CN108882559A - A kind of manufacture craft of metallized semi-pore - Google Patents
A kind of manufacture craft of metallized semi-pore Download PDFInfo
- Publication number
- CN108882559A CN108882559A CN201810739862.4A CN201810739862A CN108882559A CN 108882559 A CN108882559 A CN 108882559A CN 201810739862 A CN201810739862 A CN 201810739862A CN 108882559 A CN108882559 A CN 108882559A
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- China
- Prior art keywords
- coating
- organic matter
- manufacture craft
- metallized semi
- pore
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Classifications
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
- H05K3/42—Plated through-holes or plated via connections
- H05K3/423—Plated through-holes or plated via connections characterised by electroplating method
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- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
- Electroplating Methods And Accessories (AREA)
Abstract
The invention discloses a kind of manufacture crafts of metallized semi-pore, include the following steps：A, half bore is processed using gong trigger is positive clockwise, it is linearly increasing as the increase of machining angle synchronizes cuts depth；B, half bore is reversely processed counterclockwise using gong trigger, it is linearly increasing as the increase of machining angle synchronizes to cut depth；C, insulation organic matter coating is adhered in cutting surfaces, the insulation organic matter coating at cut edge position is purged, metal covering is exposed；D, electroplating processes are carried out to hole wall, forms copper coating；E, insulation organic matter coating is thoroughly removed, and polishing grinding is carried out to copper coating.The present invention can improve the deficiencies in the prior art, improve the processing quality of metallized semi-pore.
Description
Technical field
The present invention relates to PCB circuit board processing technique field, especially a kind of manufacture craft of metallized semi-pore.
Background technique
During PCB circuit board processing, metallized semi-pore can not only realize the conducting function of circular hole, but also can utilize half
The hole wall in hole is welded and fixed, and realizes the fixation of chip pin.The processing method of conventional metallized semi-pore is by gong plate
Machine carries out cutting production, and this method is easy to generate burr in the edge of half bore, leads to the short circuit between component.It is existing
In technology, there is by way of fill solder the technique for reducing burr generation to disclose, but this method is easy in half bore hole
Other metal components are introduced on wall, the performance of circuit board are influenced, and fill and use the intensity of solder generally not high, for cutting edge
The support effect of edge is general, can only reduce the generation of the larger burr of volume, can not eradicate to the burr of cut edge.
Summary of the invention
The technical problem to be solved in the present invention is to provide a kind of manufacture crafts of metallized semi-pore, can improve the prior art
Deficiency, improve the processing quality of metallized semi-pore.
In order to solve the above technical problems, the technical solution used in the present invention is as follows.
A kind of manufacture craft of metallized semi-pore, includes the following steps：
A, half bore is processed using gong trigger is positive clockwise, it is linearly increasing as the increase of machining angle synchronizes cuts depth；
B, half bore is reversely processed counterclockwise using gong trigger, it is linearly increasing as the increase of machining angle synchronizes to cut depth；
C, insulation organic matter coating is adhered in cutting surfaces, the insulation organic matter coating at cut edge position is purged, cruelly
Expose metal covering；
D, electroplating processes are carried out to hole wall, forms copper coating；
E, insulation organic matter coating is thoroughly removed, and polishing grinding is carried out to copper coating.
Preferably, the cutting speed in step B is 1.5~2 times of cutting speed in step A.
Preferably, adherency insulation organic matter coating includes the following steps in step C,
C1, by 55~75 parts of propane type epoxy resin of di phenolic group, 2~3 parts of allyl glycidyl ether, 3~5 parts of ethylene
Base trimethoxy silane is added in the mixed solution of ethyl alcohol and isopropanol, is heated to 65~75 DEG C, after mixing evenly for use, ethyl alcohol
It is 1 with the molar ratio of ethyl alcohol and isopropanol in the mixed solution of isopropanol:1；
C2, the cutting face brushing Diethylenetriamine in half bore,
C3, then the circuit board with half bore is immersed in the organic solution of C1 preparation, temperature is controlled at 45~55 DEG C, is kept
20~30min,
C4, circuit board is taken out, is air-dried.
Preferably, being filled out in the edge groove for needing to remove insulation organic matter coating location, groove in step C
Fiberfill is filled, scrub removal then is carried out to the insulation organic matter coating on the inside of groove using acetone.
Preferably, electroplating processes are carried out to hole wall and are included the following steps in step D,
D1, configuration copper sulfate baths,
Sulfuric acid copper content is 100~120g/L, and sulfuric acid content is 30~40g/L；
D2, after copper sulfate baths are heated to 42 DEG C, circuit board is immersed in copper sulfate baths, applies pulse current and carries out
The electroplating processes of 5min, the positive wave crest of pulse current and the time accounting of reversed wave crest are 3:1, the maximum value of positive wave crest is
20A, the maximum value of reversed wave crest are 4A, and the frequency of pulse current is 100Hz.
