CN108928511A - Full-automatic semiconductor braiding packaging machine - Google Patents
Full-automatic semiconductor braiding packaging machine Download PDFInfo
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- CN108928511A CN108928511A CN201810562491.7A CN201810562491A CN108928511A CN 108928511 A CN108928511 A CN 108928511A CN 201810562491 A CN201810562491 A CN 201810562491A CN 108928511 A CN108928511 A CN 108928511A
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- semiconductor
- cylinder
- expects pipe
- band
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Classifications
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
- B65B—MACHINES, APPARATUS OR DEVICES FOR, OR METHODS OF, PACKAGING ARTICLES OR MATERIALS; UNPACKING
- B65B15/00—Attaching articles to cards, sheets, strings, webs, or other carriers
- B65B15/04—Attaching a series of articles, e.g. small electrical components, to a continuous web
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
- B65B—MACHINES, APPARATUS OR DEVICES FOR, OR METHODS OF, PACKAGING ARTICLES OR MATERIALS; UNPACKING
- B65B35/00—Supplying, feeding, arranging or orientating articles to be packaged
- B65B35/10—Feeding, e.g. conveying, single articles
- B65B35/16—Feeding, e.g. conveying, single articles by grippers
- B65B35/18—Feeding, e.g. conveying, single articles by grippers by suction-operated grippers
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
- B65B—MACHINES, APPARATUS OR DEVICES FOR, OR METHODS OF, PACKAGING ARTICLES OR MATERIALS; UNPACKING
- B65B57/00—Automatic control, checking, warning, or safety devices
- B65B57/02—Automatic control, checking, warning, or safety devices responsive to absence, presence, abnormal feed, or misplacement of binding or wrapping material, containers, or packages
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- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
Abstract
The present invention relates to semiconductor fabrication techniques fields.Full-automatic semiconductor braiding packaging machine, semiconductor feeding device, semiconductor handling device, carrier band conveying device, CCD vision inspection apparatus, lid band conveying device and compression sealing device including rack and thereon.The advantages of full-automatic semiconductor braiding packaging machine is that semiconductor, carrier band and lid band conveying are steady, high in machining efficiency, is automatically finished the encapsulation of semiconductor.
Description
Technical field
The present invention relates to semiconductor fabrication techniques fields, the especially equipment of semiconductor tape package.
Background technique
Currently, semicon industry, which generallys use braiding packaging machine, carries out product packaging.Traditional semiconductor discharge method is
Vibrating disk discharging, existing deficiency is discharge method fluctuation of service, and is easy to damage semiconductor components and devices.It is existing it is complete from
Dynamic semiconductor braiding packaging machine is as described in the full-automatic braiding packaging machine that China Patent Publication No. is CN206255236, including machine
Frame component, the storing component for placing element, the braid component for being wound to carrier band, and for element to be put into
Take-off assembly in carrier band.It is typically rows of to be placed in expects pipe after the completion of semiconductor machining.Existing full-automatic semiconductor
Deficiency existing for braiding packaging machine is：1. manipulator is directly taken out of expects pipe, semiconductor difficulty is big and low efficiency；2. semiconductor
It after being put into carrier band also needs cover that semiconductor packages could be completed with the process pressed, existing equipment operation is not carried out semiconductor
The full automation of braid encapsulation.
Summary of the invention
The object of the present invention is to provide a kind of semiconductor, carrier band and the conveyings of lid band steadily, and high in machining efficiency full-automatic half
Conductor braiding packaging machine.
To achieve the goals above, the technical solution adopted by the present invention is that：Full-automatic semiconductor braiding packaging machine, including
Rack and semiconductor feeding device thereon, semiconductor handling device, carrier band conveying device, CCD vision inspection apparatus, lid are with defeated
It send device and compresses sealing device；
Semiconductor feeding device is used for semiconductor feeding；Semiconductor feeding device and carrier band conveying device are carried by semiconductor to be filled
Set linking, semiconductor handling device is used for semiconductor from being transported in carrier band conveying device in semiconductor feeding device；Carrier band
Conveying of the conveying device for carrier band；CCD vision inspection apparatus for detect carrier band in whether neglected loading semiconductor；Lid band conveying
Device compresses the carrier band that sealing device is used to for lid band being pressed on carrier band conveying device conveying for covering band feeding；
Semiconductor handling device include transporting supports, first motor, photoelectric sensor, turntable, footstock, first movement slide,
First movement sliding rail, sucker, suction cup carrier, limit code-disc；Transporting supports are fixed on the rack, first motor and photoelectric sensing
Device is fixed on transporting supports, and limit code-disc connects first motor, passes through limit code-disc and photoelectric sensor control first
Motor positive and inverse moves amplitude；Turntable is mounted in the rotation axis of first motor, and footstock is mounted on carrying by revolute pair connection
On bracket, footstock is connect with first movement slide, and first movement sliding rail and first movement slide form prismatic pair and cooperate, and first
Shifting sledge lower end is mutually fixedly connected with suction cup carrier, and suction cup carrier forms revolute pair with the pin shaft of turntable eccentric position and connect；Sucker
It is fixed in suction cup carrier.
