CN108913085A - A kind of synthetic method of ESD function PI glue stick - Google Patents
A kind of synthetic method of ESD function PI glue stick Download PDFInfo
- Publication number
- CN108913085A CN108913085A CN201810755211.4A CN201810755211A CN108913085A CN 108913085 A CN108913085 A CN 108913085A CN 201810755211 A CN201810755211 A CN 201810755211A CN 108913085 A CN108913085 A CN 108913085A
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- CN
- China
- Prior art keywords
- glue stick
- electronic component
- esd function
- synthetic method
- degrees celsius
- Prior art date
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Classifications
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J179/00—Adhesives based on macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing nitrogen, with or without oxygen, or carbon only, not provided for in groups C09J161/00 - C09J177/00
- C09J179/04—Polycondensates having nitrogen-containing heterocyclic rings in the main chain; Polyhydrazides; Polyamide acids or similar polyimide precursors
- C09J179/08—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G73/00—Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
- C08G73/06—Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
- C08G73/10—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
- C08G73/1075—Partially aromatic polyimides
- C08G73/1078—Partially aromatic polyimides wholly aromatic in the diamino moiety
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
- C09J11/02—Non-macromolecular additives
- C09J11/04—Non-macromolecular additives inorganic
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- Chemical & Material Sciences (AREA)
- Organic Chemistry (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Health & Medical Sciences (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Inorganic Chemistry (AREA)
- Heterocyclic Carbon Compounds Containing A Hetero Ring Having Oxygen Or Sulfur (AREA)
Abstract
The present invention proposes a kind of synthetic method of ESD function PI glue stick, includes the following steps：(1) under nitrogen protection, aromatic diamines are dissolved in polar solvent；(2) dianhydride compound is dissolved in same polar solvent, ATO powder and coupling agent is added, is uniformly dispersed；(3) under lower than -15 degrees Celsius salt water condition of ice bath, two parts of polar solvents is mixed according to aromatic diamines and dianhydride compound molar ratio 1: 1, is stirred to react to obtain amide acid solution, is put into -15 degrees Celsius of refrigerators below and saves；(4) solution is taken out when using, catalyst is added, and is heated to 60-80 degrees Celsius of solidification bonding.For the insulation bonding of electronic component in the circuit board; it is contacted with the input and output pin of electronic component; it is in parallel with electronic component internal circuit on circuit; ESD function PI glue stick is in high resistant state of insulation; when electronic component overvoltage condition; the conducting of ESD function PI glue stick seepage flow, protects electronic component.
Description
Technical field
The invention belongs to electronic materials and adhesive to synthesize field, be related to a kind of synthetic method of ESD function PI glue stick.
Background technique
Static discharge (ESD) problem is the important harm that each electronic product faces, ESD protection element with protected first device
Part is in parallel, itself is in high resistant state of value, works normally component without influence, when generating transient high voltages, ESD protection member
Part rapidly goes to low-resistance conducting, realizes protective effect.Electronic component just develops towards multi-functional, miniaturization, flexibility direction, specially
Need to tie up the valuable area on wiring board with anti-static elements, in addition the factors such as the welding of discrete component, route design also can
Increase the manufacturing cost of integral device.Polyimides (PI) is one of optimal high-molecular organic material of comprehensive performance, high temperature resistant
Up to 400 DEG C or more, -200~300 DEG C of long-term use temperature range, high insulating property is made into Jie of ESD defencive function
Matter insulate convered structure in the circuit board as electronic component, can effectively save wiring board area, reduces manufacturing cost, can mention
Rise device circuit reliability.
Summary of the invention
The present invention proposes a kind of synthetic method of ESD function PI glue stick, which is characterized in that includes the following steps：
(1) under nitrogen protection, aromatic diamines are dissolved in polar solvent；
(2) dianhydride compound is dissolved in same polar solvent, ATO powder and coupling agent is added, is uniformly dispersed；
(3) lower than under -15 degrees Celsius of salt water condition of ice bath, according to aromatic diamines and dianhydride compound molar ratio 1: 1 by two
Part polar solvent mixing, is stirred to react to obtain amide acid solution, is put into -15 degrees Celsius of refrigerators below and saves；
(4) solution is taken out when using, catalyst is added, and is heated to 60-80 degrees Celsius of solidification bonding.
The aromatic diamines include one of p-phenylenediamine, m-phenylene diamine (MPD), Isosorbide-5-Nitrae-naphthylenediamine, 1,5- naphthylenediamine, described
Dianhydride compound includes 1,2,3,4- cyclobutane dianhydrides, one of 1,2,3,4- pentamethylene dianhydride.
