rate.

Disclosure of Invention

In view of the above problems, an object of the present invention is to provide a polishing apparatus that prevents a used polishing liquid from being mixed with an initial polishing liquid, thereby solving the problem of a decrease in polishing rate.

The present invention provides a grinding apparatus comprising: a grinding platform; a polishing pad positioned on the polishing platen; the grinding fluid output structure is positioned above the grinding pad and used for outputting and placing initial grinding fluid on the grinding pad; and the grinding head is positioned above the grinding pad and used for fixing a product to be ground and enabling the product to be ground to be in contact with the grinding pad, wherein the grinding liquid output structure comprises a blocking part, the blocking part is in contact with the grinding pad, when the grinding platform drives the grinding pad to rotate, the initial grinding liquid is in contact with the product to be ground, and the blocking part is used for preventing the used grinding liquid from being mixed with the initial grinding liquid.

Preferably, the slurry output structure further includes: a fixed component at least partially located above the polishing pad; and a plurality of slurry output parts arranged opposite to the polishing pad, distributed on the fixing member, and configured to output the initial slurry; wherein, the stopping component is fixedly connected with the fixing component, and the plurality of grinding fluid output parts are positioned on one side of the stopping component.

Preferably, the number of the plurality of slurry outlets includes 5.

Preferably, the plurality of polishing liquid outlets are uniformly distributed on a surface of the fixing member facing the polishing pad.

Preferably, the polishing pad is circular.

Preferably, the length of the contact area of the blocking member with the polishing pad matches the radius of the polishing pad.

Preferably, the fixing member is a rectangular parallelepiped having a length matching a radius of the polishing pad.

Preferably, the fixing member is V-shaped.

Preferably, the grinding head comprises a positioning ring for fixing the product to be ground.

Preferably, the blocking member is the same material as the retaining ring.

Preferably, the polishing pad conditioner is also included and is positioned above the polishing pad and used for removing the used polishing liquid from the polishing pad.

According to the grinding device provided by the invention, the stopping component is arranged on the grinding fluid output structure and is in contact with the grinding pad, when the grinding platform drives the grinding pad to rotate, the used grinding fluid is separated from the initial grinding fluid by the stopping component, so that the problem of reduction of grinding speed caused by dilution of the concentration of the initial grinding fluid by the used grinding fluid is solved.

In a preferred embodiment, the plurality of slurry outlets are uniformly distributed on the fixing member, and when the initial slurry is output through the plurality of slurry outlets, the initial slurry can be uniformly distributed on the polishing pad, thereby improving the use efficiency of the slurry.

In addition, the material of the blocking component is the same as that of the positioning ring of the grinding head, so that the probability of generating defects in the product is reduced.

Drawings

The above and other objects, features and advantages of the present invention will become more apparent from the following description of the embodiments of the present invention with reference to the accompanying drawings.

Fig. 1 shows a schematic perspective view of an embodiment according to the invention.

Fig. 2 shows a top view of the grinding device of fig. 1.

Figure 3 shows a schematic view of the polishing head of figure 1.

Fig. 4 shows a schematic diagram of an effect analysis according to an embodiment of the invention.

Detailed Description

The invention will be described in more detail below with reference to the accompanying drawings. Like elements in the various figures are denoted by like reference numerals. For purposes of clarity, the various features in the drawings are not necessarily drawn to scale. Moreover, certain well-known elements may not be shown in the figures.

In the following description, numerous specific details of the invention, such as structure, materials, dimensions, processing techniques and techniques of components, are set forth in order to provide a more thorough understanding of the invention. However, as will be understood by those skilled in the art, the present invention may be practiced without these specific details.

It will be understood that when a layer, region or layer is referred to as being "on" or "over" another layer, region or layer in describing the structure of the component, it can be directly on the other layer, region or layer or intervening layers or regions may also be present. Also, if the component is turned over, one layer or region may be "under" or "beneath" another layer or region.