Preferably, semiconductor feeding device include tilt stand, inclination mounting plate, expects pipe rack, top air blowing cylinder,
Side pusher pipe mechanism, empty expects pipe collecting frame, mobile feeding mechanism, backgauge induction mechanism and empty expects pipe push away and fall cylinder；Tilt stand
It is fixed on the rack, the low early and high after inclination of inclination mounting plate is fixed on tilt stand；Top air blowing cylinder is mounted on inclination peace
The top of loading board, mobile feeding mechanism are mounted on the lower part of inclination mounting plate, and backgauge induction mechanism is connected mobile feeding mechanism；Material
Pipe rack is fixed on the inclination mounting plate between mobile feeding mechanism and top air blowing cylinder, and expects pipe rack is put for being laminated
The expects pipe of upper and lower ends opening is set, semiconductor is arranged in rows in expects pipe；Side pusher pipe mechanism is mounted on inclination mounting plate, side
Pusher pipe mechanism is in the side of expects pipe rack, and the inclination mounting plate of the expects pipe rack other side is equipped with empty expects pipe blanking
Hole；Top air blowing cylinder, empty expects pipe material-dropping hole, mobile feeding mechanism are from top to bottom on a line；Empty expects pipe, which pushes away, falls cylinder peace
On inclination mounting plate, empty expects pipe, which pushes away, falls cylinder for the empty expects pipe material-dropping hole of empty expects pipe push-in；Empty expects pipe collecting frame, which is fixed on, to incline
Oblique mounting plate bottom, empty expects pipe are collected rack position and are matched with empty expects pipe material-dropping hole.Further, side pusher pipe mechanism includes first
Cylinder, pusher part, gear tube socket and pressure pipe part；First cylinder is arranged on inclination mounting plate by the first cylinder fixed seat, and first
Telescopic-cylinder end connects pusher part, and the first cylinder drives pusher part laterally to move left and right；Pusher part is stepped, and pusher part is divided into
Low table close to the high table top of the first cylinder and by near-space expects pipe material-dropping hole, low table is in for accepting when pusher part is mobile
The expects pipe of moving condition, high table top are used to resist the expects pipe of lowermost end in expects pipe rack；Pressure pipe part is existed by gear tube socket setting
It tilts on mounting plate, pressure pipe part and pusher part are matched for clamping tightly expects pipe；Mobile feeding mechanism includes feedboard, blanking sliding rail, second
Cylinder, cylinder guide rod, distribution block and mobile limited block；Feedboard is fixed on inclination mounting plate；Feedboard is equipped with charging and slides
Empty expects pipe material-dropping hole is docked in road, charging slideway upper end；Blanking sliding rail include two pieces of blanking blocks, two pieces of blanking blocks be mounted on into
On flitch, the channel passed through for semiconductor is equipped between two pieces of blanking blocks, the channel passed through for semiconductor and charging slideway weight
It closes；Expects pipe bottom end is docked with for the channel that semiconductor passes through when pressure pipe part clamps expects pipe with pusher part；Mobile limited block is mounted on
On feedboard, for the setting of cylinder guide rod on mobile limited block, distribution block and cylinder guide rod form prismatic pair cooperation；Second cylinder is logical
It crosses the second cylinder fixed seat to be fixed on inclination mounting plate, the output end of the second cylinder connects distribution block, the second cylinder band
Dynamic distribution block moves left and right on cylinder guide rod；Distribution block be equipped with the matched deflector chute in channel that is passed through for semiconductor, lead
Hopper with charging slideway is overlapped, by distribution block move left and right selection deflector chute whether with passed through for semiconductor channel company
It is logical；Backgauge induction mechanism includes third cylinder, positioning fixture block, infrared detector and positioning seat；Positioning seat is in the bottom of feedboard
Portion, positioning seat are equipped with the locating slot docked with charging slideway, and infrared detector position corresponds to locating slot, and infrared detector is used for
Whether there is semiconductor in detection locating slot；Third cylinder clamps the semiconductor in locating slot by positioning fixture block.
Preferably, carrier band conveying device include conveying frame, unloaded band disk, fully loaded band disk, carrier tape driving mechanism,
Adjust bolt, feed screw nut seat, lead screw, movable platform, cylindrical guide component, fixed platform and leading truck；Conveying frame is fixed
It is arranged on the rack, unloaded band disk and fully loaded band disk are separately mounted to conveying frame both ends, and unloaded band disk is for zero load
The charging of band, the fully loaded collection for being used to be fully loaded with band with disk；Lid band conveying device and compress sealing device be in carrier band disk and
Between fully loaded band disk, carrier tape driving mechanism drives carrier band movement；The leading truck being fixed on conveying frame is for keeping
Carrier band is horizontal；It adjusts bolt to be fixedly connected with lead screw, lead screw is mounted on the rack by bearings at both ends seat, and feed screw nut seat passes through
Screw pair is fitted in lead screw, and feed screw nut seat is connected with movable platform；Movable platform is pacified by cylindrical guide component
Dress on the rack, adjusts movable platform by adjusting bolt and moves along cylindrical guide component direction；Fixed platform is fixed at machine
On frame, fixed platform is oppositely arranged with movable platform, and carrier band is adjusted between fixed platform and movable platform by rotation
Bolt adjusts the distance between fixed platform and movable platform.
Using the full-automatic semiconductor braiding packaging machine of above-mentioned technical proposal, semiconductor handling device is used for semiconductor
From being transported in carrier band conveying device in semiconductor feeding device, conveying and recycling of the carrier band conveying device for carrier band, CCD are regarded
Feel detection device be used for detect carrier band each magazine in whether neglected loading semiconductor, lid band conveying device for cover band feeding, press
Tight sealing device is used to for lid band being pressed on the carrier band of carrier band conveying device conveying.The full-automatic semiconductor braiding packaging machine
Advantage is that semiconductor, carrier band and lid band conveying are steady, high in machining efficiency, is automatically finished the encapsulation of semiconductor.
Detailed description of the invention
Fig. 1 is the configuration schematic diagram of the embodiment of the present invention.
Fig. 2 is the configuration schematic diagram of the semiconductor feeding device of the embodiment of the present invention.
