CN108882508B - Circuit board mounting plate with heat dissipation function - Google Patents
Circuit board mounting plate with heat dissipation function Download PDFInfo
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- CN108882508B CN108882508B CN201810957629.3A CN201810957629A CN108882508B CN 108882508 B CN108882508 B CN 108882508B CN 201810957629 A CN201810957629 A CN 201810957629A CN 108882508 B CN108882508 B CN 108882508B
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- plate
- heat
- circuit board
- diaphragm
- rolling
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
- H05K1/0203—Cooling of mounted components
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/06—Thermal details
- H05K2201/064—Fluid cooling, e.g. by integral pipes
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- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
Abstract
The invention discloses a circuit board mounting plate with a heat dissipation function, which comprises a plate body, wherein a plurality of thread grooves are formed in the top of the plate body, a mounting groove is formed in the top of the plate body, a heat conduction plate is fixedly connected to the inner side wall of the mounting groove, a plurality of accommodating grooves are formed in the inner bottom of the mounting groove at equal intervals, and a plurality of connecting grooves are formed in the inner bottom of each accommodating groove. The invention is convenient for the stable connection between the circuit board and the board body through the thread groove, the heat emitted from the heating position of the circuit board is transferred through the action of the heat conducting plate and the heat conducting rod, so that the volume of the air bag at the bottom of the heating position of the circuit board is increased, the inclination of the balance plate is caused, the rolling of the rolling ball is driven, the flow of the magnetic fluid is caused along with the rolling of the rolling ball, and further the flow of the cooling liquid is caused, in addition, the rolling of the rolling ball is facilitated through the intermittent work of the electromagnet and the matching action of the air bag, so that the continuous flow of the cooling liquid is driven, and the heat dissipation treatment of.
Description
Technical Field
The invention relates to the technical field of heat dissipation equipment, in particular to a circuit board mounting plate with a heat dissipation function.
Background
At present, intelligent electrical appliances are provided with circuit boards, wherein the circuit boards are the integration of control circuits and electronic components, the circuit boards play a role of control units in the intelligent electrical appliances, the functions of the control units are similar to the human brain, and the control units mainly play a role of controlling all components to work orderly.
The circuit board is composed of a resistor, a capacitor, a control chip and circuits, heat is generated in the using process and affects the work of the resistor, the capacitor and the control chip, for example, when the resistor is overheated in use, the resistance value is increased, and further the change of the numerical values such as current is affected, so that the collection of a receipt is affected, air cooling heat dissipation is adopted at present, and heat dissipation is performed by blowing air, but the heat dissipation mode not only occupies a large space, but also generates vibration when the fan works, and the vibration affects the stability of the circuit board, because the resistor, the capacitor and the control chip are small in size and are easily affected by vibration, in addition, the most important point is that the fan blows external dust onto the circuit board, and the electronic element most abstains from the influence of the dust, since fine dust does not enter without holes, damage to the circuit board is easily caused.
Therefore, a circuit board mounting plate with a heat dissipation function is designed.
Disclosure of Invention
The invention aims to solve the problem that the existing circuit board is inconvenient to dissipate heat, and provides a circuit board mounting plate with a heat dissipation function.
In order to achieve the purpose, the invention adopts the following technical scheme:
a circuit board mounting plate with a heat dissipation function comprises a plate body, wherein a plurality of thread grooves are formed in the top of the plate body, a mounting groove is formed in the top of the plate body, a heat conduction plate is fixedly connected to the inner side wall of the mounting groove, a plurality of accommodating grooves are formed in the inner bottom of the mounting groove in an equidistant mode, a plurality of connecting grooves are formed in the inner bottom of each accommodating groove, air bags are fixedly connected to the notches of the connecting grooves and communicated with the connecting grooves, nitrogen is filled in the air bags and the connecting grooves, a heat conduction rod in an inverted T shape is fixedly connected to the bottom of the heat conduction plate, one end, away from the heat conduction plate, of the heat conduction rod penetrates through the plate body and extends inwards the connecting grooves, a cylindrical electromagnet is fixedly connected to the plate body, a balance plate is arranged in each accommodating groove and located right above each air bag and rotatably sleeved on the electromagnet, and two ends of the balance plate, the balance plate is characterized in that rolling balls are arranged at the top of the balance plate and made of magnets and iron, rolling grooves corresponding to the rolling balls are formed in the top of the balance plate, a first diaphragm and a second diaphragm are sequentially arranged at the top of the balance plate, two ends of the first diaphragm and two ends of the second diaphragm are fixedly connected with the inner side wall of each accommodating groove, a magnetic fluid is filled between the first diaphragm and the second diaphragm, and a cooling liquid is filled between the second diaphragm and the heat conducting plate.
