CN108882567A - A kind of production method of PCB - Google Patents
A kind of production method of PCB Download PDFInfo
- Publication number
- CN108882567A CN108882567A CN201810981738.9A CN201810981738A CN108882567A CN 108882567 A CN108882567 A CN 108882567A CN 201810981738 A CN201810981738 A CN 201810981738A CN 108882567 A CN108882567 A CN 108882567A
- Authority
- CN
- China
- Prior art keywords
- slot
- groove
- copper
- production method
- blind slot
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/46—Manufacturing multilayer circuits
- H05K3/4611—Manufacturing multilayer circuits by laminating two or more circuit boards
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/46—Manufacturing multilayer circuits
- H05K3/4697—Manufacturing multilayer circuits having cavities, e.g. for mounting components
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09818—Shape or layout details not covered by a single group of H05K2201/09009 - H05K2201/09809
- H05K2201/09845—Stepped hole, via, edge, bump or conductor
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Production Of Multi-Layered Print Wiring Board (AREA)
Abstract
The present invention relates to board production technical field, the production method for disclosing a kind of PCB includes the following steps：S1, offer offer the multi-layer board of blind slot；S2, heavy copper, electroplating processes are carried out to multi-layer board, makes cell wall and the slot bottom metallization of blind slot；S3, the groove that depth is less than blind slot depth is opened up in multiple-plate blind slot open side, is located at the opening of remaining blind slot in the slot bottom region of groove；S4, through slot is opened up in the slot bottom of blind slot.The PCB containing multiple stepped grooves that the present invention makes enables the space of the stepped groove on PCB to be fully utilized, and stepped groove contains metallization cell wall and non-metallic cell wall simultaneously, conducive to the further micromation of PCB, it is suitble to the installation of the component or extraordinary combination element device of polymorphic structure.
Description
Technical field
The present invention relates to board production technical field more particularly to a kind of production methods of PCB.
Background technique
Printed circuit board (Printed circuit board, abbreviation PCB) is the offer of electronic component electrical connection
Person.Before printed circuit board appearance, the interconnection between electronic component is all to be directly connected to by electric wire and form complete line
Road.In the present age, circuit board is intended only as effective experimental tool and exists, and printed circuit board has accounted in the electronics industry
According to the status of empery.
It is required to meet highly dense attachment or the crimping of printed circuit board, stepped groove is outputed in design on multilayer printed circuit board
Mode is to reduce assembly volume.Current stepped groove design shows as single order metallization or non-metallic stepped groove, applies
Microwave radio product is embedded to power amplifier component in stepped locations, and existing design has the following disadvantages：
1) single order ladder groove shape is single, is only used for assembling single component, cannot achieve with abnormally-structured member
Device attachment；
2) single metallization stepped groove or single non-metallic stepped groove, not can be implemented simultaneously extraordinary group of component
Reload request, or other more power amplifying devices are integrated, it is equipped for needs such as additional small chips or power amplifier
Component, then need to be mounted in printed circuit plate surface, to increase the assembly volume of printed circuit board.
3) first order stepped groove as required by abnormally-structured component is non-metallic, the metallization of second level stepped groove
PCB construction, processing difficulties, production method is unreasonable, low efficiency.
Therefore the production method of PCB a kind of is needed, making, there is the stepped groove of multi-step to solve the above problems.
Summary of the invention
The purpose of the present invention is to provide the production method of PCB a kind of, production contains the PCB of multiple stepped grooves, makes on PCB
The space of stepped groove can be fully utilized, and stepped groove contains metallization cell wall and non-metallic cell wall simultaneously, conducive to PCB's
Further micromation is suitble to the installation of the component or extraordinary combination element device of polymorphic structure.