Fig. 3 is the configuration schematic diagram of the side pusher pipe mechanism of the embodiment of the present invention.
Fig. 4 is the configuration schematic diagram of the mobile feeding mechanism of the embodiment of the present invention.
Fig. 5 is the configuration schematic diagram of the backgauge induction mechanism of the embodiment of the present invention.
Fig. 6 is the configuration schematic diagram of the semiconductor handling device of the embodiment of the present invention.
Fig. 7 is the configuration schematic diagram of the carrier band conveying device of the embodiment of the present invention.
Fig. 8 is the configuration schematic diagram of the carrier tape driving mechanism of the embodiment of the present invention.
Fig. 9 is the lid of the embodiment of the present invention with the configuration schematic diagram of conveying device.
Figure 10 is the configuration schematic diagram of the CCD vision inspection apparatus of the embodiment of the present invention.
Figure 11 is the configuration schematic diagram of the compression sealing device of the embodiment of the present invention.
Specific embodiment
The present invention is described further with embodiment with reference to the accompanying drawings of the specification.
Full-automatic semiconductor braiding packaging machine as shown in figs. 1-11, semiconductor feeding device including rack 1 and thereon
2, semiconductor handling device 3, carrier band conveying device 4, CCD vision inspection apparatus 5, lid band conveying device 6, compression sealing device 7
With control assembly 8.
It semiconductor feeding device 2 and is mounted in rack 1 at 45 degree inclination angles, semiconductor feeding device 2 is for semiconductor
Material；Semiconductor handling device 3 is fixed in rack 1, and semiconductor feeding device 2 and carrier band conveying device 4 pass through semiconductor
Handling device 3 is connected, and semiconductor for being transported to carrier band conveying dress by semiconductor handling device 3 from semiconductor feeding device 2
It sets in 4；Carrier band conveying device 4 is mounted in rack 1, conveying and recycling of the carrier band conveying device 4 for carrier band；The inspection of CCD vision
Survey device 5 setting lid band conveying device 6 on, CCD vision inspection apparatus 5 be used for detect carry each magazine in whether neglected loading
Semiconductor.
Lid band conveying device 6 is arranged in rack 1 with sealing device 7 is compressed, and lid band conveying device 6 is used to cover band feeding,
It compresses sealing device 7 and is used to for lid band being pressed on the carrier band that carrier band conveying device 4 conveys, make the semiconductor being arranged on carrier band
It is encapsulated；Control assembly 8 is used to control the working condition of entire working machine.
Rack 1 includes fot screw, universal wheel, organism frame and installation panel, and fot screw and universal wheel are fixedly installed
It is used to that the attachmentes such as the gas cylinder air valve for controlling the machine cylinder moving, installation be arranged in the bottom end of organism frame, inside organism frame
Panel is fixed on organism frame.
As shown in Figure 2, Figure 3 and Figure 4, semiconductor feeding device 2 is put including tilt stand 21, inclination mounting plate 20, expects pipe
Set frame 23, top air blowing cylinder 24, side pusher pipe mechanism 26, empty expects pipe collecting frame 27, mobile feeding mechanism 28, backgauge induction mechanism
29 and empty expects pipe push away and fall cylinder 25；Tilt stand 21 is fixed in rack 1, and the low early and high after inclination of inclination mounting plate 20 is fixed on
On tilt stand 21, tilts mounting plate 20 and component thereon and tilted in 45 degree；Top air blowing cylinder 24 is mounted on inclination mounting plate
20 top, mobile feeding mechanism 28 are mounted on the lower part of inclination mounting plate 20, and backgauge induction mechanism 29 is connected mobile charger
Structure 28；Expects pipe rack 23 is fixed on the inclination mounting plate 20 between mobile feeding mechanism 28 and top air blowing cylinder 24, expects pipe
Rack 23 is used to that the expects pipe a for placing upper and lower ends opening to be laminated, and semiconductor is arranged in rows in expects pipe a；Side pusher pipe mechanism
26 are mounted on inclination mounting plate 20, and side pusher pipe mechanism 26 is in the side of expects pipe rack 23, and expects pipe rack 23 is another
The inclination mounting plate 20 of side is equipped with empty expects pipe material-dropping hole 201；Top air blowing cylinder 24, empty expects pipe material-dropping hole 201, mobile charger
Structure 28 is from top to bottom on a line；Empty expects pipe push away fall cylinder 25 be mounted on inclination mounting plate 20 on, empty expects pipe, which pushes away, falls cylinder
Empty expects pipe is pushed into empty expects pipe material-dropping hole 201 by 25；Empty expects pipe collecting frame 27 is fixed on inclination 20 bottom of mounting plate, and empty expects pipe is collected
27 position of frame is matched with empty expects pipe material-dropping hole 201.
Semiconductor feeding device 2 at work, first by side pusher pipe mechanism 26 by the material of lowermost end in expects pipe rack 23
Pipe a is released to empty 201 direction of expects pipe material-dropping hole, and top air blowing cylinder 24 blows to the opening at the top of expects pipe a, partly leading in expects pipe a
Body is because top air blowing cylinder 24 is blown and the effect of semiconductor self weight, semiconductor slide downwards, and semiconductor is by moving feeding mechanism
28 controls orderly enter backgauge induction mechanism 29, control semiconductor handling device after backgauge induction mechanism 29 detects semiconductor
3 are carried；In expects pipe a after the whole landings of all semiconductors, side pusher pipe mechanism 26 resets, and empty expects pipe, which pushes away, falls the general of cylinder 25
Empty expects pipe is pushed into empty expects pipe material-dropping hole 201, and empty expects pipe falls into sky expects pipe collecting frame 27 and completes empty expects pipe collection.