Preferably, being thoroughly removed using acetone to insulation organic matter coating remaining on circuit board in step E.
Preferably, polishing grinding is carried out to copper coating and is included the following steps in step E,
E1, polishing grinding is carried out to copper coating centre using polisher；
E2, after polishing region thickness is identical as outer surface thickness, polisher is moved in a spiral manner, to the other of copper coating
Position carries out polishing grinding, realizes that entire polishing region thickness is identical as outer surface thickness.
Brought beneficial effect is by adopting the above technical scheme：The present invention uses the mode of convention cutting twice first
Half bore is processed, the supportive of cutting position during feed each time can be improved, so as to improve in high speed rotation cutting process
Power is pullled to the cutting of layers of copper, reduces the appearance of burr.It then, can be with by carrying out plating and sanding and polishing to cutting edge
Remaining burr is thoroughly removed, fundamentally to solve influence of the burrs on edges to metallized semi-pore quality.The present invention
The insulation organic matter coating used is clear convenient for the later period by the way that allyl glycidyl ether and vinyltrimethoxysilane is added
It washes, while in the plating process, it is strong to the tolerance of pulse current.
Detailed description of the invention
Fig. 1 is the flow chart of a specific embodiment of the invention.
Fig. 2 is the structure chart of polisher in a specific embodiment of the invention.
In figure：1, top plate；2, cylinder；3, the first driving motor；4, polishing roll；5, the second driving motor；6, annular slab；7,
Burnishing stick.
Specific embodiment
The standardized element used in the present invention can commercially, and shaped piece is according to specification and attached drawing
Record can carry out customized, and the specific connection type of each part is all made of in the prior art mature bolt, rivet, weldering
The conventional means such as connect, paste, this will not be detailed here.
Referring to Fig.1, a specific embodiment of the invention includes the following steps：
A, half bore is processed using gong trigger is positive clockwise, it is linearly increasing as the increase of machining angle synchronizes cuts depth；
B, half bore is reversely processed counterclockwise using gong trigger, it is linearly increasing as the increase of machining angle synchronizes to cut depth；
C, insulation organic matter coating is adhered in cutting surfaces, the insulation organic matter coating at cut edge position is purged, cruelly
Expose metal covering；
D, electroplating processes are carried out to hole wall, forms copper coating；
E, insulation organic matter coating is thoroughly removed, and polishing grinding is carried out to copper coating.
Cutting speed in step B is 2 times of cutting speed in step A.
In step C, adherency insulation organic matter coating includes the following steps,
C1, by 65 parts of propane type epoxy resin of di phenolic group, 2 parts of allyl glycidyl ether, 5 parts of vinyl trimethoxy
Silane is added in the mixed solution of ethyl alcohol and isopropanol, is heated to 70 DEG C, after mixing evenly for use, the mixing of ethyl alcohol and isopropanol
The molar ratio of ethyl alcohol and isopropanol is 1 in solution:1；
C2, the cutting face brushing Diethylenetriamine in half bore,
C3, then the circuit board with half bore is immersed in the organic solution of C1 preparation, temperature is controlled at 50 DEG C, is kept
30min,
C4, circuit board is taken out, is air-dried.
In step C, fiberfill fibers are filled out in the edge groove for needing to remove insulation organic matter coating location, groove
Material, then carries out scrub removal to the insulation organic matter coating on the inside of groove using acetone.
In step D, electroplating processes are carried out to hole wall and are included the following steps,
D1, configuration copper sulfate baths,
Sulfuric acid copper content is 105g/L, sulfuric acid content 35g/L；
D2, after copper sulfate baths are heated to 42 DEG C, circuit board is immersed in copper sulfate baths, applies pulse current and carries out
The electroplating processes of 5min, the positive wave crest of pulse current and the time accounting of reversed wave crest are 3:1, the maximum value of positive wave crest is
20A, the maximum value of reversed wave crest are 4A, and the frequency of pulse current is 100Hz.
In step E, insulation organic matter coating remaining on circuit board is thoroughly removed using acetone.
In step E, polishing grinding is carried out to copper coating and is included the following steps,
E1, polishing grinding is carried out to copper coating centre using polisher；
E2, after polishing region thickness is identical as outer surface thickness, polisher is moved in a spiral manner, to the other of copper coating
Position carries out polishing grinding, realizes that entire polishing region thickness is identical as outer surface thickness.
In order to verify used in the present invention insulate organic matter coating performance, using used in the present invention insulation organic matter coating and
Compare coating（Only contain propane type epoxy resin of di phenolic group）Design following two comparative tests.