The invention is convenient for the stable connection between the circuit board and the board body through the thread groove, the heat emitted from the heating position of the circuit board is transferred through the action of the heat conducting plate and the heat conducting rod, so that the volume of the air bag at the bottom of the heating position of the circuit board is increased, the inclination of the balance plate is caused, the rolling of the rolling ball is driven, the flow of the magnetic fluid is caused along with the rolling of the rolling ball, and further the flow of the cooling liquid is caused, in addition, the rolling of the rolling ball is convenient to carry out the back-and-forth rolling through the intermittent work of the electromagnet and the matching action of the air bag, so that the continuous flow of the.
Drawings
Fig. 1 is a schematic structural diagram of a circuit board mounting board with a heat dissipation function according to the present invention;
FIG. 2 is a view from the direction A-A in FIG. 1;
fig. 3 is an enlarged view at B in fig. 2.
In the figure: the heat-conducting plate comprises a plate body 1, a heat-conducting plate 2, a receiving groove 3, a connecting groove 4, an air bag 5, a heat-conducting rod 6, an electromagnet 7, a balance plate 8, a rolling ball 9, a first diaphragm 10, a second diaphragm 11, a magnetic fluid 12, a cooling liquid 13 and a thread groove 14.
Detailed Description
The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments.
In the description of the present invention, it is to be understood that the terms "upper", "lower", "front", "rear", "left", "right", "top", "bottom", "inner", "outer", and the like, indicate orientations or positional relationships based on the orientations or positional relationships shown in the drawings, are merely for convenience in describing the present invention and simplifying the description, and do not indicate or imply that the device or element being referred to must have a particular orientation, be constructed and operated in a particular orientation, and thus, should not be construed as limiting the present invention.
Referring to fig. 1 to 3, a circuit board mounting panel with a heat dissipation function includes a panel body 1, wherein a plurality of thread grooves 14 are formed at the top of the panel body 1;
what needs to be explained above is: this facilitates a stable connection between the circuit board and the board body 1 by the action of the screw groove 14, and the bottom of the circuit board is in contact with the top of the board body 1.
Wherein, the top of the plate body 1 is provided with an installation groove, and the inner side wall of the installation groove is fixedly connected with a heat-conducting plate 2;
what needs to be explained above is: the top of plate body 1 contacts with the bottom of circuit board, even the bottom contact of the top of heat-conducting plate 2 and circuit board, then through heat-conducting plate 2 "impression" and the heat of transmission circuit board during operation, and then be convenient for carry out the heat dissipation processing to the circuit board afterwards, and the mounting groove that wherein sets up is the installation and the stability of the heat-conducting plate 2 of being convenient for.
The bottom of the mounting groove is equidistantly provided with a plurality of accommodating grooves 3, the bottom of the accommodating grooves 3 is provided with a plurality of connecting grooves 4, the notches of the connecting grooves 4 are fixedly connected with air bags 5, the air bags 5 are communicated with the connecting grooves 4, the air bags 5 and the connecting grooves 4 are filled with nitrogen, the bottom of the heat-conducting plate 2 is fixedly connected with a heat-conducting rod 6 in an inverted T shape, and one end, far away from the heat-conducting plate 2, of the heat-conducting rod 6 penetrates through the plate body 1 and extends into the connecting grooves 4;
what needs to be explained above is: after "feeling" the heat that lies in its top circuit board through heat-conducting plate 2, in the spread groove 4 of 6 both sides of heat-conducting rod is transmitted the heat of circuit board in proper order to effect through heat-conducting plate 2 and heat-conducting rod 6, and spread groove 4 and 5 intercommunications of gasbag and inside fill nitrogen gas, and nitrogen gas is the gas of being heated easy inflation, then receive the heat that heat-conducting rod 6 transmitted and will expand when nitrogen gas to increase the volume of gasbag 5, then will lead to the position slope of balance plate 8 afterwards along with the increase of the volume of gasbag 5.
