CN108878343B - 一种柔性显示装置的制造方法 - Google Patents
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- 239000004973 liquid crystal related substance Substances 0.000 description 3
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- 239000010409 thin film Substances 0.000 description 2
- 238000005553 drilling Methods 0.000 description 1
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- 238000005516 engineering process Methods 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
- 230000008093 supporting effect Effects 0.000 description 1
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Abstract
本发明公开了一种柔性显示装置的制造方法，包括如下步骤：S1.提供一玻璃基板，所述玻璃基板具有多个均匀分布的通孔；S2.在所述玻璃基板上贴合柔性衬底；S3.在柔性衬底上形成显示元件；S4.向通孔中充入空气或惰性气体；S5.向通孔中滴入碳酸氢钠溶液，然后滴入酸溶液，在所述通孔中生成二氧化碳气体以将柔性衬底与玻璃基板分离。本发明中，通过在玻璃基板的通孔中先充入空气或惰性气体，然后先后滴入碳酸氢钠溶液、酸溶液，通过化学反应在所述通孔中生成二氧化碳气体，二氧化碳气体释放均匀，二氧化碳气体对柔性衬底施加作用力，从而使柔性衬底与玻璃基板分离时所产生的内应力较小，不会对柔性衬底产生破坏，不会造成柔性衬底的破坏导致显示不良。
Description
技术领域
本发明涉及显示技术领域，特别是涉及了一种柔性显示装置的制造方法。
背景技术
柔性显示装置是一种基于柔性基底材料制作形成的显示装置。由于柔性显 示装置具有可卷曲、宽视角、便于携带等特点，因此，在便携产品、多数显示 应用领域柔性显示装置具有广阔的应用前景以及良好的市场潜力。
由于柔性显示装置中的柔性衬底容易发生褶皱、变形、偏移等问题，在制备显示器件的过程中，定位、 搬运、存储等均比较困难，因此通常先在玻璃基板等承载基板上形成柔性衬底，之后在其上形成显示元件，最后通过衬底剥离的方法，使柔性衬底与玻璃基板分开。在柔性显示装置制备过程中，如何将柔性衬底与玻璃基板分离是柔性显示技术领域中制备柔性器件的关键技术。然后，在实现上述将柔性衬底板从玻璃基板上分离的过程中，发明人发现现有的剥离工艺，容易对柔性衬底造成破坏，造成产品不良，分离工序复杂，不利于提高柔性显示装置的生产效率。
发明内容
为了弥补已有技术的缺陷，本发明提供一种柔性显示装置的制造方法。
本发明所要解决的技术问题通过以下技术方案予以实现：
一种柔性显示装置的制造方法，包括如下步骤：
S1.提供一玻璃基板，所述玻璃基板具有多个均匀分布的通孔；
S2.在所述玻璃基板上贴合柔性衬底；
S3.在柔性衬底上形成显示元件；
S4.向通孔中充入空气或惰性气体；
S5.向通孔中滴入碳酸氢钠溶液，然后滴入酸溶液，在所述通孔中生成二氧化碳气体以将柔性衬底与玻璃基板分离。
进一步地，所述酸溶液为醋酸溶液或草酸溶液。
进一步地，所述通孔为圆形，所述孔洞的直径为5-6mm。
进一步地，所述柔性衬底为超薄玻璃。
进一步地，所述显示元件为OLED显示元件；或者，所述显示元件为液晶显示元件。
本发明具有如下有益效果：
本发明中，通过在玻璃基板的通孔中先充入空气或惰性气体，然后先后滴入碳酸氢钠溶液、酸溶液，通过化学反应在所述通孔中生成二氧化碳气体，二氧化碳气体释放均匀，二氧化碳气体对柔性衬底施加作用力，从而使柔性衬底与玻璃基板分离时所产生的内应力较小，不会对柔性衬底产生破坏，柔性衬底与玻璃基板的剥离过程更加容易，从而解决了柔性基板剥离困难的问题。采用该方法制作柔性显示装置，工艺简单，柔性衬底与玻璃基板容易分离，不会造成柔性衬底的破坏导致显示不良。