For this purpose, the present invention uses following technical scheme：
A kind of production method of PCB, includes the following steps：
S1, offer offer the multi-layer board of blind slot；
S2, heavy copper, electroplating processes are carried out to multi-layer board, makes cell wall and the slot bottom metallization of blind slot；
S3, the groove that depth is less than blind slot depth is opened up in multiple-plate blind slot open side, makes the opening position of remaining blind slot
In in the slot bottom region of groove；
S4, through slot is opened up in the slot bottom of blind slot.
As a preferred solution of the present invention, step S3 includes step S31：Pass through target copper in controlled depth milling to multi-layer board
The adjacent prepreg in layer top, forms the initial slot bottom of groove.
As a preferred solution of the present invention, include the following steps after step S31：
S32, laser ablation is carried out to remaining prepreg above the target layers of copper, exposes target layers of copper；
S33, the target layers of copper is removed by etching, forms the final slot bottom of groove.
As a preferred solution of the present invention, step S1 includes the following steps：
S11, offer upper substrate, prepreg and lower basal plate, upper substrate and prepreg are respectively arranged with through slot；
S12, upper substrate, prepreg and lower basal plate are successively overlapped, makes the through slot pair of upper substrate and prepreg
Together；
S13, pressing obtain the multi-layer board for offering blind slot.
As a preferred solution of the present invention, the layers of copper of target layers of copper of upper substrate or more opens up the first notch,
The peripheral part for being opened in groove of first notch.
As a preferred solution of the present invention, further include between step S11 and step S12：
Step S111, brownification processing is carried out to upper substrate and lower basal plate；
Further include between step S12 and step S13：
Step S121, resistance glue material is placed in the through slot of upper substrate and prepreg.
As a preferred solution of the present invention, the horizontal section area of groove is greater than the horizontal section area of blind slot, blind
The horizontal section area of slot is greater than the horizontal section area of through slot.
As a preferred solution of the present invention, include upon step s 2：
Step S21, tin plating to the cell wall of metallization；
Correspondingly, further including after step S33：
S34, the part of tin plating protection in step S21 is carried out moving back tin.
As a preferred solution of the present invention, blind slot offers multiple, and groove is provided with multiple, and through slot is provided with more
It is a.
Beneficial effects of the present invention：
There is the PCB of the stepped groove containing multi-stage stairs by making, enable the space of the stepped groove on PCB by abundant benefit
With；Processing by laser ablation and etch process, to can be realized to groove slot bottom target layers of copper；Stepped groove contains gold simultaneously
Categoryization cell wall and non-metallic cell wall are suitble to component or the special type combination of polymorphic structure conducive to the further micromation of PCB
The installation of component.
Detailed description of the invention
Fig. 1 is the production method flow chart of PCB described in the embodiment of the present invention；
Fig. 2 is multi-layer board bonding processes structural schematic diagram described in the embodiment of the present invention.
Fig. 3 is to carry out heavy copper, electroplating processes process structural schematic diagram to multi-layer board described in the embodiment of the present invention.
Fig. 4 is the structural schematic diagram of exposing target layers of copper process described in the embodiment of the present invention.
Fig. 5 is the structure that etching described in the embodiment of the present invention removes that target layers of copper forms the final slot bottom process of groove
Schematic diagram.
Fig. 6 is the structural schematic diagram of final PCB product described in the embodiment of the present invention.
In figure：
1, blind slot；2, multi-layer board；21, upper substrate；22, prepreg；23, lower basal plate；3, groove；4, through slot；5,
Hinder glue material.
Specific embodiment
To further illustrate the technical scheme of the present invention below with reference to the accompanying drawings and specific embodiments.
As shown in Figure 1, present embodiments providing the production method flow chart of PCB a kind of comprising and lower step：
Step 1: the multi-layer board 2 for offering blind slot 1 is made, structural schematic diagram is as shown in Figure 2.