For the ATO diameter of particle between 0.1 micron to 1 micron, additional amount is final solidification binder volume fraction
30%-50%, the coupling agent are one of chelating titanate coupling agent, corrdination type titanate coupling agent or combinations thereof.
The polar solvent includes one of n,N-Dimethylformamide, -2 pyrrolidones of 1- methyl.
The catalyst is one of pyridine, 3- picoline, and additional amount is step (2) amic acid mole 1-1.5
Times.
Insulation bonding of the ESD function PI glue stick for electronic component in the circuit board, the input and output with electronic component
Pin has a contact, in parallel with electronic component internal circuit on circuit, and ESD function PI glue stick is in high resistant state of insulation, works as electricity
When subcomponent overvoltage condition, electronic component is protected in the conducting of ESD function PI glue stick seepage flow.
Present invention process is simple, low in cost, and binder mechanics and electric property are stablized, and water resistant oxygen ability is strong.
The contents of the present invention and feature have revealed that as above, however the present invention that describes of front only briefly or pertains only to this
The specific part of invention, feature of the invention may be more than what content disclosed herein was related to.Therefore, protection model of the invention
The revealed content of embodiment should be not limited to by enclosing, and should include the combination of all the elements embodied in different piece, with
And it is various without departing substantially from replacement and modification of the invention, and covered by claims of the present invention.
Specific embodiment
Embodiment 1：
(1) under nitrogen protection, 1, the 5- naphthylenediamine of 10mmol is dissolved in -2 pyrrolidones of 50mL 1- methyl；
(2) 1,2,3,4- cyclobutane dianhydride of 10mmol is dissolved in -2 pyrrolidones of 50mL 1- methyl, 180g is added
ATO powder and 0.5g chelating titanate coupling agent, are uniformly dispersed；
(3) mixed solution under lower than -15 degrees Celsius salt water condition of ice bath, is stirred to react to obtain amide acid solution, is put into -15
It is saved in degree Celsius refrigerator below；
(4) solution is taken out when using, 10mmol pyridine is added, and is heated to 70 degrees Celsius of solidification bondings, shear strength：
13MPa；ESD performance reaches IEC6100-4-2.
Embodiment 2：
(1) under nitrogen protection, 10mmol Isosorbide-5-Nitrae-naphthylenediamine is dissolved in 50mL n,N-Dimethylformamide；
(2) 1,2,3,4- pentamethylene dianhydride of 10mmol is dissolved in 50mL n,N-Dimethylformamide, 160g is added
ATO powder and 0.5g corrdination type titanate coupling agent, are uniformly dispersed；
(3) mixed solution under lower than -15 degrees Celsius salt water condition of ice bath, is stirred to react to obtain amide acid solution, is put into -15
It is saved in degree Celsius refrigerator below；
(4) solution is taken out when using, the 3- picoline of 12mmol is added, is heated to 70 degrees Celsius of solidification bondings, shearing
Intensity：9MPa；ESD performance reaches IEC6100-4-2.
Embodiment 3：
(1) under nitrogen protection, 10mmol p-phenylenediamine is dissolved in 50mL n,N-Dimethylformamide；
(2) 1,2,3,4- cyclobutane dianhydride of 10mmol is dissolved in 50mL n,N-Dimethylformamide, 120g is added
ATO powder and 0.5g chelating titanate coupling agent, are uniformly dispersed；
(3) mixed solution under lower than -15 degrees Celsius salt water condition of ice bath, is stirred to react to obtain amide acid solution, is put into -15
It is saved in degree Celsius refrigerator below；
(4) solution is taken out when using, 15mmol pyridine is added, and is heated to 60 degrees Celsius of solidification bondings, shear strength：
10MPa；ESD performance reaches IEC6100-4-2.
Embodiment 4：
(1) under nitrogen protection, 10mmol m-phenylene diamine (MPD) is dissolved in -2 pyrrolidones of 50mL 1- methyl；
(2) 1,2,3,4- cyclobutane dianhydride of 10mmol is dissolved in -2 pyrrolidones of 50mL 1- methyl, 180g is added
ATO powder and 0.5g chelating titanate coupling agent, are uniformly dispersed；
(3) mixed solution under lower than -15 degrees Celsius salt water condition of ice bath, is stirred to react to obtain amide acid solution, is put into -15
It is saved in degree Celsius refrigerator below；
(4) solution is taken out when using, 10mmol pyridine is added, and is heated to 80 degrees Celsius of solidification bondings, shear strength：
12MPa；ESD performance reaches IEC6100-4-2.