Comparative test 1
It is immersed in acetone using the metal plate for being stained with insulation organic matter coating and comparison coating, stands and keep 3min, then take
Pure water rinsing is used out, and the weight difference of measurement test front and back, obtains acetone for the dissolving ratio of coating respectively:
| Group | Acetone solution ratio（wt%） |
| Insulate organic matter coating | 55.3 |
| Compare coating | 21.8 |
Comparative test 2
It is carried out using the metal plate for being stained with insulation organic matter coating and comparison coating using the electro-plating method in step D of the present invention
Electroplating processes.Wherein electroplating time increases to 1h, and the maximum value of the positive wave crest of pulse current is 100A, the maximum of reversed wave crest
Value is 20A.Then residual coating is thoroughly cleaned using acetone, acetone is then subjected to heating evaporation, is measured respectively residual
The weight for staying object obtains that the extent of corrosion for coating is electroplated：
| Group | Bimatallic corrosion ratio（wt%） |
| Insulate organic matter coating | 0.12 |
| Compare coating | 0.33 |
In addition, in order to improve polishing grinding precision, the present invention specially provides a kind of polisher referring to Fig. 2.Including top plate
1,1 bottom of top plate is connected with the first driving motor 3 by cylinder 2, and the first driving motor 3 is connected with polishing roll 4.1 side of top plate
It is connected with the second driving motor 5,1 underrun sliding slot of top plate slidably connects annular slab 6, and the second driving motor 5 drives annular
Plate 6 rotates, and 6 bottom surface of annular slab is uniformly fixed with several burnishing sticks 7.The ratio between roughness of polishing roll 4 and burnishing stick 7 is 10:
1, the ratio between the first driving motor 3 and the revolving speed of the second driving motor 5 are 1:2.In bruting process, using polishing roll to center
It is quickly polished, is then refined using the burnishing stick on periphery, fast, accurately polishing operation may be implemented.Polishing roll 4
It can move up and down, so that the polishing pressure of polishing position be adjusted.
In the description of the present invention, it is to be understood that, term " longitudinal direction ", " transverse direction ", "upper", "lower", "front", "rear",
The orientation or positional relationship of the instructions such as "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outside" is based on attached drawing institute
The orientation or positional relationship shown is merely for convenience of the description present invention, rather than the device or element of indication or suggestion meaning must
There must be specific orientation, be constructed and operated in a specific orientation, therefore be not considered as limiting the invention.
The above shows and describes the basic principles and main features of the present invention and the advantages of the present invention.The technology of the industry
Personnel are it should be appreciated that the present invention is not limited to the above embodiments, and the above embodiments and description only describe this
The principle of invention, without departing from the spirit and scope of the present invention, various changes and improvements may be made to the invention, these changes
Change and improvement all fall within the protetion scope of the claimed invention.The claimed scope of the invention by appended claims and its
Equivalent thereof.
Claims (7)
1. a kind of manufacture craft of metallized semi-pore, it is characterised in that include the following steps：
A, half bore is processed using gong trigger is positive clockwise, it is linearly increasing as the increase of machining angle synchronizes cuts depth；
B, half bore is reversely processed counterclockwise using gong trigger, it is linearly increasing as the increase of machining angle synchronizes to cut depth；
C, insulation organic matter coating is adhered in cutting surfaces, the insulation organic matter coating at cut edge position is purged, cruelly
Expose metal covering；
D, electroplating processes are carried out to hole wall, forms copper coating；
E, insulation organic matter coating is thoroughly removed, and polishing grinding is carried out to copper coating.
2. the manufacture craft of metallized semi-pore according to claim 1, it is characterised in that：Cutting speed in step B is
1.5~2 times of cutting speed in step A.
3. the manufacture craft of metallized semi-pore according to claim 1, it is characterised in that：In step C, adherency insulation is organic
Object coating includes the following steps,
C1, by 55~75 parts of propane type epoxy resin of di phenolic group, 2~3 parts of allyl glycidyl ether, 3~5 parts of ethylene
Base trimethoxy silane is added in the mixed solution of ethyl alcohol and isopropanol, is heated to 65~75 DEG C, after mixing evenly for use, ethyl alcohol
It is 1 with the molar ratio of ethyl alcohol and isopropanol in the mixed solution of isopropanol:1；
C2, the cutting face brushing Diethylenetriamine in half bore,
C3, then the circuit board with half bore is immersed in the organic solution of C1 preparation, temperature is controlled at 45~55 DEG C, is kept
20~30min,
C4, circuit board is taken out, is air-dried.
4. the manufacture craft of metallized semi-pore according to claim 3, it is characterised in that：It is exhausted needing to remove in step C
The edge groove of edge organic matter coating location, fiberfill fibers filler in groove, then using acetone to exhausted on the inside of groove
Edge organic matter coating carries out scrub removal.