Specifically, upper substrate 21, prepreg 22 and lower basal plate 23 are provided, upper substrate 21 is provided with through slot, and half
Cured sheets 22 are provided with the through slot of adjoining dimensions.Brownification processing is carried out to upper substrate 21 and lower basal plate 23.Successively in overlapping
Portion's substrate 21, prepreg 22 and lower basal plate 23 are aligned the through slot of upper substrate 21 and prepreg 22.In upper substrate
21 and prepreg 22 through slot in place resistance glue material 5, prevent the prepreg that melts when pressing from flowing into blind slot 1, influence blind
The accuracy of 1 size of slot and the bottom surface for polluting blind slot 1.
In the present embodiment, substrate can be the daughter board that individual core plate or multiple core plates are pressed into, can also be according to design need
Selection core plate and/or daughter board is asked to be combined, to obtain the layers of copper quantity for meeting demand；Also, these core plates and/or daughter board
Combination can first be pressed into force fit plate in some is rapid, can also press together in subsequent steps.
Specifically, as shown in Fig. 2, using layers of copper is target layers of copper where the slot bottom of upper substrate groove to be processed, in target
The layers of copper of layers of copper or more opens up the first notch of annular, the peripheral part for being opened in groove of the first notch, and the first notch
Horizontal cross-sectional profile is located at the periphery of the horizontal cross-sectional profile of groove to be processed.The setting of first notch is so that in following process
In the process, the prepreg melted when pressing fills up the first notch, after recessing, the prepreg and substrate energy of the first indentation, there
Enough form the non-metallic cell wall of groove.
Press upper substrate 21, prepreg 22 and lower basal plate 23, lower basal plate 23 stop a side opening of through slot with
Blind slot 1 is formed, so that the multi-layer board 2 for offering blind slot 1 be made, takes out resistance glue material 5.Blind slot 1 can open up on multilayer boards
Have multiple.
Step 2: carrying out heavy copper, electroplating processes to the multi-layer board 2 after pressing, make cell wall and the slot bottom metallization of blind slot 1,
Its structural schematic diagram is as shown in Figure 3.Cell wall, which metallizes, realizes the attachment of component, is conducive to carry out signal screen to component
It covers, slot bottom metallization improves the radiating efficiency of component.
Step 3: opening up groove 3, technical process is as illustrated in figures 4-5.
By prepreg adjacent above target layers of copper in controlled depth milling to multi-layer board 2, the initial slot bottom of groove 3 is formed,
The depth of groove 3 is less than the depth of blind slot 1, and the opening of remaining blind slot 1 is located in the slot bottom region of groove 3, structural schematic diagram
As shown in Figure 4；Then laser ablation is carried out to remaining prepreg above target layers of copper, exposes target layers of copper, prepreg
After ablated, the cell wall that blind slot 1 metallizes can form protrusion on target layers of copper surface；To the subsequent metallization to be retained
Cell wall is tin plating, prevents subsequent etching processes from damaging non-targeted layers of copper；The target layers of copper exposed is removed by etch process.At this point,
It is emphasized that the cell wall copper and target layers of copper of protrusion are etched together, finally, under the cell wall copper and target layers of copper of blind slot 1
The substrate of side concordantly forms the final slot bottom of groove 3, carries out moving back tin operation to the part of tin plating protection.As shown in figure 5, groove 3
Cell wall be to be formed by the prepreg and substrate of the first gap position, i.e. the cell wall of groove 3 is non-metallic.
Groove 3 can be set multiple, and the slot bottom of a groove 3 may include multiple blind slots 1, the horizontal cross-section face of groove 3
Product is greater than the horizontal section area of blind slot 1.The cell wall of groove 3 is non-metallic, it can be achieved that component sinks to assembling, greatly reduces
The assembly volume of PCB.
Step 4: opening up through slot 4.
Through slot 4 is opened up in the slot bottom of blind slot 1.
Through slot 4 can be set multiple, and the horizontal section area of blind slot 1 is greater than the horizontal section area of through slot 4.