The air bag type air conditioner comprises a plate body 1, a balance plate 8, an air bag 5, a cylindrical electromagnet 7, a rolling ball 9, a rolling groove 9, a balance plate 8, a motor, a power supply and a control circuit, wherein the cylindrical electromagnet 7 is fixedly connected in the plate body 1, the balance plate 8 is arranged in the containing groove 3, the balance plate 8 is positioned right above the air bag 5, the balance plate 8 is rotatably sleeved on the electromagnet 7, two ends of the balance plate 8 are symmetrically arranged relative to the electromagnet 7, the top of the balance plate 8 is provided with the rolling ball 9, the;
what needs to be explained above is: the balance plate 8 is inclined due to the volume increase of the air bag 5, wherein the plurality of receiving grooves 3 and the plurality of air bags 5 are arranged to control each part of the circuit board conveniently, because the circuit board cannot generate heat at one point when generating heat, the plurality of receiving grooves 3 and the plurality of air bags 5 arranged in this way can perform heat dissipation treatment on the part of the circuit board generating heat, namely, the heat generating part of the circuit board can be accurately fed back to two air bags 5 adjacent to the bottom of the circuit board through the heat conducting rod 6 connected with the bottom of the heat conducting plate 2, so as to increase the volume of the air bag 5 at the corresponding position, the balance plate 8 is inclined to the other side due to the volume increase of the air bag 5, the rolling balls 9 can slide downwards along with the inclination of the balance plate 8, and the subsequent flow change of the magnetic fluid 12 can be caused along with the sliding of the rolling balls 9, the electromagnet 7 is arranged in a cylindrical shape, so that the balance plate 8 can rotate conveniently, and meanwhile, as the rolling ball 9 is made of the magnet and iron, when the device is not used, namely the circuit board does not work, the electromagnet 7 is electrified, so that the electromagnet 7 is magnetized, and the rolling ball 9 is adsorbed above the electromagnet 7 under the action of the iron in the rolling ball 9, namely the middle of the balance plate 8.
The top of the balance plate 8 is sequentially provided with a first diaphragm 10 and a second diaphragm 11, two ends of the first diaphragm 10 and two ends of the second diaphragm 11 are fixedly connected with the inner side wall of the accommodating groove 3, a magnetic fluid 12 is filled between the first diaphragm 10 and the second diaphragm 11, and a cooling liquid 13 is filled between the second diaphragm 11 and the heat conducting plate 2;
what needs to be explained above is: the upper rolling ball 9 rolls towards one end of the balance plate 8, the magnetic fluid 12 at the top part can be guided to move forwards along with the rolling of the rolling ball 9, the second diaphragm 11 can move along with the movement of the magnetic fluid 12, the cooling liquid 13 at the top part can be caused to flow along with the movement of the second diaphragm 11, so that the circuit board is radiated through the heat conducting plate 2, the electromagnet 7 is powered on discontinuously, namely the rolling ball 9 is adsorbed to the center of the balance plate 8 when the electromagnet 7 is powered on, the electromagnet can drive the magnetic fluid 12 to move again in the movement process, so that the cooling liquid 13 is driven to flow, the heat radiation treatment is completed, when the power is off, the inclination angle of the balance plate 8 is changed due to the volume change of the air bags 5 at the two sides of the balance plate 8, the rolling ball 9 rolls conveniently, the cooling liquid 13 is driven to flow, and the heat radiated by the circuit board is absorbed along with the flow of the cooling liquid 13, the circuit board is subjected to heat dissipation treatment.
The above description is only for the preferred embodiment of the present invention, but the scope of the present invention is not limited thereto, and any person skilled in the art should be considered to be within the technical scope of the present invention, and the technical solutions and the inventive concepts thereof according to the present invention should be equivalent or changed within the scope of the present invention.