Claims (6)
1. a kind of synthetic method of ESD function PI glue stick, which is characterized in that include the following steps：
(1) under nitrogen protection, aromatic diamines are dissolved in polar solvent；
(2) dianhydride compound is dissolved in same polar solvent, ATO powder and coupling agent is added, is uniformly dispersed；
(3) lower than under -15 degrees Celsius of salt water condition of ice bath, according to aromatic diamines and dianhydride compound molar ratio 1: 1 by two parts of poles
Property solution mixing, be stirred to react to obtain amide acid solution, be put into -15 degrees Celsius of refrigerators below and save；
(4) solution is taken out when using, catalyst is added, and is heated to 60-80 degrees Celsius of solidification bonding.
2. a kind of synthetic method of ESD function PI glue stick according to claim 1, which is characterized in that the aromatic diamines
Including one of p-phenylenediamine, m-phenylene diamine (MPD), Isosorbide-5-Nitrae-naphthylenediamine, 1,5- naphthylenediamine, the dianhydride compound includes 1,2,3,
4- cyclobutane dianhydride, one of 1,2,3,4- pentamethylene dianhydride.
3. a kind of synthetic method of ESD function PI glue stick according to claim 1, which is characterized in that the ATO powder grain
Diameter is between 0.1 micron to 1 micron, and additional amount is final solidification binder volume fraction 30% one 50%, and the coupling agent is
One of chelating titanate coupling agent, corrdination type titanate coupling agent or combinations thereof.
4. a kind of synthetic method of ESD function PI glue stick according to claim 1, which is characterized in that the polar solvent
Including one of n,N-Dimethylformamide, -2 pyrrolidones of 1- methyl.
5. a kind of synthetic method of ESD function PI glue stick according to claim 1, which is characterized in that the catalyst is
One of pyridine, 3- picoline, additional amount are 1-1.5 times of amic acid mole of step (2).
6. ESD function prepared by a kind of synthetic method of ESD function PI glue stick as claimed in any one of claims 1 to 5, wherein
Energy PI glue stick is contacted for the insulation bonding of electronic component in the circuit board with the input and output pin of electronic component,
In parallel with electronic component internal circuit on circuit, ESD function PI glue stick is in high resistant state of insulation, when electronic component overvoltage condition
When, electronic component is protected in the conducting of ESD function PI glue stick seepage flow.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810755211.4A CN108913085A (en) | 2018-07-05 | 2018-07-05 | A kind of synthetic method of ESD function PI glue stick |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810755211.4A CN108913085A (en) | 2018-07-05 | 2018-07-05 | A kind of synthetic method of ESD function PI glue stick |
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| Publication Number | Publication Date |
|---|---|
| CN108913085A true CN108913085A (en) | 2018-11-30 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN201810755211.4A Withdrawn CN108913085A (en) | 2018-07-05 | 2018-07-05 | A kind of synthetic method of ESD function PI glue stick |
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Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101496113A (en) * | 2006-07-29 | 2009-07-29 | 肖克科技有限公司 | Voltage switchable dielectric material having high aspect ratio particles |
| CN102634021A (en) * | 2012-03-30 | 2012-08-15 | 中国科学院宁波材料技术与工程研究所 | Thermoplastic polyimide resin and preparation method thereof |
| CN103865471A (en) * | 2012-12-18 | 2014-06-18 | 上海市合成树脂研究所 | Polyimide adhesive and preparation method thereof |
| CN104672901A (en) * | 2015-02-28 | 2015-06-03 | 重庆杰博科技有限公司 | Transparent polyimide film and preparation method thereof |
| CN106478950A (en) * | 2016-09-26 | 2017-03-08 | 安徽国风塑业股份有限公司 | A kind of preparation method of high-adhesion Kapton |
-
2018
- 2018-07-05 CN CN201810755211.4A patent/CN108913085A/en not_active Withdrawn
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101496113A (en) * | 2006-07-29 | 2009-07-29 | 肖克科技有限公司 | Voltage switchable dielectric material having high aspect ratio particles |
| CN102634021A (en) * | 2012-03-30 | 2012-08-15 | 中国科学院宁波材料技术与工程研究所 | Thermoplastic polyimide resin and preparation method thereof |
| CN103865471A (en) * | 2012-12-18 | 2014-06-18 | 上海市合成树脂研究所 | Polyimide adhesive and preparation method thereof |
| CN104672901A (en) * | 2015-02-28 | 2015-06-03 | 重庆杰博科技有限公司 | Transparent polyimide film and preparation method thereof |
| CN106478950A (en) * | 2016-09-26 | 2017-03-08 | 安徽国风塑业股份有限公司 | A kind of preparation method of high-adhesion Kapton |
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Application publication date: 20181130 |
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| WW01 | Invention patent application withdrawn after publication |