Side pusher pipe mechanism 26 is two groups disposed in parallel.
Side pusher pipe mechanism 26 includes the first cylinder 261, pusher part 262, gear tube socket 263 and pressure pipe part 264；First cylinder
261 are arranged on inclination mounting plate 20 by the first cylinder fixed seat, 261 telescopic end of the first cylinder connection pusher part 262, and first
Cylinder 261 drives 262 side of pusher part to moving left and right；Pusher part 262 is stepped, and pusher part 262 divides for close to the first cylinder
261 high table top 2621 and low table 2622 by near-space expects pipe material-dropping hole 201, low table is for holding when pusher part 262 is mobile
The expects pipe in moving condition is connect, high table top is used to resist the expects pipe of lowermost end in expects pipe rack 23；Pressure pipe part 264 passes through gear
For the setting of tube socket 263 on inclination mounting plate 20, pressure pipe part 264 and pusher part 262 are matched for clamping tightly expects pipe.
Side pusher pipe mechanism 26 is in use, when the first cylinder 261 is failure to actuate, the expects pipe of lowermost end in expects pipe rack 23
A is on low table 2622；First cylinder 261 drives pusher part 262 to be moved to the left, and the left-hand end of high table top 2621 pushes expects pipe
The expects pipe a of 23 lowermost end of rack is detached from expects pipe rack 23, and expects pipe a is moved to left along pusher part 262 on low table 2622, pushed away
High table top 2621 resists the expects pipe of lowermost end in expects pipe rack 23 always during 262 left side of materials and parts is dynamic；Expects pipe a is moved to sky
201 top of expects pipe material-dropping hole, 261 stopping of the first cylinder movement, expects pipe a left and right directions is by gear tube socket 263 and high table top at this time
2621 left side is fixed, and up and down direction is fixed by 264 bottom of pressure pipe part and low table 2622.After expects pipe a is fixed, top is blown
Cylinder 24 starts to act, and semiconductor flows out expects pipe a.For semiconductor all after outflow expects pipe a, the first cylinder 261 drives pusher part 262
It resets to the right, the effect of expects pipe a compression pipe fitting 264 automatically falls into sky expects pipe material-dropping hole after the support for losing low table 2622
In 201, falls on sky expects pipe collecting frame 27 and complete empty expects pipe collection, the expects pipe rack resisted always by high table top 2621 originally
The expects pipe of lowermost end is fallen on low table 2622 in 23, repetitive operation.
Mobile feeding mechanism 28 includes feedboard 280, blanking sliding rail 22, the second cylinder 281, cylinder guide rod 282, distribution block
283 and mobile limited block；Feedboard 280 is fixed on inclination mounting plate 20；Feedboard 280 is equipped with charging slideway 2801, into
Expect that empty expects pipe material-dropping hole 201 is docked in 2801 upper end of slideway；Blanking sliding rail 22 includes two pieces of blanking blocks 221, two pieces of blanking blocks
221 are mounted on feedboard 280, and the channel 222 passed through for semiconductor is equipped between two pieces of blanking blocks 221, is worn for semiconductor
The channel 222 crossed is overlapped with charging slideway 2801；Expects pipe bottom end is partly led with confession when pressure pipe part 264 clamps expects pipe with pusher part 262
The channel docking that body passes through；Mobile limited block is mounted on feedboard 280, and the setting of cylinder guide rod 282 divides on mobile limited block
Expect that block 283 and cylinder guide rod 282 form prismatic pair cooperation；Second cylinder 281 is fixed at by the second cylinder fixed seat 284
It tilts on mounting plate 20, the output end of the second cylinder 281 connects distribution block 283, and the second cylinder 281 drives distribution block 283 in circle
It is moved left and right on column guide rod 282；Distribution block 283 is equipped with and the matched deflector chute 2831 in channel that passes through for semiconductor, guide
Slot 2831 with charging slideway 2801 is overlapped, by distribution block 283 move left and right select deflector chute 2831 whether with for semiconductor
The channel connection passed through.
Mobile feeding mechanism 28 slides along the central sliding rail of blanking sliding rail 22 at work, by semiconductor, when distribution block 283 with
When blanking sliding rail 22 is located on same axis, deflector chute 2831 is connected with the channel 222 passed through for semiconductor, and semiconductor can be slided
It falls, then distribution block 283 is pushed to move left and right, semiconductor, which is blocked, not can enter distribution block 283, falls, and thus controls and partly leads
Body orderly falls to backgauge induction mechanism 29 one by one.
As shown in figure 5, backgauge induction mechanism 29 includes third cylinder 291, positioning fixture block 292, infrared detector 293 and determines
Position seat 295；Positioning seat 295 is in the bottom of feedboard 280, and positioning seat 295 is equipped with the positioning docked with charging slideway 2801
Slot 2501,293 position of infrared detector correspond to locating slot 2501, and whether infrared detector 293 has half for detecting in locating slot
Conductor；Third cylinder 291 clamps the semiconductor in locating slot 2591 by positioning fixture block 292
Positioning fixture block 292 is two pieces, and two pieces of positioning fixture blocks 292 are connected on two mobile terminals of third cylinder 291, third
Cylinder 291 controls two 292 clamp or release semiconductors of positioning fixture block；2501 bottom of locating slot, which is equipped with, expects position block 294,
Expect position block 294 for stopping semiconductor to continue to slide.
Backgauge induction mechanism 29 in use, semiconductor whereabouts encounter expect position block 294 after stop, infrared detector
After 293 detect semiconductor, third cylinder 291 drives two positioning fixture blocks 292 in opposite directions close to movement, to clamp locating slot
Semiconductor in 2501, positions semiconductor, and semiconductor handling device 3 is waited to carry.