Finally, it is formed according to a kind of production method of PCB proposed by the present invention, the structure for processing final PCB product is shown
It is intended to, as shown in Figure 6.The horizontal section area of groove 3, blind slot 1 and through slot 4 is sequentially reduced, and forms T-shape stepped groove, meanwhile,
The cell wall and slot bottom of groove 3 are non-metallic, and the cell wall slot bottom metallization of blind slot 1, this cell wall for making groove 3 and slot bottom are nonmetallic
The production method of change is more rationally effective, can satisfy the production requirement of abnormally-structured component, solves in the prior art, the
The drawbacks of step slot is non-metallic, second level stepped groove this structural requirement processing difficulties of metallization, realizes polymorphic structure
Component and a variety of various sizes of components attachment.Second level stepped groove, which metallizes, not only increases the power amplifier of component
Efficiency also improves the transmission speed of signal, reduces the loss of signal.
In addition, according to a kind of production method of PCB provided by the invention, method simple possible has production, can obtain
To the PCB for being equipped with multi-stage stairs slot, it is not limited to three-level stepped groove shown in legend of the present invention, as long as being mentioned according to the present invention
What the production method of confession processed has the PCB of multistage slot, is within the scope of the invention.
Obviously, the above embodiment of the present invention is just for the sake of clearly illustrating examples made by the present invention, and being not is pair
The restriction of embodiments of the present invention.For those of ordinary skill in the art, may be used also on the basis of the above description
To make other variations or changes in different ways.There is no necessity and possibility to exhaust all the enbodiments.It is all this
Made any modifications, equivalent replacements, and improvements etc., should be included in the claims in the present invention within the spirit and principle of invention
Protection scope within.
Claims (9)
1. a kind of production method of PCB, which is characterized in that include the following steps：
S1, offer offer the multi-layer board of blind slot；
S2, heavy copper, electroplating processes are carried out to the multi-layer board, makes cell wall and the slot bottom metallization of the blind slot；
S3, the groove that depth is less than the blind slot depth is opened up in multiple-plate blind slot open side, makes the remaining blind slot
Opening be located at the groove slot bottom region in；
S4, through slot is opened up in the slot bottom of the blind slot.
2. the production method of PCB according to claim 1, which is characterized in that step S3 includes step S31：It is deep by control
It mills to prepreg adjacent above target layers of copper in the multi-layer board, forms the initial slot bottom of the groove.
3. the production method of PCB according to claim 2, which is characterized in that further comprising the steps of after step S31：
S32, laser ablation is carried out to remaining prepreg above the target layers of copper, exposes the target layers of copper；
S33, the target layers of copper is removed by etching, forms the final slot bottom of the groove.
4. the production method of PCB according to claim 1, which is characterized in that step S1 includes the following steps：
S11, offer upper substrate, prepreg and lower basal plate, upper substrate and prepreg are respectively arranged with through slot；
S12, upper substrate, prepreg and lower basal plate are successively overlapped, is aligned the through slot of upper substrate and prepreg；
S13, pressing obtain the multi-layer board for offering blind slot.
5. the production method of PCB according to claim 4, which is characterized in that the slot of the upper substrate groove to be processed
Layers of copper where bottom is target layers of copper, opens up the first notch of annular in the layers of copper of target layers of copper or more, the first notch is opened in
The peripheral part of groove.
6. the production method of PCB according to claim 5, which is characterized in that also wrapped between step S11 and step S12
It includes：
Step S111, brownification processing is carried out to the upper substrate and the lower basal plate；
Further include between step S12 and step S13：
Step S121, resistance glue material is placed in the through slot of the upper substrate and the prepreg.
7. the production method of PCB according to claim 1, which is characterized in that the horizontal section area of the groove is greater than
The horizontal section area of the blind slot, the horizontal section area of the blind slot are greater than the horizontal section area of the through slot.