Fig. 1 is a schematic perspective view illustrating a polishing apparatus according to an embodiment of the present invention, fig. 2 is a top view illustrating the polishing apparatus of fig. 1, and fig. 3 is a schematic structural view illustrating the polishing head of fig. 1.

As shown in fig. 1 to 3, a polishing apparatus according to an embodiment of the present invention includes: a polishing platen 110, a polishing pad 120, a slurry outlet 130, a polishing head 140, and a polishing pad conditioner 150. Wherein the polishing pad 120 is disposed on the polishing platen 110; the polishing fluid outlet 130, the polishing head 140 and the polishing pad conditioner 150 are disposed above the polishing pad 120.

In the embodiment, the polishing platen 110 and the polishing pad 120 are both circular, and the size of the polishing platen 110 is not smaller than that of the polishing pad 120, however, the embodiment of the invention is not limited thereto, and persons skilled in the art can make other settings on the shapes and sizes of the polishing platen 110 and the polishing pad 120 as required.

The slurry outlet structure 130 includes: a fixing member 131, a plurality of slurry output parts 132 and a blocking member 133, wherein the fixing member 131 is at least partially located above the polishing pad 120, the plurality of slurry output parts 132 are disposed opposite to the polishing pad 120 and distributed on the fixing member, one end of the blocking member 133 is fixedly connected to the fixing member 131, the other end of the blocking member 133 is in contact with the polishing pad 120, the plurality of slurry output parts 132 are located on the same side of the blocking member 133, wherein the fixing member 131 is rectangular and has a length matching the radius of the polishing pad 120, the plurality of slurry output parts 132 are uniformly distributed on the surface of the fixing member 131 opposite to the polishing pad 120, the length of the contact area between the blocking member 133 and the polishing pad 120 matches the radius of the polishing pad 120, for example, the length of the contact area between the blocking member 133 and the polishing pad 120 is equal to the radius of the polishing pad 120, but the embodiment of the present invention is not limited thereto, and a person skilled in the art can adjust the length of the fixing, The polishing liquid discharge portions 132 and the stopper members 133 are provided in other shapes, sizes, and numbers, for example, the fixing member 131 and the stopper members 133 may have a V-shape, and the number of the polishing liquid discharge portions 132 includes 5.

The polishing head 140 includes: a vacuum suction device 141 and a positioning ring 142, wherein the vacuum suction device 141 is located above the product 101 to be polished (e.g., a wafer), and the positioning ring 142 is located at the outer periphery of the product 101 to be polished.

The polishing pad conditioner 150 includes: the head 151 is fixedly connected to the connecting bar 152, and the head 151 is in contact with the polishing pad 120.

Hereinafter, the operation of the grinding apparatus according to the embodiment of the present invention will be described in detail.

As shown in fig. 1 to 3, when the polishing apparatus is operated, the product 101 to be polished is sucked by the vacuum sucking apparatus 141 and fixed by the positioning ring 142, and the polishing head 140 brings the product 101 to be polished into contact with the polishing pad 120. The slurry output structure 130 outputs the initial slurry through a plurality of slurry output parts 132 and places the initial slurry on the polishing pad 120. The polishing platen 110 drives the polishing pad 120 to rotate, and the polishing pad 120 and the product 101 to be polished rotate relatively, so that the initial polishing slurry is uniformly distributed on the surface of the polishing product 101 contacting the polishing pad 120. Since the plurality of slurry outlets 132 are uniformly distributed on the fixing member 131, when the initial slurry is discharged through the plurality of slurry outlets 132, the initial slurry can be uniformly distributed on the polishing pad 120. After the initial slurry contacts and reacts with the product 101 to be polished, the used slurry continues to rotate along with the polishing pad 120, the connecting rod 152 of the polishing pad adjuster 150 drives the head 151 to move, so as to remove the used slurry from the polishing pad 120, at this time, the polishing pad 120 may still have some used slurry, when the used slurry passes through the slurry output structure 130 again, because the blocking component 133 contacts the polishing pad 120, the used slurry and the initial slurry can be prevented from being mixed, and in addition, the material of the blocking component 133 is preferably the same as that of the positioning ring 142, so that defects generated on the polishing pad 120 or the product 101 to be polished can be reduced.