As shown in fig. 6, semiconductor handling device 3 includes transporting supports 31, first motor 32, photoelectric sensor 33, turntable
34, footstock 35, first movement slide 36, first movement sliding rail 37, sucker 38, suction cup carrier 39, limit code-disc 310 and shield
311；Transporting supports 31 are fixed in rack 1, and first motor 32 and photoelectric sensor 33 are fixed at transporting supports 31
On, limit code-disc 310 connects first motor 32, and it is positive and negative to control first motor 32 by limit code-disc 310 and photoelectric sensor 33
Rotation amplitude；Turntable 34 is mounted in the rotation axis of first motor 32, is located at 31 right side of transporting supports, and footstock 35 passes through rotation
Pair connection is mounted on transporting supports 31, and footstock 35 is connect with first movement slide 36, and first movement sliding rail 37 and first moves
Dynamic slide 36 forms prismatic pair cooperation, and 37 lower end of first movement sliding rail is fixedly connected with 39 phase of suction cup carrier, suction cup carrier 39 and turntable
The pin shaft of 34 eccentric positions forms revolute pair connection；Sucker 38 is fixed in suction cup carrier 39；Shield 311 is for covering the
One motor 32 improves the precision of photoelectric sensor 33.
Semiconductor handling device 3 drives turntable 34 to rotate at work, by first motor 32, the eccentric pin shaft band on turntable
Dynamic suction cup carrier 39 is rotated around footstock 35, and rotation amplitude is controlled by photoelectric sensor 33, when sucker 38 reaches right end position,
The semiconductor workpiece in backgauge induction mechanism 29 is drawn, workpiece is put into carrier band when then going to 38 vertical state of sucker to the left
In carrier band in conveying device 4.
As shown in Figure 7 and Figure 8, carrier band conveying device 4 include conveying frame 40, unloaded band disk 41, fully loaded band disk 42,
Carrier tape driving mechanism 43 adjusts bolt 44, feed screw nut seat 45, lead screw 46, movable platform 47, cylindrical guide component 48, fixes
Platform 49 and leading truck 410；Conveying frame 40 is fixed in rack 1, and unloaded band disk 41 and fully loaded band disk 42 are distinguished
40 both ends of conveying frame are mounted on, unloaded band disk 41 is in 40 right end of conveying frame, and fully loaded band disk 42 is in conveying frame
40 left ends, the unloaded charging that unloaded band is used for disk 41, the fully loaded collection for being used to be fully loaded with band with disk 42；Lid band conveying device
It 6 and compresses sealing device 7 and is between carrier band disk 41 and fully loaded band disk 42, material strip is in carrier band disk 41 and fully loaded band disk
Semiconductor feeding and lid band packaging process are completed in horizontal position between 42, and carrier tape driving mechanism 43 drives carrier band to transport from right to left
Dynamic, the leading truck 410 being fixed on conveying frame 40 is for keeping carrier band horizontal；Adjust bolt 44 and the fixed company of lead screw 46
It connects, lead screw 46 is mounted in rack 1 by bearings at both ends seat, and feed screw nut seat 45 is fitted to lead screw 46 by screw pair
In, it is connected inside feed screw nut seat 45 and movable platform 47；Movable platform 47 is mounted on rack 1 by cylindrical guide component 48
On, movable platform 47 is adjusted by adjusting bolt 44 and is moved along 48 direction of cylindrical guide component；Fixed platform 49 is fixed at machine
On frame 1, fixed platform 49 is oppositely arranged with movable platform 47, and carrier band leads between fixed platform 49 and movable platform 47
It crosses rotation and adjusts bolt 44 adjusting the distance between fixed platform 49 and movable platform 47, to adapt to the carrier band of different in width.
Carry conveying device 4 at work, carrier tape driving mechanism 43 drives carrier band to move from right to left, in movable platform 47
Horizontal segment between fixed platform 49 completes the carrying of semiconductor and the encapsulation of lid band, by the fully loaded band of left end after the completion of braid
Disk 42 is completed to collect.
Carrier tape driving mechanism 43 includes drum seat 431, pressing idler wheel 432, lifting axle bed 433 and pinch rollers 434；Drum
Seat 431 is two, and two drum seats 431 are fixed in rack 1, and pressing idler wheel 432 is mounted on drum seat 431；Pressing
There is needle roller in 432 outer ring of idler wheel, and needle roller distance is identical as the adjacent pitch-row of carrier band e, and needle roller is used to penetrate the edge circular hole of carrier band e
In；Lifting axle bed 433 is fitted on the vertical column of drum seat 431, and pinch rollers 434 are mounted on lifting axle bed 433,
Pinch rollers 434 are located above carrier band e, and pinch rollers 434 are pressed on pressing idler wheel 432 for that will carry e.
At work, motor driven pressing idler wheel 432 rotates carrier tape driving mechanism 43, due to the outer ring of pressing idler wheel 432
Needle roller is mutually chimeric with the circular hole on carrier band e, and driving carrier band e makees straight-line feed movement.
As shown in figure 9, lid band conveying device 6 includes lid belt supporting frame 61, lid band winding disc 62 and lid band guide rod 63；Lid band branch
Frame 61 is fixed in rack 1, and lid is mounted on lid band branch for placing coiled lid band, lid band winding disc 62 with winding disc 62
In shaft 64 on frame 61；Lid band guide rod 63 is fixed on lid belt supporting frame 61, and lid band guide rod 63 is used to be tensioned and guide cover
Band.