8. the production method of PCB according to claim 3, which is characterized in that include upon step s 2：
Step S21, tin plating to the cell wall of the metallization；
Correspondingly, further including after step S33：
S34, the part of tin plating protection in step S21 is carried out moving back tin.
9. the production method of PCB according to claim 7, which is characterized in that the blind slot offers multiple, the groove
It is provided with multiple, the through slot is provided with multiple.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810981738.9A CN108882567B (en) | 2018-08-27 | 2018-08-27 | Manufacturing method of PCB |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810981738.9A CN108882567B (en) | 2018-08-27 | 2018-08-27 | Manufacturing method of PCB |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN108882567A true CN108882567A (en) | 2018-11-23 |
| CN108882567B CN108882567B (en) | 2020-05-22 |
Family
ID=64321966
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201810981738.9A Active CN108882567B (en) | 2018-08-27 | 2018-08-27 | Manufacturing method of PCB |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN108882567B (en) |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112543560A (en) * | 2019-09-20 | 2021-03-23 | 深南电路股份有限公司 | Circuit board and manufacturing method thereof |
| CN112867269A (en) * | 2021-01-06 | 2021-05-28 | 珠海杰赛科技有限公司 | Method for cladding metal on side wall of PCB |
| CN112867235A (en) * | 2021-01-19 | 2021-05-28 | 中国电子科技集团公司第二十九研究所 | High-frequency microwave circuit board blind slot structure and implementation method and device |
| CN113411952A (en) * | 2021-06-07 | 2021-09-17 | 中国电子科技集团公司第二十九研究所 | Embedded micro-channel printed circuit board compatible with various blind grooves and preparation method thereof |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105764258A (en) * | 2016-04-22 | 2016-07-13 | 深圳崇达多层线路板有限公司 | Method of making step groove on PCB |
| CN107979922A (en) * | 2017-11-21 | 2018-05-01 | 生益电子股份有限公司 | A kind of production method and PCB of the PCB for being suitable for crimping device |
| CN108323040A (en) * | 2018-02-02 | 2018-07-24 | 生益电子股份有限公司 | A kind of production method and PCB of the PCB with stepped groove |
| CN108401365A (en) * | 2018-05-04 | 2018-08-14 | 生益电子股份有限公司 | A kind of PCB |
-
2018
- 2018-08-27 CN CN201810981738.9A patent/CN108882567B/en active Active
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105764258A (en) * | 2016-04-22 | 2016-07-13 | 深圳崇达多层线路板有限公司 | Method of making step groove on PCB |
| CN107979922A (en) * | 2017-11-21 | 2018-05-01 | 生益电子股份有限公司 | A kind of production method and PCB of the PCB for being suitable for crimping device |
| CN108323040A (en) * | 2018-02-02 | 2018-07-24 | 生益电子股份有限公司 | A kind of production method and PCB of the PCB with stepped groove |
| CN108401365A (en) * | 2018-05-04 | 2018-08-14 | 生益电子股份有限公司 | A kind of PCB |
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112543560A (en) * | 2019-09-20 | 2021-03-23 | 深南电路股份有限公司 | Circuit board and manufacturing method thereof |
| CN112867269A (en) * | 2021-01-06 | 2021-05-28 | 珠海杰赛科技有限公司 | Method for cladding metal on side wall of PCB |
| CN112867269B (en) * | 2021-01-06 | 2022-07-01 | 珠海杰赛科技有限公司 | Method for cladding metal on side wall of PCB |
| CN112867235A (en) * | 2021-01-19 | 2021-05-28 | 中国电子科技集团公司第二十九研究所 | High-frequency microwave circuit board blind slot structure and implementation method and device |
| CN113411952A (en) * | 2021-06-07 | 2021-09-17 | 中国电子科技集团公司第二十九研究所 | Embedded micro-channel printed circuit board compatible with various blind grooves and preparation method thereof |
Also Published As
| Publication number | Publication date |
|---|---|
| CN108882567B (en) | 2020-05-22 |
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