Claims (1)
1. A circuit board mounting plate with a heat dissipation function comprises a plate body (1), and is characterized in that a plurality of thread grooves (14) are formed in the top of the plate body (1);
the top of the plate body (1) is provided with an installation groove, and the inner side wall of the installation groove is fixedly connected with a heat-conducting plate (2);
the bottom of the mounting groove is equidistantly provided with a plurality of accommodating grooves (3), the bottom of each accommodating groove (3) is provided with a plurality of connecting grooves (4), the notches of the connecting grooves (4) are fixedly connected with air bags (5), the air bags (5) are communicated with the connecting grooves (4), the air bags (5) and the connecting grooves (4) are filled with nitrogen, the bottom of the heat-conducting plate (2) is fixedly connected with a heat-conducting rod (6) in an inverted T shape, and one end, far away from the heat-conducting plate (2), of the heat-conducting rod (6) penetrates through the plate body (1) and extends into the connecting grooves (4);
a cylindrical electromagnet (7) is fixedly connected in the plate body (1), a balance plate (8) is arranged in the accommodating groove (3), the balance plate (8) is located right above the air bag (5), the balance plate (8) is rotatably sleeved on the electromagnet (7), two ends of the balance plate (8) are symmetrically arranged relative to the electromagnet (7), rolling balls (9) are arranged at the top of the balance plate (8), the rolling balls (9) are made of magnets and iron, and rolling grooves corresponding to the rolling balls (9) are formed in the top of the balance plate (8);
the top of balance plate (8) is equipped with first diaphragm (10) and second diaphragm (11) in proper order, the both ends of first diaphragm (10) and the both ends of second diaphragm (11) all with the inside wall fixed connection who accomodates groove (3), it has magnetic current body (12) to fill between first diaphragm (10) and second diaphragm (11), it has coolant liquid (13) to fill between second diaphragm (11) and heat-conducting plate (2).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810957629.3A CN108882508B (en) | 2018-08-22 | 2018-08-22 | Circuit board mounting plate with heat dissipation function |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810957629.3A CN108882508B (en) | 2018-08-22 | 2018-08-22 | Circuit board mounting plate with heat dissipation function |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN108882508A CN108882508A (en) | 2018-11-23 |
| CN108882508B true CN108882508B (en) | 2020-11-17 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN201810957629.3A Active CN108882508B (en) | 2018-08-22 | 2018-08-22 | Circuit board mounting plate with heat dissipation function |
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Families Citing this family (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111987055B (en) * | 2020-07-16 | 2022-06-07 | 大同新成新材料股份有限公司 | Semiconductor refrigeration graphene chip |
| CN112367806B (en) * | 2020-10-28 | 2022-03-29 | 武汉第二船舶设计研究所(中国船舶重工集团公司第七一九研究所) | Resistance-reducing type micro-thin channel liquid cooling radiator |
| CN113133187B (en) * | 2021-04-17 | 2022-01-18 | 深圳市三德冠精密电路科技有限公司 | Supplementary heat dissipation mechanism of flexible circuit board |
| CN116709761B (en) * | 2023-08-01 | 2023-10-03 | 深圳启赋科创技术有限公司 | Electromagnetic shielding structure and preparation method thereof |
Family Cites Families (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE102013219688B3 (en) * | 2013-09-30 | 2015-02-05 | Robert Bosch Gmbh | Thermally conductive connection means, connection arrangement and method for producing a heat-conducting connection |
| CN206089440U (en) * | 2016-09-14 | 2017-04-12 | 深圳市力沣实业有限公司 | Heat radiation structure and have this heat radiation structure's three -dimensional forming and hot -pressing system of glass |
| CN206547216U (en) * | 2017-01-11 | 2017-10-10 | 梅州市鸿宇电路板有限公司 | A kind of four layers of lead-free tin spray plate |
| CN206835538U (en) * | 2017-06-09 | 2018-01-02 | 上海斐讯数据通信技术有限公司 | A kind of electronic equipment for automatically adjusting radiating |
| CN206977797U (en) * | 2017-07-28 | 2018-02-06 | 奥士康科技股份有限公司 | A kind of adjustable circuit board radiator structure |
| CN107579446B (en) * | 2017-09-15 | 2019-02-05 | 宁波博恩电气有限公司 | Can automatic heat radiation distribution box |
| CN207692165U (en) * | 2017-12-11 | 2018-08-03 | 广州尚诚知识产权运营有限公司 | A kind of multi-layered high-density PCB circuit board manufacture postcooling device |
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| CN108882508A (en) | 2018-11-23 |
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Effective date of registration: 20201029 Address after: 215000 No.99, Qinan Road, Jiantang village, Yangchenghu Town, Xiangcheng District, Suzhou City, Jiangsu Province (No.1 Workshop of Suzhou Dongfang Shunda Logistics Co., Ltd.) Applicant after: Suzhou Xiangcheng Yangcheng Industrial Park Development Co., Ltd Address before: 210000 No. 30 South Pearl Road, Pukou District, Jiangsu, Nanjing Applicant before: Wang Jie |
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