Lid band is chimeric with carrier band e, and lid band is pressed together with carrier band e by compressing sealing device 7, and encapsulation setting is carrying
Semiconductor workpiece in e, the feeding for covering band are driven by the carrier band e being mutually fitted into.
As shown in Figure 10, CCD vision inspection apparatus 5 includes camera supporting plate 51, adjusts mould 52, adjustment seat 53, CCD detection phase
Machine 54 and right angle mounting plate 55；It is the next on camera supporting plate 51 on the height-adjustable movable connecting cover belt supporting frame 61 of camera supporting plate 51
It sets adjustable；It adjusts mould 52 to be fixed on camera supporting plate 51, adjustment seat 53 is connect with the formation prismatic pair of mould 52 is adjusted, and is adjusted
Seat 53 is saved along 52 transverse shifting of mould is adjusted, horizontal cross position is adjusted by adjustment seat 53, position passes through holding screw after determining
Tightening；Adjustment seat 53 is flexibly connected with right angle mounting plate 55, and mounting plate 55 upper end in right angle is provided with front and back to sliding slot, adjustment seat 53
Front-rear direction position on right angle mounting plate 55 is adjustable；CCD detection camera 54 is fixed on right angle mounting plate 55, CCD
Detection camera 54 is arranged downwards.
CCD vision inspection apparatus 5 at work, by adjust three dimensions distance so that CCD detection camera 54 be located at
It carries right above conveying device 4, whether has semiconductor workpiece entrance in carrier band for detecting, obtain neglected loading rate.
As shown in figure 11, sealing device 7 is compressed to be between carrier tape driving mechanism 43 and fixed platform 49；Compress sealing dress
Setting 7 includes compressing pedestal 71, sealing back plate 72, the sealing sealing component 70, second of foreboard 711, first to seal component 710, elasticity
Claw mounting base 79 and elastic claw 78；It compresses pedestal 71 to be fixed in rack 1, sealing back plate 72 and sealing foreboard 711 are installed
It compresses on pedestal 71, sealing back plate 72 and sealing between foreboard 711 is for carrying the carrier band channel passed through；First sealing component 70
It being connected in sealing back plate 72, the second sealing component 710 is connected on sealing foreboard 711,
First sealing component 70 includes adjusting bolt group 73, the 4th cylinder 74, right angle support plate 75, the second linear guide rail assembly 76
With push type broach 77；4th cylinder 74 is fixed in right angle support plate 75, and push type broach 77 is installed by the second linear guide rail assembly 76
In right angle support plate 75；Heating wire is provided in push type broach 77 for heating push type broach 77, convenient for making carrier band and lid band be bonded in one
It rises；4th cylinder 74 connects push type broach 77, and the 4th cylinder 74 drives push type broach 77 to move up and down；Right angle support plate 75 is by adjusting screw
73 are mounted in sealing back plate 72, by adjusting position of the first sealing component 70 of the adjustment of bolt group 73 in sealing back plate 72.
Second sealing 710 structure of component is identical as the first sealing component 70.
Elastic claw mounting base 79 includes claw mounting base and claw shaft, after elastic claw mounting base 79 is fixed on sealing
On plate 72, sealing foreboard 711, claw shaft is mounted in claw mounting base；Elastic claw 78 is mounted in claw shaft, elasticity
The position of claw 78 is corresponding for carrying the carrier band channel passed through；Two elastic claws on elastic claw 78 are apart from adjustable, to adapt to
The width of carrier band, lid band；By adjusting the position of the first sealing component 70 of bolt group adjustment and the second sealing component 710 to adjust
The distance between first sealing component 70 and the second sealing component 710, to adapt to the carrier band of different in width.
Compress sealing device 7 at work, carrier band and lid band are advanced for carrying in the carrier band channel passed through, first by bullet bullet
Property claw 78 carry out precompressed processing, then first sealing component 70 and second sealing component 710 act, specifically the 4th cylinder 74
It drives push type broach 77 that lid band is pressed together on carrier band when moving downward, completes braid, realize the encapsulation to semiconductor, complete processing.
Control assembly 8 controls semiconductor feeding device 2, semiconductor handling device 3, carrier band conveying device 4, the inspection of CCD vision
Survey the movement of device 5, lid with conveying device 6 and compression sealing device 7.Control assembly 8 includes display screen and controller, display screen
It is fixed in rack 1, dynamic parameter of the display screen 81 for the equipment working condition reflects that controller is for controlling above-mentioned apparatus
Movement.
It when operation, is realized by semiconductor feeding device 2 and feeding is carried out to the semiconductor workpiece in expects pipe, feeding relies primarily on
Workpiece gravity blows for some workpiece not can not fallen to it, is allowed to slide；The workpiece of landing is first by semiconductor
It is transported in the carrier band in carrier band conveying device 4 by handling device 3 one by one；It carries conveying device 4 and carries movement for driving,
Carrying semiconductor workpiece, CCD vision-based detection and sealing operation are carried out in intermediate flat portions, and the workpiece of sealing is received
Collection；Then by whether having placement workpiece in the detection carrier band of CCD vision inspection apparatus 5, work mistake rate is detected；Lid band conveying device
Lid band is transported to carrier band top by 6, is carried out braid sealing to it by compressing sealing device 7, is completed tape package operation.