5. the manufacture craft of metallized semi-pore according to claim 1, it is characterised in that：In step D, electricity is carried out to hole wall
Plating includes the following steps,
D1, configuration copper sulfate baths,
Sulfuric acid copper content is 100~120g/L, and sulfuric acid content is 30~40g/L；
D2, after copper sulfate baths are heated to 42 DEG C, circuit board is immersed in copper sulfate baths, applies pulse current and carries out
The electroplating processes of 5min, the positive wave crest of pulse current and the time accounting of reversed wave crest are 3:1, the maximum value of positive wave crest is
20A, the maximum value of reversed wave crest are 4A, and the frequency of pulse current is 100Hz.
6. the manufacture craft of metallized semi-pore according to claim 5, it is characterised in that：In step E, using acetone to electricity
Remaining insulation organic matter coating is thoroughly removed on the plate of road.
7. the manufacture craft of metallized semi-pore according to claim 5, it is characterised in that：In step E, copper coating is carried out
Polishing grinding includes the following steps,
E1, polishing grinding is carried out to copper coating centre using polisher；
E2, after polishing region thickness is identical as outer surface thickness, polisher is moved in a spiral manner, to the other of copper coating
Position carries out polishing grinding, realizes that entire polishing region thickness is identical as outer surface thickness.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810739862.4A CN108882559B (en) | 2018-07-06 | 2018-07-06 | Manufacturing process of metallized half hole |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810739862.4A CN108882559B (en) | 2018-07-06 | 2018-07-06 | Manufacturing process of metallized half hole |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN108882559A true CN108882559A (en) | 2018-11-23 |
| CN108882559B CN108882559B (en) | 2023-06-02 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201810739862.4A Active CN108882559B (en) | 2018-07-06 | 2018-07-06 | Manufacturing process of metallized half hole |
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Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110602878A (en) * | 2019-08-15 | 2019-12-20 | 鹤山市中富兴业电路有限公司 | Direct forming method for metallized semi-hole |
| CN112074095A (en) * | 2020-10-10 | 2020-12-11 | 黄石星河电路有限公司 | Thin plate processing method with 0.4MM metal half-holes designed around |
| CN112291930A (en) * | 2019-08-07 | 2021-01-29 | 宏华胜精密电子(烟台)有限公司 | Method for manufacturing metallized semi-hole of circuit board |
| CN112312680A (en) * | 2020-10-29 | 2021-02-02 | 惠州市特创电子科技有限公司 | Method for processing metallized half hole of circuit board |
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| US6071398A (en) * | 1997-10-06 | 2000-06-06 | Learonal, Inc. | Programmed pulse electroplating process |
| CN106793575A (en) * | 2016-12-16 | 2017-05-31 | 江苏博敏电子有限公司 | A kind of manufacture craft of half bore pcb board |
| CN107396550A (en) * | 2017-08-31 | 2017-11-24 | 惠东县建祥电子科技有限公司 | A kind of hole-drilling system and method for improving the heavy copper half bore burr of pcb board |
| CN108200726A (en) * | 2018-02-08 | 2018-06-22 | 深圳市昶东鑫线路板有限公司 | Wiring board 0.3mm metallized semi-pore processing technologys |
| CN108207090A (en) * | 2017-12-29 | 2018-06-26 | 广州兴森快捷电路科技有限公司 | The production method of printed circuit board |
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2018
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Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
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| US6071398A (en) * | 1997-10-06 | 2000-06-06 | Learonal, Inc. | Programmed pulse electroplating process |
| CN106793575A (en) * | 2016-12-16 | 2017-05-31 | 江苏博敏电子有限公司 | A kind of manufacture craft of half bore pcb board |
| CN107396550A (en) * | 2017-08-31 | 2017-11-24 | 惠东县建祥电子科技有限公司 | A kind of hole-drilling system and method for improving the heavy copper half bore burr of pcb board |
| CN108207090A (en) * | 2017-12-29 | 2018-06-26 | 广州兴森快捷电路科技有限公司 | The production method of printed circuit board |
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Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112291930A (en) * | 2019-08-07 | 2021-01-29 | 宏华胜精密电子(烟台)有限公司 | Method for manufacturing metallized semi-hole of circuit board |
| CN110602878A (en) * | 2019-08-15 | 2019-12-20 | 鹤山市中富兴业电路有限公司 | Direct forming method for metallized semi-hole |
| CN112074095A (en) * | 2020-10-10 | 2020-12-11 | 黄石星河电路有限公司 | Thin plate processing method with 0.4MM metal half-holes designed around |
| CN112312680A (en) * | 2020-10-29 | 2021-02-02 | 惠州市特创电子科技有限公司 | Method for processing metallized half hole of circuit board |
| CN112312680B (en) * | 2020-10-29 | 2022-02-22 | 惠州市特创电子科技股份有限公司 | Method for processing metallized half hole of circuit board |
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| CN108882559B (en) | 2023-06-02 |
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