As shown in fig. 4, the grinding apparatus of the embodiment of the present invention successfully circumvents the following two problems:

(1) since the slurry output structure 130 ' is a cantilever structure and does not contact with the polishing pad 120 ', although part of the used slurry moves out of the polishing pad 120 ' through the polishing pad regulator 150 ', when the residual slurry passes through the slurry output structure 130 ' again along with the rotation of the polishing pad 120 ', the used slurry will contact with the initial slurry output by the slurry output part 132 ', so that the concentration of the initial slurry is diluted by the slurry, thereby reducing the polishing rate.

(2) Since the slurry output portion 132 'is concentrated at one end of the slurry output structure 130' and corresponds to the central region of the polishing pad 120 ', the relative movement between the product to be polished fixed by the polishing head 140' and the polishing pad 120 'cannot rapidly and uniformly distribute the initial slurry on the polishing pad 120' and the surface of the product to be polished, thereby reducing the usage efficiency of the slurry and the polishing efficiency.

It is noted that, herein, relational terms such as first and second, and the like may be used solely to distinguish one entity or action from another entity or action without necessarily requiring or implying any actual such relationship or order between such entities or actions. Also, the terms "comprises," "comprising," or any other variation thereof, are intended to cover a non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements does not include only those elements but may include other elements not expressly listed or inherent to such process, method, article, or apparatus. Without further limitation, an element defined by the phrase "comprising an … …" does not exclude the presence of other identical elements in a process, method, article, or apparatus that comprises the element.

While embodiments in accordance with the invention have been described above, these embodiments are not intended to be exhaustive or to limit the invention to the precise embodiments described. Obviously, many modifications and variations are possible in light of the above teaching. The embodiments were chosen and described in order to best explain the principles of the invention and the practical application, to thereby enable others skilled in the art to best utilize the invention and various embodiments with various modifications as are suited to the particular use contemplated. The invention is limited only by the claims and their full scope and equivalents.

Claims

1. A grinding apparatus comprising:

a grinding platform;

a polishing pad positioned on the polishing platen;

the grinding fluid output structure is positioned above the grinding pad and used for outputting and placing initial grinding fluid on the grinding pad; and

a grinding head which is positioned above the grinding pad and is used for fixing a product to be ground and enabling the product to be ground to be in contact with the grinding pad,

wherein, the grinding fluid output structure includes:

a blocking member in contact with the polishing pad;

the fixing component is fixedly connected with the blocking component and at least partially positioned above the grinding pad; and

a plurality of polishing liquid output portions distributed on a surface of the fixing member facing the polishing pad, the plurality of polishing liquid output portions being located outside the dam member and on one side of a contact surface between the dam member and the polishing pad,

the plurality of grinding fluid output parts are used for outputting initial grinding fluid, when the grinding platform drives the grinding pad to rotate, the initial grinding fluid is contacted with the product to be ground, and the blocking component is used for preventing the used grinding fluid from being mixed with the initial grinding fluid.

2. The polishing apparatus according to claim 1, wherein the number of the plurality of polishing liquid outputs includes 5.

3. The polishing apparatus of claim 1, wherein the polishing pad is circular.

4. The polishing apparatus as recited in claim 3, wherein a length of a contact area of the blocking member with the polishing pad matches a radius of the polishing pad.

5. The polishing apparatus as set forth in claim 3, wherein the fixing member is a rectangular parallelepiped having a length matching a radius of the polishing pad.

6. The polishing apparatus as set forth in claim 3, wherein the fixing member is V-shaped.

7. The abrading device of claim 1, wherein the abrading head includes a retaining ring for retaining the product to be abraded.

8. The abrading device of claim 7, wherein the blocking member is the same material as the positioning ring.

9. The polishing apparatus as recited in any one of claims 1 to 8, further comprising a polishing pad conditioner positioned above the polishing pad for removing used polishing slurry from the polishing pad.