Claims (5)
1. full-automatic semiconductor braiding packaging machine, it is characterised in that including rack（1）And semiconductor feeding device thereon（2）,
Semiconductor handling device（3）, carrier band conveying device（4）, CCD vision inspection apparatus（5）, lid band conveying device（6）It is sealed with compressing
It attaches together and sets（7）；
Semiconductor feeding device（2）For semiconductor feeding；Semiconductor feeding device（2）With carrier band conveying device（4）Pass through half
Conductor handling device（3）Linking, semiconductor handling device（3）For by semiconductor from semiconductor feeding device（2）In be transported to
Carry conveying device（4）In；Carry conveying device（4）Conveying for carrier band；CCD vision inspection apparatus（5）It is carried for detecting
Band in whether neglected loading semiconductor；Lid band conveying device（6）For covering band feeding, sealing device is compressed（7）It is compressed for band will to be covered
In carrier band conveying device（4）On the carrier band of conveying；
Semiconductor handling device（3）Including transporting supports（31）, first motor（32）, photoelectric sensor（33）, turntable（34）, it is fixed
Heart seat（35）, first movement slide（36）, first movement sliding rail（37）, sucker（38）, suction cup carrier（39）, limit code-disc（310）；
Transporting supports（31）It is fixed at rack（1）On, first motor（32）And photoelectric sensor（33）It is fixed at carrying branch
Frame（31）On, limit code-disc（310）Connect first motor（32）, by limiting code-disc（310）And photoelectric sensor（33）Control
First motor（32）Positive and negative rotation amplitude；Turntable（34）It is mounted on first motor（32）Rotation axis on, footstock（35）Pass through
Revolute pair connection is mounted on transporting supports（31）On, footstock（35）With first movement slide（36）Connection, first movement sliding rail
（37）With first movement slide（36）Form prismatic pair cooperation, first movement sliding rail（37）Lower end and suction cup carrier（39）It is mutually fixed to connect
It connects, suction cup carrier（39）With turntable（34）The pin shaft of eccentric position forms revolute pair connection；Sucker（38）It is fixed at suction cup carrier
（39）On.
2. full-automatic semiconductor braiding packaging machine according to claim 1, it is characterised in that semiconductor feeding device（2）Packet
Include tilt stand（21）, inclination mounting plate（20）, expects pipe rack（23）, top air blowing cylinder（24）, side pusher pipe mechanism（26）,
Empty expects pipe collecting frame（27）, mobile feeding mechanism（28）, backgauge induction mechanism（29）It is pushed away with empty expects pipe and falls cylinder（25）；Inclination branch
Frame（21）It is fixed on rack（1）On, tilt mounting plate（20）Low early and high after inclination is fixed on tilt stand（21）On；It blows at top
Cylinder（24）It is mounted on inclination mounting plate（20）Top, mobile feeding mechanism（28）It is mounted on inclination mounting plate（20）Under
Portion, backgauge induction mechanism（29）It is connected mobile feeding mechanism（28）；Expects pipe rack（23）It is fixed on mobile feeding mechanism（28）
With top air blowing cylinder（24）Between inclination mounting plate（20）On, expects pipe rack（23）Upper and lower ends opening is placed for being laminated
Expects pipe a, semiconductor is arranged in rows in expects pipe a；Side pusher pipe mechanism（26）It is mounted on inclination mounting plate（20）On, side pusher
Pipe mechanism（26）In expects pipe rack（23）Side, expects pipe rack（23）The inclination mounting plate of the other side（20）It is equipped with
Empty expects pipe material-dropping hole（201）；Top air blowing cylinder（24）, empty expects pipe material-dropping hole（201）, mobile feeding mechanism（28）From top to bottom locate
In on a line；Empty expects pipe, which pushes away, falls cylinder（25）It is mounted on inclination mounting plate（20）On, empty expects pipe, which pushes away, falls cylinder（25）Sky is expected
Pipe is pushed into empty expects pipe material-dropping hole（201）；Empty expects pipe collecting frame（27）It is fixed on inclination mounting plate（20）Bottom, empty expects pipe collecting frame
（27）Position and empty expects pipe material-dropping hole（201）Matching.
3. full-automatic semiconductor braiding packaging machine according to claim 2, it is characterised in that side pusher pipe mechanism（26）Packet
Include the first cylinder（261）, pusher part（262）, gear tube socket（263）With pressure pipe part（264）；First cylinder（261）Pass through the first gas
The setting of cylinder fixing seat is in inclination mounting plate（20）On, the first cylinder（261）Telescopic end connects pusher part（262）, the first cylinder
（261）Drive pusher part（262）Laterally move left and right；Pusher part（262）It is stepped, pusher part（262）It is divided into close to first
Cylinder（261）High table top（2621）With lean on near-space expects pipe material-dropping hole（201）Low table（2622）, pusher part（262）It is mobile
When low table be used to accept the expects pipe in moving condition, high table top is used to resist expects pipe rack（23）The material of interior lowermost end
Pipe；Pressure pipe part（264）By keeping off tube socket（263）Setting is in inclination mounting plate（20）On, pressure pipe part（264）With pusher part（262）
It is matched for clamping tightly expects pipe；Mobile feeding mechanism（28）Including feedboard（280）, blanking sliding rail（22）, the second cylinder（281）, cylinder
Guide rod（282）, distribution block（283）With mobile limited block；Feedboard（280）It is fixed on inclination mounting plate（20）On；Feedboard
（280）It is equipped with charging slideway（2801）, feed slideway（2801）Dock empty expects pipe material-dropping hole in upper end（201）；Blanking sliding rail
（22）Including two pieces of blanking blocks（221）, two pieces of blanking blocks（221）It is mounted on feedboard（280）On, two pieces of blanking blocks
（221）Between be equipped with the channel that passes through for semiconductor（222）, the channel that is passed through for semiconductor（222）With charging slideway（2801）
It is overlapped；Pressure pipe part（264）With pusher part（262）Expects pipe bottom end is docked with for the channel that semiconductor passes through when clamping expects pipe；It is mobile
Limited block is mounted on feedboard（280）On, cylinder guide rod（282）Setting is on mobile limited block, distribution block（283）It is led with cylinder
Bar（282）Form prismatic pair cooperation；Second cylinder（281）Pass through the second cylinder fixed seat（284）It is fixed at inclination installation
Plate（20）On, the second cylinder（281）Output end connect distribution block（283）, the second cylinder（281）Drive distribution block（283）?