本发明中，在一个批次柔性衬底分离完成后，对于玻璃基板可以循环利用，节省材料。
具体实施方式
下面结合实施例对本发明进行详细的说明，实施例仅是本发明的优选实施方式，不是对本发明的限定。
一种柔性显示装置的制造方法，包括如下步骤：
S1.提供一玻璃基板，所述玻璃基板具有多个均匀分布的通孔；
S2.在所述玻璃基板上贴合柔性衬底；
S3.在柔性衬底上形成显示元件；
S4.向通孔中充入空气或惰性气体；
S5.向通孔中滴入碳酸氢钠溶液，然后滴入酸溶液，在所述通孔中生成二氧化碳气体以将柔性衬底与玻璃基板分离。
其中，所述酸溶液为醋酸溶液或草酸溶液，但不局限于此。
需要说明的是，本发明中并不具体限定碳酸氢钠溶液和酸溶液的用量。优选地，所述碳酸氢钠溶液和酸溶液的物质的量之比为1:1。
本发明中，所述柔性衬底优选为超薄玻璃。
本发明中，对形成通孔的方式不作特别限定，例如： 利用钻头打孔的方式在玻璃基板上形成通孔。
本发明中，对通孔的数量不做限制，可以根据玻璃基板的大小进行合理设计。
本发明中，对通孔的形状不作特别限定，作为举例，可以为长方形、正方形、圆 形、三角形、十字形中任意一种或几种。作为优选，所述通孔为圆形，所述孔洞的直径为5-6mm。
本发明对通孔的具体排布方式不作特别限定，只要实现通孔在玻璃基板上均匀分布即可。
由于玻璃基板的支撑作用，在与玻璃基板贴合在一起柔性衬底上制作显示元件，可有效避免柔性衬底在显示元件制作过程中出现破碎、褶皱和变形。
需要说明的是，根据柔性显示装置类型及构造的不同，制备形成的柔性衬底上的显示元件也不相同。所述显示元件为OLED显示元件；或者，所述显示元件为液晶显示元件。
其中，OLED显示元件可以包括薄膜晶体管、阳极、阴极、以及位于阳极和阴极之间的有机材料功能层，其中，由于有机材料功能层的特殊性，OLED显示元件还包括封装层，但不限定于此。对此本发明不做限制，且形成上述结构均为本领域人员熟知的工艺，在此不再赘述。
液晶显示元件包括位于阵列基板上的薄膜晶体管、像素电极等，以及位于对盒基板上的彩色滤光层。其中，公共电极可设置在阵列基板上，也可设置在对盒基板上，彩色滤光层可设置在对盒基板上，也可设置在阵列基板上。对此本发明不做限制，且形成上述结构均为本领域人员熟知的工艺，在此不再赘述。
本发明中通过酸碱化学反应产生二氧化碳气体，相较于直接充入二氧化碳气体，可避免直接充入二氧化碳气体中的气压较大损伤柔性衬底，而气压较小导致无法分离的问题。本发明中，二氧化碳气体释放均匀。
发明人在实践中发现碳酸氢钠溶液和酸溶液的滴加顺序对柔性衬底和玻璃基板的分离效果有重要影响，只有在通孔中先滴加碳酸氢钠溶液，再滴加酸溶液，柔性衬底和玻璃基板的分离效果才好。
以上所述实施例仅表达了本发明的实施方式，其描述较为具体和详细，但并不能因此而理解为对本发明专利范围的限制，但凡采用等同替换或等效变换的形式所获得的技术方案，均应落在本发明的保护范围之内。
Claims (1)
1.一种柔性显示装置的制造方法，包括如下步骤：
S1.提供一玻璃基板，所述玻璃基板具有多个均匀分布的通孔；
S2.在所述玻璃基板上贴合柔性衬底；
S3.在柔性衬底上形成显示元件；
S4.向通孔中充入空气或惰性气体；
S5.向通孔中滴入碳酸氢钠溶液，然后滴入酸溶液，在所述通孔中生成二氧化碳气体以将柔性衬底与玻璃基板分离；
所述酸溶液为醋酸溶液或草酸溶液；所述碳酸氢钠溶液和酸溶液的物质的量之比为1:1；
所述柔性衬底为超薄玻璃；
所述通孔为圆形，直径为5-6mm。
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| CN105632991A (zh) * | 2016-01-07 | 2016-06-01 | 京东方科技集团股份有限公司 | 刚性衬底基板、柔性显示基板制备设备及制备方法 |
| CN106024724A (zh) * | 2016-06-21 | 2016-10-12 | 京东方科技集团股份有限公司 | 一种承载基板及利用该承载基板制作面板的方法 |
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| CN105632991A (zh) * | 2016-01-07 | 2016-06-01 | 京东方科技集团股份有限公司 | 刚性衬底基板、柔性显示基板制备设备及制备方法 |
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