Cylinder guide rod（282）On move left and right；Distribution block（283）The matched deflector chute in channel for being equipped with and being passed through for semiconductor
（2831）, deflector chute（2831）With charging slideway（2801）It is overlapped, passes through distribution block（283）Move left and right selection deflector chute
（2831）Whether it is connected to for the channel that semiconductor passes through.
4. full-automatic semiconductor braiding packaging machine according to claim 2, it is characterised in that backgauge induction mechanism（29）Packet
Include third cylinder（291）, positioning fixture block（292）, infrared detector（293）And positioning seat（295）；Positioning seat（295）In into
Flitch（280）Bottom, positioning seat（295）It is equipped with and charging slideway（2801）The locating slot of docking（2501）, infrared detection
Device（293）Position corresponds to locating slot（2501）, infrared detector（293）For detecting in locating slot whether have semiconductor；Third
Cylinder（291）By positioning fixture block（292）Clamp locating slot（2591）Interior semiconductor.
5. full-automatic semiconductor braiding packaging machine according to claim 1, it is characterised in that carrier band conveying device（4）Including
Conveying frame（40）, unloaded band disk（41）, fully loaded band disk（42）, carrier tape driving mechanism（43）, adjust bolt（44）, lead screw
Nut seat（45）, lead screw（46）, movable platform（47）, cylindrical guide component（48）, fixed platform（49）And leading truck（410）；
Conveying frame（40）It is fixed at rack（1）On, unloaded band disk（41）With fully loaded band disk（42）It is separately mounted to convey
Expect frame（40）Both ends, unloaded band disk（41）For the charging of unloaded band, it is fully loaded with band disk（42）For being fully loaded with the collection of band；Lid
Band conveying device（6）With compression sealing device（7）In carrier band disk（41）With fully loaded band disk（42）Between, carry driving machine
Structure（43）Drive carrier band movement；It is fixed at conveying frame（40）On leading truck（410）For keeping carrier band horizontal；It adjusts
Bolt（44）With lead screw（46）It is fixedly connected, lead screw（46）Rack is mounted on by bearings at both ends seat（1）On, feed screw nut seat
（45）Lead screw is fitted to by screw pair（46）In, feed screw nut seat（45）With movable platform（47）It is connected；Activity is flat
Platform（47）Pass through cylindrical guide component（48）It is mounted on rack（1）On, by adjusting bolt（44）Adjust movable platform（47）Along circle
Column guide assembly（48）Direction is mobile；Fixed platform（49）It is fixed at rack（1）On, fixed platform（49）With movable platform
（47）It is oppositely arranged, carrier band is in fixed platform（49）With movable platform（47）Between, bolt is adjusted by rotation（44）It adjusts
Save fixed platform（49）With movable platform（47）The distance between.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810562491.7A CN108928511A (en) | 2018-06-04 | 2018-06-04 | Full-automatic semiconductor braiding packaging machine |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810562491.7A CN108928511A (en) | 2018-06-04 | 2018-06-04 | Full-automatic semiconductor braiding packaging machine |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN108928511A true CN108928511A (en) | 2018-12-04 |
Family
ID=64449782
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201810562491.7A Withdrawn CN108928511A (en) | 2018-06-04 | 2018-06-04 | Full-automatic semiconductor braiding packaging machine |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN108928511A (en) |
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109775331A (en) * | 2019-03-06 | 2019-05-21 | 南方电网科学研究院有限责任公司 | A kind of chip for material strip looks into benefit equipment |
| CN110356613A (en) * | 2019-07-16 | 2019-10-22 | 安徽三优光电科技有限公司 | A kind of fully automatic vacuum packing device for SMD element |
| CN111570320A (en) * | 2020-05-29 | 2020-08-25 | 芜湖永辉汽车紧固件有限公司 | Full-automatic nut screening machine |
| CN112456074A (en) * | 2020-11-25 | 2021-03-09 | 合肥迈亚家具有限公司 | End cover feeding equipment |
| CN114455117A (en) * | 2022-02-18 | 2022-05-10 | 杭州长川科技股份有限公司 | Braider and braid debugging method |
-
2018
- 2018-06-04 CN CN201810562491.7A patent/CN108928511A/en not_active Withdrawn
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109775331A (en) * | 2019-03-06 | 2019-05-21 | 南方电网科学研究院有限责任公司 | A kind of chip for material strip looks into benefit equipment |
| CN110356613A (en) * | 2019-07-16 | 2019-10-22 | 安徽三优光电科技有限公司 | A kind of fully automatic vacuum packing device for SMD element |
| CN111570320A (en) * | 2020-05-29 | 2020-08-25 | 芜湖永辉汽车紧固件有限公司 | Full-automatic nut screening machine |
| CN111570320B (en) * | 2020-05-29 | 2021-10-15 | 芜湖永辉汽车紧固件有限公司 | Full-automatic nut screening machine |
| CN112456074A (en) * | 2020-11-25 | 2021-03-09 | 合肥迈亚家具有限公司 | End cover feeding equipment |
| CN114455117A (en) * | 2022-02-18 | 2022-05-10 | 杭州长川科技股份有限公司 | Braider and braid debugging method |
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Application publication date: 20181204 |